For free samples & the latest literature: http://www.maxim-ic.com, or phone 1-800-998-8800.
For small orders, phone 1-800-835-8769.
________________General Description
The MAX2410 performs the RF front-end transmit/receive
function in time-division-duplex (TDD) communication
systems. It operates over a wide frequency range and
is optimized for RF frequencies around 1.9GHz.
Applications include most popular cordless and PCS
standards.
The MAX2410 contains a low-noise amplifier (LNA), a
downconverter mixer, a local-oscillator (LO) buffer, an
upconverter mixer, and a variable-gain power-amplifier
(PA) driver in a low-cost, plastic surface-mount package.
The LNA has a 2.4dB (typical) noise figure and a
-10dBm input third-order intercept point (IP3). The downconverter mixer has a low 9.8dB noise figure and a
3.3dBm IP3. Image and LO filtering are implemented offchip for maximum flexibility. The PA driver has 15dB of
gain, which can be reduced over a 35dB (typical) range.
Power consumption is only 60mW in receive mode or
90mW in transmit mode and drops to less than 0.3µW in
shutdown mode.
A similar part, the MAX2411A, features the same functionality as the MAX2410 but offers a differential
bidirectional (transmit and receive) IF port. This allows
the use of a single IF filter for transmit (TX) and receive
(RX). For applications requiring a receive function only,
consult the data sheet for the MAX2406, a low-cost
downconverter with low-noise amplifier.
________________________Applications
PWT1900 DECT
DCS1800/PCS1900 ISM-Band Transceiver
PHS/PACS Iridium Handsets
____________________________Features
♦ Low-Cost Silicon Bipolar Design
♦ Integrated Upconvert/Downconvert Function
♦ Operates from Single +2.7V to +5.5V Supply
♦ 3.2dB Combined Receiver Noise Figure:
2.4dB (LNA)
9.8dB (Mixer)
♦ Flexible Power-Amplifier Driver:
18dBm Output Third-Order Intercept (OIP3)
35dB Gain Control Range
♦ LO Buffer for Low LO Drive Level
♦ Low Power Consumption:
60mW Receive
90mW Full-Power Transmit
♦ 0.3µW Shutdown Mode
♦ Flexible Power-Down Modes Compatible with
MAX2510/MAX2511 IF Transceivers
MAX2410
Low-Cost RF Up/Downconverter
with LNA and PA Driver
________________________________________________________________
Maxim Integrated Products
1
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
GND
LNAOUT
GND
GND
RXMXIN
GND
GND
IFIN
IFOUT
GND
TXMXOUT
GND
GND
PADRIN
GND
PADROUT
GND
GC
V
CC
TXEN
LO
LO
RXEN
V
CC
GND
GND
LNAIN
GND
QSOP
TOP VIEW
MAX2410
___________________Pin Configuration
MAX2410
LNAIN
LNAOUT RXMXIN
PADRINGC TXMXOUT
TX MIXER
RX MIXER
RXEN
TXEN
PADROUT
IFOUT
LNA
PA DRIVER
LO
LO
IFIN
POWER
MANAGEMENT
19-1320; Rev 1; 3/98
PART
MAX2410EEI -40°C to +85°C
TEMP. RANGE PIN-PACKAGE
28 QSOP
EVALUATION KIT MANUAL
FOLLOWS DATA SHEET
_______________Ordering Information
Functional Diagram
MAX2410E/D -40°C to +85°C Dice*
*
Dice are specified at TA= +25°C, DC parameters only.
MAX2410
Low-Cost RF Up/Downconverter
with LNA and PA Driver
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
(VCC= 2.7V to 5.5V, VGC= 3.0V, RXEN = TXEN = 0.6V, IFOUT and PADROUT pulled up to VCCwith 50Ω resistors, TXMXOUT pulled
up to V
CC
with 125Ω resistor, LNAOUT pulled up to VCCwith 100Ω resistor, all other RF and IF inputs open, TA= -40°C to +85°C,
unless otherwise noted. Typical values are at T
A
= +25°C and VCC= 3.0V.)
AC ELECTRICAL CHARACTERISTICS
(MAX2410 EV kit, VCC= 3.0V, VGC= 2.15V, RXEN = TXEN = low, fLO= 1.5GHz, PLO= -10dBm, f
LNAIN
= f
PADRIN
= f
RXMXIN
=
1.9GHz, P
LNAIN
= -32dBm, P
PADRIN
= P
RXMXIN
= -22dBm, f
IFIN
= 400MHz, P
IFIN
= -32dBm. All measurements performed in 50Ω
environment. T
A
= +25°C, unless otherwise noted.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCCto GND..............................................................-0.3V to +6V
LNAIN Input Power.........................................................+15dBm
LO,
LO Input Power........................................................+10dBm
PADRIN Input Power......................................................+10dBm
RXMXIN Input Power......................................................+10dBm
IFIN Input Power.............................................................+10dBm
RXEN, TXEN, GC Voltage...........................-0.3V to (V
CC
+ 0.3V)
Continuous Power Dissipation (T
A
= +70°C)
QSOP (derate 11mW/°C above +70°C) .......................909mW
Junction Temperature......................................................+150°C
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range.............................-65°C to +165°C
Lead Temperature (soldering, 10sec).............................+300°C
RXEN, TXEN pins
RXEN, TXEN pins
V
CC
= 3V
RXEN = 2V, TXEN = 2V
RXEN = 2V
TXEN = 2V
RXEN = 2V
TXEN = 2V
CONDITIONS
V0.6Digital Input Voltage Low
V2.0
V2.7 5.5Supply Voltage Range
Digital Input Voltage High
µA0.1 10Supply Current, Shutdown Mode
µA160 520Supply Current, Standby Mode
µA0.1 1RXEN Input Bias Current (Note 1)
µA0.1 1TXEN Input Bias Current (Note 1)
mA20 29.5Supply Current, Receive Mode
mA30 44.5Supply Current, Transmit Mode
UNITSMIN TYP MAXPARAMETER
TA= T
MIN
to T
MAX
TA= +25°C
TA= +25°C
(Note 2)
RXEN = high or low
CONDITIONS
dB
12.6 19.1
Gain (Note 1)
14.2 16.2 17.4
6.6 8.3 9.8
dB2.4Noise Figure
dBm-10Input IP3
dBm-5Output 1dB Compression
dBm-49LO to LNAIN Leakage
UNITSMIN TYP MAXPARAMETER
TA= T
MIN
to T
MAX
dB
5.4 10.8
Conversion Gain (Note 1)
(Note 3) dBm3.3Input IP3
Single sideband dB9.8Noise Figure
dBm-8Input 1dB Compression
(Note 5) dBm-17Minimum LO Drive Level
(Notes 1, 4) MHz450IFOUT Frequency
LOW-NOISE AMPLIFIER (RXEN = High)
RECEIVE MIXER (RXEN = High)
GC = 3V, TXEN = 2V µA35 46GC Input Bias Current
MAX2410
Low-Cost RF Up/Downconverter
with LNA and PA Driver
_______________________________________________________________________________________ 3
AC ELECTRICAL CHARACTERISTICS (continued)
(MAX2410 EV kit, VCC= 3.0V, VGC= 2.15V, RXEN = TXEN = low, fLO= 1.5GHz, PLO= -10dBm, f
LNAIN
= f
PADRIN
= f
RXMXIN
=
1.9GHz, P
LNAIN
= -32dBm, P
PADRIN
= P
RXMXIN
= -22dBm, f
IFIN
= 400MHz, P
IFIN
= -32dBm. All measurements performed in 50Ω
environment. T
A
= +25°C, unless otherwise noted.)
Note 1: Guaranteed by design and characterization.
Note 2: Two tones at 1.9GHz and 1.901GHz at -32dBm per tone
Note 3: Two tones at 1.9GHz and 1.901GHz at -22dBm per tone
Note 4: Mixer operation guaranteed to this frequency. For optimum gain, adjust output match. See the
Typical Operating
Characteristics
for graphs of IFIN and IFOUT Impedance vs. IF Frequency.
Note 5: At this LO drive level the mixer conversion gain is typically 1dB lower than with -10dBm LO drive.
Note 6: Two tones at 400MHz and 401MHz at -32dBm per tone.
Note 7: Transmit mixer output at -17dBm.
Note 8: Calculated from measurements taken at V
GC
= 1.0V and VGC= 1.5V.
Note 9: Time from RXEN = low to RXEN = high transition until the combined receive gain is within 1dB of its final value. Measured
with 47pF blocking capacitors on LNAIN and LNAOUT.
Note 10: Time from TXEN = low to TXEN = high transition until the combined transmit gain is within 1dB of its final value. Measured
with 47pF blocking capacitors on PADRIN and PADROUT.
(Notes 1, 10)
(Notes 1, 9)
(Note 6)
Transmit (RXEN = Low)
Receive (TXEN = Low)
(Note 8)
f
OUT
= 2LO-2IF = 2.2GHz
(Note 3)
Single sideband
TA= T
MIN
to T
MAX
(Notes 1, 4)
TA= +25°C
CONDITIONS
µs0.3 2.5Transmitter Turn-On Time
µs0.5 2.5Receiver Turn-On Time
1.02
Input Relative VSWR Normalized to
Standby-Mode Impedance
1.10
dB/V12Gain-Control Sensitivity
dB35Gain-Control Range
dBm6.3Output 1dB Compression Point
dBm18Output IP3
12.3 17
Gain (Note 1) dB
13 15 16.4
dBm-0.3Output IP3
dBc-90
Intermod Spurious Response
(Note 7)
dBc-74
dBc-44
dBm-11.4Output 1dB Compression Point
dBm-52LO Leakage
dB8.2Noise Figure
MHz450IFIN Frequency
UNITSMIN TYP MAXPARAMETER
f
OUT
= 3LO-6IF = 2.1GHz
f
OUT
= 2LO-3IF = 1.8GHz
TA= T
MIN
to T
MAX
TA= +25°C
7.3 11.8
dB
8.6 10 11.1
Conversion Gain (Note 1)
TRANSMIT MIXER (TXEN = high)
POWER AMPLIFIER DRIVER (TXEN = high)
LOCAL OSCILLATOR INPUTS (RXEN = TXEN = high)
POWER MANAGEMENT (RXEN = TXEN = low)
MAX2410
Low-Cost RF Up/Downconverter
with LNA and PA Driver
4 _______________________________________________________________________________________
__________________________________________Typical Operating Characteristics
(MAX2410 EV kit, VCC= 3.0V, VGC= 2.15V, RXEN = TXEN = low, fLO= 1.5GHz, PLO= -10dBm, f
LNAIN
= f
PADRIN
= f
RXMXIN
=
1.9GHz, P
LNAIN
= -32dBm, P
PADRIN
= P
RXMXIN
= -22dBm, f
IFIN
= 400MHz, P
IFIN
= -32dBm. All measurements performed in 50Ω
environment. TA= +25°C, unless otherwise noted. All impedance measurements made directly to pin (no matching network).)
26
30
28
34
32
36
38
-40 10-15 35 60 85
TRANSMIT-MODE SUPPLY CURRENT
vs. TEMPERATURE
MAX2410-01
TEMPERATURE (°C)
TRANSMIT-MODE SUPPLY CURRENT (mA)
VCC = 5.5V
TXEN = V
CC
VCC = 4.0V
VCC = 2.7V
VCC = 3.0V
17
19
18
21
20
23
22
24
-40 10-15 35 60 85
RECEIVE-MODE SUPPLY CURRENT
vs. TEMPERATURE
MAX2410-02
TEMPERATURE (°C)
RECEIVE-MODE SUPPLY CURRENT (mA)
VCC = 5.5V
RXEN = V
CC
VCC = 4.0V
VCC = 2.7V
VCC = 3.0V
0
0.03
0.02
0.01
0.04
0.05
0.06
0.07
0.08
0.09
0.10
-40 10-15 35 60 85
SHUTDOWN SUPPLY CURRENT
vs. TEMPERATURE
MAX2410-03
TEMPERATURE (°C)
SHUTDOWN SUPPLY CURRENT (µA)
VCC = 5.5V
RXEN = TXEN = GND
VCC = 4.0V
VCC = 2.7V
VCC = 3.0V
0
100
300
200
400
500
-40 10-15 35 60 85
STANDBY SUPPLY CURRENT
vs. TEMPERATURE
MAX2410-04
TEMPERATURE (°C)
STANDBY SUPPLY CURRENT (µA)
VCC = 5.5V
RXEN = TXEN = 2.0V
VCC = 4.0V
VCC = 2.7V
VCC = 3.0V
0
10
5
20
15
25
30
0 1.0 1.50.5 2.0 2.5 3.0
LNA GAIN vs. FREQUENCY
MAX2410-07
FREQUENCY (GHz)
LNA GAIN (dB)
1pF SHUNT CAPACITOR AT LNA INPUT
USING EV KIT MATCHING CIRCUIT (OPTIMIZED
FOR 1.9GHz)
RXEN = V
CC
0
40
20
80
60
100
120
0 1.0 1.50.5 2.0 2.5 3.0
LNA INPUT IMPEDANCE
vs. FREQUENCY
MAX2410-05
FREQUENCY (GHz)
REAL IMPEDANCE (Ω)
-200
-120
-160
-40
-80
0
40
IMAGINARY IMPEDANCE (Ω)
IMAGINARY
RXEN = V
CC
REAL
0
50
150
100
200
250
0 1.00.5 1.5 2.0 2.5 3.0
LNA OUTPUT IMPEDANCE
vs. FREQUENCY
MAX2410-06
FREQUENCY (GHz)
REAL IMPEDANCE (Ω)
-125
-100
-50
-75
-25
0
IMAGINARY IMPEDANCE (Ω)
IMAGINARY
REAL
RXEN = V
CC
13
15
14
17
16
19
18
20
-40 10-15 35 60 85
LNA GAIN vs. TEMPERATURE
MAX2410-08
TEMPERATURE (°C)
LNA GAIN (dB)
VCC = 5.5V
VCC = 4.0V
VCC = 2.7V
VCC = 3.0V
RXEN = V
CC
-15
-12
-13
-14
-10
-11
-6
-7
-8
-9
-5
-40 -20 0 20 40 60 10080
LNA INPUT IP3 vs. TEMPERATURE
MAX2410-09
TEMPERATURE (°C)
INPUT IP3 (dBm)
VCC = 5.5V
VCC = 4.0V
VCC = 2.7V
VCC = 3.0V
RXEN = V
CC
MAX2410
Low-Cost RF Up/Downconverter
with LNA and PA Driver
_______________________________________________________________________________________
5
0
1.0
0.5
2.0
1.5
3.0
2.5
3.5
4.5
4.0
5.0
100 480 860 1240 1620 2000
LNA NOISE FIGURE vs. FREQUENCY
MAX2410-10
FREQUENCY (MHz)
NOISE FIGURE (dB)
RXEN = V
CC
-6
-4
-5
-2
-3
-1
0
2.7 3.7 4.23.2 4.7 5.2
LNA OUTPUT 1dB COMPRESSION POINT
vs. SUPPLY VOLTAGE
MAX2410-11
SUPPLY VOLTAGE (V)
OUTPUT 1dB COMPRESSION POINT (dBm)
RXEN = V
CC
0
20
40
60
80
100
120
140
-250
-210
-170
-130
-90
-50
-10
30
160 70
0 1.00.5 1.5 2.0 2.5 3.0
PA DRIVER INPUT IMPEDANCE
vs. FREQUENCY
MAX2410-12
FREQUENCY (GHz)
REAL IMPEDANCE (Ω)
IMAGINARY IMPEDANCE (Ω)
IMAGINARY
REAL
TXEN = V
CC
0
25
50
75
100
125
150
175
200
-350
-300
-250
-200
-150
-100
-50
0
50
0 1.00.5 1.5 2.0 2.5 3.0
PA DRIVER OUTPUT IMPEDANCE
vs. FREQUENCY
MAX2410-13
FREQUENCY (GHz)
REAL IMPEDANCE (Ω)
IMAGINARY IMPEDANCE (Ω)
IMAGINARY
REAL
TXEN = V
CC
14
16
15
18
17
20
19
21
-40 0 20-20 40 60 10080
PA DRIVER OUTPUT IP3
vs. TEMPERATURE
MAX2410-16
TEMPERATURE (°C)
OUTPUT IP3 (dBm)
VCC = 5.5V
VCC = 4.0V
VCC = 2.7V
VCC = 3.0V
TXEN = V
CC
0
10
5
20
15
25
30
0 1.0 1.50.5 2.0 2.5 3.0
PA DRIVER GAIN vs. FREQUENCY
MAX2410-14
FREQUENCY (GHz)
GAIN (dB)
USING EV KIT MATCHING NETWORK
(OPTIMIZED FOR 1.9GHz)
TXEN = V
CC
-30
-20
-25
-5
-10
-15
0
5
15
10
20
0 0.4 0.60.2 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
PA DRIVER GAIN AND OUTPUT IP3
vs. GAIN-CONTROL VOLTAGE
MAX2410-15
GAIN-CONTROL VOLTAGE (V)
GAIN (dB) OR OUTPUT IP3 (dBm)
IP3
GAIN
TXEN = V
CC
12
14
13
16
15
17
18
-40 10-15 35 60 85
PA DRIVER GAIN vs. TEMPERATURE
MAX2410-17
TEMPERATURE (°C)
PA DRIVER GAIN (dB)
VCC = 5.5V
VCC = 4.0V
VCC = 2.7V
VCC = 3.0V
TXEN = V
CC
-4
0
-2
4
2
6
8
2.7 3.7 4.23.2 4.7 5.75.2
PA DRIVER OUTPUT 1dB COMPRESSION
POINT vs. SUPPLY VOLTAGE
MAX2410-18
SUPPLY VOLTAGE (V)
OUTPUT 1dB COMPRESSION POINT (dBm)
VGC = 2.15V
VGC = 1.0V
TXEN = V
CC
_____________________________Typical Operating Characteristics (continued)
(MAX2410 EV kit, VCC= 3.0V, VGC= 2.15V, RXEN = TXEN = low, fLO= 1.5GHz, PLO= -10dBm, f
LNAIN
= f
PADRIN
= f
RXMXIN
=
1.9GHz, P
LNAIN
= -32dBm, P
PADRIN
= P
RXMXIN
= -22dBm, f
IFIN
= 400MHz, P
IFIN
= -32dBm. All measurements performed in 50Ω
environment. TA= +25°C, unless otherwise noted. All impedance measurements made directly to pin (no matching network).)
0
2
1
4
3
6
5
7
9
8
10
0 0.4 0.6 0.80.2 1.0 1.2 1.4 1.81.6 2.0
PA DRIVER NOISE FIGURE
vs. FREQUENCY
MAX2410-19
NOISE FIGURE (dB)
TXEN = V
CC
0
10
5
20
15
25
30
0 1.0 1.50.5 2.0 2.5 3.0
PA DRIVER NOISE FIGURE
vs. GAIN-CONTROL VOLTAGE
MAX2410-20
GAIN-CONTROL VOLTAGE (V)
NOISE FIGURE (dB)
TXEN = V
CC
0
10
30
20
40
100
80
90
70
60
50
-200
-180
-140
-160
-20
-40
-60
-80
-100
-120
0
0.0 1.00.5 1.5 2.0 2.5 3.0
RECEIVE MIXER INPUT IMPEDANCE
vs. FREQUENCY
FREQUENCY (GHz)
REAL IMPEDANCE (Ω)
MAX2410-21
IMAGINARY IMPEDANCE (Ω)
IMAGINARY
REAL
RXEN = V
CC
0
300
200
100
500
400
900
800
700
600
1000
-1000
-700
-800
-900
-500
-600
-100
-200
-300
-400
0
0 100 200 300 400 500 600 700
IF OUTPUT IMPEDANCE
vs. FREQUENCY
FREQUENCY (MHz)
REAL IMPEDANCE (Ω)
MAX2410-21
IMAGINARY IMPEDANCE (Ω)
IMAGINARY
REAL
RXEN = V
CC
-4
2
0
-2
4
6
8
10
12
14
16
0.5 1.51.0 2.0 2.5 3.0
RECEIVE MIXER CONVERSION GAIN
vs. RF FREQUENCY
MAX2410-25
RF FREQUENCY (GHz)
CONVERSION GAIN (dB)
NARROWBAND
MATCH AT RXMXIN,
EV KIT MATCH AT IFOUT
EV KIT MATCHING
NETWORK AT RXMXIN
AND IFOUT
fIF = 400MHz
RXEN = V
CC
5
6
8
7
9
10
-40 10-15 35 60 85
RECEIVE MIXER CONVERSION GAIN
vs. TEMPERATURE
MAX2410-23
TEMPERATURE (°C)
CONVERSION GAIN (dB)
VCC = 5.5V
VCC = 2.7V
RXEN = V
CC
0
2
1
4
3
6
5
7
-40 0 20-20 40 60 80
RECEIVE MIXER INPUT IP3
vs. TEMPERATURE
MAX2410-24
TEMPERATURE (°C)
INPUT IP3 (dBm)
100
VCC = 5.5V
VCC = 4.0V
VCC = 2.7V
VCC = 3.0V
RXEN = V
CC
5
7
6
10
9
8
12
11
13
-18 -12 -10-16 -14 -8 -6 -4 -2 0
RECEIVE MIXER CONVERSION GAIN AND
NOISE FIGURE vs. LO POWER
MAX2410-26
LO POWER (dBm)
GAIN AND NOISE FIGURE (dB)
NOISE FIGURE
GAIN
RXEN = V
CC
-100
-50
0
50
100
150
200
250
300
-200
-175
-150
-125
-100
-75
-50
-25
0
0 1.00.5 1.5 2.0 2.5 3.0
TRANSMIT MIXER OUTPUT IMPEDANCE
vs. FREQUENCY
MAX2410-27
FREQUENCY (GHz)
REAL IMPEDANCE (Ω)
IMAGINARY IMPEDANCE (Ω)
IMAGINARY
REAL
TXEN = V
CC
MAX2410
Low-Cost RF Up/Downconverter
with LNA and PA Driver
6 _______________________________________________________________________________________
_____________________________Typical Operating Characteristics (continued)
(MAX2410 EV kit, VCC= 3.0V, VGC= 2.15V, RXEN = TXEN = low, fLO= 1.5GHz, PLO= -10dBm, f
LNAIN
= f
PADRIN
= f
RXMXIN
=
1.9GHz, P
LNAIN
= -32dBm, P
PADRIN
= P
RXMXIN
= -22dBm, f
IFIN
= 400MHz, P
IFIN
= -32dBm. All measurements performed in 50Ω
environment. TA= +25°C, unless otherwise noted. All impedance measurements made directly to pin (no matching network).)
MAX2410
Low-Cost RF Up/Downconverter
with LNA and PA Driver
_______________________________________________________________________________________
7
_____________________________Typical Operating Characteristics (continued)
(MAX2410 EV kit, VCC= 3.0V, VGC= 2.15V, RXEN = TXEN = low, fLO= 1.5GHz, PLO= -10dBm, f
LNAIN
= f
PADRIN
= f
RXMXIN
=
1.9GHz, P
LNAIN
= -32dBm, P
PADRIN
= P
RXMXIN
= -22dBm, f
IFIN
= 400MHz, P
IFIN
= -32dBm. All measurements performed in 50Ω
environment. TA= +25°C, unless otherwise noted. All impedance measurements made directly to pin (no matching network).)
0
100
300
200
400
500
0 200100 300 400 500 700600
IF INPUT IMPEDANCE
vs. FREQUENCY
MAX2410-28
FREQUENCY (GHz)
REAL IMPEDANCE (Ω)
-1500
-1200
-600
-900
-300
0
IMAGINARY IMPEDANCE (Ω)
IMAGINARY
REAL
TXEN = V
CC
6
7
8
9
10
11
12
13
14
-40 -15 10 35 60 85
TRANSMIT MIXER CONVERSION GAIN
vs. TEMPERATURE
MAX2410-29
TEMPERATURE (°C)
CONVERSION GAIN (dB)
VCC = 5.5V
VCC = 4.0V
VCC = 2.7V
VCC = 3.0V
TXEN = V
CC
0
4
2
8
6
10
12
0.5 1.5. 2.01.0 2.5 3.0 3.5
TRANSMIT MIXER CONVERSION GAIN
vs. RF FREQUENCY
MAX2410-30
RF FREQUENCY (GHz)
CONVERSION GAIN (dB)
900MHz MATCH
3GHz MATCH
EV KIT MATCHING NETWORK
TXEN = V
CC
-2.0
-1.0
-1.5
0
-0.5
0.5
1.0
-40 10-15 35 60 85
TRANSMIT MIXER OUTPUT IP3
vs. TEMPERATURE
MAX2410-31
TEMPERATURE (°C)
OUTPUT IP3 (dBm)
VCC = 5.5V
VCC = 4.0V
VCC = 2.7V
VCC = 3.0V
TXEN = V
CC
6
7
9
8
10
11
-18 -14-16 -12 -10 0-8 -6 -4 -2
TRANSMIT MIXER GAIN AND NOISE FIGURE
vs. LO POWER
MAX2410-32
LO POWER (dBm)
GAIN AND NOISE FIGURE (dB)
GAIN
NOISE FIGURE
TXEN = V
CC
40
35
30
25
20
15
10
5
0
0 1.00.5 1.5 2.0 2.5 3.0
LO PORT RETURN LOSS vs. FREQUENCY
MAX2410-33
FREQUENCY (GHz)
RETURN LOSS (dB)
RXEN = TXEN = V
CC
MAX2410
Low-Cost RF Up/Downconverter
with LNA and PA Driver
8 _______________________________________________________________________________________
______________________________________________________________Pin Description
LNA Output. AC couple to this pin. This output typically provides a VSWR of better than 2:1 at frequencies from 1.7GHz to 3GHz with no external matching components. At other frequencies, a matching
network may be required to match this pin to an external filter. Consult the
Typical Operating
Characteristics
for a plot of LNA Output Impedance vs. Frequency.
LNAOUT27
LNA Output Ground. Connect to PC board ground plane with minimal inductance.GND26
Receive Mixer Input Ground. Connect to PC board ground plane with minimal inductance.GND25
RF Input to Receive Mixer (Downconverter). AC couple to this pin. This input typically requires a matching
network for connecting to an external filter. See the
Typical Operating Characteristics
for a plot of RXMXIN
Impedance vs. Frequency.
RXMXIN24
IF Input of Transmit Mixer (Upconverter). AC couple to this pin. IFIN presents a high input impedance
and typically requires a matching network. See the
Typical Operating Characteristics
for a plot of IFIN
Impedance vs. Frequency.
IFIN22
IF Output of Receive Mixer (Downconverter). AC couple to this pin. This output is an open collector and
should be pulled up to VCCwith an inductor. This inductor can be part of the matching network to the
desired IF impedance. Alternatively, a resistor can be placed in parallel to this inductor to set a terminating impedance. See the
Typical Operating Circuit
for more information.
IFOUT21
RF Output of Transmit Mixer (Upconverter). AC couple to this pin. Use an external shunt inductor to
VCCas part of a matching network to 50Ω. This also provides DC bias. See the
Typical Operating
Characteristics
for a plot of TXMXOUT Impedance vs. Frequency.
TXMXOUT19
RF Input to Variable-Gain Power-Amplifier Driver. AC couple to this pin. Internally matched to 50Ω. This
input typically provides a 2:1 VSWR at 1.9GHz. See the
Typical Operating Characteristics
for a plot of
PADRIN Impedance vs. Frequency.
PADRIN16
Power-Amplifier Driver Input Ground. Connect to PC board ground plane with minimal inductance.GND15, 17
Power-Amplifier Driver Output. AC couple to this pin. Use external shunt inductor to VCCto match this pin
to 50Ω. This also provides DC bias. See the
Typical Operating Characteristics
for a plot of PADROUT
Impedance vs. Frequency.
PADROUT13
Gain-Control Input for Power-Amplifier Driver. By applying an analog control voltage between 0V and
2.15V, the gain of the PA driver can be adjusted over a 35dB range. Connect to VCCfor maximum gain.
GC11
Logic-Level Enable for Transmitter Circuitry. A logic high turns on the transmitter. When TXEN and
RXEN are both at a logic high, the part is placed in standby mode, with 160µA (typical) supply current.
If TXEN and RXEN are both at a logic low, the part is set to shutdown mode, with 0.1µA (typical) supply
current.
TXEN9
50Ω Inverting Local-Oscillator Input Port. For single-ended operation connect LO directly to GND. If a
differential LO signal is available, AC couple the inverted LO signal to this pin.
LO
8
50Ω Local-Oscillator (LO) Input Port. AC couple to this pin.LO7
Logic-Level Enable for Receiver Circuitry. A logic high turns on the receiver. When TXEN and RXEN are
both at a logic high, the part is placed in standby mode, with a supply current of 160µA (typical). If
TXEN and RXEN are both at a logic low, the part is set to shutdown mode, with a supply current of
0.1µA (typical).
RXEN6
Supply Voltage (2.7V to 5.5V). Bypass VCCto GND at each pin with a 47pF capacitor as close to each
pin as possible.
V
CC
5, 10
RF Input to the LNA. AC couple to this pin. At 1.9GHz, LNAIN can be easily matched to 50Ω with one
external shunt 1pF capacitor.
LNAIN2
PIN
Ground. Connect to PC board ground plane with minimal inductance.GND
1, 3, 4, 12,
14, 18, 20,
23, 28
FUNCTIONNAME
MAX2410
Low-Cost RF Up/Downconverter
with LNA and PA Driver
_______________________________________________________________________________________ 9
_______________Detailed Description
The MAX2410 consists of five major components: a
transmit mixer, a variable-gain power-amplifier (PA)
driver, a low-noise amplifier (LNA), a receive mixer, and
power-management section.
The following sections describe each block in the
MAX2410
Functional Diagram
.
Low-Noise Amplifier (LNA)
The LNA is a wideband, single-ended cascode amplifier that can be used over a wide range of frequencies
(refer to the LNA Gain vs. Frequency graph in the
Typical Operating Characteristics
). Its port impedances
are optimized for operation around 1.9GHz, requiring
only a 1pF shunt capacitor at the LNA input for a VSWR
of better than 2:1 and a noise figure of 2.4dB. As with
every LNA, the input match can be traded off for better
noise figure.
Typical Operating Circuit
47pF
V
CC
V
CC
V
CC
V
CC
47pF
1pF
220pF
28
27
26
25
24
23
22
1
GND
10
V
CC
2
LNA
INPUT
LO
INPUT
PA
DRIVER
OUTPUT
PA
DRIVER
INPUT
TX
MIXER
RFOUTPUT
50Ω RX
MIXER
IFOUTPUT
TX
MIXER
IFINPUT
RX
MIXER
RFINPUT
LNA
OUTPUT
3
4
5
7
8
21
20
GND
LNAOUT
GND
GND
RXMXIN
GND
IFIN
IFOUT
GND
17
18
19
LNAIN
GND
GND
V
CC
LO
LO
13
18nH
16
15
GND
GND
TXMXOUT
TXEN RXEN GC
PADRIN
GND
MAX2410
1169
220pF
1000pF
220pF
1000pF
1000pF
1000pF
V
CC
220pF
3.9nH
3.9nH
68nH
82nH
220pF
220pF
PADROUT
5.6nH
R
OPT
68nH
220pF
1000pF
12
14
GND
GND
MAX2410
Low-Cost RF Up/Downconverter
with LNA and PA Driver
10 ______________________________________________________________________________________
PA Driver
The PA driver typically has 15dB of gain, which is
adjustable over a 35dB range via the GC pin. At full
gain, the PA driver has a noise figure of 3.5dB at
1.9GHz.
For input and output matching information, refer to the
Typical Operating Characteristics
for plots of PA Driver
Input and Output Impedance vs. Frequency.
Receive Mixer
The receive mixer is a wideband, double-balanced
design with excellent noise figure and linearity. The
inputs to the mixer are the RF signal at the RXMXIN pin
and the LO inputs at LO and LO. The downconverted
output signal appears at the IFOUT port. The conversion gain of the receive mixer is typically 8.3dB with a
noise figure of 9.8dB.
RF Input
The RXMXIN input is typically connected to the LNA
output through an off-chip filter. This input is externally
matched to 50Ω. See the
Typical Operating Circuit
for an example matching network and the RXMXIN
Impedance vs. Frequency graph in the
Typical Operating
Characteristics
.
Local-Oscillator Inputs
The LO and LO pins are internally terminated with 50Ω
on-chip resistors. AC couple the LO signal to these
pins. If a single-ended LO source is used, connect LO
directly to ground.
IF Output Port
The MAX2410’s receive mixer output appears at the
IFOUT pin, an open-collector output that requires an
external pull-up inductor to VCC. This inductor can be
part of a matching network to the desired IF impedance. Alternatively, a resistor can be placed in parallel
with the pull-up inductor to set a terminating impedance.
The MAX2411A, a similar part to the MAX2410, has the
same functionality as the MAX2410 but offers a differential, bidirectional (transmit and receive) IF port. This
allows sharing of TX and RX IF filters, which for some
applications provides a lower cost, smaller solution.
Transmit Mixer
The transmit mixer takes an IF signal at the IFIN pin and
upconverts it to an RF frequency at the TXMXOUT pin.
The conversion gain is typically 10dB and the output
1dB compression point is typically -11.4dBm at
1.9GHz.
RF Output
The transmit mixer output appears on the TXMXOUT
pin. It is an open-collector output that requires an external pull-up inductor to VCCfor DC biasing, which can
be part of an impedance-matching network. Consult
the
Typical Operating Characteristics
for a plot of
TXMXOUT Impedance vs Frequency.
IF Input
The IFIN pin is a self-biasing input that must be ACcoupled to the IF source. Refer to the
Typical Operating
Characteristics
for plots of Input and Output Impedance
vs. Frequency.
Local-Oscillator Inputs
The LO and LO pins are terminated with 50Ω on-chip
resistors. AC couple the LO signal to these pins. If a
single-ended LO source is used, connect LO directly to
GND.
Advanced System
Power Management
RXEN and TXEN are the two separate power-control
inputs for the receiver and the transmitter. If both inputs
are at logic 0, the part enters shutdown mode and the
supply current drops below 1µA. When one input is
brought to a logic 1, the corresponding function is
enabled. If RXEN and TXEN are both set to logic 1, the
part enters standby mode as described in the
Standby
Mode
section. Table 1 summarizes these operating
modes.
Power-down is guaranteed with a control voltage at or
below 0.6V. The power-down function is designed to
reduce the total power consumption to less than 1µA in
less than 2.5µs. Complete power-up will happen in the
same amount of time.
Table 1. Advanced System PowerManagement Functions
Receive01
Standby Mode11
Transmit10
Shutdown00
RXEN FUNCTIONTXEN
MAX2410
Low-Cost RF Up/Downconverter
with LNA and PA Driver
______________________________________________________________________________________ 11
Standby Mode
When the TXEN and RXEN pins are both set to logic 1,
all functions are disabled and the supply current drops
to 160µA (typical). This mode is called standby, and it
corresponds to a standby mode on the compatible IF
transceiver chips MAX2510 and MAX2511.
Applications Information
Extended Frequency Range
The MAX2410 has been characterized at 1.9GHz for use
in PCS-band applications; however, it operates over a
much wider frequency range. The LNA gain and noise
figure, as well as mixer conversion gain, are plotted over
a wide frequency range in the
Typical Operating
Characteristics
. When operating the device at RF fre-
quencies other than those specified in the
AC Electrical
Characteristics
table, it may be necessary to design or
alter the matching networks on the RF ports. If the IF
frequency is different than that specified in the
AC
Electrical Characteristics
table, the IFIN and IFOUT
matching networks must be altered. The
Typical
Operating Characteristics
provide Port Impedance Data
vs. Frequency on all RF and IF pins for use in designing
matching networks. The LO port (LO and LO) is internally
terminated with 50Ω resistors and provides a VSWR of
approximately 1.2:1 to 2GHz and 2:1 up to 3GHz.
Layout Issues
A properly designed PC board is an essential part of
any RF/microwave circuit. Be sure to use controlled
impedance lines on all high-frequency inputs and outputs. Use low-inductance connections to ground on all
GND pins, and place decoupling capacitors close to all
VCCconnections.
For the power supplies, a star topology works well. In a
star topology, each VCCnode in the circuit has its own
path to the central VCC, and its own decoupling capacitor which provides a low impedance at the RF frequency of interest. The central VCCnode has a large
decoupling capacitor as well, to provide good isolation
between the different sections of the MAX2410. The
MAX2410 EV kit layout can be used as a guide to integrating the MAX2410 into your design.
_________________________________________Typical Application Block Diagram
MAX2410
LNAIN
ANTENNA
T/R
GC
TX MIXER
CBLOCK
RX MIXER
RXEN
RF
BPF
RF
BPF
TXEN
PADROUT
RECEIVE
IFOUT
LOCAL
OSCILLATOR
LNA
PA DRIVER
TRANSMIT
IFIN
IFOUT
IFIN
LO
LO
POWER
MANAGEMENT
MATCH MATCH
RF
BPF
IF
BPF
MATCH
IF
BPF
MATCH
RF
BPF
MATCH
MAX2410
Low-Cost RF Up/Downconverter
with LNA and PA Driver
12 ______________________________________________________________________________________
________________________________________________________Package Information
QSOP.EPS
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