The MAX2667/MAX2669 high-gain, low-noise amplifiers
(LNAs) are designed for GPS L1, Galileo, and GLONASS
applications. Designed in Maxim’s advanced SiGe process, the devices achieve a high gain and our lowest
noise figure, while maximizing the input-referred 1dB
compression point and the 3rd-order intercept point.
The devices operate from a +1.6V to +3.3V single supply. The MAX2667 is optimized for low current. The
MAX2669 is optimized for high linearity. The shutdown
feature in the device reduces the supply current to be
less than 10μA. The devices are available in a very small,
lead-free, RoHS-compliant, 0.86mm x 1.26mm x 0.65mm
wafer-level package (WLP).
Features
S19dB High-Power Gain (MAX2667)
S
Ultra-Low Noise Figure: 0.65dB
S
Integrated 50Ω Output Matching Circuit
S
Low 4.1mA Supply Current (MAX2667)
S
Wide 1.6V to 3.3V Supply Voltage Range
S
Low Bill of Materials: Two Inductors, Three
Capacitors, and One Resistor
SSmall Footprint: 0.86mm x 1.26mm
S
Thin Profile: 0.65mm
S
0.4mm-Pitch Wafer-Level Package (WLP)
MAX2667/MAX2669
Applications
Automotive Navigation
Location-Enabled Mobile Devices
Telematics (Asset Tracking and Management)
Personal Navigation Devices (PNDs)
Cellular Phones with GPS
Ordering Information
PARTTEMP RANGEPIN-PACKAGE
MAX2667EWT+T-40°C to +85°C6 WLP
MAX2669EWT+T-40°C to +85°C6 WLP
+Denotes a lead(Pb)-free/RoHS-compliant package.
T = Tape and reel.
Note 1: Refer to Application Note 1891: Wafer-level packaging (WLP) and its applications.
CAUTION! ESD SENSITIVE DEVICE
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
= +70°C)
A
+ 0.3V)
CC
DC ELECTRICAL CHARACTERISTICS
(MAX2667/MAX2669 EV kit. VCC = 1.6V to 3.3V, no RF signals are applied, TA = -40°C to +85°C. Typical values are at VCC = 2.85V
and T
= +25°C, unless otherwise noted.) (Note 2)
MAX2667/MAX2669
A
PARAMETERCONDITIONSMINTYPMAXUNITS
Supply Voltage1.62.853.3V
Supply Current
Digital Input Logic-HighT
Digital Input Logic-LowT
SHDN = high
Shutdown mode, SHDN = low
= +25°C1.2V
A
= +25°C0.45V
A
Maximum Current into RF Input .........................................10mA
Operating Temperature Range .......................... -40°C to +85°C
Junction Temperature .....................................................+150°C
Storage Temperature Range ............................ -65°C to +160°C
Soldering Temperature (reflow) (Note 1) ........................+260°C
= 1575.42MHz, TA = -40°C to +85°C. Typical values are at VCC = 2.85V and
RFIN
MAX2667/MAX2669
Note 2: Min and max limits guaranteed by test at T
= +25°C and guaranteed by design and characterization at TA = -40°C and
A
TA = +85°C.
Note 3: Measured with the two tones located at 1MHz and 2MHz offset from the center of the GPS band with -30dBm/tone for
MAX2667 and -27dBm/tone for MAX2669.
Note 4: Measured with input tones at 1713MHz (-25dBm) and 1851MHz (-49dBm).
Note 5: Measured with a tone located at 5MHz offset from the center of the GPS band.
Typical Operating Characteristics
(MAX2667/MAX2669 EV kit. Typical values are at VCC = 2.85V, f
INPUT RETURN LOSS vs. FREQUENCY
0
-5
-10
-15
|S11| (dB)
-20
-25
-30
-35
5002500
MAX2667
FREQUENCY (MHz)
MAX2669
200015001000
MAX2667 toc01
25
20
15
10
GAIN (dB)
5
0
-5
-10
5002500
GAIN vs. FREQUENCY
MAX2669
= 1575.42MHz, TA = +25°C, unless otherwise noted.)
RFIN
REVERSE ISOLATION vs. FREQUENCY
MAX2667 toc02
-20
-30
-40
|S12| (dB)
-50
-60
-70
MAX2669
5002500
FREQUENCY (MHz)
MAX2667
200015001000
FREQUENCY (MHz)
MAX2667
200015001000
MAX2667 toc03
OUTPUT RETURN LOSS vs. FREQUENCY
0
-5
MAX2667
-10
MAX2669
|S22| (dB)
-15
-20
-25
5002500
FREQUENCY (MHz)
200015001000
MAX2667 toc04
MAX2667 IN-BAND IIP3 vs.
SUPPLY VOLTAGE AND TEMPERATURE
(TWO TONES LOCATED AT 1MHz AND
2MHz OFFSET WITH -35dBm/TONE)
0
-1
-2
IIP3 (dBm)
-3
-4
-5
-40NC
+25NC
+85NC
1.63.2
SUPPLY VOLTAGE (V)
MAX2669 IN-BAND IIP3 vs.
SUPPLY VOLTAGE AND TEMPERATURE
(TWO TONES LOCATED AT 1MHz AND
2MHz OFFSET WITH -30dBm/TONE)
8
MAX2667 toc05
3.02.82.62.42.22.01.8
6
-40NC
4
IIP3 (dBm)
+25NC
2
+85NC
0
1.6
SUPPLY VOLTAGE (V)
MAX2667 toc06
3.2
3.02.82.62.42.22.01.8
3
GPS/GNSS Ultra-Low-Noise-Figure LNAs
Typical Operating Characteristics (continued)
(MAX2667/MAX2669 EV kit. Typical values are at VCC = 2.85V, f
= 1575.42MHz, TA = +25°C, unless otherwise noted.)
RFIN
MAX2667 OUT-OF-BAND IIP3 vs.
SUPPLY VOLTAGE AND TEMPERATURE
(TONE 1 AT 1713MHz, -25dBm;
TONE 2 AT 1851MHz, -49dBm)
3
2
+25NC
1
IIP3 (dBm)
0
+85NC
-40NC
MAX2667/MAX2669
-1
1.6
SUPPLY VOLTAGE (V)
MAX2667 INPUT P1dB COMPRESSION
vs. SUPPLY VOLTAGE AND TEMPERATURE
-11
-12
-13
-14
-15
INPUT P1dB (dBm)
-16
-17
-18
+85NC
+25NC
-40NC
SUPPLY VOLTAGE (V)
3.02.82.62.42.22.01.8
3.02.82.62.42.22.01.81.63.2
3.2
MAX2667 toc07
MAX2667 toc09
MAX2669 OUT-OF-BAND IIP3 vs.
SUPPLY VOLTAGE AND TEMPERATURE
(TONE 1 AT 1713MHz, -25dBm;
TONE 2 AT 1851MHz, -49dBm)
10
9
+85NC
8
7
IIP3 (dBm)
6
5
4
-40NC
SUPPLY VOLTAGE (V)
+25NC
MAX2669 INPUT P1dB COMPRESSION vs.
SUPPLY VOLTAGE AND TEMPERATURE
-9
-10
-11
-12
INPUT P1dB (dBm)
-13
-14
1.63.2
+85NC
+25NC
-40NC
SUPPLY VOLTAGE (V)
MAX2667 toc08
3.02.82.62.42.22.01.81.63.2
MAX2667 toc10
3.02.82.62.42.22.01.8
4
GPS/GNSS Ultra-Low-Noise-Figure LNAs
Bump Configuration
TOP VIEW
BUMP SIDE DOWN
MAX2667/MAX2669
12
+
MAX2667/MAX2669
A
B
CGNDDC
BIAS
RFINV
GNDAC
RFOUT/
SHDN
CC
WLP
Bump Description
BUMPNAMEFUNCTION
A1BIAS
A2
B1RFIN
B2V
C1GNDAC
C2GNDDC
RFOUT/SHDN
CC
Provides Bias for LNA Input. Connect to B1 (RFIN) through a high-value inductor (100nH),
and bypass to ground close to the pin.
RF Output and SHDN Logic Input. RFOUT is internally matched to 50I and has an internal
DC-blocking capacitor. The SHDN logic input is coupled through a 25kI resistor.
RF Input. Connect to A1 through bias choke, and connect matching network and DCblocking capacitor.
Supply Voltage. Bypass to ground with a capacitor close to the IC.
Ground of the RF Path. Connect to the 2nd-layer PCB ground plane with a via next to the pin
pad.
Ground of Bias Circuit. Connect to the 2nd-layer PCB ground plane with a separate via from
pin C1. Sharing a ground via with pin C1 might cause stability problems.
Detailed Description
The MAX2667/MAX2669 are LNAs designed for GPS
L1, Galileo, and GLONASS applications. The devices
feature a power-shutdown control mode to eliminate the
need for an external supply switch. The devices achieve
a high gain and an ultra-low noise figure.
Input and Output Matching
The devices require an off-chip input matching. Only
an inductor in series with a DC-blocking capacitor is
needed to form the input matching circuit. The Typical Application Circuit shows the recommended inputmatching network. These values are optimized for the
best simultaneous gain, noise figure, and return loss
performance. Tables 1 and 2 list typical device S parameters and K
values. The devices integrate an on-chip
f
output matching to 50Ω at the output, eliminating the
need for external matching components. The value of the
input coupling capacitor affects IIP3. A smaller coupling
capacitor results in lower IIP3.
5
GPS/GNSS Ultra-Low-Noise-Figure LNAs
Shutdown
The devices include a shutdown feature to turn off the
entire chip. Apply a logic-high to the SHDN pin to place
the part in the active mode, and a logic-low to place the
part in the shutdown mode.
decoupling capacitors located close to the device. For
long V
lines, it may be necessary to add decoupling
CC
capacitors. Locate these additional capacitors further
away from the device package. Proper grounding of
the GND_ pins is essential. If the PCB uses a topside
RF ground, connect it directly to the GND_ pins. For a
Applications Information
A properly designed PCB is essential to any RF microwave circuit. Use controlled-impedance lines on all
high-frequency inputs and outputs. Bypass V
CC
with
board where the ground is not on the component layer,
connect the GND_ pins to the board with multiple vias
close to the package.
Table 1. MAX2667 Typical Device S-Parameter Values and K-Factor
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PACKAGE
TYPE
6 WLPW61B1+1
PACKAGE
CODE
OUTLINE
NO.
21-0217
LAND
PATTERN NO.
—
7
GPS/GNSS Ultra-Low-Noise-Figure LNAs
Revision History
REVISION
NUMBER
09/10Initial release—
REVISION
DATE
MAX2667/MAX2669
DESCRIPTION
PAGES
CHANGED
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied.
Maxim reserves the right to change the circuitry and specifications without notice at any time.
8 Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600