The MAX2692/MAX2695 low-noise amplifiers (LNAs) are
designed for WLAN/WiMAXM applications. Designed
in Maxim’s advanced SiGe process, the devices
achieve high gain and low noise figure while maximizing
3rd-order intercept point.
The devices operate from a +1.6V to +3.6V single supply.
The optional shutdown feature in the devices reduces the
supply current to less than 10FA. The devices are available in a very small, lead-free, RoHS-compliant, 0.86mm
x 0.86mm x 0.65mm wafer-level package (WLP).
Applications
Smart Phones
Notebook PCs/Tablets
Industrial WLAN/WiMAX
Embedded Modules
Automotive
Features
S 2.5GHz WLAN (MAX2692)
S 3.7GHz WiMAX (MAX2695)
S High-Power Gain: 18dB (MAX2692)
S Low Noise Figure: 1.1dB (MAX2692)
S High-Input-IP3: -3dBm (MAX2695)
S Integrated 50Ω Output Matching Circuit
S Low Supply Current: 4.0mA
S Low Bill of Materials: One Inductor, Two
Capacitors
S Small Footprint: 0.86mm x 0.86mm
Ordering Information appears at end of data sheet.
For related parts and recommended products to use with this part,
refer to www.maxim-ic.com/MAX2692.related.
Typical Operating Circuit
MAX2692
INPUT
V
V
CC
C1
RF
CC
C2
L1
RFIN
MAX2695
A1A2
B1B2
MAX2692
L1 = 4.3nH
C1 = 100nF
C2 = 1nF
MAX2695
L1 = 3.3nH
C1 = 100nF
C2 = 100nF
RFOUT
RF
OUTPUT
R1
25kI
OPTIONAL SHUTDOWN
GND
SHDN
WiMAX is a registered service mark of WiMAX Forum.
Maximum Current into RF Input .........................................10mA
Note 1: Refer to Application Note 1891: Wafer-Level Packaging (WLP) and its Applications.
CAUTION! ESD SENSITIVE DEVICE
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(MAX2692/MAX2695 EV kit, VCC = 1.6V to 3.6V, TA = -40NC to +85NC, no RF signals are applied. Typical values are at VCC = 2.85V
and TA = +25NC, unless otherwise noted.) (Note 2)
PARAMETERCONDITIONSMINTYPMAXUNITS
Supply Voltage 1.62.853.6V
Supply Current
Digital Input Logic-High (Note 3)1.2V
Digital Input Logic-Low (Note 3)0.45V
SHDN = high
Shutdown mode, V
SHDN
= 0V
Operating Temperature Range .......................... -40°C to +85°C
Junction Temperature .....................................................+150°C
Storage Temperature Range ............................ -65°C to +160°C
Soldering Temperature (reflow) ......................................+260°C
MAX2692 4.0
MAX26954.0
10µA
mA
AC ELECTRICAL CHARACTERISTICS
(MAX2692/MAX2695 EV kit, VCC = 1.6V to 3.6V, TA = -40NC to +85NC, MAX2692 f
values are at VCC = 2.85V and TA = +25NC, unless otherwise noted.) (Note 3)
(MAX2692/MAX2695 EV kit, VCC = 1.6V to 3.6V, TA = -40NC to +85NC, MAX2692 f
values are at VCC = 2.85V and TA = +25NC, unless otherwise noted.) (Note 2)
PARAMETERCONDITIONSMINTYPMAXUNITS
Output Return Loss
Reverse Isolation
MAX2692 17
MAX2695 14
MAX2692 32
MAX2695 28
Note 2: Min and max limits guaranteed by test at TA = +25°C and guaranteed by design and characterization at TA = -40°C and
TA = +85°C, unless otherwise noted.
Note 3: Min and max limits guaranteed by test at TA = +25°C.
Note 4: Min limit guaranteed by design and characterization.
Note 5: Measured with the two tones located at 1MHz and 2MHz offset from the center of the band with -30dBm/tone.
Note 6: Measured with a tone located at 2.45GHz for the MAX2692 and 3.5GHz for the MAX2695.
Typical Operating Characteristics
(MAX2692/MAX2695 EV kit. Typical values are at VCC = 2.85V, TA = +25°C, unless otherwise noted.)
B1RFINRF Input. Requires a DC-blocking capacitor and external matching components.
B2GNDGround. Connect to the PCB ground plane.
CC
RFOUT
(SHDN)
Supply Voltage. Bypass to ground with a 10pF capacitor as close as possible to the IC.
RF Output/SHDN Input. RFOUT is internally matched to 50I and pulled up to VCC through a 25kI
resistor. SHDN is shared with the RFOUT bump. The devices are in active mode by default once
VCC is applied. RFOUT(SHDN) can be pulled to a DC low externally to shut down the IC.
RFOUT(SHDN)
GND
Bump Description
Detailed Description
The MAX2692/MAX2695 are LNAs designed for WLAN/
WiMax applications. The devices feature an optional
power-shutdown control mode to eliminate the need for
an external supply switch. The devices achieve high
gain, low noise figure, and excellent linearity.
Input and Output Matching
The devices require an off-chip input matching. Only an
inductor in series with a DC-blocking capacitor is needed
to form the input matching circuit. The Typical Operating
Circuit shows the recommended input-matching network.
These values are optimized for the best simultaneous
gain, noise figure, and return loss performance. The
devices integrate an on-chip output matching to 50I at
the output, eliminating the need for external matching
components. Table 1 and Table 2 list typical device S
parameters and Kf values. Typical noise parameters are
shown in Table 3 and Table 4.
Shutdown
The devices include an optional shutdown feature to turn
off the entire chip. The devices are placed in active mode
by default once VCC is applied, due to the on-chip pullup resistor to VCC at the RFOUT bump (shared with the
SHDN input). To shut down the part, apply a logic-low
to the RFOUT bump through an external resistor with an
adequate value, e.g., 25kI, in order not to load the RF
output signal during active operation.
MAX2692/MAX2695
WLAN/WiMAX Low-Noise Amplifiers
Table 1. MAX2692 Typical S Parameter Values and K-Factor
A properly designed PCB is essential to any RF microwave circuit. Use controlled-impedance lines on all
high-frequency inputs and outputs. Bypass VCC with
decoupling capacitors located close to the device. For
long VCC lines, it may be necessary to add decoupling
capacitors. Locate these additional capacitors further
away from the device package. Proper grounding of the
GND bump is essential. If the PCB uses a topside RF
ground, connect it directly to the GND bump. For a board
where the ground is not on the component layer, connect
the GND bump to the board with multiple vias close to
the package.
Refer to www.maxim-ic.com/datasheet/index.mvp/id/6939/t/do
for the MAX2692/MAX2695 EV kit schematic, Gerber data,
PADS layout file, and BOM information.
Chip Information
PROCESS: SiGe BiCMOS
Ordering Information
PARTTEMP RANGEPIN-PACKAGE
MAX2692EWS+T-40NC to +85NC4 WLP
MAX2695EWS+T-40NC to +85NC4 WLP
+Denotes a lead(Pb)-free/RoHS-compliant package.
T = Tape and reel.
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied.
Maxim reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical
Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 9