MAXIM MAX2335 User Manual

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General Description

The MAX2335 RF front-end receiver IC is designed for
CDMA and OFDM applications in the 450MHz band.

The MAX2335 includes a low-noise amplifier (LNA) with
adjustable IIP3 to minimize desensitization due to cross­modulation in the presence of a large interfering signal.

The mixer features differential IF outputs and is
designed for high linearity and low noise, which is well
suited for CDMA and OFDM applications.

An on-chip frequency divider is included to allow the
use of a standard 1GHz VCO. Alternatively, the divider
can be bypassed for use with a lower-frequency VCO.

The MAX2335 is available in a 28-pin TQFN package
with exposed paddle and is specified for the -40°C to
+85°C extended temperature range. The device is also
offered in a lead-free package.

Features

♦ 1.5dB LNA Noise Figure

♦ 16dB LNA Gain

♦ 2.1dB Cascaded Noise Figure

♦ Adjustable LNA IIP3

♦ LO Output Buffer for Transmitter

♦ LO Frequency Divider

♦ Small 5mm x 5mm, 28-Pin (Lead-Free) TQFN

Package

MAX2335

450MHz CDMA/OFDM LNA/Mixer

________________________________________________________________ Maxim Integrated Products 1

MAX2335

TOP VIEW

÷2

THIN QFN

5mm x 5mm

26

27

25

24

10

9

11

R

LNA

LNAIN

MODEO

MODE1

MODE2

12

DEGEN

IF_CDMA+

N.C.

BUFFEN

EP

R

BIAS

VCCV

CC

12

N.C.

4567

2021 19 17 16 15

V

CC

N.C.

I.C.

N.C.

LO_IN

LO/2

GND

IF_CDMA-

3

18

28

8

LNAOUT

N.C.

N.C.

23

13

LO_OUT

I.C.

22

14

N.C.

MIXIN

+

Pin Configuration/

Functional Diagram

Ordering Information

19-0492; Rev 0; 10/05

For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

*EP = Exposed paddle.
+Denotes lead-free package.

EVALUATION KIT

AVAILABLE

PART

TEMP RANGE

PIN-PACKAGE

PKG

CODE

MAX2335ETI

(5mm x 5mm)

T2855-3

MAX2335ETI+

(5mm x 5mm)

T2855+3

Applications

450MHz-Band, WCDMA, IS-95, IS-2000, OFDM,
Wireless Data Links

-40°C to +85°C

-40°C to +85°C

28 Thin QFN-EP*

28 Thin QFN-EP*

MAX2335

450MHz CDMA/OFDM LNA/Mixer

2 _______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

DC ELECTRICAL CHARACTERISTICS

(VCC= +2.9V to +3.3V, R

BIAS

= 18kΩ, R

LNA

= 24kΩ, BUFFEN = LOW, LO/2 = HIGH, TA= -40°C to +85°C, unless otherwise noted.

Typical values are at V

CC

= +2.9V, LOW = 0V, HIGH = +3.0V, TA= +25°C, unless otherwise noted.) (Note 1)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.

VCCto GND...........................................................-0.3V to +4.3V

All Other Pins to GND.................................-0.3V to (V

CC

+ 0.3V)

AC Input Pins (LNAIN, LO_IN, MIXIN) to GND ...............1V Peak

Continuous Power Dissipation (T

A

= +70°C)

28-Pin Thin QFN (derate 34.5mW/°C above +70°C) ...........2.7W

Operating Temperature Range ...........................-40°C to +85°C

Junction Temperature......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

CAUTION! ESD SENSITIVE DEVICE

PARAMETER

CONDITIONS

UNITS

HGHL mode (MODE[2:0] = 111) 32 38

HGLL mode (MODE[2:0] = 101) 24 29

Operating Supply Current I

CC

LG mode (MODE[2:0] = 011) 27 31

mA

Shutdown Supply Current I

CC

Shutdown mode (MODE[2:0] = 000) 0.2 10 µA

LO Buffer Supply Current I

CC

Addition for BUFFEN = HIGH 7 13 mA

Digital Input-Logic High V

IH

2V

Digital Input-Logic Low V

IL

0.6 V

Digital Input Current (Logic-High)

I

IH

5µA

Digital Input Current (Logic-Low)

I

IL

-25 µA

AC ELECTRICAL CHARACTERISTICS

(MAX2335 EV Kit, VCC= +2.9V to +3.3V, f

LNAIN

= f

MIXIN

= 465MHz, fIF= 110MHz, fLO= 2 x (f

MIXIN

+ fIF), 50Ω system impedance,

R

BIAS

= 18kΩ, R

LNA

= 24kΩ, cascaded performance includes 2dB interstage filter loss, TA= -40°C to +85°C, unless otherwise

noted. Typical values are at V

CC

= +2.9V, P

LO_IN

= -7dBm, LOW = 0V, HIGH = +3.0V, TA= +25°C, unless otherwise noted.)

SYMBOL

MIN TYP MAX

OVERALL PERFORMANCE

RF Frequency Range f

LO Frequency Range f

IF Frequency Range f

LO Input Power (Note 2) -7 -3 0 dBm

LO Buffer Output Power BUFFEN = HIGH -10 -6 dBm

Return Loss

CASCADED PERFORMANCE

HIGH-GAIN, HIGH-LINEARITY MODE (MODE[2:0] = 111)

Gain G (Note 1) 23.0 27 31.5 dB

Noise Figure NF Incl ud i ng off- chi p m atchi ng , TA = + 25°C ( N ote 2) 2.2 2.6 dB

Input Third-Order Intercept Point IIP3 TA = + 25°C (Notes 1, 3) -14 -11.5 dBm

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

RF

LO

IF

After optional LO/2 500 to 660 MHz

All modes, all active ports, including
2-element matching network, if necessary

420 to 470 MHz

80 to 190 MHz

10 dB

MAX2335

450MHz CDMA/OFDM LNA/Mixer

_______________________________________________________________________________________ 3

Note 1: Specifications at TA= +25°C and +85°C are guaranteed by production test. Specifications at TA= -40°C are guaranteed

by design and characterization.

Note 2: Guaranteed by design and characterization.
Note 3: Two-tone IIP3 tested at f

RF1

= 465.9MHz and f

RF2

= 466.7MHz at -25dBm/tone.

AC ELECTRICAL CHARACTERISTICS (continued)

(MAX2335 EV Kit, VCC= +2.9V to +3.3V, f

LNAIN

= f

MIXIN

= 465MHz, fIF= 110MHz, fLO= 2 x (f

MIXIN

+ fIF), 50Ω system impedance,

R

BIAS

= 18kΩ, R

LNA

= 24kΩ, cascaded performance includes 2dB interstage filter loss, TA= -40°C to +85°C, unless otherwise

noted. Typical values are at V

CC

= +2.9V, P

LO_IN

= -7dBm, LOW = 0V, HIGH = +3.0V, TA= +25°C, unless otherwise noted.)

PARAMETER

CONDITIONS

TYP

UNITS

HIGH-GAIN, LOW-LINEARITY MODE (MODE[2:0] = 101)

Gain G (Note 1)

26.5

dB

Noise Figure NF

2.1

dB

Input Third-Order Intercept Point

IIP3 TA = + 25°C (Notes 1, 3)

-12.5

dBm

LOW-GAIN MODE (MODE[2:0] = 011)

Gain G (Note 1) 5 9

dB

Noise Figure NF

12

dB

Input Third-Order Intercept Point

IIP3 TA = + 25°C (Notes 1, 3) 3 7

dBm

LNA PERFORMANCE

HIGH-GAIN, HIGH-LINEARITY MODE (MODE[2:0] = 111)

Gain G

LNA

15.5 dB

Noise Figure

Including off-chip matching 1.7 dB

Input Third-Order Intercept Point

(Note 3) +7

dBm

HIGH-GAIN, LOW-LINEARITY MODE (MODE[2:0] = 101)

Gain G

LNA

14.5 dB

Noise Figure NF

LNA

Including off-chip matching 1.5 dB

Input Third-Order Intercept Point

IIP3

LNA

(Note 3) +5

dBm

LOW-GAIN MODE (MODE[2:0] = 011)

Gain G

LNA

-2.7 dB

Noise Figure

Including off-chip matching 5.5 dB

Input Third-Order Intercept Point

(Note 3) +14

dBm

MIXER PERFORMANCE

HIGH-GAIN, HIGH-LINEARITY MODE (MODE[2:0] = 111)

Gain

14 dB

Noise Figure

Including off-chip matching 7 dB

Input Third-Order Intercept Point

(Note 3) +2

dBm

HIGH-GAIN, LOW-LINEARITY MODE (MODE[2:0] = 101)

Gain

13.5 dB

Noise Figure

Including off-chip matching 6.7 dB

Input Third-Order Intercept Point

(Note 3) 0

dBm

LOW-GAIN MODE (MODE[2:0] = 011)

Gain

14 dB

Noise Figure

Including off-chip matching 7 dB

Input Third-Order Intercept Point

(Note 3) +2

dBm

SYMBOL

IIP3

IIP3

G

NF

IIP3

G

NF

IIP3

G

NF

IIP3

Incl ud i ng off- chi p m atchi ng , TA = + 25°C ( N ote 2)

Incl ud i ng off- chi p m atchi ng , TA = + 25°C ( N ote 2)

NF

LNA

LNA

NF

LNA

LNA

MIXER

MIXER

MIXER

MIXER

MIXER

MIXER

MIXER

MIXER

MIXER

MIN

21.0

MAX

30.5

2.5

-15

14

15

MAX2335

450MHz CDMA/OFDM LNA/Mixer

4 _______________________________________________________________________________________

Typical Operating Characteristics

(MAX2335 EV Kit, VCC= +2.9V, f

LNAIN

= 465MHz, fIF= 110MHz, f

LO_IN

= 1150MHz, P

LO_IN

= -7dBm, R

BIAS

= 18kΩ, R

LNA

= 24kΩ,

TA= +25°C, unless otherwise noted.)

SUPPLY CURRENT (HGHL)

vs. TEMPERATURE

MAX2335 toc01

TEMPERATURE (°C)

SUPPLY CURRENT (mA)

603510-15

28

30

32

34

26

-40 85

LNA GAIN VS RF FREQUENCY

MAX2335 toc02

RF FREQUENCY (MHz)

LNA GAIN (dB)

480460440420

-4

0

4

8

12

16

20

-8
400 500

HG

LG

6

4

2

0

400

LG

HG

440420 460 480 500

LNA NOISE FIGURE vs. RF FREQUENCY

MAX2335 toc03

RF FREQUENCY (MHz)

LNA NOISE FIGURE (dB)

5

6

8

7

9

10

-40 10-15 35 60 85

LNA HGHL IIP3 vs. TEMPERATURE

MAX2335 toc04

TEMPERATURE (°C)

LNA HGHL IIP3 (dBm)

R

LNA

= 18kΩ

R

LNA

= 24kΩ

MIXER HGHL IIP3 vs. TEMPERATURE

MAX2335 toc05

TEMPERATURE (°C)

MIXER HGHL IIP3 (dBm)

603510-15

-1

0

1

2

3

4

-2

-40 85

R

BIAS

= 18kΩ

R

BIAS

= 24kΩ

MIXER HG NOISE FIGURE

vs. RF FREQUENCY

MAX2335 toc06

RF FREQUENCY (MHz)

MIXER HG NOISE FIGURE (dB)

480460440420

6.6

6.8

7.0

6.4
400 500

20

15

10

5

0

2.0

1.5

1.0

0.5

0

0 200100 300 400 500

MIXER IF PORT DIFFERENTIAL

PORT IMPEDANCE

MAX2335 toc07

RF FREQUENCY (MHz)

EQUIVALENT PARALLEL RESISTANCE (kΩ)

EQUIVALENT PARALLEL CAPACITANCE (pF)

CAPACITANCE

RESISTANCE

MAX2335

450MHz CDMA/OFDM LNA/Mixer

_______________________________________________________________________________________ 5

Pin Description

PIN NAME DESCRIPTION

1 DEGEN LNA Degeneration. Connect a 1nH to 3nH inductor from DEGEN to ground.

2R

LNA

LNA Bias. Connect an 18kΩ to 24kΩ resistor from R

LNA

to ground. Adjust R

LNA

to adjust the linearity

of the input LNA in the HGHL mode.

3 GND Ground. Connect to PC board ground plane using low-inductance vias.

4 LNAIN RF Input. Requires a DC-blocking capacitor, which can be used as part of the matching network.

5 MODE0 Logic Input. See Table 1.

6 MODE1 Logic Input. See Table 1.

7 MODE2 Logic Input. See Table 1.

8, 11, 14, 18,

24, 25, 27

N.C. No Connection. These pins are internally unconnected. Connect to the PC board ground plane.

9 LO/2 Logic Input. Drive low to disable the LO/2. Drive high to enable the LO/2.

10 LO_IN

LO Input. Internally matched to 50Ω. Requires an external DC-blocking capacitor. The LO input
frequency can be internally divided by two prior to application to the mixer by driving LO/2 high.

12, 23 I.C. Internally Connected. Leave these pins unconnected for proper operation.

13 LO_OUT

LO Buffer Output. Internally matched to 50Ω. Does not require a DC-blocking capacitor. The output
frequency of the buffer is equal to the LO frequency divided by two when LO/2 is high, or the LO
frequency when LO/2 is low.

15, 16, 26

V

CC

Power Supply. Bypass pins 16 and 26 to the PC board ground with a capacitor placed as close to the
pin as possible. Do not share capacitor ground vias with other ground connections.

17 BUFFEN

LO Output Buffer Enable. Drive high to enable the LO output buffer. Drive low to disable the LO
output buffer.

19, 20

IF_CDMA-,

Differential IF Output Port. Requires pullup inductors to VCC, which can be used as part of the
matching network.

21 R

BIAS

Bias Resistor Connection. Connect an 18kΩ to 24kΩ resistor from R

BIAS

to ground. Adjust R

BIAS

to

adjust the linearity of the input LNA in all modes except HGHL and the mixer in all modes.

22 MIXIN Mixer Input. Requires an external matching network

28 LNAOUT

LNA Output. Requires an external pullup inductor to V

CC

and a DC-blocking capacitor, both of which

can be used as part of the matching network.

—EP

Exposed-Paddle Ground Connection. Solder the exposed paddle (EP) evenly to the board’s ground
plane for proper operation.

IF_CDMA+

MAX2335

Detailed Description

Low-Noise Amplifiers (LNAs)

The MAX2335’s LNA gain and linearity characteristics
can be adjusted using the MODE[2:0] inputs. See
Table 1 for the pin settings for various operating
modes. Use high-gain, high-linearity mode (HGHL)
when extra-high linearity is required for cross-modula­tion suppression in the presence of strong interfering
signals (e.g., when the system transmitter is on). Use
high-gain, low-linearity mode (HGLL) when the trans­mitter is off and cross-modulation is not a concern, and
use low-gain mode (LG) when receiving large signals.
R

LNA

can be adjusted to vary the current and linearity

of the HGHL LNA. R

BIAS

adjusts the current and the lin-

earity of the HGLL and LG LNA.

Downconverter

The mixer requires a DC-blocking capacitor at the input
and pullup inductors at the output. The DC-blocking
capacitors and pullup inductors can be designed to be
part of the matching circuits. See Table 1 for the MODE
settings for various operating modes.

LO Output Buffer

The LO output buffer is internally matched to 50Ω and
includes a DC-blocking capacitor. Enable the buffer by
driving the BUFFEN input high; disable the buffer by
driving the BUFFEN input low. The frequency of the
buffer output is equal to the LO frequency if the LO/2
input is driven low, or equal to the LO frequency divid­ed by two if LO/2 is driven high.

Applications Information

Cascaded LNA/Mixer Performance

The LNA and mixer design optimizes cascaded perfor­mance in all gain and linearity modes. In HGHL mode,
both the LNA and mixer have a low noise figure, high
gain, and high linearity. The LNA has high gain to mini­mize the noise contribution of the mixer, thus increasing
the receiver’s sensitivity, and the LNA has high linearity
for cross-modulation suppression. The HGLL mode is
used when the transmitter is off and cross-modulation
is not a concern. In LG mode, the received signal is
strong enough that linearity is the primary concern. The
LNA gain is reduced to achieve higher system linearity.

S-Parameters

The S-parameters in Tables 2, 3, and 4 can be used to
design the RF matching circuits.

450MHz CDMA/OFDM LNA/Mixer

6 _______________________________________________________________________________________

FUNCTION

CONTROL

PINS

MODES

LO/1

LO/2

HGHL LNA

HGLL LNA

LG LNA

HGHL MIXER

HGLL MIXER

MODE2

MODE1

MODE0

LO/2

HGHL (LO Frequency Divided by Two)

1

HGLL (LO Frequency Divided by Two)

1

LG (LO Frequency Divided by Two)

1

HGHL (LO Frequency Undivided)

0

HGLL (LO Frequency Undivided)

0

LG (LO Frequency Undivided)

0

Shutdown Mode

X

Undefined

X

Undefined

X

Table 1. Operating Modes

✓✓ ✓ 111

✓✓ ✓101

✓✓✓011

✓✓ ✓111

✓✓✓101

✓✓✓011

000

1X0

X10

MAX2335

450MHz CDMA/OFDM LNA/Mixer

_______________________________________________________________________________________ 7

FREQUENCY

(MHz)

S11 (dB)

∠S11

S21 (dB)

∠S21

S12 (dB)

∠S12

S22 (dB)

∠S22

( D EG R EES)

50 -0.693 -20.000 22.265 2.173

-39.133 -0.607 55.183

100 -1.302 -38.600 21.655 -41.256

-83.956 -0.532 10.563

150 -1.957 -54.244 20.037 -68.340

-107.964 -0.819 -11.252

200 -2.407 -68.840 18.300 -89.560

-124.383 -1.051 -26.637

250 -2.656 -82.550 16.860 -105.680

-136.021 -1.250 -39.640

300 -2.813 -97.830 15.354 -120.500

-147.784 -1.420 -51.424

350 -2.959 -112.274 14.262 -133.400

-161.620 -1.492 -63.020

400 -2.953 -127.226 12.926 -144.921

-172.633 -1.590 -73.860

410 -2.944 -130.500 12.710 -146.900

-174.766 -1.630 -76.200

420 -2.914 -133.724 12.530 -149.125

-177.340 -1.628 -78.540

430 -2.876 -136.800 12.439 -151.380

-179.138 -1.634 -80.612

440 -2.878 -139.320 12.220 -153.900

177.020 -1.650 -82.870

450 -2.884 -142.833 12.000 -155.650

176.320 -1.665 -84.900

460 -2.850 -145.863 11.820 -158.324

173.850 -1.667 -87.422

470 -2.828 -149.000 11.550 -160.300

171.027 -1.697 -89.183

480 -2.828 -159.962 11.343 -161.928

169.065 -1.711 -91.480

490 -2.811 -155.360 11.150 -163.540

167.483 -1.720 -93.335

500 -2.763 -158.386 11.060 -165.000

164.144 -1.718 -95.970

550 -2.628 -174.012 10.298 -174.600

152.660 -1.756 -107.020

600 -2.444 169.970 9.810 178.350

139.530 -1.770 -117.930

650 -2.230 153.600 9.255 170.400

128.572 -1.778 -129.730

700 -1.989 137.420 9.200 162.304

117.290 -1.776 -141.100

750 -1.733 121.170 9.164 154.522

106.200 -1.828 -152.555

800 -1.464 104.500 9.470 146.813

94.020 -1.778 -164.610

850 -1.236 87.855 9.690 135.700

83.711 -1.810 -176.805

900 -0.978 73.488 10.432 127.430

70.714 -1.860 170.521

950 -0.889 53.876 10.613 112.950

59.976 -1.887 158.326

1000 -0.858 36.186 11.417 101.010

45.167 -2.033 145.377

Table 2. MAX2335 LNA S-Parameters in HGHL Mode

( D EG R EES)

( D EG R EES)

( D EG R EES)

-45.196

-37.836

-33.411

-31.340

-29.466

-28.422

-26.605

-25.600

-25.519

-25.062

-24.960

-24.780

-24.500

-24.465

-24.239

-24.180

-23.736

-23.568

-22.850

-21.890

-21.400

-20.375

-20.230

-19.626

-19.430

-18.654

-18.512

-17.839

MAX2335

Power-Supply Layout

To minimize coupling between different sections of the
IC, use a star configuration, which has a large decou­pling capacitor at a central VCCnode. The VCCtraces
branch out from this node, each going to a separate
VCCpin of the MAX2335. At the end of each trace is a
bypass capacitor with impedance to ground less than
1Ω at the frequency of interest. This arrangement pro­vides local decoupling at each VCCpin. Use at least
one via per bypass capacitor for a low-inductance
ground connection. Also, connect the exposed paddle
to the PC board GND with multiple vias to provide the
lowest inductance ground connection possible.

Matching Network Layout

The layout of a matching network can be very sensitive
to parasitic circuit elements. To minimize parasitic
inductance, keep all traces short and place compo­nents as close to the IC as possible.

Use high-Q components for the LNA input-matching
network to achieve the lowest possible noise figure.
Keep the distance between the differential signal lines
at the mixer outputs constant and make both lines of
equal length to ensure signal balance.

Chip Information

PROCESS: SiGe

450MHz CDMA/OFDM LNA/Mixer

8 _______________________________________________________________________________________

Table 3. MAX2335 Mixer Input Impedance
in HGHL Mode

Table 4. MAX2335 Mixer Output
Impedance (Shunt RC) in HGHL Mode

FREQUENCY (MHz) S11 (dB)

∠S11

(DEGREES)

400 -1.2 77.23

410 -1.229 74.52

420 -1.247 71.7

430 -1.24 69.124

440 -1.24 66.47

450 -1.25 63.97

460 -1.28 61.455

470 -1.32 58.68

480 -1.33 55.87

490 -1.35 53.565

500 -1.35 50.87

EQUIVALENT

IF FREQUENCY

(MHz)

80 17.7 1.21

100 16.961 1.21

120 15.79 1.21

140 14.616 1.21

160 13.49 1.21

190 11.87 1.21

SHUNT

RESISTANCE

(kΩ)

EQUIVALENT

SHUNT

CAPACITANCE

(pF)

MAX2335

450MHz CDMA/OFDM LNA/Mixer

_______________________________________________________________________________________ 9

Typical Application Circuit

V

CC

465MHz

BANDPASS

FILTER

LO INPUT

CHARGE-

PUMP OUTPUT

PLL INPUT

V

CC

47nH

IF OUT+

IF OUT-

0.01µF

6.8pF

6.8pF

100pF

3.9pF

6800pF

V

CC

V

CC

470Ω

1kΩ

18kΩ

20Ω

18nH

24kΩ

1nH

22nH

270nH

270nH

100pF

RFPLL

19.2MHz
TCXO

REFERENCE

INPUT

100pF

DUPLEXER

0.01µF

1GHz
VCO

MAX2335

MAX2370

÷2

5

6

4

3

17

16

18

R

LNA

LNAIN

MODEO

MODE1

MODE2

MODEO

MODE1

MODE2

19

DEGEN

IF_CDMA+

N.C.

BUFFEN

EP

R

BIAS

V

CC

V

CC

89

N.C.

11 12 13 14

2728 26 24 23 22

V

CC

N.C.

LO_IN

N.C.

I.C.

LO_OUT

GND

IF_CDMA-

10

25

7

15

LNAOUT

N.C.

N.C.

2

20

LO/2

I.C.

1

21

N.C.

MIXIN

+

V

CC

V

CC

1000pF100pF

100pF

22µF

LO BUFFER
ENABLE

PA

Package Information

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages

.)

QFN THIN.EPS

D2

(ND-1) X e

e

D

C

PIN # 1

I.D.

(NE-1) X e

E/2

E

0.08 C

0.10 C

A

A1

A3

DETAIL A

E2/2

E2

0.10 M C A B

PIN # 1 I.D.

b

0.35x45°

D/2

D2/2

L

C

L

C

e e

L

CC

L

k

L

L

DETAIL B

L

L1

e

AAAAA

MARKING

I

1

2

21-0140

PACKAGE OUTLINE,
16, 20, 28, 32, 40L THIN QFN, 5x5x0.8mm

-DRAWING NOT TO SCALE-

L

e/2

MAX2335

450MHz CDMA/OFDM LNA/Mixer

10 ______________________________________________________________________________________

MAX2335

450MHz CDMA/OFDM LNA/Mixer

Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.

Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 11

© 2005 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc.

COMMON DIMENSIONS

MAX.

EXPOSED PAD VARIATIONS

D2

NOM.MIN.

MIN.

E2

NOM. MAX.

NE

ND

PKG.

CODES

1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994.

2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES.

3. N IS THE TOTAL NUMBER OF TERMINALS.

4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL
CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE
OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1
IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE.

5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN

0.25 mm AND 0.30 mm FROM TERMINAL TIP.

6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY.

7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION.

8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.

9. DRAWING CONFORMS TO JEDEC MO220, EXCEPT EXPOSED PAD DIMENSION FOR
T2855-3 AND T2855-6.

NOTES:

SYMBOL

PKG.

N

L1

e

E

D

b

A3

A

A1

k

10. WARPAGE SHALL NOT EXCEED 0.10 mm.

JEDEC

0.70 0.800.75

4.90

4.90

0.25

0.250--

4

WHHB

4

16

0.350.30

5.10

5.105.00

0.80 BSC.

5.00

0.05

0.20 REF.

0.02

MIN. MAX.NOM.

16L 5x5

L

0.30 0.500.40

---

---

WHHC

20

5

5

5.00

5.00

0.30

0.55

0.65 BSC.

0.45

0.25

4.90

4.90

0.25

0.65

--

5.10

5.10

0.35

20L 5x5

0.20 REF.

0.75

0.02

NOM.

0

0.70

MIN.

0.05

0.80

MAX.

---

WHHD-1

28

7

7

5.00

5.00

0.25

0.55

0.50 BSC.

0.45

0.25

4.90

4.90

0.20

0.65

--

5.10

5.10

0.30

28L 5x5

0.20 REF.

0.75

0.02

NOM.

0

0.70

MIN.

0.05

0.80

MAX.

---

WHHD-2

32

8

8

5.00

5.00

0.40

0.50 BSC.

0.30

0.25

4.90

4.90

0.50

--

5.10

5.10

32L 5x5

0.20 REF.

0.75

0.02

NOM.

0

0.70

MIN.

0.05

0.80

MAX.

0.20 0.25 0.30

DOWN
BONDS
ALLOWED

YES3.103.00 3.203.103.00 3.20T2055-3

3.103.00 3.203.103.00 3.20

T2055-4

T2855-3 3.15 3.25 3.35 3.15 3.25 3.35

T2855-6

3.15 3.25 3.35 3.15 3.25 3.35

T2855-4 2.60 2.70 2.80 2.60 2.70 2.80
T2855-5 2.60 2.70 2.80 2.60 2.70 2.80

T2855-7 2.60 2.70

2.80

2.60 2.70 2.80

3.20

3.00 3.10T3255-3 3 .203.00 3.10

3.203.00 3.10T3255-4 3 .203.00 3.10

NO

NO
NO

NO

YES
YES

YES

YES

3.203.00T1655-3 3.10 3.00 3.10 3.20 NO
NO3.203.103.003.10T1655N-1 3.00 3.20

3.353.15T2055-5 3.25 3.15 3.25 3.35

YES

3.35

3.15

T2855N-1

3.25 3.15 3.25 3.35

NO

3.353.15T2855-8 3.25 3.15 3.25 3.35

YES

3.203.10T3255N-1 3.00

NO

3.203.103.00

L

0.40

0.40

**
**
**

**

**
**
**
**
**

**
**

**

**

**

SEE COMMON DIMENSIONS TABLE

±0.15

11. MARKING IS FOR PACKAGE ORIENTATION REFERENCE ONLY.

I

2

2

21-0140

PACKAGE OUTLINE,
16, 20, 28, 32, 40L THIN QFN, 5x5x0.8mm

-DRAWING NOT TO SCALE-

12. NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY.

3.30T4055-1 3.20 3.40 3.20 3.30 3.40

**

YES

0.050 0.02

0.600.40 0.50

10

-----

0.30

40
10

0.40 0.50

5.10

4.90 5.00

0.25 0.35 0.45

0.40 BSC.

0.15

4.90

0.250.20

5.00 5.10

0.20 REF.

0.70

MIN.

0.75 0.80

NOM.

40L 5x5

MAX.

13. LEAD CENTERLINES TO BE AT TRUE POSITION AS DEFINED BY BASIC DIMENSION "e", ±0.05.

T1655-2

**

YES3.203.103.003.103.00 3.20

T3255-5 YES3.003.103.00

3.20

3.203.10

**

exceptions

Package Information (continued)

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages

.)