MAXIM MAX2055 User Manual

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General Description
The MAX2055 evaluation kit (EV kit) simplifies the evalu­ation of the MAX2055 high-linearity, digitally controlled, variable-gain analog-to-digital converter (ADC) driver/amplifier (DVGA). The EV kit is fully assembled and tested at the factory. Standard 50SMA connec­tors are included on the EV kit for the input and output to allow quick and easy evaluation on the test bench.
This data sheet provides a list of equipment required to evaluate the device, a straightforward test procedure to verify functionality, a circuit schematic for the kit, a bill of materials (BOM) for the kit, and artwork for each layer of the PC board.
Features
Fully Assembled and Tested
30MHz to 300MHz Frequency Range
-3dB to +20dB Variable Gain
Output IP3: 40dBm (All Gain Settings at 70MHz)
-76dBc 2nd Harmonic
-69dBc 3rd Harmonic
Noise Figure: 5.8dB at Maximum Gain
Digitally Controlled Gain with 1dB Resolution and
±0.2dB Accuracy
Adjustable Bias Currents
Evaluates: MAX2055
MAX2055 Evaluation Kit
________________________________________________________________ Maxim Integrated Products 1
19-2888; Rev 0; 5/03
Component List
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
Ordering Information
*EP = Exposed paddle.
Component Suppliers
Note: When contacting these component suppliers, please specify you are using the MAX2055.
SUPPLIER PHONE WEBSITE
Coilcraft 847-639-6400 www.coilcraft.com
Johnson 507-833-8822 www.johnsoncomponents.com
Murata 770-436-1300 www.murata.com
TOKO 800-745-8656 www.tokoam.com
PART TEMP RANGE IC PACKAGE
MAX2055EVKIT -40°C to +85°C 20 TSSOP-EP*
DESIGNATION QTY DESCRIPTION
C1, C3–C6, C8,
C9, C10, C12
C2, C11 2
C7 1 Not used
R1 1 1.13k ±1% resistor (0603)
R2–R6 5 47k ±5% resistors (0603)
R7 1 10 ±5% resistor (0603)
L1, L3 2
L2 1
1000pF ±5%, 50V C0G ceramic
9
capacitors (0603) Murata GRM1885C1H102J
100pF ±5%, 50V C0G ceramic capacitors (0603) Murata GRM1885C1H101J
330nH ±5%, wire-wound inductors (0603) Coilcraft 0603LS-331XJBC
100nH ±5%, wire-wound inductor (0603) Coilcraft 0603LS-101XJBC
DESIGNATION QTY DESCRIPTION
L4, L5 2
J1, J2 2
J3 1
J4, J5, J6 0 Not installed
T1, T2 2 MiniCircuit TC1-50-4 transformers
U1 1 MAX2055EUP-T
680nH ±5%, wire-wound inductors (1008) Coilcraft 1008CS-681XJBC or TOKO FSLM2520-R68J
PC board edge-mount SMA RF connectors (flat-tab launch) Johnson 142-0741-856
Header 5 x 2 (0.100 spacing for
0.062in thick board) Molex 10-88-1101 or equivalent
Evaluates: MAX2055
MAX2055 Evaluation Kit
2 _______________________________________________________________________________________
Quick Start
The MAX2055 EV kit is fully assembled and factory test­ed. Follow the instructions in the Connections and Setup section for proper device evaluation. Table 1 lists the attenuation setting vs. gain-control bit.
Test Equipment Required
DC supply capable of delivering 5.25V and 400mA of continuous current
HP 8648 (or equivalent) signal source
HP 8561E (or equivalent) spectrum analyzer capa-
ble of covering the MAX2055s frequency range, as well as a few harmonics
Two digital multimeters (DMMs) to monitor VCCand ICC, if desired
HP 8753D (or equivalent) network analyzer to mea­sure return loss and gain
Filters to attenuate harmonic output of signal sources, if harmonic measurements are desired
Connections and Setup
This section provides a step-by-step guide to testing the basic functionality of the EV kit. As a general pre­caution to prevent damaging the outputs by driving high-VSWR loads, do not turn on DC power or RF signal generators until all connections are made.
Gain Setting
Connect the header pins for B4–B0 to GND for maxi­mum gain (20dB typ). See Table 1 for other gain­setting configurations. To set a logic high on B4–B0, leave the respective header pin unconnected as on­board resistors pull up the logic to +5V. To control B4–B0 using external logic (voltage limits per the data sheet), ensure that +5V is applied to the chip. Failure to do so can cause the on-chip ESD diodes to draw significant current and can damage the part.
Testing the Supply Current
1) Connect 50terminations to RF_IN and RF_OUT.
2) With the DC supply disabled, set it to +5.0V (through a low internal resistance ammeter, if desired) and connect to the +5V and GND terminals on the EV kit. If available, set the current limit to 400mA.
3) Enable the DC supply; the supply current should read approximately 250mA.
Testing the Power Gain
1) Connect the RF signal generator to the RF_IN SMA connector. Do not turn on the generators output. Set
the generator to an output frequency of 70MHz, and set the generator power level to -15dBm.
2) Connect the spectrum analyzer to the RF_OUT SMA connector. Set the spectrum analyzer to a center fre­quency of 70MHz and a total span of 1MHz.
3) With the DC supply disabled, set it to +5.0V (through a low internal-resistance ammeter, if desired) and connect to the +5V and GND terminals on the EV kit. If available, set the current limit to 400mA.
4) Connect B4–B0 to GND for 0dB attenuation.
5) Enable the DC supply, and then activate the RF gen­erators output. A 70MHz signal shown on the spec-
Table 1. Attenuation Setting vs. Gain­Control Bits
*Enabling B4 disables B3 and the minimum attenuation is 16dB.
ATTENUATION
(dB)
0 00000
1 00001
2 00010
3 00011
4 00100
5 00101
6 00110
7 00111
8 01000
9 01001
10 0 1 0 1 0
11 0 1 0 1 1
12 0 1 1 0 0
13 0 1 1 0 1
14 0 1 1 1 0
15 0 1 1 1 1
16 1X 000
17 1X 001
18 1X 010
19 1X 011
20 1X 100
21 1X 101
22 1X 110
23 1X 111
B4
(16dB)
B3*
(8dB)B2(4dB)B1(2dB)B0(1dB)
trum analyzer display should indicate a magnitude of approximately 5dBm. Be sure to account for external cable losses.
6) (Optional) Gain can be determined with a network analyzer. This has the advantage of displaying gain over a swept frequency band, in addition to display­ing input and output return loss. Refer to the network analyzer manufacturers user manual for setup details.
Detailed Description
Figure 1 shows the schematic for the MAX2055 EV kit. The EV kit is matched for operation up to 300MHz. Capacitors C1, C4, C5, C8, and C9 are DC-blocking capacitors for the RF_IN, ATTN
OUT
, and RF_OUT ports. To reduce the possibility of noise pickup, capacitors C2, C3, C10, C11, and C12 form the VCCdecoupling network. Inductors L1–L5 provide a method of biasing. Inductor L2 needs to handle the total IC current and have a DC resistance that is less than 0.2. If the DC resistance is higher than 0.2, the value of R1 may need to be adjusted down to maintain the nominal operating current. Inductors L4 and L5 are nonmagnet­ic coils that provide the output supply bias for the amplifier. Transformer T1 is used to convert the single­ended attenuator output to a differential signal. This technique results in an improved 2nd harmonic perfor­mance for the device. The amplifier can be driven single ended if the improved 2nd harmonic is not required (see Modifying the EV Kit section). Output transformer T2 enables single-ended measurements, in addition to providing common-mode rejection for the 2nd harmon­ic. Resistor R7 helps reduce video leakage during switching. Replace R7 with a 0resistor if video leak­age is not a concern.
Modifying the EV Kit
The EV kit is easily configured for other topologies.
For a single-ended amplifier input:
1) Remove T1 and place a low-inductance short circuit between the T1 surface-mount pads that connect capacitors C4 to C5.
2) Add a 1000pF 0603 case style capacitor for C7.
3) Change L2 to the same style and value inductor as L1 (330nH) noted in the Component List.
4) Change R1 to 909(to adjust the DC current to compensate for the higher L2 resistance).
Note: In this configuration, C6 is not required.
The EV kit also provides the ability for additional methods of testing by adding in the option for an interstage RF connection along with differential RF output connections.
Layout Considerations
The MAX2055 evaluation boards can be used as a guide for your board layout. Give close attention to thermal design and close placement of parts to the IC. The MAX2055 package exposed paddle (EP) conducts heat out of the part and provides a low-impedance electrical connection. The EP must be attached to the PC board ground plane with a low thermal and electrical-imped­ance contact. Ideally, this is provided by soldering the backside package contact directly to a top metal ground plane on the PC board. Alternatively, the EP can be con­nected to a ground plane using an array of plated vias directly below the EP. The MAX2055 EV kit uses eight evenly spaced, 0.016in-diameter, plated through holes to connect the EP to the lower ground planes.
Depending on the RF ground plane spacing, large sur­face-mount pads in the RF path may need to have the ground plane relieved under them to reduce shunt capacitance.
Evaluates: MAX2055
MAX2055 Evaluation Kit
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