MAXIM MAX3001E, MAX3002 User Manual

General Description
The MAX3000E/MAX3001E/MAX3002–MAX3012 8-channel level translators provide the level shifting nec­essary to allow data transfer in a multivoltage system. Externally applied voltages, V
CC
and VL, set the logic lev­els on either side of the device. Logic signals present on the V
side of the device appear as a higher voltage logic
signal on the V
CC
side of the device, and vice-versa.
The MAX3000E/MAX3001E/MAX3002/MAX3003 use an architecture specifically designed to be bidirectional without the use of a directional pin.
The MAX3000E/MAX3001E/MAX3002/MAX3004–MAX3012 feature an EN input that, when low, reduces the V
CC
and VLsupply currents to < 2µA. The MAX3000E/MAX3001E also have ±15kV ESD protection on the I/O V
CC
side for greater protection in applications that route signals externally. The MAX3000E operates at a guaranteed data rate of 230kbps. The MAX3001E operates at a guaranteed data rate of 4Mbps. The MAX3002–MAX3012 operate at a guaranteed data rate of 20Mbps over the entire specified operating voltage range.
The MAX3000E/MAX3001E/MAX3002–MAX3012 accept VLvoltages from +1.2V to +5.5V and VCCvoltages from +1.65V to +5.5V, making them ideal for data transfer between low-voltage ASICs/PLDs and higher voltage systems. The MAX3000E/MAX3001E/MAX3002– MAX3012 are available in 20-bump UCSP™, 20-pin TQFN (5mm x 5mm), and 20-pin TSSOP packages.
Applications
CMOS Logic-Level Translation
Cellphones
SPI™ and MICROWIRE™ Level Translation
Low-Voltage ASIC Level Translation
Smart Card Readers
Cellphone Cradles
Portable POS Systems
Portable Communication Devices
Low-Cost Serial Interfaces
GPS
Telecommunications Equipment
Features
Guaranteed Data Rate Options
230kbps (MAX3000E) 4Mbps (MAX3001E) 20Mbps (MAX3002–MAX3012)
Bidirectional Level Translation Without Using a
Directional Pin (MAX3000E/MAX3001E/MAX3002/ MAX3003)
Unidirectional Level Translation
(MAX3004–MAX3012)
Operation Down to +1.2V on V
L
±15kV ESD Protection on I/O VCCLines
(MAX3000E/MAX3001E)
Ultra-Low 0.1µA Supply Current in ShutdownLow Quiescent Current (< 10µA)UCSP, TQFN, and TSSOP Packages
MAX3000E/MAX3001E/MAX3002–MAX3012
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1µA,
35Mbps, 8-Channel Level Translators
________________________________________________________________
Maxim Integrated Products
MAX3000E MAX3001E MAX3002–
MAX3012
+1.8V
+3.3V
+1.8V
SYSTEM
CONTROLLER
+3.3V
SYSTEM
DATA DATA
GND
V
L
V
CC
I/O V
CC_
I/O V
L_
EN
Typical Operating Circuit
19-2672; Rev 5; 8/08
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
UCSP is a trademark of Maxim Integrated Products, Inc.
SPI is a trademark of Motorola, Inc.
MICROWIRE is a trademark of National Semiconductor.
Pin Configurations and Functional Diagrams appear at end of data sheet.
Note: All devices operate over the -40°C to +85°C operating
temperature range.
Ordering Information continued at end of data sheet.
PART TEMP RANGE PIN-PACKAGE
MAX3000EEUP -40°C to +85°C 20 TSSOP
MAX3000EEBP-T -40°C to +85°C 4 x 5 UCSP
Ordering Information
MAX3000E/MAX3001E/MAX3002–MAX3012
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1µA, 35Mbps, 8-Channel Level Translators
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to GND.) V
CC
...........................................................................-0.3V to +6V
V
L...........................................................................................
-0.3V to +6V
I/O V
CC_
......................................................-0.3V to (VCC+ 0.3V)
I/O V
L_
...........................................................-0.3V to (VL+ 0.3V)
EN, EN A/B ...............................................................-0.3V to +6V
Short-Circuit Duration I/O V
L_
, I/O V
CC_
to GND .......Continuous
Continuous Power Dissipation (T
A
= +70°C)
20-Pin TSSOP (derate 7.0mW/°C above +70°C) .........559mW
20-Bump UCSP (derate 10mW/°C above +70°C) .......800mW
20-Pin 5mm x 5mm TQFN
(derate 20.0mW/°C above +70°C) .....................................1667mW
Operating Temperature Ranges
MAX3001EAUP..............................................-40°C to +125°C
MAX300_EE_P .................................................-40°C to +85°C
MAX30_ _E_P ..................................................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
ELECTRICAL CHARACTERISTICS
(VCC= +1.65V to +5.5V, VL= +1.2V to VCC, EN = VL(MAX3000E/MAX3001E/MAX3002/MAX3004–MAX3012), EN A/B = VLor 0 (MAX3003), T
A
= T
MIN
to T
MAX
. Typical values are at VCC= +1.65V, VL= +1.2V, and TA= +25°C.) (Notes 1, 2)
PARAMETER
CONDITIONS
POWER SUPPLIES
VL Supply Range V
L
1.2
V
VCC Supply Range V
CC
V
I/O V CC_ = 0, I/O V L _ = 0 or I/O V
CC
_ = VCC, I/O V L _ = VL,
MAX3000E/MAX3002–MAX3012
0.1 10
Supply Current from V
CC
I
QVCC
I/O V CC_ = 0, I/O V L _ = 0 or I/O V
CC
_ = VCC, I/O V L _ = VL,
MAX3001E
0.1 50
µA
I/O V CC_ = 0, I/O V L _ = 0 or I/O V
CC
_ = VCC, I/O V L _ = VL,
MAX3000E/MAX3002–MAX3012
0.1 10
Supply Current from V
L
I
QVL
I/O V CC_ = 0, I/O V L _ = 0 or I/O V
CC
_ = VCC, I/O V L _ = VL,
MAX3001E
0.1 50
µA
TA = +25°C, EN = 0, MAX3000E/MAX3001E/MAX3002/ MAX3004–MAX3012
0.1 2
V
CC
Shutdown Supply Current
TA = +25°C, EN A/B = 0, MAX3003
0.1 2
µA
TA = +25°C, EN = 0, MAX3000E/MAX3001E/MAX3002/ MAX3004–MAX3012
0.1 2
V
L
Shutdown Supply Current
TA = +25°C, EN A/B = 0, MAX3003
0.1 2
µA
SYMBOL
MIN TYP MAX UNITS
I
SHDN-VCC
I
SHDN-VL
1.65 5.50
V
CC
MAX3000E/MAX3001E/MAX3002–MAX3012
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1µA,
35Mbps, 8-Channel Level Translators
_______________________________________________________________________________________ 3
ELECTRICAL CHARACTERISTICS (continued)
(VCC= +1.65V to +5.5V, VL= +1.2V to VCC, EN = VL(MAX3000E/MAX3001E/MAX3002/MAX3004–MAX3012), EN A/B = VLor 0 (MAX3003), T
A
= T
MIN
to T
MAX
. Typical values are at VCC= +1.65V, VL= +1.2V, and TA= +25°C.) (Notes 1, 2)
PARAMETER
CONDITIONS
TA = +25°C, EN = 0, MAX3000E/MAX3001E/MAX3002/ MAX3004–MAX3012
0.1 2
I/O V
CC
_ Three-State Output
Leakage Current
T
A
= +25°C, EN A/B = 0,
MAX3003
0.1 2
µA
I/O V
L
_ Three-State Output
Leakage Current
EN A/B = 0, MAX3003 0.1 2 µA
I/O V
L _
Pulldown Resistance
During Shutdown
EN = 0, MAX3000E/MAX3001E/MAX3002/ MAX3004–MAX3012
kΩ
E N or EN A/B Inp ut Leakag e C ur rent
TA = +25°C1µA
LOGIC-LEVEL THRESHOLDS
I/O V
L
_ Input-Voltage High
Threshold
V
IHL
V
I/O V
L
_ Input-Voltage Low
Threshold
V
ILL
1/3 x V
L
V
I/O V
CC
_ Input-Voltage High
Threshold
V
IHC
V
I/O V
CC
_ Input-Voltage Low
Threshold
V
ILC
V
EN, EN A/B Input-Voltage High Threshold
V
IH
V
EN, EN A/B Input-Voltage Low Threshold
V
IL
0.4 V
I/O VL _ Output-Voltage High V
OHL
I/O V
L
_ source current = 20µA, I/O V
CC
_
V
CC
- 0.4V
V
L
- 0.4 V
I/O V
L
_ Output-Voltage Low V
OLL
I/O VL _ sink current = 20µA, I/O V
CC
_ 0.4V
0.4 V
I/O V
CC
_ Output-Voltage High V
OHC
I/O V
CC_
source current = 20µA, I/O V
L
_
V
L
- 0.4V
V
CC
- 0.4 V
I/O V
CC
_ Output-Voltage Low V
OLC
I/O V
CC
sink current = 20µA,
I/O V
L
_ 0.4V
0.4 V
ESD PROTECTION
I/O V
CC
_
Human Body Model, MAX3000E/MAX3001E
kV
SYMBOL
MIN TYP MAX UNITS
4.59 8.30
1/3 x V
CC
±15
2/3 x V
2/3 x V
VL - 0.4
L
CC
MAX3000E/MAX3001E/MAX3002–MAX3012
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1µA, 35Mbps, 8-Channel Level Translators
4 _______________________________________________________________________________________
TIMING CHARACTERISTICS
(VCC= +1.65V to +5.5V, VL= +1.2V to VCC, EN = VL(MAX3000E/MAX3001E/MAX3002/MAX3004–MAX3012), EN A/B = VLor 0 (MAX3003), T
A
= T
MIN
to T
MAX
. Typical values are at VCC= +1.65V, VL= +1.2V, and TA= +25°C.) (Notes 1, 2)
PARAMETER
CONDITIONS
RS = 50Ω , C
VCC
= 50p F, M AX 3000E ,
Fi g ur es 1a, 1b
RS = 50Ω , C
VCC
= 50p F, M AX 3001E ,
Fi g ur es 1a, 1b
25 50
I/O VCC_ Rise Time t
RVCC
RS = 50Ω , C
VCC
= 50p F,
M AX 3002–M AX 3012, Fi g ur es 1a, 1b
15
ns
RS = 50Ω , C
VCC
= 50p F, M AX 3000E ,
Fi g ur es 1a, 1b
RS = 50Ω , C
VCC
= 50p F, M AX 3001E ,
Fi g ur es 1a, 1b
25 50
I/O VCC_ Fall Time t
FVCC
RS = 50Ω , C
VCC
= 50p F,
M AX 3002–M AX 3012, Fi g ur es 1a, 1b
15
ns
RS = 50Ω , C VL = 50p F, M AX 3000E , Fi g ur es 2a, 2b
RS = 50Ω , C VL = 50p F, M AX 3001E , Fi g ur es 2a, 2b
25 50
I/O V
L
_ Rise Time t
RVL
RS = 50Ω , C VL = 15p F, M AX 3002–M AX 3012, Fi g ur es 2a, 2b
15
ns
RS = 50Ω , C VL = 50p F, M AX 3000E , Fi g ur es 2a, 2b
RS = 50Ω , C VL = 50p F, M AX 3001E , Fi g ur es 2a, 2b
25 65
I/O V
L
_ Fall Time t
FVL
RS = 50Ω , C VL = 15p F, M AX 3002–M AX 3012, Fi g ur es 2a, 2b
15
ns
RS = 50Ω , C
VCC
= 50p F, M AX 3000E ,
Fi g ur es 1a, 1b
RS = 50Ω , C
VCC
= 50p F, M AX 3001E ,
Fi g ur es 1a, 1b
50
Propagation Delay (Driving I/O V
L
_)
RS = 50Ω , C
VCC
= 50p F,
M AX 3002–M AX 3012, Fi g ur es 1a, 1b
20
ns
RS = 50Ω , C VL = 50p F, M AX 3000E , Fi g ur es 2a, 2b
RS = 50Ω , C VL = 50p F, M AX 3001E , Fi g ur es 2a, 2b
50
Propagation Delay (Driving I/O V
CC
_)
RS = 50Ω , C VL = 15p F, M AX 3002–M AX 3012, Fi g ur es 2a, 2b
20
ns
Note 1: All units are 100% production tested at TA= +25°C. Limits over the operating temperature range are guaranteed by design
and not production tested.
Note 2: For normal operation, ensure that V
L
< VCC. During power-up, VL> VCCdoes not damage the device.
SYM B O L
MIN TYP MAX UNITS
400 800 1200
400 800 1200
I/O
VL-VCC
I/O
VCC-VL
400 800 1200
400 800 1200
1000
1000
MAX3000E/MAX3001E/MAX3002–MAX3012
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1µA,
35Mbps, 8-Channel Level Translators
_______________________________________________________________________________________ 5
TIMING CHARACTERISTICS (continued)
(VCC= +1.65V to +5.5V, VL= +1.2V to VCC, EN = VL(MAX3000E/MAX3001E/MAX3002/MAX3004–MAX3012), EN A/B = VLor 0 (MAX3003), T
A
= T
MIN
to T
MAX
. Typical values are at VCC= +1.65V, VL= +1.2V, and TA= +25°C.) (Notes 1, 2)
PARAMETER
CONDITIONS
RS = 50Ω , C
VCC
= 50p F, C VL = 50p F,
M AX 3000E
RS = 50Ω , C
VCC
= 50p F, C VL = 50p F,
M AX 3001E
10
Channel-to-Channel Skew t
SKEW
RS = 50Ω , C
VCC
= 50p F, C
VL
= 15p F,
M AX 3002–M AX 3012
5
ns
RS = 50Ω , C
V C C
= 50p F, C
V L
= 50p F,
ΔT
A
= + 20°C , MAX3000E (N ote 3)
RS = 50Ω , C
VCC
= 50p F, C VL = 50p F,
ΔT
A
= + 20°C , M AX 3001E ( N ote 3)
30
Part-to-Part Skew
RS = 50Ω , C
VCC
= 50p F, C VL = 15p F,
ΔT
A
= + 20°C , M AX 3002–M AX 3012 ( N ote 3)
10
ns
Propagation Delay from I/O V
L _
to I/O V
CC_
after EN
C
VCC
= 50p F, M AX 3000E /M AX 3001E ,
M AX 3002–M AX 3012, Fi g ur e 3
s
C VL = 50p F, M AX 3000E /M AX 3001E / M AX 3002/M AX 3004–M AX 3012, Fi g ur e 4
2
Propagation Delay from I/O V
CC_
to I/O V
L _
after EN
t
EN-VL
C VL = 15p F, M AX 3003, Fi g ur e 4 2
µs
RS = 50Ω , C
VCC
= 50p F, C VL = 50p F,
M AX 3000E
RS = 50Ω , C
VCC
= 50p F, C VL = 50p F,
M AX 3001E
4
Maximum Data Rate
R
S
= 50Ω , C
VCC
= 50p F, C VL = 15p F,
M AX 3002–M AX 3012
20
Note 3: VCCfrom device 1 must equal VCCof device 2; VLfrom device 1 must equal VLof device 2.
SYM B O L
t
PPSKEW
t
EN-VCC
MIN TYP MAX UNITS
230 kbps
500
800
Mbps
MAX3000E/MAX3001E/MAX3002–MAX3012
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1µA, 35Mbps, 8-Channel Level Translators
6 _______________________________________________________________________________________
TIMING CHARACTERISTICS—MAX3002–MAX3012
(VCC= +1.65V to +5.5V, VL= +1.2V to VCC, EN = VL(MAX3002/MAX3004–MAX3012), EN A/B = VLor 0 (MAX3003), TA= T
MIN
to
MAX.
) (Notes 1, 2)
PARAMETER
CONDITIONS
+1.2V VL VCC +3.3V
I/O VCC_ Rise Time t
RVCC
15 ns
I/O VCC_ Fall Time t
FVCC
15 ns
I/O VL _ Rise Time t
RVL
15 ns
I/O VL _ Fall Time t
FVL
15 ns
Driving I/O VL _15
Propagation Delay
Driving I/O VCC_15
ns
Channel-to-Channel Skew t
SKEW
Each translator equally loaded
5ns
Maximum Data Rate
20
+2.5V VL VCC +3.3V
I/O VCC_ Rise Time t
RVCC
ns
I/O VCC_ Fall Time t
FVCC
ns
I/O VL _ Rise Time t
RVL
ns
I/O VL _ Fall Time t
FVL
ns
Driving I/O VL _
Propagation Delay
Driving I/O VCC_
ns
Channel-to-Channel Skew t
SKEW
Each translator equally loaded 10 ns
Maximum Data Rate 35
+1.8V VL VCC +2.5V
I/O VCC_ Rise Time t
RVCC
10 ns
I/O VCC_ Fall Time t
FVCC
10 ns
I/O VL _ Rise Time t
RVL
10 ns
I/O VL _ Fall Time t
FVL
10 ns
Driving I/O VL _15
Propagation Delay
Driving I/O VCC_10
ns
Channel-to-Channel Skew t
SKEW
Each translator equally loaded 5 ns
Maximum Data Rate 30
SYM B O L
I/O
VL-VCC
I/O
VCC-VL
I/O
VL-VCC
I/O
VCC-VL
MIN TYP MAX UNITS
8.5
8.5
8.5
8.5
8.5
8.5
Mbps
I/O
VL-VCC
I/O
VCC-VL
Mbps
Mbps
MAX3000E/MAX3001E/MAX3002–MAX3012
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1µA,
35Mbps, 8-Channel Level Translators
_______________________________________________________________________________________ 7
Typical Operating Characteristics
(TA = +25°C, unless otherwise noted.)
2000
1500
1000
500
0
-40 10-15 356085
MAX3000E/01E/02-12 toc03
TEMPERATURE (°C)
V
L
SUPPLY CURRENT (μA)
VL SUPPLY CURRENT vs. TEMPERATURE (DRIVING I/O V
CC
, VCC = 3.3V, VL = 1.8V)
DATA RATE = 20Mbps
DATA RATE = 4Mbps
DATA RATE = 230kbps
0
2000
6000
4000
8000
10,000
1.5 2.5 3.02.0 3.5 4.0 4.5 5.0 5.5
MAX3000E/01E/02-12 toc02
SUPPLY VOLTAGE (V)
V
CC
SUPPLY CURRENT (μA)
VCC SUPPLY CURRENT vs. SUPPLY VOLTAGE
(DRIVING I/O V
L
, VL = 1.8V)
DATA RATE = 230kbps
DATA RATE = 4Mbps
DATA RATE = 20Mbps
0
100
200
300
400
500
600
1.5 2.52.0 3.0 3.5 4.0 4.5 5.0 5.5
V
L
SUPPLY CURRENT vs. SUPPLY VOLTAGE
(DRIVING I/O V
L
, VL = 1.8V)
MAX3000E/01E/02-12 toc01
SUPPLY VOLTAGE (V)
V
L
SUPPLY CURRENT (μA)
DATA RATE = 20Mbps
DATA RATE = 4Mbps
DATA RATE = 230kbps
0
500
1500
1000
2000
2500
-40 10-15 35 60 85
MAX3000E/01E/02-12 toc04
TEMPERATURE (°C)
V
CC
SUPPLY CURRENT (μA)
VCC SUPPLY CURRENT vs. TEMPERATURE
(DRIVING I/O V
CC
, VCC = 3.3V, VL = 1.8V)
DATA RATE = 20Mbps
DATA RATE = 4Mbps
DATA RATE = 230kbps
0
20
40
60
80
100
10 40 5020 30 60 70 80 90 100
MAX3000E/01E/02-12 toc05
CAPACITIVE LOAD (pF)
V
L
SUPPLY CURRENT (μA)
VL SUPPLY CURRENT vs. CAPACITIVE LOAD ON
I/O V
CC
(DRIVING I/O VL, VCC = 3.3V, VL = 1.8V)
DATA RATE = 20Mbps
DATA RATE = 4Mbps
DATA RATE = 230kbps
0
2000
1000
4000
3000
6000
5000
7000
10 30 4020 50 60 70 80 90 100
MAX3000E/01E/02-12 toc06
CAPACITIVE LOAD (pF)
V
CC
SUPPLY CURRENT (μA)
V
CC
SUPPLY CURRENT vs. CAPACITIVE LOAD ON
I/O V
CC
(DRIVING I/O VL, VCC = 3.3V, V
L
= 1.8V)
DATA RATE = 20Mbps
DATA RATE = 4Mbps
DATA RATE = 230kbps
MAX3000E/01E/02-12 toc07
CAPACITIVE LOAD (pF)
RISE/FALL TIME (ns)
9080706050403020
500
1000
1500
2000
0
10 100
t
HL
MAX3000E
RISE/FALL TIME vs. CAPACITIVE LOAD ON
I/O V
CC
(DRIVING I/O VL, V
CC
= 3.3V, VL = 1.8V)
DATA RATE = 230kbps
t
LH
MAX3000E/MAX3001E/MAX3002–MAX3012
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1µA, 35Mbps, 8-Channel Level Translators
8 _______________________________________________________________________________________
Typical Operating Characteristics (continued)
(TA = +25°C, unless otherwise noted.)
0
10
20
30
40
50
60
10 3020 40 50 60 70 80 90 100
MAX3000E/01E/02-12 toc08
CAPACITIVE LOAD (pF)
RISE/FALL TIME (ns)
MAX3001E
RISE/FALL TIME vs. CAPACITIVE LOAD ON
I/O V
CC
(DRIVING I/O VL, VCC = 3.3V, VL = 1.8V)
t
HL
t
LH
DATA RATE = 4Mbps
8
6
4
2
0
10 3020 40 50
MAX3000E/01E/02-12 toc09
CAPACITIVE LOAD (pF)
RISE/FALL TIME (ns)
MAX3002–MAX3012
RISE/FALL TIME vs. CAPACITIVE LOAD ON
I/O V
CC
(DRIVING I/O VL, VCC = 3.3V, VL = 1.8V)
t
LH
t
HL
DATA RATE = 20Mbps
0
500
1000
1500
2000
10 20
60
80
100
MAX3000E/01E/02-12 toc10
CAPACITIVE LOAD (pF)
RISE/FALL TIME (ns)
MAX3000E
RISE/FALL TIME vs. CAPACITIVE LOAD ON
I/O V
L
(DRIVING I/O VCC, VCC = 3.3V, VL = 1.8V)
30
40
50
70
90
t
LH
t
HL
DATA RATE = 230kbps
0
10
20
30
40
50
60
10 3020 40 50 60 70 80 90 100
MAX3000E/01E/02-12 toc11
CAPACITIVE LOAD (pF)
RISE/FALL TIME (ns)
MAX3001E
RISE/FALL TIME vs. CAPACITIVE LOAD ON
I/O V
L
(DRIVING I/O VCC, VCC = 3.3V, VL = 1.8V)
t
HL
t
LH
DATA RATE = 4Mbps
4
3
2
1
0
10 2015 25 30
MAX3000E/01E/02-12 toc12
CAPACITIVE LOAD (pF)
RISE/FALL TIME (ns)
MAX3002–MAX3012
RISE/FALL TIME vs. CAPACITIVE LOAD ON
I/O V
L
(DRIVING I/O VCC, V
CC
= 3.3V, VL = 1.8V)
t
LH
t
HL
DATA RATE = 20Mbps
0
100
200
300
400
500
10 40 5020 30 60 70 80 90 100
MAX3000E/01E/02-12 toc13
CAPACITIVE LOAD (pF)
PROPAGATION DELAY (ns)
DATA RATE = 230kbps
t
PHL
t
PLH
MAX3000E PROPAGATION DELAY vs. CAPACITIVE LOAD ON I/O V
CC
(DRIVING I/O VL, VCC = 3.3V, V
L
= 1.8V)
MAX3000E/MAX3001E/MAX3002–MAX3012
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1µA,
35Mbps, 8-Channel Level Translators
_______________________________________________________________________________________ 9
Typical Operating Characteristics (continued)
(TA = +25°C, unless otherwise noted.)
0
100
200
300
400
500
600
10 3020 40 50 60 70 80 90 100
MAX3000E/01E/02-12 toc16
CAPACITIVE LOAD (pF)
PROPAGATION DELAY (ns)
MAX3000E PROPAGATION DELAY vs. CAPACITIVE LOAD ON I/O V
L
(DRIVING I/O VCC, VCC = 3.3V, VL = 1.8V)
t
PHL
t
PLH
DATA RATE = 230kbps
0
3
9
6
12
15
MAX3000E/01E/02-12 toc17
CAPACITIVE LOAD (pF)
PROPAGATION DELAY (ns)
10 3020 40 50
MAX3001E PROPAGATION DELAY vs. CAPACITIVE LOAD ON I/O V
L
(DRIVING I/O VCC, VCC = 3.3V, VL = 1.8V)
t
PLH
t
PHL
DATA RATE = 4Mbps
0
1
3
2
4
5
MAX3000E/01E/02-12 toc18
CAPACITIVE LOAD (pF)
PROPAGATION DELAY (ns)
10 2015 25 30
MAX3002–MAX3012 PROPAGATION DELAY vs. CAPACITIVE LOAD ON I/O V
L
(DRIVING I/O VCC, VCC = 3.3V, VL = 1.8V)
t
PLH
t
PHL
DATA RATE = 20Mbps
1μs/div
MAX3000E RAIL-TO-RAIL DRIVING
(DRIVING I/O V
L
, VCC = 3.3V, VL = 1.8V,
CV
CC
= 50pF, DATA RATE = 230kbps)
GND
I/O V
L_
1V/div
GND
MAX3000E/01E/02-12 toc19
I/O V
CC_
2V/div
40ns/div
MAX3001E RAIL-TO-RAIL DRIVING
(DRIVING I/O V
L
, VCC = 3.3V, VL = 1.8V,
CV
CC
= 50pF, DATA RATE = 4Mbps)
GND
I/O V
L_
1V/div
GND
MAX3000E/01E/02-12 toc20
I/O V
CC_
2V/div
10ns/div
MAX3002–MAX3012 RAIL-TO-RAIL DRIVING
(DRIVING I/O V
L
, VCC = 3.3V, VL = 1.8V,
CV
CC
= 50pF, DATA RATE = 20Mbps)
GND
I/O V
L_
1V/div
GND
MAX3000E/01E/02-12 toc21
I/O V
CC_
2V/div
0
10
5
20
15
25
30
10 3020 40 50
MAX3000E/01E/02-12 toc14
CAPACITIVE LOAD (pF)
PROPAGATION DELAY (ns)
MAX3001E PROPAGATION DELAY vs. CAPACITIVE LOAD ON I/O V
CC
(DRIVING I/O VL, V
CC
= 3.3V, VL = 1.8V)
t
PHL
t
PLH
DATA RATE = 4Mbps
0
4
2
8
6
10
12
10 2015 25 30
MAX3000E/01E/02-12 toc15
CAPACITIVE LOAD (pF)
PROPAGATION DELAY (ns)
MAX3002–MAX3012 PROPAGATION DELAY vs. CAPACITIVE LOAD ON I/O V
CC
(DRIVING I/O VL, V
CC
= 3.3V, VL = 1.8V)
t
PHL
t
PLH
DATA RATE = 20Mbps
MAX3000E/MAX3001E/MAX3002–MAX3012
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1µA, 35Mbps, 8-Channel Level Translators
10 ______________________________________________________________________________________
Pin Description
PIN
TSSOP
NAME FUNCTION
1 B1 19 I/O VL1 Input/Output 1, Referenced to V
L
2A120 VLLogic Input Voltage, +1.2V VL VCC. Bypass VL to GND with a 0.1µF capacitor.
3 A2 1 I/O VL2 Input/Output 2, Referenced to V
L
4 B2 2 I/O VL3 Input/Output 3, Referenced to V
L
5 A3 3 I/O VL4 Input/Output 4, Referenced to V
L
6 B3 4 I/O VL5 Input/Output 5, Referenced to V
L
7 A4 5 I/O VL6 Input/Output 6, Referenced to V
L
8 B4 6 I/O VL7 Input/Output 7, Referenced to V
L
9 A5 7 I/O VL8 Input/Output 8, Referenced to V
L
10 B5 8 EN
Enable Input. If EN is pulled low, I/O V
CC
1 to I/O VCC8 are in three-state, while I/O VL1
to I/O V
L
8 have internal 6kΩ pulldown resistors. Drive EN high (VL) for normal
operation.
11 C5 9 GND Ground
12 D5 10
Input/Output 8, Referenced to V
CC
13 C4 11
Input/Output 7, Referenced to V
CC
14 D4 12
Input/Output 6, Referenced to V
CC
15 C3 13
Input/Output 5, Referenced to V
CC
16 D3 14
Input/Output 4, Referenced to V
CC
17 C2 15
Input/Output 3, Referenced to V
CC
18 D2 16
Input/Output 2, Referenced to V
CC
19 D1 17 V
CC
20 C1 18
Input/Output 1, Referenced to V
CC
EP EP Exposed Pad. Connect to GND.
MAX3000E/MAX3001E/MAX3002
UCSP TQFN
I/O VCC8
I/O VCC7
I/O VCC6
I/O VCC5
I/O VCC4
I/O VCC3
I/O VCC2
VCC Input Voltage, +1.65V VCC +5.5V. Bypass VCC to GND with a 0.1µF capacitor.
I/O VCC1
MAX3000E/MAX3001E/MAX3002–MAX3012
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1µA,
35Mbps, 8-Channel Level Translators
______________________________________________________________________________________ 11
Pin Description (continued)
PIN
TSSOP
NAME FUNCTION
1B119
Input/Output 1A, Referenced to V
L
2A120 VLLogic Input Voltage, +1.2V VL VCC. Bypass VL to GND with a 0.1µF capacitor.
3A21
Input/Output 2A, Referenced to V
L
4B22
Input/Output 3A, Referenced to V
L
5A33
Input/Output 4A, Referenced to V
L
6B34
Input/Output 1B, Referenced to V
L
7A45
Input/Output 2B, Referenced to V
L
8B46
Input/Output 3B, Referenced to V
L
9A57
Input/Output 4B, Referenced to V
L
10 B5 8 EN A/B
Enable Input. If EN A/B is pulled low, channels 1B through 4B are active, and channels 1A through 4A are in three-state. If EN A/B is driven high to VL, channels 1A through 4A are active, and channels 1B through 4B are in three-state.
11 C5 9 GND Ground
12 D5 10
Input/Output 4B, Referenced to V
CC
13 C4 11
Input/Output 3B, Referenced to V
CC
14 D4 12
Input/Output 2B, Referenced to V
CC
15 C3 13
Input/Output 1B, Referenced to V
CC
16 D3 14
Input/Output 4A, Referenced to V
CC
17 C2 15
Input/Output 3A, Referenced to V
CC
18 D2 16
Input/Output 2A, Referenced to V
CC
19 D1 17 V
CC
20 C1 18
Input/Output 1A, Referenced to V
CC
EP EP Exposed Pad. Connect to GND.
MAX3003
UCSP TQFN
I/O VL1A
I/O VL2A
I/O VL3A
I/O VL4A
I/O VL1B
I/O VL2B
I/O VL3B
I/O VL4B
I/O VCC4B
I/O VCC3B
I/O VCC2B
I/O VCC1B
I/O VCC4A
I/O VCC3A
I/O VCC2A
I/O VCC1A
VCC Input Voltage, +1.65V VCC +5.5V. Bypass VCC to GND with a 0.1µF capacitor.
MAX3000E/MAX3001E/MAX3002–MAX3012
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1µA, 35Mbps, 8-Channel Level Translators
12 ______________________________________________________________________________________
Pin Description (continued)
NAME FUNCTION (Note 1)
V
CC
V
CC
Input Voltage, +1.65V < VCC < +5.5V. Bypass VCC to GND with a 0.1µF capacitor.
V
L
Logic Input Voltage, +1.2V ≤ VL VCC. Bypass VL to GND with a 0.1µF capacitor.
GND Ground
EN
(MAX3004)
Enable Input. If EN is pulled low, OVCC1–OVCC8 are in three-state, while IVL1–IVL8 have 6kΩ pulldown resistors. Drive EN high (V
L
) for normal operation.
EN
(MAX3005)
Enable Input. If EN is pulled low, IVCC1 and OVCC2–OVCC8 are in three-state, while OVL1 and IVL2–IVL8 have 6kΩ pulldown resistors. Drive EN high (V
L
) for normal operation.
EN
(MAX3006)
Enable Input. If EN is pulled low, IVCC1, IVCC2, and OVCC3–OVCC8 are in three-state, while OVL1, OVL2, and IV
L
3–IVL8 have 6kΩ pulldown resistors. Drive EN high (VL) for normal operation.
EN
(MAX3007)
Enable Input. If EN is pulled low, IVCC1, IVCC2, IVCC3, and OVCC4–OVCC8 are in three-state, while OVL1, OV
L
2, OVL3, and IVL4–IVL8 have 6kΩ pulldown resistors. Drive EN high (VL) for normal operation.
EN
(MAX3008)
Enable Input. If EN is pulled low, IVCC1–IVCC4 and OVCC5–OVCC8 are in three-state, while OVL1–OVL4 and IV
L
5–IVL8 have 6kΩ pulldown resistors. Drive EN high (VL) for normal operation.
EN
(MAX3009)
Enable Input. If EN is pulled low, IVCC1–IVCC5, OVCC6, OVCC7, and OVCC8 are in three-state, while OV
L
1–OVL5, IVL6, IVL7, and IVL8 have 6kΩ pulldown resistors. Drive EN high (VL) for normal operation.
EN
(MAX3010)
Enable Input. If EN is pulled low, IVCC1–IVCC6, OVCC7, and OVCC8 are in three-state, while OVL1–OVL6, IVL7, and IV
L
8 have 6kΩ pulldown resistors. Drive EN high (VL) for normal operation.
EN
(MAX3011)
Enable Input. If EN is pulled low, IVCC1–IVCC7 and OVCC8 are in three-state, while OVL1–OVL7 and IVL8 have 6kΩ pulldown resistors. Drive EN high (V
L
) for normal operation.
EN
(MAX3012)
Enable Input. If EN is pulled low, IVCC1–IVCC8 are in three-state, while OVL1–OVL8 have 6kΩ pulldown resistors. Drive EN high (V
L
) for normal operation.
IVL1–IVL8 Inputs Referenced to VL, Numbers 1 to 8
OVL1–OVL8 Outputs Referenced to VL, Numbers 1 to 8
IVCC1–IVCC8 Inputs Referenced to VCC, Numbers 1 to 8
OVCC1–OVCC8
Outputs Referenced to VCC, Numbers 1 to 8
MAX3004–MAX3012
Note 1: For specific pin numbers, see the
Pin Configurations
.
MAX3000E/MAX3001E/MAX3002–MAX3012
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1µA,
35Mbps, 8-Channel Level Translators
______________________________________________________________________________________ 13
______________________________________________Test Circuits/Timing Diagrams
MAX3000E/MAX3001E/
MAX3002/MAX3003
SOURCE
R
S
I/O V
L
EN
V
L
V
CC
I/O V
CC
C
VCC
I/O
VL-VCC
I/O
VL-VCC
I/O V
CC
I/O V
L
90%
50%
10%
90%
50%
10%
t
RISE/FALL
3ns
t
FVCC
t
RVCC
SOURCE
R
S
I/O V
L
EN
V
L
V
CC
I/O V
CC
C
VL
MAX3000E/MAX3001E/
MAX3002/MAX3003
I/O
VCC-VL
I/O
VCC-VL
I/O V
L
I/O V
CC
90%
50%
10%
90%
50%
10%
t
RISE/FALL
3ns
t
FVL
t
RVL
Figure 1a. Driving I/O V
L
Figure 1b. Timing for Driving I/O V
L
Figure 2a. Driving I/O V
CC
Figure 2b. Timing for Driving I/O V
CC
MAX3000E/MAX3001E/MAX3002–MAX3012
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1µA, 35Mbps, 8-Channel Level Translators
14 ______________________________________________________________________________________
_________________________________Test Circuits/Timing Diagrams (continued)
SOURCE
EN
I/O V
CC
I/O V
L
C
VCC
V
L
EN
I/O V
L
I/O V
CC
t'
EN-VCC
V
L
V
L
V
CC
0
0
SOURCE
EN
I/O V
CC
I/O V
L
C
VCC
V
L
EN
I/O V
L
I/O V
CC
V
CC 2
t"
EN-VCC
V
L
V
L
V
CC
0
0
0
t
EN-VCC
IS WHICHEVER IS LARGER BETWEEN t'
EN-VCC
AND t"
EN-VCC
MAX3000E/MAX3001E/
MAX3002/MAX3003
MAX3000E/MAX3001E/
MAX3002/MAX3003
V
CC 2
Figure 3. Propagation Delay from I/O VLto I/O VCCAfter EN
SOURCE
EN
I/O V
CC
I/O V
L
C
VL
V
CC
EN
I/O V
L
I/O V
CC
t'
EN-VL
V
L
V
L
V
CC
0
0
0
SOURCE
EN
I/O V
CC
I/O V
L
C
VL
V
CC
EN
I/O V
L
I/O V
CC
t"
EN-VL
V
L
V
L
V
CC
0
0
0
t
EN-VL
IS WHICHEVER IS LARGER BETWEEN t'
EN-VL
AND t"
EN-VL
MAX3000E/MAX3001E/
MAX3002/MAX3003
MAX3000E/MAX3001E/
MAX3002/MAX3003
V
L
2
V
L
2
Figure 4. Propagation Delay from I/O VCCto I/O VLAfter EN
MAX3000E/MAX3001E/MAX3002–MAX3012
Detailed Description
The MAX3000E/MAX3001E/MAX3002–MAX3012 logic­level translators provide the level shifting necessary to allow data transfer in a multivoltage system. Externally applied voltages, V
CC
and VL, set the logic levels on either side of the device. Logic signals present on the VLside of the device appear as a higher voltage logic signal on the VCCside of the device, and vice-versa. The MAX3000E/MAX3001E/MAX3002/MAX3003 are bidirectional level translators allowing data translation in either direction (VL↔ VCC) on any single data line. These devices use an architecture specifically designed to be bidirectional without the use of a direc­tion pin. The MAX3004–MAX3012 unidirectional level translators level shift data in one direction (VL → VCCor V
CC
VL) on any single data line. The
MAX3000E/MAX3001E/ MAX3002–MAX3012 accept V
from +1.2V to +5.5V. All devices have VCCranging from +1.65V to +5.5V, making them ideal for data trans­fer between low-voltage ASICs/PLDs and higher volt­age systems.
The MAX3000E/MAX3001E/MAX3002/MAX3004– MAX3012 feature an output enable mode that reduces VCCsupply current to less than 2µA, and VLsupply current to less than 2µA when in shutdown. The MAX3000E/MAX3001E have ±15kV ESD protection on the VCCside for greater protection in applications that route signals externally. The MAX3000E operates at a guaranteed data rate of 230kbps; the MAX3001E oper­ates at a guaranteed data rate of 4Mbps and the MAX3002–MAX3012 are guaranteed with a data rate of 20Mbps of operation over the entire specified operating voltage range.
Level Translation
For proper operation, ensure that +1.65V ≤ VCC≤ +5.5V, +1.2V ≤ VL≤ +5.5V, and VL≤ VCC. During power-up sequencing, V
VCCdoes not damage the device. During power-supply sequencing, when VCCis floating and VLis powering up, up to 10mA current can be sourced to each load on the V
L
side, yet the device does
not latch up.
The maximum data rate also depends heavily on the load capacitance (see the
Typical Operating
Characteristics
), output impedance of the driver, and
the operational voltage range (see the
Timing
Characteristics
table).
Input Driver Requirements
The MAX3001E/MAX3002–MAX3012 architecture is based on a one-shot accelerator output stage. See Figure 5. Accelerator output stages are always in three-
state except when there is a transition on any of the translators on the input side, either I/O VLor I/O VCC.
When there is such a transition, the accelerator stages become active, charging (discharging) the capacitances at the I/Os. Due to its bidirectional nature, both stages become active during the one-shot pulse. This can lead to some current feeding into the external source that is driving the translator. However, this behavior helps to speed up the transition on the driven side.
For proper full-speed operation, the output current of a device that drives the inputs of the MAX3000E/ MAX3001E/MAX3002–MAX3012 should meet the fol­lowing requirements:
• MAX3000E (230kbps): i > 1mA, R
drv
< 1kΩ
• MAX3001E (4Mbps): i > 10
7
x V x (C + 10pF)
• MAX3002–MAX3012 (20Mbps): i > 108x V x (C + 10pF)
where i is the driver output current, V is the logic-supply voltage (i.e., V
or VCC) and C is the parasitic capaci-
tance of the signal line.
Enable Output Mode (EN, EN A/B)
The MAX3000E/MAX3001E/MAX3002 and the MAX3004– MAX3012 feature an EN input, and the MAX3003 has an EN A/B input. Pull EN low to set the MAX3000E/ MAX3001E/MAX3002/MAX3004–MAX3012s’ I/O VCC1 through I/O VCC8 in three-state output mode, while I/O VL1 through I/O VL8 have internal 6kΩ pulldown resistors. Drive EN to logic-high (V
) for normal operation. The MAX3003 is intended for bus multiplexing or bus switch­ing applications. Drive EN A/B low to place channels 1B through 4B in active mode, while channels 1A through 4A are in three-state mode. Drive EN A/B to logic-high (V
) to enable channels 1A through 4A, while channels
1B through 4B remain in three-state mode.
±15kV ESD Protection
As with all Maxim devices, ESD-protection structures are incorporated on all pins to protect against electro­static discharges encountered during handling and assembly. The I/O V
CC
lines have extra protection against static discharge. Maxim’s engineers have developed state-of-the-art structures to protect these pins against ESD of ±15kV without damage. The ESD structures withstand high ESD in all states: normal operation, three-state output mode, and powered down. After an ESD event, Maxim’s E versions keep working without latchup, whereas competing products can latch and must be powered down to remove latchup.
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1µA,
35Mbps, 8-Channel Level Translators
______________________________________________________________________________________ 15
MAX3000E/MAX3001E/MAX3002–MAX3012
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1µA, 35Mbps, 8-Channel Level Translators
16 ______________________________________________________________________________________
ESD protection can be tested in various ways. The I/O VCClines of the MAX3000E/MAX3001E are char­acterized for protection to ±15kV using the Human Body Model.
ESD Test Conditions
ESD performance depends on a variety of conditions. Contact Maxim for a reliability report that documents test setup, test methodology, and test results.
Human Body Model
Figure 7a shows the Human Body Model and Figure 7b shows the current waveform it generates when dis­charged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of interest, which is then discharged into the test device through a
1.5kΩ resistor.
Machine Model
The Machine Model for ESD tests all pins using a 200pF storage capacitor and zero discharge resis­tance. Its objective is to emulate the stress caused by contact that occurs with handling and assembly during manufacturing. Of course, all pins require this protec­tion during manufacturing, not just inputs and outputs. Therefore, after PCB assembly, the Machine Model is less relevant to I/O ports.
P
ONE-SHOT
V
CC
V
L
I/O V
L
I/O V
CC
6kΩ
6kΩ
I/O V
CC_
TO I/O V
L_
PATH
I/O V
L_
TO I/O V
CC_
PATH
N
ONE-SHOT
P
ONE-SHOT
N
ONE-SHOT
Figure 5. MAX3001E/MAX3002–MAX3012 Simplified Functional Diagram (1 I/O Line)
0
V
TH_IN
/ 6kΩ
-(V
S
- V
TH_IN
) / 6kΩ
I
IN
V
TH_IN
V
S
V
IN
WHERE VS = VCC OR V
L
Figure 6. Typical IINvs. V
IN
Applications Information
Power-Supply Decoupling
To reduce ripple and the chance of transmitting incor­rect data, bypass V
and VCCto ground with a 0.1µF capacitor. To ensure full ±15kV ESD protection, bypass VCCto ground with a 1µF capacitor. Place all capaci­tors as close to the power-supply inputs as possible.
I2C Level Translation
For I2C level translation for I2C applications, please refer to the MAX3372E–MAX3379E/MAX3390E–MAX3393E datasheet.
Unidirectional vs. Bidirectional Level
Translator
The MAX3000E/MAX3001E/MAX3002/MAX3003 bidi­rectional translators can operate as a unidirectional device to translate signals without inversion. The MAX3004–MAX3012 unidirecitional level translators, level-shift data in one direction (V
VCCor VCC→ V
L)
on any single data line (see the
Ordering Information
.) These devices provide the smallest solution (UCSP package) for unidirectional level translation without inversion.
MAX3000E/MAX3001E/MAX3002–MAX3012
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1µA,
35Mbps, 8-Channel Level Translators
______________________________________________________________________________________ 17
MAX3000E/MAX3001E/MAX3002–MAX3012
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1µA, 35Mbps, 8-Channel Level Translators
18 ______________________________________________________________________________________
HIGH-
VOLTAGE
DC
SOURCE
DEVICE
UNDER
TEST
R
C
1MΩ RD 1500Ω
CHARGE-CURRENT-
LIMIT RESISTOR
DISCHARGE RESISTANCE
STORAGE CAPACITOR
C
S
100pF
Figure 7a. Human Body ESD Test Model
100%
90%
36.8%
t
RL
t
DL
TIME
CURRENT WAVEFORM
PEAK-TO-PEAK RINGING (NOT DRAWN TO SCALE)
10%
0
0
AMPERES
I
P
I
r
Figure 7b. Human Body Current Waveform
PART EN EN A/B Tx/Rx* DATA RATE
ESD PROTECTION
(kV)
MAX3000E 8/8 230kbps ± 15 MAX3001E 8/8 4Mbps ± 15
MAX3002 8/8 ** ± 2 MAX3003 8/8 ** ± 2 MAX3004 8/0 ** ± 2 MAX3005 7/1 ** ± 2 MAX3006 6/2 ** ± 2 MAX3007 5/3 ** ± 2 MAX3008 4/4 ** ± 2 MAX3009 3/5 ** ± 2 MAX3010 2/6 ** ± 2 MAX3011 1/7 ** ± 2 MAX3012 0/8 ** ± 2
Selector Guide
*
T
x
=
V
L
VCC; Rx= V
CC
V
L
**
See Table 1.
VL V
CC
(V)
MAX3002–MAX3012
GUARANTEED DATA RATE
(Mbps)
1.2 5.5 40
1.2 3.3 20
2.5 3.3 35
1.8 2.5 30
1.2 2.5 20
1.2 1.8 20
Table 1. Data Rate
MAX3000E/MAX3001E/MAX3002–MAX3012
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1µA,
35Mbps, 8-Channel Level Translators
______________________________________________________________________________________ 19
MAX3000E/
MAX3001E/MAX3002
V
L
V
CC
EN
I/O V
L
1
I/O V
L
2
I/O V
L
3
I/O V
L
4
I/O VL5
I/O V
L
6
I/O V
L
7
I/O V
L
8 I/O VCC8
I/O V
CC
7
I/O VCC6
I/O V
CC
5
I/O VCC4
I/O VCC3
I/O V
CC
2
I/O V
CC
1
GND
MAX3000E/MAX3001E/MAX3002 Functional Diagram
MAX3000E/MAX3001E/MAX3002–MAX3012
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1µA, 35Mbps, 8-Channel Level Translators
20 ______________________________________________________________________________________
MAX3003
V
L
V
CC
EN A/B
I/O V
L
1A
I/O V
L
2A
I/O V
L
3A
I/O V
L
4A
I/O VL1B
I/O VL2B
I/O V
L
3B
I/O V
L
4B I/O VCC4B
I/O V
CC
3B
I/O V
CC
2B
I/O VCC1B
I/O VCC4A
I/O VCC3A
I/O V
CC
2A
I/O V
CC
1A
GND
MAX3003 Functional Diagram
MAX3000E/MAX3001E/MAX3002–MAX3012
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1µA,
35Mbps, 8-Channel Level Translators
______________________________________________________________________________________ 21
MAX3000E/MAX3001E/MAX3002
MAX3004–MAX3012
20 UCSP (Bottom View)
MAX3003
20 UCSP (Bottom View)
I/O VCC2V
CC
I/O VCC4I/O VCC6
I/O V
CC
3I/O VCC1I/O V
CC
5I/O VCC7
I/O V
L
3I/O VL1I/O V
L
5I/O VL7
I/O VL2V
L
I/O VL4I/O VL6
I/O VCC8
GND
EN
I/O VL8
1
B
A
C
D
2345
I/O V
CC
4AV
CC
I/O VCC2B I/O VCC4B
I/O V
CC
1BI/O VCC1A I/O VCC3B GND
I/O VL1BI/O VL1A I/O VL3B EN A/B
I/O VL4AV
L
I/O VL2B I/O VL4B
I/O V
CC
2A
I/O V
CC
3A
I/O VL3A
I/O VL2A
1
B
A
C
D
3452
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
V
L
I/O VL1
I/O V
L
2
I/O VL3
I/O V
L
4
I/O VL5
I/O V
L
6
I/O VL7
I/O V
L
8
EN
TOP VIEW
12
11
9
10
I/O VCC8
I/O V
CC
7
I/O V
CC
6
I/O V
CC
5
I/O V
CC
4
I/O V
CC
3
I/O V
CC
2
V
CC
I/O VCC1
GND
MAX3000E/MAX3001E/MAX3002
TSSOP
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
V
L
I/O VL1A
I/O V
L
2A
I/O VL3A
I/O V
L
4A
I/O VL1B
I/O V
L
2B
I/O VL3B
I/O V
L
4B
EN A/B
12
11
9
10
I/O VCC4B
I/O V
CC
3B
I/O V
CC
2B
I/O V
CC
1B
I/O V
CC
4A
I/O V
CC
3A
I/O V
CC
2A
V
CC
I/O VCC1A
GND
MAX3003
TSSOP
20
19
18
17
V
L
I/O V
L
1A
I/O V
CC
1A
V
CC
16 I/O V
CC
2A
13
12
11
14
15
I/O V
CC
2B
*EXPOSED PADDLE
I/O V
CC
1B
I/O V
CC
4A
I/O V
CC
3A
I/O VCC3B
4
3
2
1
I/O VL1B
I/O V
L
4A
I/O V
L
3A
I/O V
L
2A
5I/O VL2B
6
7
8
9
I/O V
L
3B
I/O V
L
4B
EN A/B
I/O V
CC
4B
10
GND
TOP VIEW
5mm
5mm THIN QFN
MAX3003
20
191817
V
L
I/O V
L
1
I/O V
CC
1
V
CC
16 I/O V
CC
2
13
12
11
14
15
I/O V
CC
6
*EXPOSED PADDLE
I/O V
CC
5
I/O V
CC
4
I/O V
CC
3
I/O VCC7
4
3
2
1
I/O VL5
I/O V
L
4
I/O V
L
3
I/O V
L
2
5I/O VL6
6
7
8
9
I/O V
L
7
I/O V
L
8
EN
GND
10I/O V
CC
8
5mm ✕ 5mm THIN QFN
MAX3000E/ MAX3001E/
MAX3002
Pin Configurations
MAX3000E/MAX3001E/MAX3002–MAX3012
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1µA, 35Mbps, 8-Channel Level Translators
22 ______________________________________________________________________________________
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
V
L
I VL1
I V
L
2
I V
L
3
I V
L
4
I VL5
I V
L
6
I VL7
I V
L
8
EN
TOP VIEW
12
11
9
10
O VCC8
O V
CC
7
O V
CC
6
O V
CC
5
O V
CC
4
O V
CC
3
O V
CC
2
V
CC
O VCC1
GND
MAX3004
TSSOP
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
V
L
O VL1
I V
L
2
I V
L
3
I V
L
4
I VL5
I V
L
6
I VL7
I V
L
8
EN
12
11
9
10
O VCC8
O V
CC
7
O V
CC
6
O V
CC
5
O V
CC
4
O V
CC
3
O V
CC
2
V
CC
I VCC1
GND
MAX3005
TSSOP
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
V
L
O VL1
O V
L
2
I V
L
3
I V
L
4
I VL5
I V
L
6
I VL7
I V
L
8
EN
12
11
9
10
O VCC8
O V
CC
7
O V
CC
6
O V
CC
5
O V
CC
4
O V
CC
3
I V
CC
2
V
CC
I VCC1
GND
MAX3006
TSSOP
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
V
L
O VL1
O V
L
2
O VL3
I V
L
4
I VL5
I V
L
6
I VL7
I V
L
8
EN
12
11
9
10
O VCC8
O V
CC
7
O V
CC
6
O V
CC
5
O VCC4
I V
CC
3
I VCC2
V
CC
I VCC1
GND
MAX3007
TSSOP
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
V
L
O VL1
O V
L
2
O VL3
O V
L
4
I VL5
I V
L
6
I VL7
I V
L
8
EN
12
11
9
10
O VCC8
O V
CC
7
O V
CC
6
O V
CC
5
I VCC4
I V
CC
3
I VCC2
V
CC
I VCC1
GND
MAX3008
TSSOP
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
V
L
O VL1
O V
L
2
O VL3
O V
L
4
O VL5
I V
L
6
I VL7
I V
L
8
EN
12
11
9
10
O VCC8
O V
CC
7
O V
CC
6
I V
CC
5
I VCC4
I V
CC
3
I VCC2
V
CC
I VCC1
GND
MAX3009
TSSOP
Pin Configurations (continued)
MAX3000E/MAX3001E/MAX3002–MAX3012
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1µA,
35Mbps, 8-Channel Level Translators
______________________________________________________________________________________ 23
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
V
L
O V
L
1
O V
L
2
O V
L
3
O V
L
4
O V
L
5
O V
L
6
I VL7
I V
L
8
EN
12
11
9
10
O VCC8
O V
CC
7
I V
CC
6
I V
CC
5
I V
CC
4
I V
CC
3
I V
CC
2
V
CC
I VCC1
GND
MAX3010
TSSOP
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
V
L
O V
L
1
O V
L
2
O V
L
3
O V
L
4
O V
L
5
O V
L
6
O VL7
I V
L
8
EN
12
11
9
10
O VCC8
I V
CC
7
I V
CC
6
I V
CC
5
I V
CC
4
I V
CC
3
I V
CC
2
V
CC
I VCC1
GND
MAX3011
TSSOP
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
V
L
O V
L
1
O V
L
2
O V
L
3
O V
L
4
O V
L
5
O V
L
6
O VL7
O V
L
8
EN
12
11
9
10
I VCC8
I V
CC
7
I V
CC
6
I V
CC
5
I V
CC
4
I V
CC
3
I V
CC
2
V
CC
I VCC1
GND
MAX3012
TSSOP
TOP VIEW
Pin Configurations (continued)
Ordering Information (continued)
*
Future product—contact factory for availability.
-T = Tape-and-reel package.
PART TEMP RANGE PIN-PACKAGE
MAX3001EEUP -40°C to +85°C 20 TSSOP
MAX3001EEBP-T*
-40°C to +85°C 4 x 5 UCSP
MAX3001EETP -40°C to +85°C 20 TQFN
MAX3001EAUP
20 TSSOP
MAX3002EUP -40°C to +85°C 20 TSSOP
MAX3002EBP-T* -40°C to +85°C 4 x 5 UCSP
MAX3002ETP -40°C to +85°C 20 TQFN
MAX3003EUP -40°C to +85°C 20 TSSOP
MAX3003EBP-T* -40°C to +85°C 4 x 5 UCSP
MAX3003ETP -40°C to +85°C 20 TQFN
MAX3004EUP -40°C to +85°C 20 TSSOP
MAX3004EBP-T* -40°C to +85°C 4 x 5 UCSP
MAX3005EUP -40°C to +85°C 20 TSSOP
MAX3005EBP-T* -40°C to +85°C 4 x 5 UCSP
MAX3006EUP -40°C to +85°C 20 TSSOP
MAX3006EBP-T* -40°C to +85°C 4 x 5 UCSP
PART TEMP RANGE PIN-PACKAGE
MAX3007EUP -40°C to +85°C 20 TSSOP
MAX3007EBP-T* -40°C to +85°C 4 x 5 UCSP
MAX3008EUP -40°C to +85°C 20 TSSOP
MAX3008EBP-T* -40°C to +85°C 4 x 5 UCSP
MAX3009EUP -40°C to +85°C 20 TSSOP
MAX3009EBP-T* -40°C to +85°C 4 x 5 UCSP
MAX3010EUP -40°C to +85°C 20 TSSOP
MAX3010EBP-T* -40°C to +85°C 4 x 5 UCSP
MAX3011EUP -40°C to +85°C 20 TSSOP
MAX3011EBP-T* -40°C to +85°C 4 x 5 UCSP
MAX3012EUP -40°C to +85°C 20 TSSOP
MAX3012EBP-T* -40°C to +85°C 4 x 5 UCSP
Chip Information
TRANSISTOR COUNT: 1184
PROCESS: BiCMOS
-40°C to +125°C
MAX3000E/MAX3001E/MAX3002–MAX3012
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1µA, 35Mbps, 8-Channel Level Translators
24 ______________________________________________________________________________________
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
20 TSSOP U20-3
21-0066
20 TQFN T2055-4
21-0140
4 x 5 UCSP B20-1
21-0095
Package Information
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages.
MAX3000E/MAX3001E/MAX3002–MAX3012
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1µA,
35Mbps, 8-Channel Level Translators
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________
25
© 2008 Maxim Integrated Products is a registered trademark of Maxim Integrated Products.
Revision History
REVISION
NUMBER
REVISION
DATE
DESCRIPTION
PAGES
CHANGED
4 12/06 Added TQFN packages
1, 2, 3, 10, 11, 15,
16, 21, 23–26
5 8/08 Changed pin description and package drawing 1, 10, 11, 23
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