The MAX19994A dual-channel downconverter is
designed to provide 8.4dB of conversion gain, +25dBm
input IP3, +14dBm 1dB input compression point, and a
noise figure of 9.8dB for 1200MHz to 2000MHz diversity
receiver applications. With an optimized LO frequency
range of 1450MHz to 2050MHz, this mixer supports both
high- and low-side LO injection architectures for the
1200MHz to 1700MHz and 1700MHz to 2000MHz RF
bands, respectively.
In addition to offering excellent linearity and noise performance, the device also yields a high level of component
integration. This device includes two double-balanced
passive mixer cores, two LO buffers, a dual-input LO
selectable switch, and a pair of differential IF output
amplifiers. Integrated on-chip baluns allow for singleended RF and LO inputs. The MAX19994A requires a
nominal LO drive of 0dBm and a typical supply current of
330mA at V
= 5.0V, or 264mA at VCC = 3.3V.
CC
The MAX19994A is pin compatible with the MAX9985/
M AX9995/MAX19985A/MAX1 9 9 9 3 / M A X 1 9 9 9 5 /
MAX19995A series of 700MHz to 2500MHz mixers
and pin similar with the MAX19997A/MAX19999 series
of 1850MHz to 4000MHz mixers, making this entire
family of downconverters ideal for applications where a
common PCB layout is used across multiple frequency
bands.
The device is available in a 6mm x 6mm, 36-pin thin QFN
package with an exposed pad. Electrical performance is
guaranteed over the extended temperature range, from
= -40NC to +85NC.
T
C
Applications
WCDMA/LTE Base Stations
TD-SCDMA Base Stations
GSM/EDGE Base Stations
M
cdma2000
Wireless Local Loop
Fixed Broadband Wireless Access
Private Mobile Radios
Military Systems
Base Stations
Features
S 1200MHz to 2000MHz RF Frequency Range
S 1450MHz to 2050MHz LO Frequency Range
S 50MHz to 500MHz IF Frequency Range
S 8.4dB Typical Conversion Gain
S 9.8dB Typical Noise Figure
S +25dBm Typical Input IP3
S +14dBm Typical Input 1dB Compression Point
S 68dBc Typical 2LO - 2RF Spurious Rejection at
= -10dBm
P
RF
S Dual Channels Ideal for Diversity Receiver
Applications
S 47dB Typical Channel-to-Channel Isolation
S Low -6dBm to +3dBm LO Drive
S Integrated LO Buffer
S Internal RF and LO Baluns for Single-Ended
Inputs
S Built-In SPDT LO Switch with 48dB LO-to-LO
Isolation and 50ns Switching Time
S Pin Compatible with the MAX9985/MAX9995/
MAX19985A/MAX19993/MAX19995/MAX19995A
Series of 700MHz to 2200MHz Mixers
S Pin Similar to the MAX19997A/MAX19999 Series
of 1850MHz to 4000MHz Mixers
S Single 5.0V or 3.3V Supply
S External Current-Setting Resistors Provide Option
for Operating Device in Reduced-Power/ReducedPerformance Mode
Ordering Information
PARTTEMP RANGEPIN-PACKAGE
MAX19994AETX+
MAX19994AETX+T
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
T = Tape and reel.
-40NC to +85NC
-40NC to +85NC
36 Thin QFN-EP*
36 Thin QFN-EP*
MAX19994A
cdma2000 is a registered trademark of Telecommunications
Industry Association.
Note 1: Junction temperature TJ = TA + (BJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is
MAX19994A
Note 2: Based on junction temperature T
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Note 4: T
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
known. The junction temperature must not exceed +150NC.
= TC + (BJC x VCC x ICC). This formula can be used when the temperature of the
exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.
The junction temperature must not exceed +150NC.
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.
C
J
5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, VCC = 4.75V to 5.25V, no input AC signals. TC = -40NC to +85NC, R1 = R4 = 681I, R2 = R5 = 1.82kI.
Typical values are at V
former as defined in the Typical Application Circuit, IF matching components affect the
IF frequency range (Note 5)
Using alternative Mini-Circuits TC4-1W-7A
4:1 transformer as defined in the Typical Application Circuit, IF matching components
affect the IF frequency range (Note 5)
(Note 5)-6+3dBm
100500
MHz
50250
5.0V SUPPLY, HIGH-SIDE INJECTION AC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit optimized for the Standard RF Band(see Table 1). R1 = R4 = 681I, R2 = R5 = 1.82kI, VCC = 4.75V
to 5.25V, RF and LO ports are driven from 50I sources, P
f
= 1550MHz to 2050MHz, fIF = 350MHz, fRF < fLO, TC = -40NC to +85NC. Typical values are at V
LO
PLO = 0dBm, f
characterization, unless otherwise noted.) (Note 6)
Conversion GainG
Conversion Gain FlatnessDG
Gain Variation Over TemperatureTC
Input Compression PointIP
Input Third-Order Intercept PointIIP3
Input Third-Order Intercept Point
Variation Over Temperature
Noise Figure (Note 9)NF
Noise Figure Temperature
Coefficient
Noise Figure with BlockerNF
= 1450MHz, fLO = 1800MHz, fIF = 350MHz, TC = +25NC. All parameters are guaranteed by design and
RF
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
T
= +25NC (Note 7)7.08.49.0
C
CG
1dBfRF
TC
IIP3
SSB
TC
NF
C
T
= +25NC, fRF = 1427MHz to 1463MHz
C
(Note 7)
fRF = 1427MHz to 1463MHzQ0.05dB
C
TC = -40NC to +85NC-0.01dB/NC
= 1450MHz (Notes 7, 8)12.614.0dBm
f
RF1
f
RF1
f
= 1427MHz to 1463MHz, TC = +25NC
RF
(Note 7)
f
RF1
f
= 1427MHz to 1463MHz
RF
f
RF1
T
= -40NC to +85NC
C
Single sideband, no blockers present 9.813
f
= 1427MHz to 1463MHz, TC = +25NC,
RF
P
LO
present
f
= 1427MHz to 1463MHz, PLO = 0dBm,
RF
single sideband, no blockers present
Single sideband, no blockers present,
T
= -40NC to +85NC
C
P
BLOCKER
f
LO
B
P
LO
(Notes 9, 10)
= -6dBm to +3dBm, PRF = -5dBm, fRF = 1200MHz to 1700MHz,
LO
= 5.0V, PRF = -5dBm,
CC
6.28.49.8
7.98.48.9
- f
= 1MHz, PRF = -5dBm per tone21.525.0
RF2
- f
= 1MHz, PRF = -5dBm per tone,
RF2
23.025.0
- f
= 1MHz, PRF = -5dBm per tone,
RF2
- f
= 1MHz, PRF = -5dBm per tone,
RF2
= 0dBm, single sideband, no blockers
= +8dBm, fRF = 1450MHz,
= 1800MHz, f
= 0dBm, VCC = 5.0V, TC = +25NC
BLOCKER
= 1350MHz,
2225.0
Q0.75dBm
9.811
9.812.5
0.016dB/NC
20.222dB
dB
dBm
dB
MAX19994A
3
Dual, SiGe, High-Linearity, 1200MHz to 2000MHz
Downconversion Mixer with LO Buffer/Switch
5.0V SUPPLY, HIGH-SIDE INJECTION AC ELECTRICAL CHARACTERISTICS (continued)
(Typical Application Circuit optimized for the Standard RF Band (see Table 1). R1 = R4 = 681I, R2 = R5 = 1.82kI, VCC = 4.75V
to 5.25V, RF and LO ports are driven from 50I sources, P
f
= 1550MHz to 2050MHz, fIF = 350MHz, fRF < fLO, TC = -40NC to +85NC. Typical values are at V
LO
PLO = 0dBm, f
characterization, unless otherwise noted.) (Note 6)
MAX19994A
2LO - 2RF Spur Rejection (Note 9)2 x 2
3LO - 3RF Spur Rejection (Note 9)3 x 3
RF Input Return Loss
LO Input Return Loss
IF Output ImpedanceZ
IF Output Return Loss
RF-to-IF Isolation(Note 7)1930dB
LO Leakage at RF Port(Note 7)-42dBm
2LO Leakage at RF Port(Note 7)-30dBm
LO Leakage at IF Port(Note 7)-35dBm
Channel Isolation (Note 7)
LO-to-LO Isolation
LO Switching Time50% of LOSEL to IF settled within 2 degrees50ns
= 1450MHz, fLO = 1800MHz, fIF = 350MHz, TC = +25NC. All parameters are guaranteed by design and
RF
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
= 1450MHz,
f
RF
f
LO
f
SPUR
f
= 1450MHz,
RF
f
LO
f
SPUR
P
LO
T
= +25NC
C
= 1450MHz,
f
RF
f
LO
f
SPUR
f
= 1450MHz,
RF
f
LO
f
SPUR
P
LO
T
= +25NC
C
LO and IF terminated into matched
impedance, LO “on”
LO port selected, RF and IF terminated into
matched impedance
LO port unselected, RF and IF terminated
into matched impedance
Nominal differential impedance of the IF
IF
outputs
RF terminated into 50I, LO driven by
50I source, IF transformed to 50I using
external components shown in the Typical
Application Circuit
RFMAIN converted power measured at
IFDIV relative to IFMAIN, all unused ports
terminated to 50I
RFDIV converted power measured at
IFMAIN relative to IFDIV, all unused ports
terminated to 50I
P
LO1
f
LO1
= -6dBm to +3dBm, PRF = -5dBm, fRF = 1200MHz to 1700MHz,
LO
= 5.0V, PRF = -5dBm,
CC
P
= -10dBm5768
= 1800MHz,
= 1625MHz
= 1800MHz,
= 1625MHz,
= 0dBm, VCC = 5.0V,
= 1800MHz,
= 1683.33MHz
= 1800MHz,
= 1683.33MHz,
= 0dBm, VCC = 5.0V,
= +3dBm, P
= 1800MHz, f
= +3dBm,
LO2
LO2
= 1801MHz (Note 7)
RF
= -5dBm5263
P
RF
P
= -10dBm5868
RF
= -5dBm5363
P
RF
P
= -10dBm6884
RF
= -5dBm5874
P
RF
P
= -10dBm7084
RF
= -5dBm6074
P
RF
4347
4347
4248dB
17dB
16
20
200
13.0dB
dBc
dBc
dB
I
dB
4
Dual, SiGe, High-Linearity, 1200MHz to 2000MHz
Downconversion Mixer with LO
Buffer/Switch
3.3V SUPPLY, HIGH-SIDE INJECTION AC ELECTRICAL CHARACTERISTICS
(Typical Application Circuitoptimized for the Standard RF Band (see Table 1). R1 = R4 = 681I, R2 = R5 = 1.43kI. Typical
values are at V
noted.) (Note 6)
Conversion GainG
Conversion Gain FlatnessDG
Gain Variation Over TemperatureTC
Input Compression PointIP
Input Third-Order Intercept PointIIP3f
Input Third-Order Intercept Point
Variation Over Temperature
Noise FigureNF
Noise Figure Temperature CoefficientTC
2LO - 2RF Spur Rejection2 x 2
3LO - 3RF Spur Rejection3 x 3
RF Input Return Loss
LO Input Return Loss
IF Output Return Loss
RF-to-IF Isolation31dB
LO Leakage at RF Port-49dBm
2LO Leakage at RF Port-40dBm
LO Leakage at IF Port-35dBm
Channel Isolation
LO-to-LO Isolation
LO Switching Time50% of LOSEL to IF settled within 2 degrees50ns
LO and IF terminated into matched
impedance, LO “on”
LO port selected, RF and IF terminated into
matched impedance
LO port unselected, RF and IF terminated
into matched impedance
RF terminated into 50I, LO driven by
50I source, IF transformed to 50I using
external components shown in the Typical
Application Circuit
RFMAIN converted power measured at
IFDIV relative to IFMAIN, all unused ports
terminated to 50I
RFDIV converted power measured at
IFMAIN relative to IFDIV, all unused ports
terminated to 50I
P
LO1
f
LO1
= 1MHz23.6dBm
RF2
- f
= 1MHz, PRF = -5dBm per tone,
RF2
= -40NC to +85NC
= -40NC to +85NC
= -10dBm68
= -5dBm63
= -10dBm77
= -5dBm67
= +3dBm, P
= 1800MHz, f
= +3dBm,
LO2
= 1801MHz
LO2
±0.5dBm
0.016dB/NC
15dB
18
21
12.5dB
48
48
50dB
dBc
dBc
dB
dB
MAX19994A
5
Dual, SiGe, High-Linearity, 1200MHz to 2000MHz
Downconversion Mixer with LO Buffer/Switch
5.0V SUPPLY, LOW-SIDE INJECTION AC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit optimized for the Extended RF Band (see Table 1), R1 = R4 = 681I, R2 = R5 = 1.82kI. Typical
values are at V
noted.) (Note 6)
Conversion GainG
Conversion Gain FlatnessDG
Gain Variation Over TemperatureTC
Input Compression PointIP
MAX19994A
Input Third-Order Intercept PointIIP3f
Input Third-Order Intercept Point
Variation Over Temperature
Noise FigureNF
Noise Figure Temperature CoefficientTC
2RF - 2LO Spur Rejection2 x 2
3RF - 3LO Spur Rejection3 x 3
RF Input Return Loss
LO Input Return Loss
IF Output Return Loss
RF-to-IF Isolation37dB
LO Leakage at RF Port-52dBm
2LO Leakage at RF Port-29dBm
LO Leakage at IF Port-19.4dBm
Channel Isolation
LO-to-LO Isolation
LO Switching Time50% of LOSEL to IF settled within 2 degrees50ns
Note 5: Not production tested. Operation outside this range is possible, but with degraded performance of some parameters.
LO and IF terminated into matched
impedance, LO “on”
LO port selected, RF and IF terminated into
matched impedance
LO port unselected, RF and IF terminated
into matched impedance
RF terminated into 50I, LO driven by
50I source, IF transformed to 50I using
external components shown in the Typical
Application Circuit
RFMAIN converted power measured at
IFDIV relative to IFMAIN, all unused ports
terminated to 50I
RFDIV converted power measured at
IFMAIN relative to IFDIV, all unused ports
terminated to 50I
P
LO1
f
LO1
= 1MHz24.9dBm
RF2
- f
= 1MHz, PRF = -5dBm per tone,
RF2
= -40NC to +85NC
= -40NC to +85NC
= -10dBm68
= -5dBm 63
= -10dBm87
= -5dBm77
= +3dBm, P
= 1500MHz, f
= +3dBm,
LO2
= 1501MHz
LO2
dBc
dBc
dB
dB
6
Dual, SiGe, High-Linearity, 1200MHz to 2000MHz
Downconversion Mixer with LO
Buffer/Switch
Note 6: All limits reflect losses of external components, including a 0.8dB loss at fIF = 350MHz due to the 4:1 transformer. Output
measurements were taken at IF outputs of the Typical Application Circuit.
Note 7: 100% production tested for functionality.
Note 8: Maximum reliable continuous input power applied to the RF or IF port of this device is +12dBm from a 50I source.
Note 9: Not production tested.
Note 10: Measured with external LO source noise filtered so the noise floor is -174dBm/Hz. This specification reflects the effects
of all SNR degradations in the mixer, including the LO noise, as defined in Application Note 2021: Specifications and
Measurement of Local Oscillator Noise in Integrated Circuit Base Station Mixers.
Typical Operating Characteristics
(Typical Application Circuit optimized for the Standard RF Band (see Table 1). VCC = 5.0V, fRF = 1200MHz to 1700MHz, LO is
high-side injected for a 350MHz IF, P
Dual, SiGe, High-Linearity, 1200MHz to 2000MHz
Downconversion Mixer with LO Buffer/Switch
Typical Operating Characteristics (continued)
(Typical Application Circuit optimized for the Standard RF Band (see Table 1). VCC = 5.0V, fRF = 1200MHz to 1700MHz, LO is
high-side injected for a 350MHz IF, P
(Typical Application Circuit optimized for the Standard RF Band (see Table 1). VCC = 5.0V, fRF = 1200MHz to 1700MHz, LO is
high-side injected for a 350MHz IF, P