MAXIM MAX2055EUP User Manual

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MAX2055EUP
Rev. A

RELIABILITY REPORT

FOR

MAX2055EUP

PLASTIC ENCAPSULATED DEVICES

April 2, 2004

MAXIM INTEGRATED PRODUCTS

120 SAN GABRIEL DR.

SUNNYVALE, CA 94086

Written by Reviewed by

Jim Pedicord Bryan J. Preeshl
Quality Assurance Quality Assurance
Reliability Lab Manager Executive Director

Conclusion
The MAX2055 successfully meets the quality and reliability standards required of all Maxim products. In addition,

Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality and
reliability standards.

Table of Contents

I. ........Device Description V. ........Quality Assurance Information

II. ........Manufa cturing Information VI. .......Reliability Evaluation

III. .......Packaging Information

IV. .......Die Information ......Attachments

I. Device Description
A. General

The MAX2055 high-performance, digitally controlled, variable-gain, differential analog-to-digital converter (ADC)
driver/amplifier (DVGA) is designed for use from 30MHz to 300MHz in base-station receivers.

The device integrates a digitally controlled attenuator and a high-linearity single-ended-to-differential output amplifier,
which can either eliminate an external transformer, or can improve the even-order distortion performance of a
transformer-coupled circuit, thus relaxing the requirements of the anti-alias filter preceding an ADC. Targeted for ADC
driver applications to adjust gain either dynamically or as a one-time channel gain setting, the MAX2055 is ideal for
applications requiring high performance. The attenuator provides 23dB of attenuation range with ±0.2dB accuracy.

The MAX2055 is available in a thermally enhanced 20-pin TSSOP-EP package and operates over the -40°C to +85°C
temperature range.

B. Absolute Maximum Ratings
Item Rating

All Pins to GND -0.3V to +(VCC + 0.25V)
Input Signal (RF_IN) 20dBm
Output Power (RF_OUT) 24dBm
Operating Temperature Range -40°C to +85°C
Junction Temperature +150°C
Storage Temperature Range -65°C to +165°C
Lead Temperature (soldering, 10s) +300°C
Continuous Power Dissipation (TA = +85°C)
28-Pin TSSOP 2100mW
Derates above +85°C
28-Pin TSSOP 21.7mW/°C

II. Manufacturing Information

A. Description/Function: Digitally Controlled, Variable-Gain, Differential ADC Driver/Amplifier
B. Process: GST4
C. Number of Device Transistors: 325
D. Fabrication Location: Oregon, USA
E. Assembly Location: Philippines or Malaysia
F. Dat e of Initial Production: April, 2003

III. Packaging Information
A. Package Type: 28-Pin TSSOP
B. Lead Frame: Copper
C. Lead Finish: Solder Plate
D. Die Attach: Silver-filled epoxy
E. Bondwire: Gold (1. 2 mil dia.)
F. Mold Material: Epoxy with silica filler
G. Assembly Diagram: Buildsheet # 05-9000-0419
H. Flammability Rating: Class: UL94-V0
I. Classification of Moisture Sensitivity per

JEDEC standard J-STD-020-A: Level 1

IV. Die Information
A. Dimensions: 125 x 79 mils

B. Passivation: Si3N4 (Silicon nitride)
C. Interconnect: Au
D. Backside Metallization: None
E. Minimum Metal Width: Metal1: 1.2; Metal2: 1.2; Metal3: 1.2; Metal4: 5.6 microns (as drawn)
F. Minimum Metal Spacing: Metal1: 1.6; Metal2: 1.6; Metal3: 1.6; Metal4: 4.2 microns (as drawn)
G. Bondpad Dimensions: 5 mil. Sq.
H. Isolation Dielectric: SiO

2

I. Die Separation Method: Wafer Saw