19-4946; Rev 0; 10/09
EVALUATION KIT
AVAILABLE
General Description
The MAX2209 is a wideband (800MHz to 2GHz) RF
power detector. It takes an RF signal from the directional
coupler at the input, and outputs a DC voltage propor-
tional to the RF peak voltage. The change in output
voltage versus temperature is very repeatable from part
to part and enables a lookup table based on nominal
behavior, minimizing the effective detection error to less
than Q0.5dB relative to room temperature.
The MAX2209 comes in a space-saving 2 x 2, 0.5mm
pitch wafer-level package (WLP) and requires only two
external components.
RF Power Detector
Features
S -25dBm to 0dBm Power Detection Range
S ±0.5dB Detection Error Due to Temperature
S +2.7V to +5V Single-Supply Operation
S Space-Saving 4-Bump, 1mm
S On-Chip 50I Termination and DC-Blocking
Capacitor
2
UCSP™ Package
MAX2209
Applications
Dual-Band WCDMA Handsets
High-Speed Downlink Packet Access (HSDPA)
High-Speed Uplink Packet Access (HSUPA)
Ordering Information
PART TEMP RANGE
MAX2209EBS+
+Denotes a lead(Pb)-free/RoHS-compliant package.
-40NC to +85NC
PIN-
PACKAGE
4 UCSP AGJ
TOP
MARK
Pin Configuration/Functional Diagram/Typical Operating Circuit
ADC
MAX2209
A1
OUT
B1
GND
A2
V
B2
RFIN
CC
V
CC
RF INPUT
UCSP is a trademark of Maxim Integrated Products, Inc.
_______________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
RF Power Detector
ABSOLUTE MAXIMUM RATINGS
VCC to GND .............................................................-0.3V to +6V
RFIN to GND ......................................... -0.3V to + (VCC + 0.3V)
OUT to GND .......................................... -0.3V to + (VCC + 0.3V)
RFIN Input Power ..........................................................+10dBm
Continuous Power Dissipation (TA = +70NC)
4-Bump WLP (derate 3mW/NC above +70NC) .............238mW
MAX2209
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a
4-layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Note 2: For detailed information on soldering, refer to Application Note 1891: Wafer-Level Packaging (WLP) and Its Applications.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
CAUTION! ESD SENSITIVE DEVICE
DC ELECTRICAL CHARACTERISTICS
(VCC = 2.7V to 5.0V, T
noted.) (Note 3)
PARAMETER CONDITIONS MIN TYP MAX UNITS
Supply Voltage 2.7 5.0 V
Supply Current 3.6 6 mA
Idle Output Voltage VCC = 2.8V, no RF signal 35 mV
Output Current Source Capability PIN = 0dBm, V
Output Current Sink Capability No RF signal, V
= -40NC to +85NC, no RF signal applied. Typical values are at VCC = 2.8V, T
A
forced to 0.5V 750 1800
OUT
forced to 2V 300 525
OUT
Junction-to-Ambient Thermal
Resistance (BJA) (Note 1) ..........................................335NC/W
Operating Temperature Range .......................... -40NC to +85NC
Storage Temperature Range ............................ -65NC to +160NC
Junction Temperature ....................................................+150NC
Bump Temperature (soldering, Note 2)
Infrared (15s) ...............................................................+260NC
= +25NC, unless otherwise
A
FA
FA
AC ELECTRICAL CHARACTERISTICS
(T
= -40NC to +85NC, 50I system, VCC = 2.8V. Typical values are at T
A
PARAMETER CONDITIONS MIN TYP MAX UNITS
RF Input Frequency 800 2000 MHz
RF Input VSWR
Output Voltage, 836MHz
Output Voltage, 1950MHz
Residual Error after Room
Temperature Calibration
(TA = -40NC to +85NC) (Note 4)
Note 3: Guaranteed by production test at TA = +25NC. Guaranteed by design and characterization at TA = -40NC and
TA = +85NC.
Note 4: Guaranteed by design and characterization. See the Typical Operating Characteristics.
2 ______________________________________________________________________________________
800MHz -17
2000MHz -12
-5dBm input 0.88
-25dBm input 0.06
-5dBm input 0.72
-25dBm input 0.06
-5dBm input
-25dBm input
= +25NC, unless otherwise noted.) (Note 3)
A
Q0.5
Q1.5
dB
V
V
dB
RF Power Detector
Typical Operating Characteristics
(VCC = 2.8V, typical values are at T
= +25NC, unless otherwise noted.)
A
MAX2209
OUTPUT VOLTAGE vs. INPUT POWER
(RF = 836MHz)
10
1
OUT (V)
0.1
0.01
-25 0
INPUT POWER (dBm)
ERROR DUE TO TEMPERATURE
(RF = 836MHz, 58 UNITS)
1.5
1.0
0.5
0
ERROR (dB)
-0.5
-1.0
-1.5
-25 0
INPUT POWER (dBm)
-40°C
+85°C
OUTPUT VOLTAGE vs. INPUT POWER
10
(RF = 1950MHz)
MAX2209 toc01
1
OUT (V)
0.1
-5-10-15-20
0.01
-25 0
INPUT POWER (dBm)
-5-10-15-20
MAX2209 toc02
OUTPUT VOLTAGE vs. FREQUENCY
1
PIN = -5dBm
0.1
OUT (V)
0.01
0 3500
PIN = -10dBm
PIN = -15dBm
INPUT FREQUENCY (MHz)
MAX2209 toc03
30002500200015001000500
ERROR DUE TO TEMPERATURE
1.5
1.0
MAX2209 toc04
0.5
0
ERROR (dB)
-0.5
-1.0
-1.5
-5-10-15-20
-25 0
INPUT POWER (dBm)
-40°C
+85°C
-5-10-15-20
MAX2209 toc05
0.16
0.14
0.12
0.10
0.08
SIGMA (dB)
0.06
0.04
0.02
0
(RF = 1950MHz, 58 UNITS)
SIGMA OF -40°C ERROR
MAX2209 toc06
RF = 836MHz
RF = 1950MHz
-5-10-15-20-25 0
INPUT POWER (dBm)
0.12
0.10
0.08
0.06
SIGMA (dB)
0.04
0.02
0
-25 0
RF = 1950MHz
RF = 836MHz
INPUT POWER (dBm)
_______________________________________________________________________________________ 3
SIGMA OF +85°C ERROR
RESIDUAL ERROR AFTER ROOM
TEMPERATURE CALIBRATION
0.5
RF = 836MHz, 58 UNITS, -40°C
0.4
MAX2209 toc07
0.3
0.2
0.1
0
ERROR (dB)
-0.1
-0.2
-0.3
-0.4
-5-10-15-20
-0.5
-5-10-15-20-25 0
INPUT POWER (dBm)
MAX2209 toc08
ERROR (dB)
RESIDUAL ERROR AFTER ROOM
TEMPERATURE CALIBRATION
0.5
RF = 836MHz, 58 UNITS, +85°C
0.4
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
-0.4
-0.5
INPUT POWER (dBm)
MAX2209 toc09
-5-10-15-20-25 0
RF Power Detector
ERROR (dB)
Typical Operating Characteristics (continued)
(VCC = 2.8V, typical values are at T
= +25NC, unless otherwise noted.)
A
RESIDUAL ERROR AFTER ROOM
TEMPERATURE CALIBRATION
0.5
RF = 1950MHz, 58 UNITS, -40°C
0.4
0.3
MAX2209
0.2
0.1
0
-0.1
-0.2
-0.3
-0.4
-0.5
INPUT POWER (dBm)
-5-10-15-20-25 0
MAX2209 toc10
RESIDUAL ERROR AFTER ROOM
TEMPERATURE CALIBRATION
0.5
RF = 1950MHz, 58 UNITS, +85°C
0.4
0.3
0.2
0.1
0
ERROR (dB)
-0.1
-0.2
-0.3
-0.4
-0.5
INPUT POWER (dBm)
-5-10-15-20-25 0
MAX2209 toc11
SETTLING TIME FROM RF POWER
(ON/OFF RF = 836MHz)
1.0
0.8
0.6
OUT (V)
0.4
0.2
0
0.0E+00
PIN = -5dBm
PIN = -7dBm
PIN = -10dBm
PIN = -15dBm
5.0E-07 1.0E-06 1.5E-06 2.0E-06
TIME (s)
MAX2209 toc12
4 ______________________________________________________________________________________
RF Power Detector
Pin Description
BUMP NAME FUNCTION
A1 OUT Detector Output
A2 V
B1 GND Ground Connection. Connect to PCB ground plane with as low inductance as possible.
B2 RFIN
CC
Detailed Description
The MAX2209 power detector is designed to operate from 800MHz to 2.0GHz. The device is ideal for
wideband code-division multiple access (WCDMA),
cdma2000M, and high-speed downlink/uplink packet
access. The MAX2209 accepts an RF signal at the input,
and outputs a temperature-independent voltage related
to the input signal voltage. The output voltage expressed
in dBV is proportional to the input power expressed in
dBm. The device has a detection range from -25dBm to
0dBm.
Applications Information
The MAX2209 contains an internal termination resistor
for use with directional couplers. The typical application
circuit is shown in Figure 1. The output of the detector
goes to an ADC for further processing by the baseband
system. Connect a series resistor and shunt capacitor to
the MAX2209 output to reduce residual amplitude ripple.
Power Supply. Bypass to GND with a capacitor as close as possible to the bump.
RF Input. Internally terminated to 50I. AC-couple the RF input to this pin.
ADC
PA
MAX2209
A1
OUT
B1
GND
DIRECTIONAL
COUPLER
A2
V
CC
B2
RFIN
V
CC
RF INPUT
TO
ANTENNA
MAX2209
Layout
There are two areas that require attention: the GND pin
and the supply bypassing. Connect the GND pin to the
PCB ground with a GND via as close as possible, and
bypass VCC to ground with a capacitor as close as possible to the part.
Chip Information
PROCESS: BIPOLAR
cdma2000 is a registered trademark of the Telecommunications
Industry Association.
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied.
Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 5
©
2009 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.
Figure 1. Typical Application Circuit
Package Information
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that
a “+”, “#”, or “-” in the package code indicates RoHS
status only. Package drawings may show a different suffix character, but the drawing pertains to the package
regardless of RoHS status.
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
4 UCSP B4+4
21-0117
Loading...