Maxim MAX2235EUP Datasheet

General Description

The MAX2240 single-supply, low-voltage power amplifi­er (PA) IC is designed specifically for applications in
the 2.4GHz to 2.5GHz frequency band. The PA is com­pliant with Bluetooth, HomeRF, and 802.11 standards,
as well as other FSK modulation systems. The PA pro­vides a nominal +20dBm (100mW) output power in the
highest power mode.

The PA includes a digital power control circuit to greatly
simplify control of the output power. Four digitally con­trolled output power levels are provided: from +3dBm
to +20dBm. A digital input controls the active or shut­down operating modes of the PA. In the shutdown
mode, the current reduces to 0.5µA.

The IC integrates the RF input and interstage matching
to simplify application of the IC. Temperature and sup­ply-independent biasing are also included to provide
stable performance under all operating conditions.

The IC operates from a +2.7V to +5V single-supply volt­age. No negative bias voltage is required. Current con­sumption is a modest 105mA at the highest power
level.

The part is packaged in the ultra-chipscale package
(UCSP), significantly reducing the required PC board
area. The chip occupies only a 1.56mm x 1.56mm area.
The 3 x 3 array of solder bumps are spaced with a

0.5mm bump pitch.

________________________Applications

Bluetooth

HomeRF

802.11 FHSS WLAN

2.4GHz ISM Proprietary Radios

Features

♦ 2.4GHz to 2.5GHz Frequency Range

♦ High +20dBm Output Power

♦ 2-Bit Digital Power Control: 4 Output Levels

♦ Integrated Input Match to 50Ω

♦ Low 105mA Operating Current

♦ 0.5µA Low-Power Shutdown Mode Current

♦ +2.7V to +5V Single-Supply Operation

♦ Ultra-Chipscale Package

(1.56mm x 1.56mm)

MAX2240

2.5GHz, +20dBm Power Amplifier IC
in UCSP Package

________________________________________________________________ Maxim Integrated Products 1

Typical Application Circuit/Functional Diagram

19-1624; Rev 0; 3/00

Ordering Information

9 UCSP*

PIN-PACKAGETEMP. RANGE

-40°C to +85°CMAX2240EBL

PART

*UCSP reliability is integrally linked to the user’s assembly
methods, circuit board material, and environment. Refer to the
UCSP Reliability Notice in the UCSP Reliability section of this
data sheet for more information.

Pin Configuration appears at end of data sheet.

For free samples and the latest literature, visit www.maxim-ic.com or phone [phone].
For small orders, phone [phone].

EVALUATION KIT MANUAL

FOLLOWS DATA SHEET

V

CC

220 pF

BIAS

D0

D1

LOGIC INPUTS

*INDUCTANCE CREATED WITH PC BOARD TRANSMISSION LINE
(SEE APPLICATIONS SECTION).

SHDN

RFIN

CONTROL

MATCH

BIAS &
POWER

V

CC

18pF

1.2nH* (BOARD TRACE)

V

CC

GND1 GND2

RFOUT

75Ω

θ = 26°

V

CC

65Ω

θ = 41°

22nH

RFOUT

10pF

MAX2240

2.5GHz, +20dBm Power Amplifier IC
in UCSP Package

2 _______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

DC ELECTRICAL CHARACTERISTICS

(Using Typical Application Circuit, VCC= +2.7V to +5V, P

RFIN

= 0dBm to +4dBm, f

RFIN

= 2.4GHz to 2.5GHz, SHDN = VCC,

T

A

= -40°C to +85°C. Typical values measured at VCC= +3.2V, P

RFIN

= +3dBm, f

RFIN

= 2.45GHz, TA= +25°C, unless otherwise

noted.) (Note 1)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.

BIAS, VCC, RFOUT to GND ......................................-0.3V to +6V

Input Voltages

(SHDN, D0, D1, to GND).......................-0.3V to (V

BIAS

+ 0.3V)

(RFIN to GND) ....................................................-0.7V to +0.7V

Input Current (SHDN, D0, D1) ..........................................±10mA

RF Input Power (RFIN)....................................................+10dBm

Continuous Power Dissipation (T

A

= +85°C)

9-Pin UCSP...................................................................810mW

Operating Temperature Range ...........................-40°C to +85°C

Storage Temperature Range .............................-65°C to +150°C

Supply Current
(Note 2)

Shutdown Supply Current

DIGITAL CONTROL INPUT (D0, D1, AND SHDN)

Input Logic Voltage High

Input Logic Voltage Low

Input Current GND ≤ VIN ≤ V

PARAMETER CONDITIONS MIN TYP MAX UNITS

VDI ≤ 0.8V, VDO ≤ 0.8V, TA = +25°C, P
V

= 3.2V, f

CC

VDI ≤ 0.8V, VDO ≤ 0.8V 110

VDI ≤ 0.8V, VDO ≥ 2.0V, TA = +25°C, P
V

= 3.2V, f

CC

VDI ≤ 0.8V, VDO ≥ 2.0V 111

V

≥ 2.0V, VDO ≤ 0.8V, TA = +25°C, P

DI

= 3.2V, f

V

CC

VDI ≥ 2.0V, VDO ≤ 0.8V 115

VDI ≥ 2.0V, VDO ≥ 2.0V, TA = +25°C, P
V

= 3.2V, f

CC

V

≥ 2.0V, VDO ≥ 2.0V 155

DI

SHDN ≤ 0.8V, VD0 ≤ 0.8V, VD1 ≤ 0.8V, no input signal 0.5 10.0

= 2.45GHz (Note 3)

RFIN

= 2.45GHz (Note 3)

RFIN

= 2.45GHz (Note 3)

RFIN

= 2.45GHz (Note 3)

RFIN

BIAS

RFIN

RFIN

RFIN

RFIN

= +3dBm,

= +3dBm,

= +3dBm,

= +3dBm,

65 80

68 85

75 90

105 125

2

11µA

0.8

mA

µA

V

V

MAX2240

2.5GHz, +20dBm Power Amplifier IC
in UCSP Package

_______________________________________________________________________________________ 3

AC ELECTRICAL CHARACTERISTICS

(MAX2240 EV kit, VCC= +2.7V to +5V, P

RFIN

= 0dBm to +4dBm, f

RFIN

= 2.4GHz to 2.5GHz, SHDN = VCC, TA= +25°C. Typical values

measured at V

CC

= +3.2V, P

RFIN

= +3dBm, f

RFIN

= 2.45GHz, unless otherwise noted.)

All power levels set by D0, D1;
any load phase angle, any duration

All power levels set by D0, D1; load VSWR ≤ 3:1

SHDN = 1 to 0, D0 = D1 = logic high-to-low transition

CONDITIONS

6:1

Maximum Output VSWR Without
Damage (Note 8)

dB45

Input to Output Isolation in
Shutdown

dBm-30

Nonharmonic Spurious Output
(Note 9)

µs2

Power Ramp Turn-Off Time
(Notes 7, 9)

UNITSMIN TYP MAXPARAMETERS

VCC= 5.0V 268

Power Control Steps
(Notes 4, 9)

SHDN = 0 to 1, D0 = D1 = logic low-to-high transition

µs2

Power Ramp Turn-On Time
(Notes 6, 9)

dBm-15 -5Harmonic Output (Notes 3, 9)

RS= 50Ω, over full Pinrange dBm1.5:1 2:1

In-Band Spurious Noise
(Notes 5, 9)

Frequency offset = ±550kHz dBc-21 -20

Frequency offset = ±1.5MHz

dBm

-20

Frequency offset = ±2.5MHz -40

Input VSWR (Note 9)

VCC= 2.7V to 5.0V

dB

2 8.6

Note 1: Limits are 100% production tested at TA= +25°C. Limits over the entire operating temperature range are guaranteed by

design and characterization but are not production tested.

Note 2: Supply current is measured with RF power applied to the input.

Note 3: Measured with an output-matching network to minimize the 2nd and 3rd harmonics (see Applications section).

Note 4: Power steps between adjacent power levels. All other operating conditions remain constant during power step change.

Note 5: Output measured in 100kHz RBW. Test signal modulation shall comply with GFSK, BT = 0.5, 1-bit/symbol, 1Mbps, frequency

deviation = 175kHz.

Note 6: The total turn-on time for the PA output power to settle within 1dB of the final value.
Note 7: The total turn-off time for the PA output power to drop to -10dBm.
Note 8: After removal of the load mismatch, the PA returns to operation under normal conditions.
Note 9: Guaranteed by design and characterization.

MHz2400 2500Frequency Range

VD1≤ 0.8V, VD0≥ 2V 8

VD1≥ 2V, VD0≤ 0.8V 12

VD1≥ 2V, VD0≥ 2V, TA= -40°C to +85°C (Note 1) 15.3 19 24

VD1≤ 0.8V, VD0≤ 0.8V

dBm

3

Output Power

dBm04Input Power Range