The MAX2101 6-bit quadrature digitizer combines quadrature demodulation with analog-to-digital conversion on
a single bipolar silicon die. This unique RF-to-Bits
TM
function bridges the gap between existing RF downconverters and CMOS digital signal processors (DSPs).
The MAX2101’s simple receiver subsystem is designed
for digital communications systems such as those used
in DBS, TVRO, WLAN, and other applications.
The MAX2101 accepts input signals from 400MHz to
700MHz and applies adjustable gain, providing at least
40dB of dynamic range.
Each baseband is filtered by an on-chip, 5th-order
Butterworth lowpass filter, or the user can select an
external filter path. Baseband sample rate is 60Msps.
The MAX2101 is available in a commercial temperature
range, 100-pin MQFP package.
________________________Applications
Recovery of PSK and QAM Modulated RF Carriers
Direct-Broadcast Satellite (DBS) Systems
Television Receive-Only (TVRO) Systems
Cable Television (CATV) Systems
Wireless Local Area Networks (WLANs)
____________________________Features
♦ ADCs Provide Greater than 5.5 Effective Bits at
fS= 60Msps, fIN= 15MHz
♦ Fully Integrated Lowpass Filters with
Externally Variable Bandwidth (10MHz to 30MHz)
♦ 40dB Dynamic Range
♦ Integrated VCO and Quadrature Generation
Network for I/Q Demodulation
♦ Divide-by-16 Prescaler for Oscillator PLL
♦ Programmable Counter for Variable Sample Rates
♦ Signal-Detection Function
Operating Temperature Range...............................0°C to +70°C
Storage Temperature Range.............................-65°C to +150°C
Lead Temperature (soldering, <10sec)...........................+300°C
Note 1: The digital control inputs are diode protected; however, permanent damage may occur on unconnected units under high-
energy electrostatic fields. Keep unused units in conductive foam or shunt the terminals together. Discharge the conductive
foam to the destination socket before insertion.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
MAX2101
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC= 4.75V to 5.25V, TA= +25°C, unless otherwise noted.)
CONDITIONS
DC SPECIFICATIONS (V
Digital Supply Current
ADC Supply Current
RF Blocks Supply Current
IF Port DC Dynamic Range
IF Port Input Resistance
AGC Input Voltage
AGC Input Resistance
AGC Input Capacitance
AGC Control Slope Variation
AGC Control Input Bias Current
Lowpass Filter Tune Input Resistance
Lowpass Filter Tune Input Capacitance
TNKA, TNKB Resonant Port Bias Voltage
LO Resonant Port Input Resistance
LO Resonant Port Input Capacitance
LO Prescaler Output High (Note 3)
LO Prescaler Output Low
LO Prescaler Output Source Current
LO Prescaler Output Sink Current
Baseband Amplifier DC GainA
Baseband Input—Input CapacitanceC
Baseband Amplifier I/Q Offset Match
(VCC= 4.75V to 5.25V, TA= +25°C, unless otherwise noted.)
V
Power Detect Output Minimum
Power Detect Output Maximum
ADC Amplitude Response Match
ADC Input Offset
OFFAD
RF Signal Path DC Gain
Composite I/Q Gain Mismatch
Buffered Reference Voltage
(Zero Temperature Coefficient)
Buffered Reference Voltage
(Proportional to Absolute Temperature)
V
Temperature Coefficient
PTAT
Buffered Reference Voltage
(2 x VREF)
Data Output High (Note 3)
Data Output Low
Data Output Source Current (Note 3)
Data Output Sink Current
Data Clock Output High (Note 3)
Data Clock Output Low
Data Clock Output Source Current (Note 3)
Data Clock Output Sink Current
Master Clock Input Dynamic Range
Master Clock Input Resistance
Master Clock Input Capacitance
Reference Clock Output High (Note 3)
Reference Clock Output Low
Reference Clock Output Source Current
(Note 3)
Reference Clock Output Sink Current
Digital Input High Threshold (Note 5)V
Digital Input Low Threshold (Note 5)V
Digital Input Current High (Note 5)I
Digital Input Current Low (Note 5)I
FLTRSEL Input Current HighI
FLTRSEL Input Current LowI
PWR
PWR
VM
VRF
(IQ)
REF
PTAT
2R5
OH
OL
OH
OL
OH
OL
OH
OL
MCLK
IMCLK
IMCLK
OH
OL
OH
OL
IH
IL
IH
IL
IH
IL
= 0V
p-p
> 2V DC
V
OBB
OBB
Channel to channeldB0.4A
LSB = 24mV, either channel
AGC set to maximum gaindB63A
Entire signal path, DC,
Data Clock Period (Figure 2)
Propagation Delay, Clock to Data (Figure 2)
Data Output Skew (all 12 outputs) Settled within 20% (Figure 2)
Aperture Delay Relative to Data Clock (Figure 2)
Aperture Delay Match, Channel to Channel
Data Output Rise, Fall Time (20% to 80%) (Note 7)
Data Clock Output Rise, Fall Time (20% to 80%) (Note 7)
Reference (Div 6) Clock Output Rise, Fall Time (20% to 80%) (Note 7)
Reference Clock Output Jitter, RMS
VCO Prescaler Output Rise, Fall Time (20% to 80%) (Note 7)
35D1QQ Channel Data Output, bit 1
36D0QQ Channel Data Output, bit 0 (LSB)
39RCLK
41DCLKBData Clock Complementary Output
42DCLKData Clock Output
45D0II Channel Data Output, bit 0 (LSB)
46D1II Channel Data Output, bit 1
49D2II Channel Data Output, bit 2
50D3II Channel Data Output, bit 3
53D4II Channel Data Output, bit 4
54D5II Channel Data Output, bit 5 (MSB)
56BINENBinary Enable