The MAX2032 high-linearity passive upconverter or
downconverter mixer is designed to provide +33dBm
IIP3, 7dB NF, and 7dB conversion loss for a 650MHz to
1000MHz RF frequency range to support a multitude of
base-station applications. With a 650MHz to 1250MHz
LO frequency range, this particular mixer is ideal for
high-side LO injection architectures. For a pin-to-pincompatible mixer meant for low-side LO injection, refer
to the MAX2029.
In addition to offering excellent linearity and noise performance, the MAX2032 also yields a high level of component integration. This device includes a doublebalanced passive mixer core, a dual-input LO selectable switch, and an LO buffer. On-chip baluns are also
integrated to allow for a single-ended RF input for
downconversion (or RF output for upconversion) and
single-ended LO inputs. The MAX2032 requires a nominal LO drive of 0dBm, and supply current is guaranteed
to be below 100mA.
The MAX2032 is pin compatible with the MAX2039/
MAX2041 1700MHz to 2200MHz mixers, making this
family of passive upconverters and downconverters
ideal for applications where a common PCB layout is
used for both frequency bands.
The MAX2032 is available in a compact 20-pin thin
QFN package (5mm x 5mm) with an exposed pad.
Electrical performance is guaranteed over the extended
-40°C to +85°C temperature range.
Applications
Features
♦ 650MHz to 1000MHz RF Frequency Range
♦ 650MHz to 1250MHz LO Frequency Range
♦ 570MHz to 900MHz LO Frequency Range
(Refer to the MAX2029 Data Sheet)
♦ DC to 250MHz IF Frequency Range
♦ 7dB Conversion Loss
♦ +33dBm Input IP3
♦ +24dBm Input 1dB Compression Point
♦ 7dB Noise Figure
♦ Integrated LO Buffer
♦ Integrated RF and LO Baluns
♦ Low -3dBm to +3dBm LO Drive
♦ Built-In SPDT LO Switch with 49dB LO1 to LO2
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
EVALUATION KIT
AVAILABLE
cdma2000 is a registered trademark of Telecommunications
Industry Association.
iDEN is a registered trademark of Motorola, Inc.
WiMAX is a trademark of WiMAX Forum.
WCDMA/LTE and
cdma2000®Base
Stations
GSM 850/GSM 900 2G
and 2.5G EDGE Base
Stations
Integrated Digital
Enhanced Network
(iDEN
®
) Base Stations
WiMAXTMBase Stations
and Customer Premise
Equipment
Predistortion Receivers
Microwave and Fixed
Broadband Wireless
Access
Wireless Local Loop
Digital and Spread-
Spectrum Communication
Systems
Ordering Information
+
Denotes a lead(Pb)-free/RoHS-compliant package.
T = Tape and reel.
*
EP = Exposed pad.
MAX2032
TOP VIEW
4
5
3
2
12
11
13
LOBIAS
LOSEL
GND
14
V
CC
IF+
GND
GND
GND
67
TAP
910
20191716
GND
GND
V
CC
GND
GND
LO1
V
CC
IF-
8
18
RF
+
1
15
LO2
V
CC
EP
Pin Configuration/
Functional Diagram
PARTTEMP RANGEPIN-PACKAGE
M AX 2032E TP + - 40°C to + 85° C 20 Thi n QFN- E P *
M AX 2032E TP + T- 40°C to + 85° C 20 Thi n QFN- E P *
MAX2032
High-Linearity, 650MHz to 1000MHz Upconversion/
Downconversion Mixer with LO Buffer/Switch
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCCto GND...........................................................-0.3V to +5.5V
RF (RF is DC shorted to GND through a balun)..................50mA
LO1, LO2 to GND ..................................................-0.3V to +0.3V
IF+, IF- to GND ...........................................-0.3V to (V
CC
+ 0.3V)
TAP to GND ...........................................................-0.3V to +1.4V
LOSEL to GND ...........................................-0.3V to (V
CC
+ 0.3V)
LOBIAS to GND..........................................-0.3V to (V
CC
+ 0.3V)
RF, LO1, LO2 Input Power (Note 1) ...............................+20dBm
Continuous Power Dissipation (Note 2)....................................5W
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
DC ELECTRICAL CHARACTERISTICS
(
Typical Application Circuit
, VCC= 4.75V to 5.25V, no RF signals applied, TC= -40°C to +85°C. IF+ and IF- are DC grounded through an
IF balun. Typical values are at V
CC
= 5V, TC= +25°C, unless otherwise noted.)
RECOMMENDED AC OPERATING CONDITIONS
Note 1: Maximum, reliable, continuous input power applied to the RF and IF port of this device is +12dBm from a 50Ω source.
Note 2: Based on junction temperature T
J
= TC+ (θJCx VCCx ICC). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a PCB. See the
Applications Information
section for details. The junction
temperature must not exceed +150°C.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial
.
Note 4: Junction temperature T
J
= TA+ (θJAx VCCx ICC). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 5: T
C
is the temperature on the exposed pad of the package. TAis the ambient temperature of the device and PCB.
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
Supply VoltageV
Supply CurrentI
LOSEL Input Logic-LowV
LOSEL Input Logic-HighV
CC
CC
IL
IH
4.755.005.25V
2V
85100mA
0.8V
RF Frequencyf
LO Frequencyf
IF Frequencyf
LO Drive LevelP
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
RF
LO
IF
LO
C om p onents tuned for the 700M H z b and
( Tab l e 1) , C 1 = 7p F, C 5 = 3.3p F ( N otes 6, 7)
C om p onents tuned for the 800M H z/900M H z
cel l ul ar b and ( Tab l e 1) , C 1 = 82p F,
C 5 = 2.0p F ( N ote 6)
(Notes 6, 7)6501250MHz
IF frequency range depends on external IF
transformer selection
Note 6: Operation outside this range is possible, but with degraded performance of some parameters.
Note 7: Not production tested.
Note 8: All limits include external component losses. Output measurements are taken at IF or RF port of the
Typical Application Circuit
.
Note 9: Compression point characterized. It is advisable not to continuously operate the mixer RF/IF inputs above +12dBm.
Note 10: Guaranteed by design.
Note 11: Measured with external LO source noise filtered, so its noise floor is -174dBm/Hz. This specification reflects the effects of all
SNR degradations in the mixer, including the LO noise as defined in Application Note 2021:
Specifications and Measurement
of Local Oscilator Noise in Integrated Circuit Base Station Mixers.
AC ELECTRICAL CHARACTERISTICS (700MHz BAND DOWNCONVERTER OPERATION)
(
Typical Application Circuit
, optimized for the 700MHz band (see Table 1), C1 = 7pF, C5 = 3.3pF, L1 and C4 are not used, VCC=
4.75V to 5.25V, RF and LO ports driven from 50Ω sources, P
LO
= -3dBm to +3dBm, PRF= 0dBm, fRF= 650MHz to 850MHz, fLO=
790MHz to 990MHz, f
IF
= 140MHz, fLO> fRF, TC= +25°C, unless otherwise noted. Typical values are at VCC= 5V, PRF= 0dBm,
, L1 = 4.7nH, C4 = 6pF, C5 not used, VCC= 5.0V, PLO= 0dBm, PIF= 0dBm, fRF= f
LO
+ fIF, fIF= 160MHz,
T
C
= +25°C, unless otherwise noted.)
LO LEAKAGE AT RF PORT vs. LO FREQUENCY
(L-C BPF TUNED FOR 810MHz RF FREQUENCY)
-15
LO LEAKAGE AT RF PORT vs. LO FREQUENCY
(L-C BPF TUNED FOR 810MHz RF FREQUENCY)
-15
LO LEAKAGE AT RF PORT vs. LO FREQUENCY
(L-C BPF TUNED FOR 810MHz RF FREQUENCY)
-15
-20
-25
-30
LO LEAKAGE AT RF PORT (dBm)
-35
910106096010101110 1160 1210
TC = -40°C, -25°C
TC = +85°C
LO FREQUENCY (MHz)
TC = +25°C
IF LEAKAGE AT RF PORT vs. LO FREQUENCY
(L-C BPF TUNED FOR 810MHz RF FREQUENCY)
-50
-60
-70
-80
IF LEAKAGE AT RF PORT (dBm)
-90
-100
91010109601060 1110 1160 1210
TC = +25°C
TC = -40°C, -25°C
TC = +85°C
LO FREQUENCY (MHz)
MAX2032 toc87
-20
-25
-30
LO LEAKAGE AT RF PORT (dBm)
-35
PLO = -3dBm, 0dBm, +3dBm
910106096010101110 1160 1210
LO FREQUENCY (MHz)
IF LEAKAGE AT RF PORT vs. LO FREQUENCY
(L-C BPF TUNED FOR 810MHz RF FREQUENCY)
-50
MAX2032 toc90
-60
-70
-80
IF LEAKAGE AT RF PORT (dBm)
-90
-100
91010109601060 1110 1160 1210
PLO = -3dBm
PLO = +3dBm
LO FREQUENCY (MHz)
PLO = 0dBm
MAX2032 toc88
-20
-25
-30
LO LEAKAGE AT RF PORT (dBm)
-35
910106096010101110 1160 1210
IF LEAKAGE AT RF PORT vs. LO FREQUENCY
(L-C BPF TUNED FOR 810MHz RF FREQUENCY)
-50
MAX2032 toc91
-60
-70
-80
IF LEAKAGE AT RF PORT (dBm)
-90
-100
91010109601060 1110 1160 1210
VCC = 4.75V
LO FREQUENCY (MHz)
VCC = 5.0V
VCC = 4.75V
LO FREQUENCY (MHz)
VCC = 5.25V
VCC = 5.0V
VCC = 5.25V
MAX2032 toc89
MAX2032 toc92
RF PORT RETURN LOSS vs. RF FREQUENCY
(L-C BPF TUNED FOR 810MHz RF FREQUENCY)
0
5
L1 AND C4 BPF
10
INSTALLED
15
20
25
RF PORT RETURN LOSS (dB)
30
35
7508509008009501000 1050
L1 AND C4 BPF
REMOVED
THE OPTIONAL L-C BPF
ENHANCES PERFORMANCE
IN THE UPCONVERTER
MODE, BUT LIMITS
RF BANDWIDTH
RF FREQUENCY (MHz)
MAX2032 toc93
MAX2032
Detailed Description
The MAX2032 can operate either as a downconverter or
an upconverter mixer that provides approximately 7dB of
conversion loss with a typical 7dB noise figure. IIP3 is
+33dBm and +31dBm for downconversion and upconversion modes, respectively. The integrated baluns and
matching circuitry allow for 50Ω single-ended interfaces
to the RF port and the two LO ports. The RF port can be
used as an input for downconversion or an output for
upconversion. A single-pole, double-throw (SPDT) switch
provides 50ns switching time between the two LO inputs
with 49dB of LO-to-LO isolation. Furthermore, the integrated LO buffer provides a high drive level to the mixer
core, reducing the LO drive required at the MAX2032’s
inputs to a -3dBm to +3dBm range. The IF port incorporates a differential output for downconversion, which is
ideal for providing enhanced IIP2 performance. For
upconversion, the IF port is a differential input.
Specifications are guaranteed over broad frequency
ranges to allow for use in cellular band WCDMA,
cdmaOne™, cdma2000, and GSM 850/GSM 900 2.5G
EDGE base stations. The MAX2032 is specified to operate over a 650MHz to 1000MHz RF frequency range, a
650MHz to 1250MHz LO frequency range, and a DC to
250MHz IF frequency range. Operation beyond these
ranges is possible; see the
Typical Operating Charac-
teristics
for additional details.
The MAX2032 is optimized for high-side LO injection architectures. However, the device can operate in low-side LO
injection applications with an extended LO range, but
performance degrades as f
LO
decreases. See the
Typical
Operating Characteristics
for measurements taken with
fLObelow 960MHz. For a pin-compatible device that has
been optimized for LO frequencies below 960MHz, refer
to the MAX2029.
RF Port and Balun
For using the MAX2032 as a downconverter, the RF
input is internally matched to 50Ω, requiring no external
matching components. A DC-blocking capacitor is
required because the input is internally DC shorted to
ground through the on-chip balun. For upconverter
operation, the RF port is a single-ended output similarly
matched to 50Ω.
LO Inputs, Buffer, and Balun
The MAX2032 is optimized for high-side LO injection
architectures with a 650MHz to 1250MHz LO frequency
range. For a device with a 570MHz to 900MHz LO frequency range, refer to the MAX2029. As an added feature, the MAX2032 includes an internal LO SPDT switch
that can be used for frequency-hopping applications.
The switch selects one of the two single-ended LO
ports, allowing the external oscillator to settle on a particular frequency before it is switched in. LO switching
time is typically less than 50ns, which is more than adequate for nearly all GSM applications. If frequency hopping is not employed, set the switch to either of the LO
inputs. The switch is controlled by a digital input
(LOSEL): logic-high selects LO2, logic-low selects LO1.
High-Linearity, 650MHz to 1000MHz Upconversion/
Downconversion Mixer with LO Buffer/Switch
2RFS i ng l e- E nd ed 50Ω RF Inp ut/O utp ut. Thi s p or t i s i nter nal l y m atched and D C shor ted to G N D thr oug h a b al un.
3TAPCenter Tap of the Internal RF Balun. Connect to ground.
4, 5, 10, 12,
13, 16, 17, 20
7LOBIAS Bias Resistor for Internal LO Buffer. Connect a 523Ω ±1% resistor from LOBIAS to the power supply.
9LOSEL Local Oscillator Select. Logic-control input for selecting LO1 or LO2.
11LO1Local Oscillator Input 1. Drive LOSEL low to select LO1.
15LO2Local Oscillator Input 2. Drive LOSEL high to select LO2.
18, 19IF-, IF+ Differential IF Input/Outputs
—EP
GNDGround
Power-Supply Connection. Bypass each VCC pin to GND with capacitors as shown in the Typical
CC
Application Circuit.
Exposed Pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses multiple
ground vias to provide heat transfer out of the device into the PCB ground planes. These multiple ground
vias are also required to achieve the noted RF performance.
To avoid damage to the part, voltage MUST be applied
to V
CC
before digital logic is applied to LOSEL (see the
Absolute Maximum Ratings
). LO1 and LO2 inputs are
internally matched to 50Ω, requiring an 82pF DC-blocking capacitor at each input.
A two-stage internal LO buffer allows a wide inputpower range for the LO drive. All guaranteed specifications are for a -3dBm to +3dBm LO signal power. The
on-chip low-loss balun, along with an LO buffer, drives
the double-balanced mixer. All interfacing and matching components from the LO inputs to the IF outputs
are integrated on-chip.
High-Linearity Mixer
The core of the MAX2032 is a double-balanced, highperformance passive mixer. Exceptional linearity is provided by the large LO swing from the on-chip LO buffer.
Differential IF
The MAX2032 mixer has a DC to 250MHz IF frequency
range. Note that these differential ports are ideal for providing enhanced IIP2 performance. Single-ended IF
applications require a 1:1 balun to transform the 50Ω dif-
ferential IF impedance to 50Ω single-ended. Including
the balun, the IF return loss is better than 15dB. The differential IF is used as an input port for upconverter operation. The user can use a differential IF amplifier following
the mixer, but a DC block is required on both IF pins.
Applications Information
Input and Output Matching
The RF and LO inputs are internally matched to 50Ω. No
matching components are required. As a downconverter, the return loss at the RF port is typically better than
15dB over the entire input range (650MHz to 1000MHz),
and return loss at the LO ports are typically 15dB
(960MHz to 1180MHz). RF and LO inputs require only
DC-blocking capacitors for interfacing (see Table 1).
An optional L-C bandpass filter (BPF) can be installed at
the RF port to improve upconverter performance. See
the
Typical Application Circuit
and
Typical Operating
Characteristics
for upconverter operation with an L-C
BPF tuned for 810MHz RF frequency. Performance can
be optimized at other frequencies by choosing different
values for L1 and C4. Removing L1 and C4 altogether
results in a broader match, but performance degrades.
Contact factory for details.
The IF output impedance is 50Ω (differential). For evaluation, an external low-loss 1:1 (impedance ratio) balun
transforms this impedance to a 50Ω single-ended output (see the
Table 1. Typical Application Circuit Component List
*
C4 and L1 installed only when mixer is used as an upconverter.
**
C5 installed only when mixer is used as a downconverter.
DESIGNATIONQTYDESCRIPTIONSUPPLIER
82pF microwave capacitor (0603). Use for 800MHz/
C11
C2, C7, C8, C10,
C11, C12
C3, C6, C930.01µF microwave capacitors (0603)Murata Electronics North America, Inc.
C4*16pF microwave capacitor (0603)—
C5**1
L1*14.7nH inductor (0603)—
R11523Ω ±1% resistor (0603)Digi-Key Corp.
T11MABAES0029 1:1 transformer (50:50)M/A-Com, Inc.
U11MAX2032 IC (20 TQFN)Maxim Integrated Products, Inc.
900MHz cellular band applications.
7pF microwave capacitor (0603). Use for 700MHz band
applications.
682pF microwave capacitors (0603)Murata Electronics North America, Inc.
2pF microwave capacitor (0603). Use for 800MHz/900MHz cellular band applications.
3.3pF microwave capacitor (0603). Use for 700MHz band
applications.
Murata Electronics North America, Inc.
Murata Electronics North America, Inc.
MAX2032
Bias Resistor
Bias current for the LO buffer is optimized by fine tuning resistor R1. If reduced current is required at the
expense of performance, contact the factory for details.
If the ±1% bias resistor values are not readily available,
substitute standard ±5% values.
Layout Considerations
A properly designed PCB is an essential part of any
RF/microwave circuit. Keep RF signal lines as short as
possible to reduce losses, radiation, and inductance.
For the best performance, route the ground-pin traces
directly to the exposed pad under the package. The
PCB exposed pad MUST be connected to the ground
plane of the PCB. It is suggested that multiple vias be
used to connect this pad to the lower-level ground
planes. This method provides a good RF/thermal conduction path for the device. Solder the exposed pad on
the bottom of the device package to the PCB. The
MAX2032 evaluation kit can be used as a reference for
board layout. Gerber files are available upon request at
www.maxim-ic.com.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for highfrequency circuit stability. Bypass each VCCpin with
the capacitors shown in the
Typical Application Circuit
.
See Table 1.
Exposed Pad RF/Thermal Considerations
The exposed pad (EP) of the MAX2032’s 20-pin thin
QFN-EP package provides a low-thermal-resistance
path to the die. It is important that the PCB on which the
MAX2032 is mounted be designed to conduct heat
from the EP. In addition, provide the EP with a lowinductance path to electrical ground. The EP MUST be
soldered to a ground plane on the PCB, either directly
or through an array of plated via holes.
High-Linearity, 650MHz to 1000MHz Upconversion/
Downconversion Mixer with LO Buffer/Switch
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________
For the latest package outline information and land patterns, go to
www.maxim-ic.com/packages
. Note that a “+”, “#”, or “-” in the
package code indicates RoHS status only. Package drawings
may show a different suffix character, but the drawing pertains
to the package regardless of RoHS status.
PACKAGE TYPEPACKAGE CODEDOCUMENT NO.
20 Thin QFN-EPT2055+3
21-0140
RF
C3C2
C1
L1
T1
1
3
C5
V
CC
IF+
GND
20+191716
1
V
CC
2
TAP
GND
GND
RF
3
4
EP
5
67
V
CC
C4
18
CC
V
LOBIAS
R1
IF-
MAX2032
8
CC
V
GND
910
LOSEL
LOSEL
GND
GND
4
IF
5
C12
15
LO2
14
V
CC
13
GND
12
GND
11
LO1
C10
C11
LO2
V
LO1
CC
C6
NOTE: L1 AND C4 USED ONLY FOR UPCONVERTER OPERATION.
C5 USED ONLY FOR DOWNCONVERTER OPERATION.
C7
C8
V
CC
C9
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