MAXIM MAX2209 Technical data

19-4946; Rev 0; 10/09

EVALUATION KIT

AVAILABLE

General Description

The MAX2209 is a wideband (800MHz to 2GHz) RF
power detector. It takes an RF signal from the directional
coupler at the input, and outputs a DC voltage propor-

tional to the RF peak voltage. The change in output
voltage versus temperature is very repeatable from part
to part and enables a lookup table based on nominal
behavior, minimizing the effective detection error to less

than Q0.5dB relative to room temperature.

The MAX2209 comes in a space-saving 2 x 2, 0.5mm
pitch wafer-level package (WLP) and requires only two
external components.

RF Power Detector

Features

S -25dBm to 0dBm Power Detection Range

S ±0.5dB Detection Error Due to Temperature

S +2.7V to +5V Single-Supply Operation

S Space-Saving 4-Bump, 1mm

S On-Chip 50I Termination and DC-Blocking

Capacitor

2

UCSP™ Package

MAX2209

Applications

Dual-Band WCDMA Handsets

High-Speed Downlink Packet Access (HSDPA)

High-Speed Uplink Packet Access (HSUPA)

Ordering Information

PART TEMP RANGE

MAX2209EBS+

+Denotes a lead(Pb)-free/RoHS-compliant package.

-40NC to +85NC

PIN-

PACKAGE

4 UCSP AGJ

TOP

MARK

Pin Configuration/Functional Diagram/Typical Operating Circuit

ADC

MAX2209

A1

OUT

B1

GND

A2

V

B2

RFIN

CC

V

CC

RF INPUT

UCSP is a trademark of Maxim Integrated Products, Inc.

_______________________________________________________________ Maxim Integrated Products 1

For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.

RF Power Detector

ABSOLUTE MAXIMUM RATINGS

VCC to GND .............................................................-0.3V to +6V

RFIN to GND ......................................... -0.3V to + (VCC + 0.3V)

OUT to GND .......................................... -0.3V to + (VCC + 0.3V)

RFIN Input Power ..........................................................+10dBm

Continuous Power Dissipation (TA = +70NC)

4-Bump WLP (derate 3mW/NC above +70NC) .............238mW

MAX2209

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a

4-layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

Note 2: For detailed information on soldering, refer to Application Note 1891: Wafer-Level Packaging (WLP) and Its Applications.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.

CAUTION! ESD SENSITIVE DEVICE

DC ELECTRICAL CHARACTERISTICS

(VCC = 2.7V to 5.0V, T
noted.) (Note 3)

PARAMETER CONDITIONS MIN TYP MAX UNITS

Supply Voltage 2.7 5.0 V
Supply Current 3.6 6 mA
Idle Output Voltage VCC = 2.8V, no RF signal 35 mV
Output Current Source Capability PIN = 0dBm, V
Output Current Sink Capability No RF signal, V

= -40NC to +85NC, no RF signal applied. Typical values are at VCC = 2.8V, T

A

forced to 0.5V 750 1800

OUT

forced to 2V 300 525

OUT

Junction-to-Ambient Thermal

Resistance (BJA) (Note 1) ..........................................335NC/W

Operating Temperature Range .......................... -40NC to +85NC

Storage Temperature Range ............................ -65NC to +160NC

Junction Temperature ....................................................+150NC

Bump Temperature (soldering, Note 2)

Infrared (15s) ...............................................................+260NC

= +25NC, unless otherwise

A

FA
FA

AC ELECTRICAL CHARACTERISTICS

(T

= -40NC to +85NC, 50I system, VCC = 2.8V. Typical values are at T

A

PARAMETER CONDITIONS MIN TYP MAX UNITS

RF Input Frequency 800 2000 MHz

RF Input VSWR

Output Voltage, 836MHz

Output Voltage, 1950MHz

Residual Error after Room
Temperature Calibration
(TA = -40NC to +85NC) (Note 4)

Note 3: Guaranteed by production test at TA = +25NC. Guaranteed by design and characterization at TA = -40NC and

TA = +85NC.

Note 4: Guaranteed by design and characterization. See the Typical Operating Characteristics.

2 ______________________________________________________________________________________

800MHz -17
2000MHz -12

-5dBm input 0.88

-25dBm input 0.06

-5dBm input 0.72

-25dBm input 0.06

-5dBm input

-25dBm input

= +25NC, unless otherwise noted.) (Note 3)

A

Q0.5

Q1.5

dB

V

V

dB