
General Description
The MAX2205–MAX2208 wideband (800MHz to 2GHz)
power detectors are ideal for GSM/EDGE (MAX2206),
TDMA (MAX2207), and CDMA (MAX2205/MAX2208)
applications. The MAX2206/MAX2207/MAX2208 take an
RF signal from a directional coupler at the input, and output a highly repeatable voltage. The output voltage
increases monotonically with increasing input power. The
output is compensated for temperature and process
shifts, reducing the worst-case variation to less than
±1dB at full power and ±2.5dB at the lowest power.
The MAX2206 features 40dB dynamic range, making
it ideally suited to GSM/EDGE applications. The
MAX2207 offers reduced current consumption for TDMA
applications. The MAX2205/MAX2208 each have an integrated filter to allow for average power detection of
CDMA signals over a 25dB dynamic range. The
MAX2206/MAX2207/MAX2208 offer internal 50Ω termina-
tion for interfacing with a directional coupler. The
MAX2205 has a high-impedance input to provide a lowloss resistive tap in CDMA applications. All devices allow
the user to control the averaging time constant externally.
The MAX2205–MAX2208 come in a space-saving 2 ✕ 2,
0.5mm-pitch UCSP™ and require only three external
components.
Applications
Dual-Band GSM/EDGE Handsets
Dual-Band CDMA/TDMA Handsets
WCDMA Handsets
PA Modules
Features
♦ Space-Saving 2 ✕ 2 UCSP Occupies Only 1mm
2
♦ Internal Temperature Compensation Gives ±0.3dB
Detection Accuracy
♦ No External Filter or Op Amp Required
♦ Power-Detection Range
40dB (MAX2206)
25dB (MAX2205/MAX2207/2208)
MAX2205–MAX2208
RF Power Detectors in UCSP
________________________________________________________________ Maxim Integrated Products 1
Pin Configuration/Functional
Diagram/Typical Operating Circuit
19-2015; Rev 6; 9/06
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
EVALUATION KIT
AVAILABLE
Ordering Information
UCSP is a trademark of Maxim Integrated Products, Inc.
*Requires solder temperature profile described in the Absolute
Maximum Ratings section.
2 ✕ 2 UCSP
1.01 mm
✕
1.01 mm
+ Indicates lead-free package.
PART TEMP RANGE BUMP-PACKAGE
MAX2205EBS -40°C to +85°C 2 × 2 UCSP*
MAX2205EBS+ -40°C to +85°C 2 × 2 UCSP*
MAX2206EBS -40°C to +85°C 2 × 2 UCSP*
MAX2206EBS+ -40°C to +85°C 2 × 2 UCSP*
MAX2207EBS -40°C to +85°C 2 × 2 UCSP*
MAX2208EBS -40°C to +85°C 2 × 2 UCSP*
MAX2208EBS+ -40°C to +85°C 2 × 2 UCSP*
TOP VIEW
680Ω (MAX2205)
FROM PA
OUTPUT
(MAX2205)
FROM
COUPLER/TAP
(MAX2206/MAX2207/MAX2208)
10Ω (MAX2206)
0Ω (MAX2207/MAX2208)
SHDN LOGIC INPUT
10kΩ (MAX2205)
240Ω (MAX2206/MAX2207/MAX2208)
V
CC
47pF
RFIN/
SHDN
(A1)
SHUTDOWN
LOGIC
GND
(B1)
TEMPERATURECOMPENSATED
PEAK
DETECTOR
UCSP
V
CC
(A2)
MAX2205
MAX2206
MAX2207
MAX2208
OUT
(B2)
27pF
TO ADC
C
FILTER
(OPTIONAL)

MAX2205–MAX2208
RF Power Detectors in UCSP
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS (MAX2205–MAX2208)
(VCC= +2.7V to +5.0V, SHDN = +2.0V, no RF signal applied, TA= -40°C to +85°C. Typical values are at VCC= +2.85V and
T
A
= +25°C, unless otherwise noted.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCCto GND...........................................................-0.3V to +6.5V
RFIN/SHDN to GND....................................-0.3V to (V
CC
+ 0.3V)
RF Input Power (800MHz)
(MAX2206/MAX2207/MAX2208) .................................+20dBm
RF Input Power (2GHz)
(MAX2206/MAX2207/MAX2208) .................................+17dBm
RF Input Voltage (800MHz) (MAX2205)..............................1.5V
P
RF Input Voltage (2GHz) (MAX2205) ..................................0.8V
P
Continuous Power Dissipation (TA= +70°C)
2
✕
2 UCSP (derate 3.8mW/°C above +70°C) ............303mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +160°C
Bump Temperature (soldering) (Note 1)
Infrared (15s) (leaded)................................................+220°C
Vapor Phase (60s) (leaded)........................................+215°C
Infrared (15s) (lead-free).............................................+260°C
AC ELECTRICAL CHARACTERISTICS (MAX2205)
(MAX2205 EV kit, VCC= +2.7V to +5.0V, SHDN = +2.0V, fRF= 800MHz to 2GHz, 50Ω system, TA= -40°C to +85°C. Typical values
are at V
CC
= +2.85V and TA= +25°C, unless otherwise noted.) (Note 2)
Supply Voltage V
Idle Supply Current I
Shutdown Supply Current I
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
CC
IDLE
SHDN
MAX2206 3.5 5.5
MAX2205/MAX2207/MAX2208 2 3.5
SHDN = 0V 0.5 10 µA
2.7 5.0 V
mA
OUT Voltage During Shutdown V
Logic-High Threshold V
Logic-Low Threshold V
SHDN Input Current
Output Current Source Capability MAX2206/MAX2207, V
Output Current Sink Capability MAX2206/MAX2207, V
OUT
I
I
SHDN = 0V 0.01 V
H
L
SHDN = +2.0V -1 +10
IH
IL SHDN
= +0.6V -1 +1
= +2.5V 400 µA
OUT
= 0V 300 µA
OUT
2.0 V
0.6 V
µA
RF Input Frequency f
Turn-On Time t
Response Time t
Variation Due to Temperature
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
RF
ON
R
(Note 3) 15 µs
High input power
V
= +2.85V,
CC
= -40°C to +85°C
T
A
(Note 4)
Low input power
(Note 5)
800 2000 MHz
2µs
±0.3 ±1
±1.3 ±2.5
dB

MAX2205–MAX2208
RF Power Detectors in UCSP
_______________________________________________________________________________________ 3
Note 1: This device is constructed using a unique set of packaging techniques that imposes a limit on the thermal profile the device
can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recommended in the industry-standard specification, JEDEC 020 rev. C or later, paragraph 7.6, Table 3 for IR/VPR and convection
reflow. Preheating is required. Hand or wave soldering is not allowed.
Note 2: Specifications over T
A
= -40°C to +85°C are guaranteed by design. Production tests are performed at TA= +25°C.
Note 3: Response time is taken from the time the RF signal is applied to 90% of the final value of V
OUT
.
Note 4: At 800MHz, output voltage is held at a value that nominally results from the final value of +31dBm input power. Deviation from
+31dBm is specified. At 2GHz, output voltage is held at a value that nominally results from +28dBm input power. Deviation
from +28dBm is specified.
Note 5: At 2GHz, output voltage is held 22dB lower than specified in Note 4. At 800MHz, output voltage is held 25dB lower than spec-
ified in Note 4.
Note 6: At 800MHz, output voltage is held at a value that nominally results from +15dBm input power. Deviation from +15dBm is
specified. At 2GHz, output voltage is held at a value that nominally results from +13dBm input power. Deviation from +13dBm
is specified.
Note 7: For MAX2206, the output voltage is held at 40dB lower input power than specified in Note 6; for MAX2207/MAX2208, output
voltage is held at a value that nominally results from 25dB lower input power than specified in Note 6. Deviation from the
nominal input power is specified.
AC ELECTRICAL CHARACTERISTICS (MAX2206/MAX2207/MAX2208)
(MAX2206/MAX2207/MAX2208 EV kit, VCC= +2.7V to +5.0V, SHDN = 2.0V, fRF= 800MHz to 2GHz, 50Ω system, TA= -40°C to
+85°C. Typical values are at V
CC
= +2.85V and TA= +25°C, unless otherwise noted.) (Note 2)
Typical Operating Characteristics
(MAX2206/MAX2207/MAX2208 EV kit, TA = +25°C, unless otherwise noted.)
0
0.4
0.2
0.8
0.6
1.2
1.0
1.4
1.8
1.6
2.0
-25 -15 -10-20 -5 0 5 10 15
MAX2206
OUTPUT VOLTAGE vs. INPUT POWER
MAX2205/06/07/08 toc01
POWER (dBm)
OUTPUT VOLTAGE (V)
VCC = +2.7V to +3.5V
f
RF
= 800MHz
T
A
= -40°C TO +85°C
VCC = +3.5V
T
A
= +85°C
VCC = +2.7V
T
A
= -40°C
0
0.4
0.2
0.8
0.6
1.0
1.2
1.4
1.6
-25 -15 -10-20 -5 0 5 10 15
MAX2206
OUTPUT VOLTAGE vs. INPUT POWER
MAX2205/06/07/08 toc02
POWER (dBm)
OUTPUT VOLTAGE (V)
VCC = +2.7V to +3.5V
f
RF
= 2GHz
T
A
= -40°C TO +85°C
VCC = +3.5V
T
A
= +85°C
VCC = +2.7V
T
A
= -40°C
265
270
275
280
285
290
295
300
305
310
315
320
-40 -15 10 35 60 85
MAX2206
RESPONSE TIME vs. TEMPERATURE
MAX2205/06/07/08 toc03
TEMPERATURE (°C)
RESPONSE TIME (ns)
VCC = +2.7V
VCC = +3.5V
VCC = +3.0V
fRF = 900MHz
P
IN
= +15dBm
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
RF Input Frequency f
RF Input VSWR VSWR 2:1
Turn-On Time t
Response Time (Note 3) t
Variation Due to Temperature
RF
ON
MAX2206/MAX2207 300 ns
R
MAX2208 15 µs
V
= +2.85V,
CC
= -40°C to +85°C
T
A
H i g h i np ut p ow er ( N ote 6) ±0.3 ±1
Low i np ut p ow er ( N ote 7) ±1.3 ±2.5
800 2000 MHz
2µs
dB

MAX2205–MAX2208
RF Power Detectors in UCSP
4 _______________________________________________________________________________________
Typical Operating Characteristics (continued)
(MAX2206/MAX2207/MAX2208 EV kit, TA = +25°C, unless otherwise noted.)
Pin Description
MAX2207/MAX2208
OUTPUT VOLTAGE vs. INPUT POWER
2.5
VCC = +2.7V to +3.5V
= 800MHz
f
RF
= -40°C TO +85°C
T
A
2.0
1.5
1.0
OUTPUT VOLTAGE (V)
VCC = +3.5V
= +85°C
T
A
0.5
0
-10 0-5 5 10 15
POWER (dBm)
VCC = +2.7V
= -40°C
T
A
1.8
1.6
1.4
MAX2205/06/07/08 toc04
1.2
1.0
0.8
0.6
OUTPUT VOLTAGE (V)
0.4
0.2
0
-10 0-5 5 10 15
MAX2207/MAX2208
OUTPUT VOLTAGE vs. INPUT POWER
VCC = +2.7V to +3.5V
= 2GHz
f
RF
= -40°C TO +85°C
T
A
VCC = +3.5V
= +85°C
T
A
POWER (dBm)
MAX2205/MAX2208
RESPONSE TIME vs. TEMPERATURE
19
18
17
16
15
VCC = +3.0V
14
13
RESPONSE TIME (µs)
12
11
10
-40 10-15 356085
fRF = 900MHz
= +15dBm (MAX2208)
P
IN
= +31dBm (MAX2205)
P
IN
VCC = +3.5V
TEMPERATURE (°C)
VCC = +2.7V
2.5
2.0
MAX2205/06/07/08 toc07
1.5
1.0
OUTPUT VOLTAGE (V)
0.5
OUTPUT VOLTAGE vs. INPUT POWER
VCC = +2.7V to +3.5V
= 836MHz
f
RF
= -40°C to +85°C
T
A
MAX2205 EV KIT
0
61611 21 26 31
MAX2205
VCC = +3.5V
= +85°C
T
A
INPUT POWER (dBm)
VCC = +2.7V
= -40°C
T
A
VCC = +2.7V
= -40°C
T
A
310
305
300
MAX2205/06/07/08 toc05
295
290
RESPONSE TIME (ns)
285
280
275
0.8
0.7
0.6
MAX2205/06/07/08 toc08
0.5
0.4
0.3
OUTPUT VOLTAGE (V)
0.2
0.1
RESPONSE TIME vs. TEMPERATURE
MAX2207
fRF = 900MHz
= +15dBm
P
IN
VCC = +2.7V
VCC = +3.0V
VCC = +3.5V
-40 10-15 35 60 85
TEMPERATURE (°C)
MAX2205
OUTPUT VOLTAGE vs. INPUT POWER
VCC = +2.7V to +3.5V
= 1880MHz
f
RF
= -40°C to +85°C
T
A
MAX2205 EV KIT
VCC = +3.5V
= +85°C
T
A
VCC = +2.7V
= -40°C
T
A
0
6141810 22 26
INPUT POWER (dBm)
MAX2205/06/07/08 toc06
MAX2205/06/07/08 toc09
PIN NAME FUNCTION
A1 RFIN/SHDN
A2 V
CC
B1 GND
B2 OUT Detector Output
RF Input and Shutdown Logic Input. AC-couple the RF input to this pin and apply the shutdown logic
input through a resistor. Drive low to turn the part off, drive high, or connect to V
CC
Power-Supply Pin. Bypass to GND with a capacitor as close to the bump as possible.
Ground Connection. Multiple ground vias placed as close to the IC as possible should be used to
connect the ground pin to the ground plane. Connect to PC board ground plane with as low
inductance as possible.
to turn the part on.

Applications Information
The MAX2205–MAX2208 have internal termination
resistors for use with directional couplers. The application circuit is shown in Figure 1. The output of the
detector goes to an op amp in an analog GSM powercontrol scheme, or to an ADC in other systems such as
TDMA or discrete-time GSM power control.
The MAX2205 has high-input impedance for use with
high-value resistive tapping from a CDMA power amplifier. This coupling method is the lowest cost and lowest
loss when used with an isolator. The application circuit
is shown in Figure 2. Connect C
FILTER
from the
MAX2205 output to GND to reduce residual amplitude
ripple. For IS98A reverse channel signal with peak-toavg ratio of 3.9dB, a 1.5nF capacitor gives 43mV
P-P
ripple at 28dBm PA output and 390µs response time. For
CDMA2000 (pilot + DCCH) with peak-to-avg ratio of
5.4dB, the ripple is about 65mV
P-P
at 26dBm PA output.
The MAX2205 input impedance is listed in Table 1.
Layout
As with any RF circuit, the layout of the MAX2205–
MAX2208 circuits affects performance. Use a short
50Ω line at the input with multiple ground vias along the
length of the line. The input capacitor and resistor
should be placed as close to the IC as possible. The
VCCinput should be bypassed as close as possible to
the IC with multiple vias connecting the capacitor to
ground. Refer to the MAX2205–MAX2208 EV kit data
sheet for a sample layout and details.
UCSP Reliability
The UCSP is a unique package that greatly reduces
board space compared to other packages. UCSP reliability is integrally linked to the user’s assembly methods,
circuit board material, and usage environment. The user
should closely review these areas when considering
using a UCSP. This form factor might not perform equally
to a packaged product through traditional mechanical
reliability tests. Performance through operating life test
and moisture resistance remains uncompromised, as it
is determined primarily by the wafer-fabrication process.
Mechanical stress performance is a greater consideration for a UCSP. UCSP solder-joint contact integrity must
be considered because the package is attached through
direct solder contact to the user’s PC board. Testing
done to characterize the UCSP reliability performance
shows that it is capable of performing reliably through
environmental stresses. Results of environmental stress
tests and additional usage data and recommendations
are detailed in the UCSP application note, which can be
found on Maxim’s website, www.maxim-ic.com.
Chip Information
TRANSISTOR COUNT: 344
MAX2205–MAX2208
RF Power Detectors in UCSP
_______________________________________________________________________________________ 5
Figure 2. MAX2205 Typical Application Circuit
Figure 1. MAX2206/MAX2207/MAX2208 Typical Application
Circuit
PA
COUPLER
TO ANT
50Ω
TO ADC
OR OP AMP
MAX2206
MAX2207
MAX2208
PEAK
DETECTOR
ISOLATOR/
CIRCULATOR
PA
680
Ω
47pF
MAX2205
PEAK
DETECTOR
C
TO ANT
TO ADC
FILTER

MAX2205–MAX2208
RF Power Detectors in UCSP
6 _______________________________________________________________________________________
Table 2. MAX2205–MAX2208 Device
Marking Codes
Table 1. MAX2205 Input Impedance (R || jX, PC Board De-Embedded)
FREQUENCY (GHz)
0.8 189.9 -51.7 199.4 -54.0
0.9 177.3 -47.4 185.5 -49.4
1.0 165.8 -43.6 175.2 -45.7
1.1 155.2 -40.3 167.0 -42.5
1.2 146.4 -37.6 158.8 -39.8
1.3 138.8 -35.0 150.9 -37.3
1.4 131.5 -32.9 144.0 -35.1
1.5 123.3 -30.7 139.4 -33.3
1.6 115.0 -29.1 131.6 -31.8
1.7 107.2 -27.5 132.0 -30.9
1.8 110.7 -26.7 126.6 -29.3
1.9 105.3 -25.2 120.3 -27.9
2.0 94.7 -23.6 111.4 -26.7
REAL IMAG REAL IMAG
PIN = -30dBm PIN = +5dBm
DEVICE CODE
MAX2205EBS AFR
MAX2206EBS AFO
MAX2207EBS AFP
MAX2208EBS AFQ

Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 _____________________ 7
© 2006 Maxim Integrated Products is a registered trademark of Maxim Integrated Products, Inc.
MAX2205–MAX2208
RF Power Detectors in UCSP
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages
.)
Revision History
Pages changed at Rev 6: 1, 2, 3, 7
4L, UCSP 2x2.EPS
PACKAGE OUTLINE, 2x2 UCSP
21-0117
1
G
1