MAX2411A
Low-Cost RF Up/Downconverter
with LNA and PA Driver
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
(VCC= +2.7V to +5.5V, VGC= +3.0V, RXEN = TXEN = 0.6V, PADROUT pulled up to VCCwith 50Ω resistor; IF, IF pulled up to V
CC
with 50Ω resistor, TXMXOUT pulled up to VCCwith 125Ω resistor, LNAOUT pulled up to VCCwith 100Ω resistor, all RF inputs open,
T
A
= -40°C to +85°C. Typical values are at +25°C and VCC= +3.0V, unless otherwise noted.)
AC ELECTRICAL CHARACTERISTICS
(MAX2411A EV kit, VCC= +3.0V, VGC= +2.15V, RXEN = TXEN = low, all measurements performed in 50Ω environment,
f
LO
= 1.5GHz, PLO= -10dBm, f
LNAIN
= f
PADRIN
= f
RXMXIN
= 1.9GHz, P
LNAIN
= -32dBm, P
PADRIN
= P
RXMXIN
= -22dBm,
f
IF, IF
= 400MHz, PIF= -32dBm (Note 1), TA= +25°C, unless otherwise noted.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCCto GND ................................................................-0.3V to 6V
LNAIN Input Power...........................................................15dBm
LO, LO Input Power..........................................................10dBm
PADRIN Input Power.........................................................10dBm
RXMXIN Input Power ........................................................10dBm
IF, IF Input Power (transmit mode) ...................................10dBm
Voltage at RXEN, TXEN, GC.......................-0.3V to (V
CC
+ 0.3V)
Continuous Power Dissipation (T
A
= +70°C)
QSOP (derate 11mW/°C above +70°C)........................909mW
Junction Temperature......................................................+150°C
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature.........................................-65°C to +165°C
Lead Temperature (soldering, 10sec).............................+300°C
RXEN, TXEN pins
RXEN, TXEN pins
VCC= 3.0V
RXEN = 2.0V, TXEN = 2.0V
RXEN = 2.0V
TXEN = 2.0V
RXEN = 2.0V
TXEN = 2.0V
CONDITIONS
µA0.1 10Supply Current, Shutdown Mode
V0.6Digital Input Voltage Low
V2.0
V2.7 5.5Supply-Voltage Range
Digital Input Voltage High
µA160 520Supply Current, Standby Mode
µA0.1 1RXEN Input Bias Current (Note 1)
µA0.1 1TXEN Input Bias Current (Note 1)
mA20 29.6Supply Current, Receive Mode
mA30 44.7Supply Current, Transmit Mode
UNITSMIN TYP MAXPARAMETER
TA= T
MIN
to T
MAX
TA= +25°C
(Note 3)
RXEN = high or low
CONDITIONS
dB
12.6 19.1
Gain (Note 2)
14.2 16.2 17.4
dB2.4Noise Figure
dBm-10Input IP3
dBm-5Output 1dB Compression
dBm-49LO to LNAIN Leakage
UNITSMIN TYP MAXPARAMETER
TA= -40°C to +85°C
TA= +25°C
Single sideband
(Note 4)
(Notes 2, 5)
dB
7.5 10.9
Conversion Gain (Note 2)
8.5 9.4 10.0
dB9.2Noise Figure
dBm4.0Input IP3
dBm-7.7Input 1dB Compression
MHz450IF Frequency
(Note 6) dBm-17Minimum LO Drive Level
LOW-NOISE AMPLIFIER (RXEN = high)
RECEIVE MIXER (RXEN = high)
GC = 3V, TXEN = 2V µA35 51.1GC Input Bias Current