Maxim MAX196ACWI, MAX196ACNI, MAX196ACAI, MAX196BCNI, MAX196BCAI Datasheet

19-0435; Rev 0; 9/95
EVALUATION KIT
AVAILABLE
Multirange, Single +5V, 12-Bit DAS
with 12-Bit Bus Interface
_______________General Description
The MAX196/MAX198 multirange, 12-bit data-acquisi­tion systems (DAS) require only a single +5V supply for operation, yet convert analog signals at their inputs up to ±10V (MAX196) and ±4V (MAX198). These systems provide six analog input channels that are indepen­dently software programmable for a variety of ranges: ±10V, ±5V, 0V to +10V, and 0V to +5V for the MAX196; ±V
, ±V
REF
/2, 0V to +V
REF
, and 0V to +V
REF
REF
/2 for the MAX198. This range switching increases the effec­tive dynamic range to 14 bits and provides the flexibility to interface ±12V, ±15V, and 4mA to 20mA powered sensors to a single +5V system. In addition, these con­verters are fault protected to ±16.5V; a fault condition on any channel will not affect the conversion result of the selected channel. Other features include a 5MHz bandwidth track/hold, 100ksps throughput rate, soft­ware-selectable internal/external clock, internal/external acquisition control, 12-bit parallel interface, and internal
4.096V or external reference. Two programmable power-down modes (STBYPD,
FULLPD) provide low-current shutdown between con­versions. In STBYPD mode, the reference buffer remains active, eliminating start-up delays.
The MAX196/MAX198 employ a standard microproces­sor (µP) interface. A three-state data I/O port is config­ured to operate with 16-bit data buses, and data­access and bus-release timing specifications are com­patible with most popular µPs. All logic inputs and out­puts are TTL/CMOS compatible.
These devices are available in 28-pin DIP, wide SO, SSOP (55% smaller in area than wide SO), and ceramic SB packages. For 8+4 bus interface, see the MAX197 and the MAX199 data sheets. An evaluation kit will be available after December 1995 (MAX196EVKIT-DIP).
________________________Applications
Industrial-Control Systems Robotics Data-Acquisition Systems Automatic Testing Systems Medical Instruments Telecommunications
Functional Diagram appears at end of data sheet.
____________________________Features
12-Bit Resolution, 1/2LSB LinearitySingle +5V Supply OperationSoftware-Selectable Input Ranges:
±10V, ±5V, 0V to +10V, 0V to +5V (MAX196) ±V
, ±V
REF
(MAX198)
/2, 0V to +V
REF
, 0V to +V
REF
REF
/2
Internal 4.096V or External ReferenceFault-Protected Input Multiplexer6 Analog Input Channels6µs Conversion Time, 100ksps Sampling RateInternal or External Acquisition ControlTwo Power-Down ModesInternal or External Clock
______________Ordering Information
PART
MAX196ACNI
MAX196BCNI MAX196ACWI 0°C to +70°C MAX196BCWI 0°C to +70°C 28 Wide SO MAX196ACAI 0°C to +70°C 28 SSOP MAX196BCAI 0°C to +70°C 28 SSOP
Ordering Information continued at end of data sheet.
TEMP. RANGE PIN-PACKAGE
0°C to +70°C 0°C to +70°C
28 Narrow Plastic DIP 28 Narrow Plastic DIP 28 Wide SO
__________________Pin Configuration
TOP VIEW
CLK
1
CS
2
D11
3
D10
4
D9
5 D8 D7 D6 D5 D4 D3 D2 D1 D0
DIP/SO/SSOP/Ceramic SB
MAX196
6
MAX198
7
8
9
10 11 12 13 14
28 27 26 25 24 23 22 21 20 19 18 17 16 15
DGND V
DD
WR RD INT REF REFADJ CH5 CH4 CH3 CH2 CH1 CH0 AGND
MAX196/MAX198
________________________________________________________________
Maxim Integrated Products
Call toll free 1-800-722-8266 for free samples or literature.
1
Multirange, Single +5V, 12-Bit DAS with 12-Bit Bus Interface
ABSOLUTE MAXIMUM RATINGS
VDDto AGND............................................................-0.3V to +7V
AGND to DGND.....................................................-0.3V to +0.3V
REF to AGND..............................................-0.3V to (V
REFADJ to AGND.......................................-0.3V to (V
Digital Inputs to DGND...............................-0.3V to (V
Digital Outputs to DGND............................-0.3V to (V
CH0–CH5 to AGND ..........................................................±16.5V
Continuous Power Dissipation (T
Narrow Plastic DIP (derate 14.29mW/°C above +70°C)....1143mW
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
= +70°C)
A
DD DD DD DD
+ 0.3V) + 0.3V) + 0.3V) + 0.3V)
ELECTRICAL CHARACTERISTICS
(VDD= 5V ±5%; unipolar/bipolar range; external reference mode, V with 50% duty cycle; T
MAX196/MAX198
ACCURACY (Note 1)
Offset Error
Channel-to-Channel Offset Error Matching
Gain Error (Note 2)
Gain Temperature Coefficient (Note 2)
DYNAMIC SPECIFICATIONS (10kHz sine-wave input, ±10Vp-p (MAX196) or ±4.096Vp-p (MAX198), f
= T
to T
A
MIN
; unless otherwise noted. Typical values are at TA= +25°C.)
MAX
MAX196A/MAX198A
INLIntegral Nonlinearity
MAX196B/MAX198B
Unipolar
Bipolar Unipolar
Bipolar Unipolar
Bipolar Unipolar
Bipolar
SINADSignal-to-Noise + Distortion Ratio
MAX196A/MAX198A MAX196B/MAX198B 69 Up to the 5th harmonic
MAX196A/MAX198A MAX196B/MAX198B MAX196A/MAX198A MAX196B/MAX198B
MAX196A/MAX198A MAX196B/MAX198B MAX196A/MAX198A MAX196B/MAX198B
Wide SO (derate 12.50mW/°C above +70°C)..............1000mW
SSOP (derate 9.52mW/°C above +70°C) ......................762mW
Narrow Ceramic SB (derate 20.00mW/°C above +70°C)..1600mW
Operating Temperature Ranges
MAX196_C_ I/MAX198_C_ I .................................0°C to +70°C
MAX196_E_ I/MAX198_E_ I...............................-40°C to +85°C
MAX196_MYI/MAX198_MYI.............................-55°C to +125°C
Storage Temperature Range.............................-65°C to +150°C
Lead Temperature (soldering, 10sec).............................+300°C
= 4.096V; 4.7µF at REF pin; external clock, f
REF
CONDITIONS
±1/2
±1
±3 ±5 ±5
±10 ±0.1 ±0.5
±7
±10
±7
±10
3 5
= 100ksps)
SAMPLE
70
CLK
= 2.0MHz
UNITSMIN TYP MAXSYMBOLPARAMETER
ppm/°C
Bits12Resolution LSB LSB±1DNLDifferential Nonlinearity
LSB
LSB
LSB
dB dB-85 -78THDTotal Harmonic Distortion dB80SFDRSpurious-Free Dynamic Range
50kHz, VIN= ±5V (MAX196) or ±4V (MAX198) (Note 3)
External CLK mode/external acquisition control External CLK mode/external acquisition control
Aperture Jitter
2 _______________________________________________________________________________________
Internal CLK mode/internal acquisition control (Note 4)
10
dB-86Channel-to-Channel Crosstalk ns15Aperture Delay
ps<50 ns
Multirange, Single +5V, 12-Bit DAS
with 12-Bit Bus Interface
ELECTRICAL CHARACTERISTICS (continued)
(VDD= 5V ±5%; unipolar/bipolar range; external reference mode, V with 50% duty cycle; T
PARAMETER SYMBOL MIN TYP MAX UNITS
ANALOG INPUT
Track/Hold Acquisition Time 3 µs
Small-Signal Bandwidth
Input Voltage Range (see Table 3)
Input Current
Input Resistance Input Capacitance 40 pF
INTERNAL REFERENCE
REF Output Voltage V REF Output Tempco
(Contact Maxim Applications for guaranteed temperature drift specifications)
Output Short-Circuit Current 30 mA Load Regulation 10 mV0mA to 0.5mA output current (Note 6) Capacitive Bypass at REF 4.7 µF REFADJ Output Voltage 2.465 2.500 2.535 V REFADJ Adjustment Range ±1.5 %With recommended circuit (Figure 1) Buffer Voltage Gain 1.6384 V/V
= T
to T
A
MIN
; unless otherwise noted. Typical values are at TA= +25°C.)
MAX
CONDITIONS
f
= 2.0MHz
V
I
TC V
CLK
-3dB rolloff
Unipolar
V
IN
Bipolar
Unipolar
I
IN
Bipolar
Unipolar
IN
IN
Bipolar (Note 5)
TA= +25°C
REF
MAX196_C/MAX198_C
REF
±10V or ±V ±5V or ±V 0V to 10V or 0V to V 0V to 5V or 0V to V
MAX196
MAX198
MAX196
MAX198
MAX196 MAX198 MAX196
MAX198
= 4.096V; 4.7µF at REF pin; external clock, f
REF
range
REF
/2 range
REF
0V to 10V range 0V to 5V range
±10V range ±5V range ±V
REF
±V
REF
REF
/2 range
REF
range
/2 range
range
1.25 010 05 0V 0V
-10 10
-5 5
-V
REF
-V
/2 V
REF
-1200 720
-600 360
-1200 10
-600 10
4.076 4.096 4.116 V
5
2.5
2.5
REF
V
REF
720 360
0.1 10
21 16
15 30MAX196_E/MAX198_E 40MAX196_M/MAX198_M
CLK
REF
REF
= 2.0MHz
/2
/2
ppm/°C
MAX196/MAX198
MHz
V
µA
k
_______________________________________________________________________________________ 3
Multirange, Single +5V, 12-Bit DAS with 12-Bit Bus Interface
ELECTRICAL CHARACTERISTICS (continued)
(VDD= 5V ±5%; unipolar/bipolar range; external reference mode, V with 50% duty cycle; T
REFERENCE INPUT (buffer disabled, reference input applied to REF pin)
Input Current
Input Resistance REFADJ Threshold for
Buffer Disable
POWER REQUIREMENTS
MAX196/MAX198
Supply Voltage
Supply Current
Power-Supply Rejection Ratio (Note 8)
TIMING
Internal Clock Frequency External Clock Frequency Range MHz
Acquisition Time
Conversion Time
Throughput Rate Bandgap Reference
Start-Up Time Reference Buffer Settling DIGITAL INPUTS (D7–D0, CLK, RD, WR, CS) (Note 11)
Input High Voltage V Input Low Voltage V Input Leakage Current I Input Capacitance
= T
to T
A
MIN
; unless otherwise noted. Typical values are at TA= +25°C.)
MAX
Normal, or STANDBY
=
power-down mode FULL power-down mode
= 100pF MHz1.25 1.56 2.00f
CLK
CLK
DD
DD
I
DD
PSRR
CLK CLK
t
ACQI
t
ACQE
t
CONV
INH
INL IN
C
IN
V
REF
4.18V Normal, or STANDBY power-down mode k10
FULL power-down mode 5 M
Normal mode, bipolar ranges Normal mode, unipolar ranges STANDBY power-down mode FULL power-down mode (Note 7) External reference = 4.096V Internal reference ±1/
C
CLK
Internal acquisition External acquisition (Note 9)
After FULLPD or STBYPD External CLK Internal CLK, C External CLK Internal CLK, C
Power-up (Note 10) µs200
To 0.1mV REF bypass capacitor fully discharged
= 4.096V; 4.7µF at REF pin; external clock, f
REF
CONDITIONS
610
700 850
60 120
±0.1 ±1/
2
0.1 2.0f
External CLK
Internal CLK
= 100pF 6.0 7.7 10.0
= 100pF 62
C
= 4.7µF
REF
C
= 33µF
REF
3.0
3.0 5.0
3.0 5
6.0
8
60
2.4 V
= 2.0MHz
CLK
UNITSMIN TYP MAXSYMBOLPARAMETER
400
1
18
2
100
0.8 V
±10 µAVIN= 0V or V
15 pF(Note 5)
V2.4 4.18Input Voltage Range
µA
VVDD- 50mV
V4.75 5.25V
mA
µA
LSB
µs
µs
ksps
ms
4 _______________________________________________________________________________________
Multirange, Single +5V, 12-Bit DAS
with 12-Bit Bus Interface
ELECTRICAL CHARACTERISTICS (continued)
(VDD= 5V ±5%; unipolar/bipolar range; external reference mode, V with 50% duty cycle; T
PARAMETER SYMBOL MIN TYP MAX UNITSCONDITIONS
DIGITAL OUTPUTS (D11–D0, INT)
Output Low Voltage V Output High Voltage V Three-State Output Capacitance C
= T
to T
A
MIN
; unless otherwise noted. Typical values are at TA= +25°C.)
MAX
OL OH
OUT
SINK SOURCE
= 4.096V; 4.7µF at REF pin; external clock, f
REF
= 1.6mA
= 1mA
VDD- 1 VVDD= 4.75V, I
CLK
0.4 VVDD= 4.75V, I
15 pF(Note 5)
= 2.0MHz
TIMING CHARACTERISTICS
(VDD= 5V ±5%; unipolar/bipolar range; external reference mode, V with 50% duty cycle; T
PARAMETER SYMBOL MIN TYP MAX UNITS
CS Pulse Width t WR Pulse Width t CS to WR Setup Time CS to WR Hold Time t CS to RD Setup Time CS to RD Hold Time t CLK to WR Setup Time CLK to WR Hold Time t Data Valid to WR Setup Data Valid to WR Hold t RD Low to Output Data Valid RD High to Output Disable RD Low to INT High Delay
Note 1: Accuracy specifications tested at VDD= 5.0V. Performance at power-supply tolerance limits guaranteed by Power-Supply Note 2: External reference: V
Note 3: Ground “on” channel; sine wave applied to all “off” channels. Note 4: Maximum full-power input frequency for 1LSB error with 10ns jitter = 3kHz. Note 5: Guaranteed by design. Not tested. Note 6: Use static loads only. Note 7: Tested using internal reference. Note 8: PSRR measured at full-scale. Note 9: External acquisition timing: starts at data valid at ACQMOD = low control byte; ends at rising edge of WR
Note 10: Not subject to production testing. Provided for design guidance only. Note 11: All input control signals specified with t Note 12: t Note 13: t
Rejection test. Tested for the ±10V (MAX196) and ±4.096V (MAX198) input ranges.
= high control byte.
is measured with the load circuits of Figure 2 and defined as the time required for an output to cross 0.8V or 2.4V.
DO
is defined as the time required for the data lines to change by 0.5V.
TR
= T
to T
A
MIN
; unless otherwise noted.)
MAX
CONDITIONS
CS
WR
t
CSWS CSWH
t
CSRS CSRH
t
CWS CWH
t
DS
DH
t
DO
t
TR
t
INT1
= 4.096V, offset error nulled, ideal last code transition = FS - 3/2LSB.
REF
= tF= 5ns from a voltage level of 0.8V to 2.4V.
R
= 4.096V; 4.7µF at REF pin; external clock, f
REF
80 ns 80 ns
0 ns 0 ns 0 ns 0 ns
60 ns
0 ns
= 2.0MHz
CLK
100 ns
50 ns
120 nsFigure 2, CL= 100pF (Note 12)
70 ns(Note 13)
120 ns
with ACQMOD
MAX196/MAX198
_______________________________________________________________________________________ 5
Multirange, Single +5V, 12-Bit DAS with 12-Bit Bus Interface
__________________________________________Typical Operating Characteristics
(TA = +25°C, unless otherwise noted.)
INTEGRAL NONLINEARITY
0.250
0.200
0.150
0.100
0.050 0
-0.050
INTEGRAL NONLINEARITY (LSB)
-0.100
MAX196/MAX198
-0.150
vs. DIGITAL CODE
0 1000 3000
2000 4000
DIGITAL CODE
REFERENCE OUTPUT VOLTAGE (V
4.100
4.095
(V)
4.090
REF
V
4.085
4.080
-55
-35 45
vs. TEMPERATURE
+2.5V
INTERNAL
REFERENCE
REFADJ
525 65
-15 TEMPERATURE (°C)
MAX196/8-1
A
V
= 1.6384
0
-20
-40
-60
AMPLITUDE (dB)
-80
-100
-120
)
REF
REF
105 125
85
FFT PLOT
05025
FREQUENCY (kHz)
MAX196/8-4
f
TONE
f
SAMPLE
= 10kHz
= 100kHz
12.0
MAX196/8-2
11.5
11.0
10.5
EFFECTIVE NUMBER OF BITS
10.0
POWER-SUPPLY REJECTION RATIO
0.4
vs. TEMPERATURE
120Hz
0.2
0
100Hz
-0.2
PSRR (LSB)
-0.4
-0.6
-70 -50
-30 -10 10 30 70 90 TEMPERATURE (°C)
EFFECTIVE NUMBER OF BITS
vs. INPUT FREQUENCY
f
= 100kHz
SAMPLE
1 10 100
INPUT FREQUENCY (kHz)
= 5V ±0.25V
V
DD
50
110
130
MAX196/8-5
MAX196/8-3
OFFSET-ERROR MATCHING vs. TEMPERATURE
CHANNEL-TO-CHANNEL
OFFSET-ERROR MATCHING (LSB)
CHANNEL-TO-CHANNEL
0.20 
0.18
0.16
0.14
0.12
0.10
-70 -50 50 110
-30 -10 10 30 70 90 TEMPERATURE (°C)
130
MAX196/8-6
CHANNEL-TO-CHANNEL
CHANNEL-TO-CHANNEL
GAIN-ERROR MATCHING vs. TEMPERATURE
0.33
0.32
0.31
0.30
0.29
GAIN-ERROR MATCHING (LSB)
0.28
0.27
-70 -50 50 110
-30 -10 10 30 70 90 TEMPERATURE (°C)
6 _______________________________________________________________________________________
MAX196/8-7
130
Multirange, Single +5V, 12-Bit DAS
with 12-Bit Bus Interface
______________________________________________________________Pin Description
PIN
Clock Input. In external clock mode, drive CLK with a TTL/CMOS-compatible clock. In internal clock mode,
CLK1
REFADJ22
REF23
WR26
27
+5V
100k
24k
Figure 1. Reference-Adjust Circuit
D
OUT
3k
a) High-Z to V
Figure 2. Load Circuits for Enable Time
place a capacitor (C with C
Chip Select, active lowCS2 Three-State Digital I/O, D11 = MSBD11–D03–14 Analog GroundAGND15 Analog Input ChannelsCH0–CH516–21 Bandgap Voltage-Reference Output/External Adjust Pin. Bypass with a 0.01µF capacitor to AGND. Connect
to VDDwhen using an external reference at the REF pin. Reference Buffer Output/ADC Reference Input. In internal reference mode, the reference buffer provides a
4.096V nominal output, externally adjustable at REFADJ. In external reference mode, disable the internal buffer by pulling REFADJ to VDD.
INT goes low when conversion is complete and output data is ready.INT24 If CS is low, a falling edge on RD will enable a read operation on the data bus.RD25
In the internal acquisition mode, when CSis low, a rising edge on WR latches in configuration data and starts an acquisition plus a conversion cycle. In the external acquisition mode, when CSis low, the first rising edge on WR starts an acquisition, and a second rising edge on WRends acquisition and starts a conversion cycle.
+5V Supply. Bypass with 0.1µF capacitor to AGND.V
DD
Digital GroundDGND28
510k
0.01µF
C
and VOL to V
OH
LOAD
OH
= 100pF.
CLK
REFADJ
D
b) High-Z to VOL and VOH to V
) from this pin to ground to set the internal clock frequency; f
CLK
MAX196 MAX198
+5V
3k
OUT
C
LOAD
OL
FUNCTIONNAME
= 1.56MHz typical
CLK
_______________Detailed Description
The MAX196/MAX198 multirange, fault-tolerant ADCs use successive approximation and internal input track/hold (T/H) circuitry to convert an analog signal to a 12-bit digital output. The 12-bit parallel-output format provides easy interface to microprocessors (µPs). Figure 3 shows the MAX196/MAX198 in the simplest operational configuration.
In the internal acquisition control mode (control bit D5 set to 0), the T/H enters its tracking mode on WR’s ris­ing edge, and enters its hold mode when the internally timed (6 clock cycles) acquisition interval ends. In bipo­lar mode and unipolar mode (MAX196 only), a low­impedance input source, which settles in less than
1.5µs, is required to maintain conversion accuracy at the maximum conversion rate.
When the MAX198 is configured for unipolar mode, the input does not need to be driven from a low-impedance source. The acquisition time (tAZ) is a function of the source output resistance (RS), the channel input resis­tance (RIN), and the T/H capacitance.
Converter Operation
Analog-Input Track/Hold
MAX196/MAX198
_______________________________________________________________________________________ 7
Multirange, Single +5V, 12-Bit DAS with 12-Bit Bus Interface
Acquisition time is calculated as follows:
For 0V to V For 0V to V
: tAZ= 9 x (RS+ RIN) x 16pF
REF
/2: tAZ= 9 x (RS+ RIN) x 32pF
REF
where RIN= 7kand tAZis never less than 2µs (0V to V
range) or 3µs (0V to V
REF
/2 range).
REF
In the external acquisition control mode (D5 = 1), the T/H enters its tracking mode on the first WR rising edge and enters its hold mode when it detects the second WR rising edge with D5 = 0 (see
External Acquisition
section).
1
100pF
MAX196/MAX198
µP
CONTROL
INPUTS
µP DATA BUS
CLK
MAX196
25
MAX198
RD
26
WR
2
CS
3
D11
4
D10
5
D9
6
D8
7
D7
8
D6
9
D5
10
D4
11
D3
12
D2
13
D1
14
D0
Figure 3. Operational Diagram
S1
5.12k
R1
CH_
S1 = BIPOLAR/UNIPOLAR SWITCH S2 = INPUT MUX SWITCH S3, S4 = T/H SWITCH
S2
R2
R1 = 12.5k (MAX196) OR 5.12k (MAX198) R2 = 8.67k (MAX196) OR (MAX198)
Figure 4. Equivalent Input Circuit
DGND
V REF
REFADJ
CH5 CH4 CH3
CH2 CH1 CH0
AGND
BIPOLAR
UNIPOLAR
OFF
ON
DD
INT
S3
TRACKHOLD
28
27 23 22
0.01µF 0.01µF
24
21 20 19 18 17
16
15
C
HOLD
4.7µF4.7µF
OUTPUT STATUS
ANALOG
INPUTS
VOLTAGE REFERENCE
S4
T/H OUT
The ADC’s input tracking circuitry has a 5MHz small-
Input Bandwidth
signal bandwidth. When using the internal acquisition mode with an external clock frequency of 2MHz, a 100ksps throughput rate can be achieved. It is possible to digitize high-speed transient events and measure periodic signals with bandwidths exceeding the ADC’s sampling rate by using undersampling techniques. To avoid high-frequency signals being aliased into the fre­quency band of interest, anti-alias filtering is recom­mended (MAX274/MAX275 continuous-time filters).
Input Range and Protection
Figure 4 shows the equivalent input circuit. The full­scale input voltage depends on the voltage at the refer-
+5V
ence (V allows input voltage ranges of ±10V, ±5V, 0V to +10V,
). The MAX196 uses a scaling factor, which
REF
or 0V to +5V with a 4.096V voltage reference (Table 1). Program the desired range by setting the appropriate control bits (D3, D4) in the control byte (Tables 2 and
3). The MAX198 does not use a scaling factor, so its input voltage range directly corresponds with the refer­ence voltage. It can be programmed for input voltages of ±V
REF
, ±V
/2, 0V to V
REF
, or 0V to V
REF
REF
/2 (Table
3). When an external reference is applied at REFADJ, the voltage at REF is given by V (2.4V < V
REF
< 4.18V).
= 1.6384 x V
REF
REFADJ
The input channels are overvoltage protected to ±16.5V. This protection is active even if the device is in power-down mode.
Even with VDD= 0V, the input resistive network provides current-limiting that adequately protects the device.
Digital Interface
Input data (control byte) and output data are multi­plexed on a three-state parallel interface. This parallel I/O can easily be interfaced with a µP. CS, WR, and RD control the write and read operations. CS is the stan­dard chip-select signal, which enables a µP to address the MAX196/MAX198 as an I/O port. When high, it dis­ables the WR and RD inputs and forces the interface into a high-Z state.
Table 1. Full Scale and Zero Scale
HOLDTRACK
(MAX196 only)
RANGE (V)
0 to +5 0 V
0 to +10 0 V
ZERO SCALE
(V) -FULL SCALE +FULL SCALE
±5 -V
±10 -V
x 1.2207 V
REF
x 2.4414 V
REF
REF REF REF REF
x 1.2207 x 2.4414 x 1.2207 x 2.4414
8 _______________________________________________________________________________________
Multirange, Single +5V, 12-Bit DAS
with 12-Bit Bus Interface
Table 2. Control-Byte Format
D7 (MSB) D6 D5 D4 D3 D2 D1 D0 (LSB)
PD1 PD0 ACQMOD RNG BIP A2 A1 A0
BIT NAME DESCRIPTION
7, 6 PD1, PD0 These two bits select the clock and power-down modes (Table 4).
5 ACQMOD 0 = internally controlled acquisition (6 clock cycles), 1 = externally controlled acquisition 4 RNG Selects the full-scale voltage magnitude at the input (Table 3). 3 BIP Selects unipolar or bipolar conversion mode (Table 3).
2, 1, 0 A2, A1, A0 These are address bits for the input mux to select the “on” channel (Table 5).
Table 3. Range and Polarity Selection
BIP RNG
0 0 0 to 5 0 1 0 to 10 1 0 ±5 1 1 ±10
INPUT RANGE (V)
(MAX196)
INPUT RANGE (V)
(MAX198)
0 to V
REF
0 to V
REF
±V
/2
REF
±V
REF
/2
Table 4. Clock and Power-Down Selection
PD1 PD0 DEVICE MODE
0 0 Normal Operation / External Clock Mode 0 1 Normal Operation / Internal Clock Mode
1 0
1 1
Standby Power-Down (STBYPD); clock mode is unaffected
Full Power-Down (FULLPD); clock mode is unaffected
MAX196/MAX198
Table 5. Channel Selection
A2 A1 A0 CH0 CH1 CH2 CH3 CH4 CH5
0 0 0 0 0 1 0 1 0 0 1 1 1 0 0 1 0 1
_______________________________________________________________________________________ 9
Multirange, Single +5V, 12-Bit DAS with 12-Bit Bus Interface
The control byte is latched into the device, on pins
Input Format
D7–D0, during a write cycle. Table 2 shows the control­byte format.
Output Data Format
The output data format is binary in unipolar mode and twos-complement binary in bipolar mode. When reading the output data, CS and RD must be low.
How to Start a Conversion
Conversions are initiated with a write operation, which selects the mux channel and configures the MAX196/ MAX198 for either a unipolar or bipolar input range. A write pulse (WR + CS) can either start an acquisition inter­val or initiate a combined acquisition plus conversion. The sampling interval occurs at the end of the acquisition
MAX196/MAX198
interval. The ACQMOD bit in the input control byte offers two options for acquiring the signal: internal or external. The conversion period lasts for 12 clock cycles in either internal or external clock or acquisition mode.
Writing a new control byte during a conversion cycle will abort the conversion and start a new acquisition interval.
Internal Acquisition
Select internal acquisition by writing the control byte with the ACQMOD bit cleared (ACQMOD = 0). This causes the write pulse to initiate an acquisition interval whose
t
CS
duration is internally timed. Conversion starts when this six-clock-cycle acquisition interval (3µs with f
CLK
2MHz) ends (see Figure 5).
External Acquisition
Use the external acquisition timing mode for precise con­trol of the sampling aperture and/or independent control of acquisition and conversion times. The user controls acquisition and start-of-conversion with two separate write pulses. The first pulse, written with ACQMOD = 1, starts an acquisition interval of indeterminate length. The second write pulse, written with ACQMOD = 0, termi­nates acquisition and starts conversion on WR’s rising edge (Figure 6). However, if the second control byte contains ACQMOD = 1, an indefinite acquisition interval is restarted.
The address bits for the input mux must have the same values on the first and second write pulses. Power-down mode bits (PD0, PD1) can assume new values on the second write pulse (see
Power-Down Mode
section).
How to Read a Conversion
A standard interrupt signal, INT, is provided to allow the device to flag the µP when the conversion has ended and a valid result is available. INT goes low when con­version is complete and the output data is ready (Figures 5 and 6). It returns high on the first read cycle or if a new control byte is written.
t
t
CSRS
CSRH
=
CS
t
CSWS
WR
D7–D0
INT
RD
DOUT
Figure 5. Conversion Timing Using Internal Acquisition Mode
10 ______________________________________________________________________________________
t
t
DS
WR
CONTROL
BYTE
ACQMOD ="0"
t
ACQI
t
t
DH
CSWH
t
CONV
t
INT1
t
D0
DATA VALID
t
TR
HIGH-ZHIGH-Z
Multirange, Single +5V, 12-Bit DAS
with 12-Bit Bus Interface
MAX196/MAX198
t
CS
CS
t
CSWS
WR
D7–D0
INT
RD
DOUT
Figure 6. Conversion Timing Using External Acquisition Mode
t
DS
ACQMOD = "1"
t
WR
CONTROL
BYTE
t
t
CSHW
DH
t
ACQI
CONTROL
BYTE
ACQMOD = "0"
Clock Modes
The MAX196/MAX198 operate with either an internal or an external clock. Control bits (D6, D7) select either internal or external clock mode. Once the desired clock mode is selected, changing these bits to program power-down will not affect the clock mode. In each mode, internal or external acquisition can be used. At power-up, external clock mode is selected.
Internal Clock Mode
Select internal clock mode to free the µP from the burden of running the SAR conversion clock. To select this mode, write the control byte with D7 = 0 and D6 =
1. A 100pF capacitor between the CLK pin and ground sets this frequency to 1.56MHz nominal. Figure 7 shows a linear relationship between the internal clock period and the value of the external capacitor used.
External Clock Mode
Select external clock mode by writing the control byte with D7 = 0 and D6 = 0. Figure 8 shows CLK and WR timing relationships in internal and external acquisition modes, with an external clock. A 100kHz to 2.0MHz external clock with 45% to 55% duty cycle is required for proper operation. Operating at clock frequencies lower than 100kHz will cause a voltage droop across the hold capacitor, and subsequently degrade performance.
t
CSRS
t
CONV
t
INT1
t
D0
DATA VALID
2000
1500
1000
500
INTERNAL CLOCK PERIOD (ns)
0
0 50 250 350
100 150 200 300
CLOCK PIN CAPACITANCE (pF)
Figure 7. Internal Clock Period vs. Clock Pin Capacitance
t
CSRH
t
TR
______________________________________________________________________________________ 11
Multirange, Single +5V, 12-Bit DAS with 12-Bit Bus Interface
ACQUISITION STARTS
CLK
t
CWS
WR
WR GOES HIGH WHEN CLK IS HIGH
CLK
ACQMOD = "0"
t
CWH
ACQUISITION STARTS
MAX196/MAX198
WR
ACQMOD = "0"
Figure 8a. External Clock and WR Timing (Internal Acquisition Mode)
ACQUISITION STARTS
CLK
t
DH
WR
ACQMOD = "1"
ACQUISITION STARTS
WR GOES HIGH WHEN CLK IS LOW
WR GOES HIGH WHEN CLK IS HIGH
ACQUISITION ENDS
ACQUISITION ENDS
ACQUISITION ENDS
ACQUISITION ENDS
t
CWS
ACQMOD = "0"
CONVERSION STARTS
CONVERSION STARTS
CONVERSION STARTS
CONVERSION STARTS
CLK
t
t
DH
WR
ACQMOD = "1"
WR GOES HIGH WHEN CLK IS LOW
CWH
ACQMOD = "0"
Figure 8b. External Clock and WR Timing (External Acquisition Mode)
12 ______________________________________________________________________________________
Multirange, Single +5V, 12-Bit DAS
with 12-Bit Bus Interface
__________Applications Information
Power-On Reset
At power-up, the internal power-on reset circuitry sets INT high and puts the device in normal operation/exter­nal clock mode. This state is selected to keep the inter­nal clock from loading the external clock driver when the part is used in external clock mode.
Internal or External Reference
The MAX196/MAX198 can operate with either an inter­nal or external reference. An external reference can be connected to either the REF pin or the REFADJ pin (Figure 9).
To use the REF input directly, disable the internal buffer by tying REFADJ to VDD. Using the REFADJ input elimi­nates the need to buffer the reference externally. When the reference is applied at REFADJ, bypass REFADJ with a 0.01µF capacitor to AGND.
The REFADJ internal buffer gain is trimmed to 1.6384 to provide 4.096V at the REF pin from a 2.5V reference.
Internal Reference
The internally trimmed 2.50V reference is gained through the REFADJ buffer to provide 4.096V at REF. Bypass the REF pin with a 4.7µF capacitor to AGND and the REFADJ pin with a 0.01µF capacitor to AGND. The internal reference voltage is adjustable to ±1.5% (±65 LSBs) with the reference-adjust circuit of Figure 1.
External Reference
At REF and REFADJ, the input impedance is a mini­mum of 10kfor DC currents. During conversions, an external reference at REF must be able to deliver 400µA DC load currents, and must have an output impedance of 10or less. If the reference has higher output impedance or is noisy, bypass it close to the REF pin with a 4.7µF capacitor to AGND.
With an external reference voltage of less than 4.096V at the REF pin or less than 2.5V at the REFADJ pin, the increase in the ratio of the RMS noise to the LSB value (FS / 4096) results in performance degradation (loss of effective bits).
Power-Down Mode
To save power, you can put the converter into low­current shutdown mode between conversions. Two programmable power-down modes are available: STBYPD and FULLPD. Select STBYPD or FULLPD by programming PD0 and PD1 in the input control byte. When power-down is asserted, it becomes effective only after the end of conversion. In all power-down modes, the interface remains active and conversion
4.096V
REF
26
MAX196 MAX198
AV = 1.638
10k
2.5V
Figure 9a. Internal Reference
REF
MAX196 MAX198
A
= 1.638
V
10k
2.5V
Figure 9b. External Reference, Reference at REF
REF
MAX196 MAX198
A
= 1.638
V
10k
2.5V
Figure 9c. The external reference overdrives the internal refer­ence.
4.7µF C
REF
25REFADJ
0.01µF
26
25REFADJ
26
25REFADJ
4.096V
4.7µF C
REF
V
4.096V
DD
4.7µF C
REF
0.01µF
2.5V
MAX196/MAX198
______________________________________________________________________________________ 13
Multirange, Single +5V, 12-Bit DAS with 12-Bit Bus Interface
results may be read. Input overvoltage protection is active in all power-down modes. The device returns to normal operation on the first WR falling edge during write operation.
Choosing Power-Down Modes
The bandgap reference and reference buffer remain active in STBYPD mode, maintaining the voltage on the
4.7µF capacitor at the REF pin. This is a “DC” state that does not degrade after power-down of any duration. Therefore, you can use any sampling rate with this mode, without regard to start-up delays.
However, in FULLPD mode, only the bandgap refer­ence is active. Connect a 33µF capacitor between REF and AGND to maintain the reference voltage between conversions and to reduce transients when the buffer is
MAX196/MAX198
enabled and disabled. Throughput rates down to 1ksps can be achieved without allotting extra acquisition time for reference recovery prior to conversion. This allows conversion to begin immediately after power-down ends. If the discharge of the REF capacitor during FULLPD exceeds the desired limits for accuracy (less
OUTPUT CODE
11... 111
11... 110
11... 101
FULL-SCALE
TRANSITION
1 LSB =
4096
than a fraction of an LSB), run a STBYPD power-down cycle prior to starting conversions. Take into account that the reference buffer recharges the bypass capaci­tor at an 80mV/ms slew rate, and add 50µs for settling time. Throughput rates of 10ksps offer typical supply currents of 470µA, using the recommended 33µF capacitor value.
Auto-Shutdown
Selecting STBYPD on every conversion automatically shuts the MAX196/MAX198 down after each conversion without requiring any start-up time on the next conversion.
Transfer Function
Output data coding for the MAX196/MAX198 is binary in unipolar mode with 1LSB = (FS / 4096) and twos­complement binary in bipolar mode with 1LSB = [(2 x
) / 4096]. Code transitions occur halfway between
|FS|
successive-integer LSB values. Figures 10 and 11 show the input/output (I/O) transfer functions for unipo­lar and bipolar operations, respectively. For full-scale (FS) values, refer to Table 1.
FS
OUTPUT CODE
011... 111
011... 110
1 LSB =
2FS
4096
000... 001
000... 000
111... 111 
00... 011
00... 010
00... 001
00... 000 0
123
INPUT VOLTAGE (LSB)
Figure 10. Unipolar Transfer Function
14 ______________________________________________________________________________________
FS -
3
/2 LSB
FS
100... 010
100... 001
100... 000
-FS
Figure 11. Bipolar Transfer Function
0V +FS - 1 LSB
INPUT VOLTAGE (LSB)
Multirange, Single +5V, 12-Bit DAS
with 12-Bit Bus Interface
Careful printed circuit board layout is essential for best
Layout, Grounding, and Bypassing
system performance. For best performance, use a ground plane. To reduce crosstalk and noise injection, keep analog and digital signals separate. Digital ground lines can run between digital signal lines to minimize interference. Connect analog grounds and DGND in a star configuration to AGND. For noise-free operation, ensure the ground return from AGND to the supply ground is low impedance and as short as possi­ble. Connect the logic grounds directly to the supply ground. Bypass VDDwith 0.1µF and 4.7µF capacitors to AGND to minimize high- and low-frequency fluctua­tions. If the supply is excessively noisy, connect a 5 resistor between the supply and VDD, as shown in Figure 12.
+5V
R* = 5
* OPTIONAL ** CONNECT AGND AND DGND WITH A GROUND PLANE OR A SHORT TRACE
4.7µF
0.1µF
V
DD
Figure 12. Power-Supply Grounding Connection
MAX196 MAX198
SUPPLY
**
GND
+5V
DGNDAGND
DGND
DIGITAL
CIRCUITRY
_________________________________________________________Functional Diagram
REF REFADJ
CH5 CH4 CH3 CH2 CH1 CH0
CLK
WR
INT
10k
COMP
12
REGISTER
12
D0–D11
AV = 
1.638
SIGNAL
CONDITIONING
BLOCK
&
OVERVOLTAGE
TOLERANT
MUX
CLOCK
CS
RD
CONTROL LOGIC
&
LATCHES
T/H
CHARGE REDISTRIBUTION
12-BIT DAC
8
THREE-STATE, BIDIRECTIONAL
I/O INTERFACE
SUCCESSIVE-
APPROXIMATION
12-BIT DATA BUS
MAX196 MAX198
+2.5V
REFERENCE
V
DD
AGND DGND
MAX196/MAX198
______________________________________________________________________________________ 15
Multirange, Single +5V, 12-Bit DAS with 12-Bit Bus Interface
_Ordering Information (continued)
PIN-PACKAGETEMP. RANGEPART
Dice*0°C to +70°CMAX196BC/D MAX196AENI MAX196BENI
MAX198ACNI
-40°C to +85°C
-40°C to +85°CMAX196AEWI
MAX196/MAX198
MAX198ACWI
MAX198ACAI MAX198BCAI
MAX198AENI MAX198BENI
* Dice are specified at TA= +25°C, DC parameters only. ** Contact factory for availability and processing to MIL-STD-883.
0°C to +70°C 0°C to +70°CMAX198BCWI
0°C to +70°C 0°C to +70°CMAX198BC/D
-40°C to +85°C
-40°C to +85°CMAX198AEWI
28 Narrow Plastic DIP-40°C to +85°C
28 Narrow Plastic DIP
28 Wide SO
28 Wide SO-40°C to +85°CMAX196BEWI
28 SSOP-40°C to +85°CMAX196AEAI
28 SSOP-40°C to +85°CMAX196BEAI
28 Narrow Ceramic SB**-55°C to +125°CMAX196AMYI
28 Narrow Ceramic SB**-55°C to +125°CMAX196BMYI
28 Narrow Plastic DIP0°C to +70°C
28 Narrow Plastic DIP0°C to +70°CMAX198BCNI
28 Wide SO
28 Wide SO
28 SSOP0°C to +70°C
28 SSOP
Dice*
28 Narrow Plastic DIP-40°C to +85°C
28 Narrow Plastic DIP
28 Wide SO
28 Wide SO-40°C to +85°CMAX198BEWI
28 SSOP-40°C to +85°CMAX198AEAI
28 SSOP-40°C to +85°CMAX198BEAI
28 Narrow Ceramic SB**-55°C to +125°CMAX198AMYI
28 Narrow Ceramic SB**-55°C to +125°CMAX198BMYI
___________________Chip Topography
V
V
CLKD11
CS
D10
D9 D8
D7
D6 D5
D4
D3
D2
0.144"
(3.659mm)
TRANSISTOR COUNT: 2956 SUBSTRATE CONNECTED TO GND
DD
CH0
CC
WRDGND
RD INT REF
0.231"
(5.870mm)
REFADJ
CH5
CH4 CH3 CH2
CH1D0D1AGND
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
16
__________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 (408) 737-7600
© 1995 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.
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