MAXIM MAX2232, MAX2233 Technical data

General Description

The MAX2232/MAX2233 low-voltage, silicon RF power
amplifiers (PAs) are designed for use in the 900MHz
ISM band. They operate from a single +2.7V to +5.5V
supply, allowing them to be powered directly from a 3­cell NiCd or a 1-cell Lithium-Ion battery. The devices
typically deliver 250mW (+24dBm) of output power at
915MHz from a single +3.6V supply, or 150mW
(+22dBm) from a single +2.7V supply. At +24dBm out­put power, power-added efficiency (PAE) is 44%.

The MAX2232/MAX2233 provide 24dB of gain, which is
adjustable over a continuous 24dB span via the analog
gain-control pin of the MAX2232 or in two 10dB steps
via the 2-bit programmable gain-control DAC of the
MAX2233. An external capacitor sets the RF output
power envelope ramp time, reducing spurious emis­sions during power-up and power-down by providing a
gradual change in output power (MAX2232).

The MAX2232/MAX2233 feature a low-power shutdown
mode, which typically draws less than 1µA of supply
current, saving power during “idle slots” in time-division
multiple-access (TDMA) systems. The ∆VSWR of the RF
input in shutdown mode relative to normal operation is

1.2:1. The devices also feature a thermal shutdown
function, enabling the PA to protect itself from excessive
temperature conditions that could damage the IC. A
capacitor to ground limits thermal cycling by setting a
thermal shutdown timeout period.

The MAX2232/MAX2233 are available in a space-sav­ing, thermally enhanced 16-pin power-QSOP (PQSOP)
package.

Applications

900MHz ISM Band

Digital Cordless Phones

Wireless Data

FM Analog Transmitters

868MHz European ISM Band

Features

♦ 800MHz to 1000MHz Frequency Range

♦ 250mW (+24dBm) Output Power at 915MHz from

+3.6V Supply

♦ +2.7V to +5.5V Single-Supply Operation

♦ 44% Power-Added Efficiency

♦ 24dB Power Gain

♦ 24dB Analog Gain-Control Range (MAX2232)

♦ Three Levels of Digitally Programmed Power Gain

in 10dB Steps (MAX2233)

♦ Programmable RF Power Envelope Ramping

(MAX2232)

♦ Thermal Shutdown

♦ Programmable Thermal Shutdown Timeout Period

♦ 0.2µA Low-Power Shutdown Mode

♦ Low ∆VWSR in Standby and Shutdown Modes

MAX2232/MAX2233

900MHz ISM-Band, 250mW Power Amplifiers

with Analog or Digital Gain Control

________________________________________________________________ Maxim Integrated Products 1

19-1470; Rev 1; 6/00

PART

MAX2232EEE

MAX2233EEE

-40°C to +85°C

-40°C to +85°C

TEMP. RANGE PIN-PACKAGE

16 PQSOP

16 PQSOP

Pin Configuration

Ordering Information

Functional Diagrams appear at end of data sheet.

For price, delivery, and to place orders, please contact Maxim Distribution at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.

TOP VIEW

1

RFIN V

GND

2

SHDN (D1)

CTRL (D0)

GND

GND

GND

RFOUT

3

MAX2232

4

MAX2233

5

6

7

8

16

GND

15

RAMP+ (N.C.)

14

RAMP- (N.C.)

13

V

12

V

11

TSET

10

N.C.

9

CC

CC

CC

GROUND OF OUTPUT STAGE CONNECTED TO PACKAGE SLUG.
( ) ARE FOR MAX2233.

PQSOP

MAX2232/MAX2233

900MHz ISM-Band, 250mW Power Amplifiers
with Analog or Digital Gain Control

2 _______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

DC ELECTRICAL CHARACTERISTICS

(V

CC

= +2.7V to +5.5V, V

CTRL

= +2.2V, V

SHDN

= VD0= VD1= +2V, TA= -40°C to +85°C. No input signal applied, unless otherwise

noted. Typical values are at V

CC

= +3.6V and TA= +25°C.)

AC ELECTRICAL CHARACTERISTICS

(MAX2232/MAX2233 Evaluation Kit, VCC= +3.6V, V

CTRL

= +2.2V, SHDN = VCC(MAX2232), D0 = D1 = VCC(MAX2233),

P

RFIN

= 0dBm, ƒ

RFIN

= 915MHz, TA= +25°C, unless otherwise noted.)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.

VCCto GND...........................................................-0.3V to +6.5V

SHDN, CTRL, D0, D1 to GND ....................-0.3V to (V

CC

+0.3V)

I

RFIN

....................................................................................10mA

RFIN Power (50Ω AC-coupled source). .........................+10dBm

Output Load VSWR. ................................................................6:1

Continuous Power Dissipation (T

A

= +70°C)

16-Pin PQSOP (derate 80mW/°C above +70°C) ................3W

Operating Temperature Range ...........................-40°C to +85°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

V

CTRL

≤ 0.4V (MAX2232)

V

SHDN

= 0.6V,

VD0= VD1= 0.6V

V

CTRL

= GND

V

SHDN

= GND (MAX2232),

VD0= VD1= GND (MAX2233)

V

SHDN

= 2.0V (MAX2232),

V

D0

= VD1= 2.0V (MAX2233)

MAX2232

SHDN (MAX2232), D0, D1 (MAX2233)
SHDN (MAX2232), D0, D1 (MAX2233)

MAX2232

V

CTRL

= 2.2V

CONDITIONS

1.5

mA20.3 25I

CC

Standby Supply Current

0.2 10

I

CC

V2.7 5.5V

CC

Supply Voltage Range

Shutdown Supply Current

µA

-1.5 1

CTRL Input Current

-1 1I

IL

µA

-1 10I

IH

Logic Input Current

V0.6V

CTRL

CTRL Input for Gain-Control
Mode

V2.0V

IH

Logic Input High

V0.6V

IL

Logic Input Low

V0.4V

CTRL

CTRL Input for Standby Mode

UNITSMIN TYP MAXSYMBOLPARAMETER

µA

120

VCC≤ 3.6V

VCC= 5.5V

VCC= 4.8V

(Notes 1, 2)

D0 = GND, D1 = VCC(MAX2233 only)

VCC= 3.6V (Note 1)

VCC= 3.0V

VCC= 2.7V

TA= T

MIN

to T

MAX

(Note 1)

CONDITIONS

25.4

dB23.9G

P

MHz902 928ƒ

IN

Frequency Range

Power Gain

dBm15.8P

OUT

Output Power, Medium-Power
Mode

22.9 23.9 24.9
dBm

22.5

21.6

P

OUT

Output Power

dB1.9 3.2∆P

OUT

Output Power Variation Over
Temperature

UNITSMIN TYP MAXSYMBOLPARAMETER

MAX2232/MAX2233

900MHz ISM-Band, 250mW Power Amplifiers

with Analog or Digital Gain Control

_______________________________________________________________________________________ 3

AC ELECTRICAL CHARACTERISTICS (continued)

(MAX2232/MAX2233 Evaluation Kit, VCC= +3.6V, V

CTRL

= +2.2V, SHDN = VCC(MAX2232), D0 = D1 = VCC(MAX2233),

P

RFIN

= 0dBm, ƒ

RFIN

= 915MHz, TA= +25°C, unless otherwise noted.)

Note 1: Guaranteed by design.
Note 2: Operation outside this range is possible, but not characterized.
Note 3: Gain is monotonic with V

CTRL

.

Note 4: Input VSWR relative to input impedance in operating mode.
Note 5: Harmonics measured on evaluation kit, which provides some harmonic attenuation in addition to the rejection provided by

the IC. The combined suppression is specified.

Note 6: Time measured from SHDN (MAX2232) low-to-high transition to when output power is within 1dB of final value. Includes

effects of 1% tolerance capacitor.

Note 7: Time measured from SHDN (MAX2232) high-to-low transition to when output power is -20dB of final value. Includes effects

of 1% tolerance capacitors.

Note 8: Time from die temperature dropping below Thermal Shutdown Temperature, T

TH

, to when the device turns itself back on.

C

RAMP

= 0.22µF (Notes 1, 6) (MAX2232 only)

(Note 5)

Any load phase angle, P

RFIN

= +5dBm,

TA= T

MIN

to T

MAX

VCC= +2.7V to +5.5V,
6:1 VSWR at any phase angle,
P

RFIN

= +5dBm

CTRL = GND (MAX2232 only)

SHDN = D0 = D1 = GND

MAX2232 only

0.6V < V

CTRL

< 2.2V (MAX2232 only)

Z

SOURCE

= 50Ω (Note 1)

D0 = VCC, D1 = GND (MAX2233 only)

D0 = VCC, D1 = GND (MAX2233 only)

D0 = GND, D1 = VCC(MAX2233 only)

CTRL adjusted to give P

RFOUT

= +21dBm

(MAX2232 only)

CONDITIONS

ms0.9Autoramping Rise Time

dBc29Harmonic Suppression

6:1

Maximum Output Load VSWR
Without Damage (Note1)

dBc-60

Maximum Nonharmonic
Spurious Output Due to Load
Mismatch

dB

38

52

Off-Isolation

1.2:1∆VSWR

Input VSWR Change, Standby
Mode (Notes 1, 4)

1.4:1∆VSWR

Input VSWR Change, Shutdown
Mode (Notes 1, 4)

1.5:1VSWRInput VSWR

mA44.0I

CC

Supply Current, Low-Power
Mode

mA78.5I

CC

Supply Current, Medium-Power
Mode

%29PAE

Power-Added Efficiency at
+21dBm Output Power

%44PAEPower-Added Efficiency

dB23.6∆G

P

Gain-Control Range (Note 3)

dBm6.5P

OUT

Output Power, Low-Power Mode

UNITSMIN TYP MAXSYMBOLPARAMETER

P

RFIN

= 0dBm, VCC= +3.6V

RAMP+ = RAMP- = unconnected (Note 6)

C

RAMP

= 0.22µF (Notes 1, 7) (MAX2232 only)

C

TSET

= 0.22µF (Note 8)

°C145T

TH

Thermal Shutdown Temperature

µs0.4

ms3.2Autoramping Fall Time

Output Power Rise Time

ms900t

TH

Thermal Shutdown Timeout
Period

LINEAR

SCALE

0

3V

1ms/div

MAX2232

OUTPUT POWER vs. SHUTDOWN CONTROL

MAX2232/33 toc10

C

RAMP

= 0.22µF

OUTPUT
POWER

SHUTDOWN

MAX2232/MAX2233

900MHz ISM-Band, 250mW Power Amplifiers
with Analog or Digital Gain Control

4 _______________________________________________________________________________________

Typical Operating Characteristics

(MAX2232/MAX2233 Evaluation Kit, VCC= +3.6V, CTRL = VCC, SHDN = D0 = D1 = VCC, P

RFIN

= 0dBm, f

RFIN

= 915MHz, TA= +25°C,

unless otherwise noted.)

0.001

0.01

1

0.1

10

100

2.5 3.53.0 4.0 4.5 5.0 5.5

SHUTDOWN SUPPLY CURRENT

vs. SUPPLY VOLTAGE

MAX2232/33 toc01

SUPPLY VOLTAGE (V)

SHUTDOWN SUPPLY CURRENT (µA)

TA = -40°C

TA = +25°C

TA = +85°C

0

10

5

20

15

25

30

2.5 3.5 4.03.0 4.5 5.0 5.5

MAX2232

STANDBY SUPPLY CURRENT

vs. SUPPLY VOLTAGE

MAX2232/33 toc02

SUPPLY VOLTAGE (V)

SUPPLY CURRENT (mA)

TA = -40°C

TA = +25°C

TA = +85°C

V

SHDN

= V

CC

V

CTRL

= GND

RFIN = UNCONNECTED

22

23

24

25

26

27

28

20

21

2.5 3.53.0 4.0 4.5 5.0 5.5

OUTPUT POWER vs. SUPPLY VOLTAGE

MAX2232/33 toc03

SUPPLY VOLTAGE (V)

OUTPUT POWER (dBm)

TA = +85°C

TA = -40°C

TA = +25°C

0

5

10

15

20

25

30

0.6 1.00.8 1.2 1.4 1.6 .1.8 2.0 2.2 2.4

MAX2232

OUTPUT POWER vs. GAIN CONTROL VOLTAGE

MAX2232/33 toc06

V

CTRL

(V)

OUTPUT POWER (dBm)

TA = -40°C

TA = +25°C

TA = +85°C

10

0

20

40

30

50

60

2.5 3.53.0 4.0 4.5 5.0 5.5

POWER-ADDED EFFICIENCY

vs. SUPPLY VOLTAGE

MAX2232/33 toc04

SUPPLY VOLTAGE (V)

POWER-ADDED EFFICIENCY (%)

TA = -40°C

TA = +25°C

TA = +85°C

5

10

15

20

25

30

902 915 928

OUTPUT POWER vs. FREQUENCY

MAX2232/33 toc05

FREQUENCY (MHz)

OUTPUT POWER (dBm)

MAX2233 (D0 = 0, D1 = 1)

MAX2233 (D0 = D1 = 1), AND MAX2232

MAX2233 (D0 = 1, D1 = 0)

3

8

18

13

23

28

10

25

55

40

70

85

-20 -10-15 -5 0 5 10 15

OUTPUT POWER AND POWER-ADDED EFFICIENCY

vs. INPUT POWER

MAX2232/33 toc07

INPUT POWER (dBm)

OUTPUT POWER (dBm)

PAE (%)

TA = -40°C

TA = -40°C

TA = +25°C

P

OUT

PAE

TA = +25°C

TA = +85°C

TA = +85°C

1.0

1.2

1.4

1.6

1.8

2.0

902 915 928

MAX2232

RFIN PORT VSWR vs. FREQUENCY

MAX2232/33 toc08

FREQUENCY (MHz)

VSWR

SHUTDOWN MODE

NORMAL OPERATION

STANDBY MODE

MAX2232/MAX2233

900MHz ISM-Band, 250mW Power Amplifiers

with Analog or Digital Gain Control

_______________________________________________________________________________________ 5

Pin Description

PIN

FUNCTION

MAX2232 MAX2233

13 —

Negative Terminal of Output Power Ramp Capacitor. Connect capacitor, C

RAMP

, between

RAMP+ and RAMP- to control the rise and fall time of the output power ramp.

12 12 Input Stage Supply Voltage. Bypass with appropriate capacitors to GND.

11 11 Second Stage Supply Voltage. Bypass with appropriate capacitors to GND.

10 10

Thermal Shutdown Timeout Capacitor Terminal. Connect a capacitor from TSET to ground
to limit thermal cycling.

9 9, 13, 14 No Connection. Do not make a connection to this pin.

14 —

Positive Terminal of Output Power Ramp Capacitor. Connect capacitor, C

RAMP

, between

RAMP+ and RAMP- to control the rise and fall time of the output power ramp.

15 15

Bias Circuitry Ground. Connect directly to low-inductance ground plane. If vias are used,
separate them from other GND pin vias.

16 16 Bias Circuitry Supply Voltage. Bypass with appropriate capacitors to GND.

SLUG SLUG

Output Stage Ground. Provides additional thermal conduction, as well as a low-inductance
path to ground. Connect directly to low-inductance ground plane.

NAME

RAMP-

V

CC

V

CC

TSET

N.C.

RAMP+

GND

V

CC

GND

8 8 Open-Collector, RF Output Port. Connect output matching network to this pin.RFOUT

5, 6 5, 6

Second Stage Ground. Connect directly to low-inductance ground plane. If vias are used,
separate them from other GND pin vias.

GND

7 7

Output Stage Ground. Connect directly to low-inductance ground plane. If vias are used,
separate them from other GND pin vias.

GND

4 —

Analog Gain-Control Input. Apply a voltage between 0.6V and 2.2V to vary the gain of the
PA. Drive CTRL below 0.4V to place the device in standby mode. Drive CTRL above 2.2V to
place the device in peak output power mode.

CTRL

3 —

Shutdown Control Input. Drive SHDN low to place the device in shutdown mode. Drive high
for normal operation.

SHDN

— 3

Digital Gain/Shutdown Control Input. MSB of the 2-bit digital output power control. D0 and
D1 set the output power to one of three discrete levels. To place the device in shutdown,
drive D0 and D1 low (Table 2).

D1

— 4

Digital Gain/Shutdown Control Input. LSB of the 2-bit digital output power control. D0 and
D1 set the output power to one of three discrete levels. To place the device in shutdown,
drive D0 and D1 low (Table 2).

D0

1 1 RF Input Port. Requires external matching network and blocking capacitor.RFIN

2 2

Input Stage Ground. Connect directly to low-inductance ground plane. If vias are used,
separate them from other GND pin vias.

GND

MAX2232/MAX2233

900MHz ISM-Band, 250mW Power Amplifiers
with Analog or Digital Gain Control

6 _______________________________________________________________________________________

Detailed Description

The MAX2232/MAX2233 are nonlinear power amplifiers
(PAs) intended for constant envelope applications (FM,
FSK, GMSK). The devices operate over the 902MHz to
928MHz frequency range and provide typically 250mW
of output power and 44% efficiency from a single +2.7V
to +5.5V supply. Both devices typically provide 24dB of
gain, which is adjustable over a continuous 24dB range
through an analog voltage on CTRL of the MAX2232 or
in two 10dB steps through the 2-bit programmable gain
inputs (D0, D1) on the MAX2233. A low-power shutdown
mode on both devices reduces supply current to 0.2µA.

All bias, gain control, and temperature-sensing circuitry
is provided on-chip to save board space and reduce
component count. The signal path includes a variable
gain amplifier (VGA), an output driver, and an output
power transistor. On-chip interstage matching networks
are provided for optimal loading and power transfer.
Internal bias circuitry responds to CTRL and SHDN of
the MAX2232, or to the 2-bit gain/shutdown control
DAC of the MAX2233, providing optimum biasing and
efficiency as well as shutdown and ramp control func­tions. A unique temperature-sensing circuit protects the
device from overheating by shutting down the PA until
a safe temperature is resumed.

The devices come in a 16-pin PQSOP package, which
incorporates a slug on the bottom of the device to
increase heat conduction and provide a low induc­tance path to ground.

RF Input Stage (Variable Gain Amplifier)

The input stage includes a variable gain amplifier
(VGA) with 24dB gain-control range. With the appropri­ate matching network, the input VSWR is nominally

1.5:1 during operation and the change in VSWR is only

1.2:1, relative to normal operation. This stage remains
active during standby mode (MAX2232) to provide a
constant input impedance but is off during shutdown
mode (MAX2232/MAX2233). AC-couple this port with a
DC-blocking capacitor.

RF Second Stage (Driver)

The driver provides gain to overcome interstage match­ing losses and to produce a signal large enough to
drive the output power transistor into saturation. The
driver stage is off during standby (MAX2232) and shut­down (MAX2232/MAX2233) modes.

RF Output Stage

(Output Power Transistor)

The output power transistor delivers +24dBm of output
power from a single +3.6V supply. The transistor’s
open-collector output requires a pull-up inductor to

V

CC

for proper biasing, as well as a proper output
matching network to ensure optimum output power.
Connect the output matching network to RFOUT (pin

8). See the Typical Application Circuit for bias and
matching components suitable for 900MHz operation.
The ground of the output stage is connected to a metal
slug on the bottom of the MAX2232/MAX2233’s 16-pin
PQSOP package. The metal slug increases heat con­duction and provides a low-inductance path to ground.
Solder the metal slug to the PC-board ground plane.

___________________________MAX2232

Analog Gain Control

and Power Management

Shutdown Mode

Drive the shutdown (SHDN) pin below 0.6V to place the
MAX2232 in shutdown mode. The VGA, driver, and out­put transistor are off in shutdown mode and the supply
current is typically reduced to 0.2µA. When SHDN is
above 2.0V, the device is enabled.

Standby Mode

Drive SHDN above 2.0V and CTRL below 0.4V to place
the MAX2232 in standby mode. In standby mode, the
VGA remains biased while the driver and output tran­sistor are disabled. Supply current is typically 20mA in
standby mode. This mode allows the device to maintain
a good input VSWR while maintaining 38dB of isolation.
This is useful to users who drive the PA with a direct
modulated VCO, where pulling of the VCO results from
changes in the input VSWR.

Analog Gain Control

The voltage applied to the gain-control (CTRL) pin varies
the output power of the MAX2232 continuously over a
24dB range. An internal comparator holds the PA to a
constant peak output power if V

CTRL

is above 2.2V. For

V

CTRL

below 0.4V, the PA is in standby mode. CTRL pre-

sents a high input impedance, allowing the V

CTRL

voltage

to be set with a resistor-divider or a voltage output DAC.

Output Power Autoramping

The internal bias circuitry of the MAX2232 automatically
ramps the output power of the PA down or up at a con­stant rate (in W/sec) when switched in or out of shut­down mode. The output power is ramped to the level set
by V

CTRL

on the MAX2232. The output power rise and

fall time ramp is set by placing a capacitor, C

RAMP

,
between RAMP+ and RAMP-. This provides an easy
means of avoiding spectral splatter and complying with
transmit mask requirements, without using a separate
controller. The output power rise and fall time is set by
the value of C

RAMP

.

___________________________MAX2233

Digital Gain Control

and Power Management

The MAX2233 responds to logic-level signals at the
device’s 2-bit DAC inputs, D0 and D1, placing the
device in shutdown mode or into one of three discrete
output power levels. See Table 2 for operating modes
and output power levels. Setting D0 and D1 to a logic­level low places the device in shutdown mode and
reduces supply current to 0.2µA. The VGA, driver, and
output stage are off in shutdown mode, while the input
impedance is only slightly changed. Setting D0 and D1
to one of the other three modes adjusts the output
power to one of three discrete levels in 10dB steps.

Thermal Shutdown

The MAX2232/MAX2233 feature a thermal shutdown
mode that helps to protect the device from damage
when the die temperature becomes excessive. If the
temperature of the die exceeds the thermal shutdown
temperature, TTH, the VGA is forced into a low-gain
mode and output power is reduced to a minimum. After

the PA’s die temperature drops below T

TH

, the device
remains in thermal shutdown mode for the thermal shut­down timeout period, tTH. A single capacitor, C

TSET

,
from TSET to ground sets tTH. The thermal shutdown
timeout period helps to limit device thermal cycling that
results if the source of the excessive temperature is not
removed. tTHis set by the value of C

TSET

.

Applications Information

Proper attention to voltage supply bypassing is essen­tial for high-frequency RF circuit stability. Bypass V

CC

with 0.1µF, 10nF, and 100pF capacitors in parallel with
each other to ground. Use separate vias to the ground
plane for each of the bypass capacitors and minimize
trace length to reduce inductance. Use separate vias to
the ground plane for each ground pin. Use low-induc­tance ground connections.

Decouple SHDN, CTRL, D0, and D1 with 0.1µF capaci­tors to ground to minimize noise on the internal bias cell.
Use a series resistor (typically 100Ω) to further reduce
coupling of high-frequency signals into the control pins.

MAX2232/MAX2233

900MHz ISM-Band, 250mW Power Amplifiers

with Analog or Digital Gain Control

_______________________________________________________________________________________ 7

MODE

Standby > 2.0V

< 0.6V

V

SHDN

V

CTRL

X

≤ 0.4V

OUTPUT POWER

(P

RFIN

= 0dBm,

V

CC

= +3.6V)

< -35dBm

< -35dBm

Variable Gain > 2.0V

0.6V ≤ V

CTRL

< 2.2V

0dBm to +24dBm

Maximum Gain > 2.0V > 2.2V +24 dBm

Shutdown

Table 1. MAX2232 Operating Modes

X = Don’t care

Table 2. MAX2233 Operating Modes
Truth Table

MODE

Shutdown

Low Power 0

0

D1 D0

0

1

OUTPUT POWER

(P

RFIN

= 0dBm,

VCC= +3.6V)

< -35dBm

+6.5dBm

Medium Power 1 0 +15dBm

High Power 1 1 +24dBm

Functional Diagrams

MAX2232

VGA DRIVER

TEMP

SENSOR

RFOUT

TSET

2

16 15

5, 6 7, SLUG

8

10

SHDN

RAMP+

14

3

11

12

1

13

RAMP-

V

CC

V

CC

4

CTRL

RFIN

BIAS

GND

V

CC

GND

GND GND

TSET

MAX2233

VGA DRIVER

TEMP

SENSOR

RFOUT

2

16 15

5, 6 7, SLUG

10

D0

4

3

11
12

1

D1

V

CC

V

CC

RFIN

BIAS

GND

V

CC

GND

GND GND

8

2-BIT

DAC

MAX2232/MAX2233

900MHz ISM-Band, 250mW Power Amplifiers
with Analog or Digital Gain Control

Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.

8 _____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600

© 2000 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.

Typical Application Circuit

Package Information

0.22µF

RFIN

15nH

100pF

100pF

68pF

1

RFIN

MAX2232

2

MAX2233

GND GND

3

SHDN
(D1)

4

CTRL
(D0)

5

GND

6

GND

RAMP+

(N.C.)

RAMP-

(N.C.)

V

16

V

CC

15

14

13

12

V

CC

11

V

CC

C

RAMP

0.22µF

100pF

10nF 0.1µF

10nF 0.1µF100pF

10nF 0.1µF100pF

CC

V

CC

V

CC

RFOUT

NOTES: ( ) APPLIES TO MAX2233.
BACKSIDE SLUG MUST BE SOLDERED

0.22µF

3.6pF

TO GROUNDPLANE.

2.55nH

7

GND

8

RFOUT

27nH

100pF 10nF 0.1µF

TSET

N.C.

10

9

C

TSET

0.22µF

V

CC

PSSOPPS.EPS