The MAX196/MAX198 multirange, 12-bit data-acquisition systems (DAS) require only a single +5V supply for
operation, yet convert analog signals at their inputs up
to ±10V (MAX196) and ±4V (MAX198). These systems
provide six analog input channels that are independently software programmable for a variety of ranges:
±10V, ±5V, 0V to +10V, and 0V to +5V for the MAX196;
±V
, ±V
REF
/2, 0V to +V
REF
, and 0V to +V
REF
REF
/2 for
the MAX198. This range switching increases the effective dynamic range to 14 bits and provides the flexibility
to interface ±12V, ±15V, and 4mA to 20mA powered
sensors to a single +5V system. In addition, these converters are fault protected to ±16.5V; a fault condition
on any channel will not affect the conversion result of
the selected channel. Other features include a 5MHz
bandwidth track/hold, 100ksps throughput rate, software-selectable internal/external clock, internal/external
acquisition control, 12-bit parallel interface, and internal
4.096V or external reference.
Two programmable power-down modes (STBYPD,
FULLPD) provide low-current shutdown between conversions. In STBYPD mode, the reference buffer
remains active, eliminating start-up delays.
The MAX196/MAX198 employ a standard microprocessor (µP) interface. A three-state data I/O port is configured to operate with 16-bit data buses, and dataaccess and bus-release timing specifications are compatible with most popular µPs. All logic inputs and outputs are TTL/CMOS compatible.
These devices are available in 28-pin DIP, wide SO,
SSOP (55% smaller in area than wide SO), and ceramic
SB packages. For 8+4 bus interface, see the MAX197
and the MAX199 data sheets. An evaluation kit will be
available after December 1995 (MAX196EVKIT-DIP).
________________________Applications
Industrial-Control Systems
Robotics
Data-Acquisition Systems
Automatic Testing Systems
Medical Instruments
Telecommunications
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
= +70°C)
A
DD
DD
DD
DD
+ 0.3V)
+ 0.3V)
+ 0.3V)
+ 0.3V)
ELECTRICAL CHARACTERISTICS
(VDD= 5V ±5%; unipolar/bipolar range; external reference mode, V
with 50% duty cycle; T
MAX196/MAX198
ACCURACY (Note 1)
Offset Error
Channel-to-Channel Offset
Error Matching
Gain Error
(Note 2)
Gain Temperature Coefficient
(Note 2)
DYNAMIC SPECIFICATIONS (10kHz sine-wave input, ±10Vp-p (MAX196) or ±4.096Vp-p (MAX198), f
= T
to T
A
MIN
; unless otherwise noted. Typical values are at TA= +25°C.)
MAX
MAX196A/MAX198A
INLIntegral Nonlinearity
MAX196B/MAX198B
Unipolar
Bipolar
Unipolar
Bipolar
Unipolar
Bipolar
Unipolar
Bipolar
SINADSignal-to-Noise + Distortion Ratio
MAX196A/MAX198A
MAX196B/MAX198B69
Up to the 5th harmonic
(VDD= 5V ±5%; unipolar/bipolar range; external reference mode, V
with 50% duty cycle; T
PARAMETERSYMBOLMINTYPMAXUNITSCONDITIONS
DIGITAL OUTPUTS (D11–D0, INT)
Output Low VoltageV
Output High VoltageV
Three-State Output CapacitanceC
= T
to T
A
MIN
; unless otherwise noted. Typical values are at TA= +25°C.)
MAX
OL
OH
OUT
SINK
SOURCE
= 4.096V; 4.7µF at REF pin; external clock, f
REF
= 1.6mA
= 1mA
VDD- 1VVDD= 4.75V, I
CLK
0.4VVDD= 4.75V, I
15pF(Note 5)
= 2.0MHz
TIMING CHARACTERISTICS
(VDD= 5V ±5%; unipolar/bipolar range; external reference mode, V
with 50% duty cycle; T
PARAMETERSYMBOLMINTYPMAXUNITS
CS Pulse Widtht
WR Pulse Widtht
CS to WR Setup Time
CS to WR Hold Timet
CS to RD Setup Time
CS to RD Hold Timet
CLK to WR Setup Time
CLK to WR Hold Timet
Data Valid to WR Setup
Data Valid to WR Holdt
RD Low to Output Data Valid
RD High to Output Disable
RD Low to INT High Delay
Note 1: Accuracy specifications tested at VDD= 5.0V. Performance at power-supply tolerance limits guaranteed by Power-Supply
Note 2: External reference: V
Note 3: Ground “on” channel; sine wave applied to all “off” channels.
Note 4: Maximum full-power input frequency for 1LSB error with 10ns jitter = 3kHz.
Note 5: Guaranteed by design. Not tested.
Note 6: Use static loads only.
Note 7: Tested using internal reference.
Note 8: PSRR measured at full-scale.
Note 9: External acquisition timing: starts at data valid at ACQMOD = low control byte; ends at rising edge of WR
Note 10: Not subject to production testing. Provided for design guidance only.
Note 11: All input control signals specified with t
Note 12: t
Note 13: t
Rejection test. Tested for the ±10V (MAX196) and ±4.096V (MAX198) input ranges.
= high control byte.
is measured with the load circuits of Figure 2 and defined as the time required for an output to cross 0.8V or 2.4V.
DO
is defined as the time required for the data lines to change by 0.5V.
Clock Input. In external clock mode, drive CLK with a TTL/CMOS-compatible clock. In internal clock mode,
CLK1
REFADJ22
REF23
WR26
27
+5V
100k
24k
Figure 1. Reference-Adjust Circuit
D
OUT
3k
a) High-Z to V
Figure 2. Load Circuits for Enable Time
place a capacitor (C
with C
Chip Select, active lowCS2
Three-State Digital I/O, D11 = MSBD11–D03–14
Analog GroundAGND15
Analog Input ChannelsCH0–CH516–21
Bandgap Voltage-Reference Output/External Adjust Pin. Bypass with a 0.01µF capacitor to AGND. Connect
to VDDwhen using an external reference at the REF pin.
Reference Buffer Output/ADC Reference Input. In internal reference mode, the reference buffer provides a
4.096V nominal output, externally adjustable at REFADJ. In external reference mode, disable the internal
buffer by pulling REFADJ to VDD.
INT goes low when conversion is complete and output data is ready.INT24
If CS is low, a falling edge on RD will enable a read operation on the data bus.RD25
In the internal acquisition mode, when CSis low, a rising edge on WR latches in configuration data and starts an
acquisition plus a conversion cycle. In the external acquisition mode, when CSis low, the first rising edge on WR
starts an acquisition, and a second rising edge on WRends acquisition and starts a conversion cycle.
+5V Supply. Bypass with 0.1µF capacitor to AGND.V
DD
Digital GroundDGND28
510k
0.01µF
C
and VOL to V
OH
LOAD
OH
= 100pF.
CLK
REFADJ
D
b) High-Z to VOL and VOH to V
) from this pin to ground to set the internal clock frequency; f
CLK
MAX196
MAX198
+5V
3k
OUT
C
LOAD
OL
FUNCTIONNAME
= 1.56MHz typical
CLK
_______________Detailed Description
The MAX196/MAX198 multirange, fault-tolerant ADCs
use successive approximation and internal input
track/hold (T/H) circuitry to convert an analog signal to
a 12-bit digital output. The 12-bit parallel-output format
provides easy interface to microprocessors (µPs).
Figure 3 shows the MAX196/MAX198 in the simplest
operational configuration.
In the internal acquisition control mode (control bit D5
set to 0), the T/H enters its tracking mode on WR’s rising edge, and enters its hold mode when the internally
timed (6 clock cycles) acquisition interval ends. In bipolar mode and unipolar mode (MAX196 only), a lowimpedance input source, which settles in less than
1.5µs, is required to maintain conversion accuracy at
the maximum conversion rate.
When the MAX198 is configured for unipolar mode, the
input does not need to be driven from a low-impedance
source. The acquisition time (tAZ) is a function of the
source output resistance (RS), the channel input resistance (RIN), and the T/H capacitance.
Multirange, Single +5V, 12-Bit DAS
with 12-Bit Bus Interface
Acquisition time is calculated as follows:
For 0V to V
For 0V to V
: tAZ= 9 x (RS+ RIN) x 16pF
REF
/2: tAZ= 9 x (RS+ RIN) x 32pF
REF
where RIN= 7kΩ and tAZis never less than 2µs (0V to
V
range) or 3µs (0V to V
REF
/2 range).
REF
In the external acquisition control mode (D5 = 1), the
T/H enters its tracking mode on the first WR rising edge
and enters its hold mode when it detects the second
WR rising edge with D5 = 0 (see
R1 = 12.5kΩ (MAX196) OR 5.12kΩ (MAX198)
R2 = 8.67kΩ (MAX196) OR ∞ (MAX198)
Figure 4. Equivalent Input Circuit
DGND
V
REF
REFADJ
CH5
CH4
CH3
CH2
CH1
CH0
AGND
BIPOLAR
UNIPOLAR
OFF
ON
DD
INT
S3
TRACKHOLD
28
27
23
22
0.01µF0.01µF
24
21
20
19
18
17
16
15
C
HOLD
4.7µF4.7µF
OUTPUT STATUS
ANALOG
INPUTS
VOLTAGE
REFERENCE
S4
T/H
OUT
The ADC’s input tracking circuitry has a 5MHz small-
Input Bandwidth
signal bandwidth. When using the internal acquisition
mode with an external clock frequency of 2MHz, a
100ksps throughput rate can be achieved. It is possible
to digitize high-speed transient events and measure
periodic signals with bandwidths exceeding the ADC’s
sampling rate by using undersampling techniques. To
avoid high-frequency signals being aliased into the frequency band of interest, anti-alias filtering is recommended (MAX274/MAX275 continuous-time filters).
Input Range and Protection
Figure 4 shows the equivalent input circuit. The fullscale input voltage depends on the voltage at the refer-
+5V
ence (V
allows input voltage ranges of ±10V, ±5V, 0V to +10V,
). The MAX196 uses a scaling factor, which
REF
or 0V to +5V with a 4.096V voltage reference (Table 1).
Program the desired range by setting the appropriate
control bits (D3, D4) in the control byte (Tables 2 and
3). The MAX198 does not use a scaling factor, so its
input voltage range directly corresponds with the reference voltage. It can be programmed for input voltages
of ±V
REF
, ±V
/2, 0V to V
REF
, or 0V to V
REF
REF
/2 (Table
3). When an external reference is applied at REFADJ,
the voltage at REF is given by V
(2.4V < V
REF
< 4.18V).
= 1.6384 x V
REF
REFADJ
The input channels are overvoltage protected to
±16.5V. This protection is active even if the device is in
power-down mode.
Even with VDD= 0V, the input resistive network provides
current-limiting that adequately protects the device.
Digital Interface
Input data (control byte) and output data are multiplexed on a three-state parallel interface. This parallel
I/O can easily be interfaced with a µP. CS, WR, and RD
control the write and read operations. CS is the standard chip-select signal, which enables a µP to address
the MAX196/MAX198 as an I/O port. When high, it disables the WR and RD inputs and forces the interface
into a high-Z state.
Multirange, Single +5V, 12-Bit DAS
with 12-Bit Bus Interface
The control byte is latched into the device, on pins
Input Format
D7–D0, during a write cycle. Table 2 shows the controlbyte format.
Output Data Format
The output data format is binary in unipolar mode and
twos-complement binary in bipolar mode. When reading
the output data, CS and RD must be low.
How to Start a Conversion
Conversions are initiated with a write operation, which
selects the mux channel and configures the MAX196/
MAX198 for either a unipolar or bipolar input range. A
write pulse (WR + CS) can either start an acquisition interval or initiate a combined acquisition plus conversion. The
sampling interval occurs at the end of the acquisition
MAX196/MAX198
interval. The ACQMOD bit in the input control byte offers
two options for acquiring the signal: internal or external.
The conversion period lasts for 12 clock cycles in either
internal or external clock or acquisition mode.
Writing a new control byte during a conversion cycle will
abort the conversion and start a new acquisition interval.
Internal Acquisition
Select internal acquisition by writing the control byte with
the ACQMOD bit cleared (ACQMOD = 0). This causes
the write pulse to initiate an acquisition interval whose
t
CS
duration is internally timed. Conversion starts when this
six-clock-cycle acquisition interval (3µs with f
CLK
2MHz) ends (see Figure 5).
External Acquisition
Use the external acquisition timing mode for precise control of the sampling aperture and/or independent control
of acquisition and conversion times. The user controls
acquisition and start-of-conversion with two separate
write pulses. The first pulse, written with ACQMOD = 1,
starts an acquisition interval of indeterminate length. The
second write pulse, written with ACQMOD = 0, terminates acquisition and starts conversion on WR’s rising
edge (Figure 6). However, if the second control byte
contains ACQMOD = 1, an indefinite acquisition interval
is restarted.
The address bits for the input mux must have the same
values on the first and second write pulses. Power-down
mode bits (PD0, PD1) can assume new values on the
second write pulse (see
Power-Down Mode
section).
How to Read a Conversion
A standard interrupt signal, INT, is provided to allow the
device to flag the µP when the conversion has ended
and a valid result is available. INT goes low when conversion is complete and the output data is ready
(Figures 5 and 6). It returns high on the first read cycle
or if a new control byte is written.
t
t
CSRS
CSRH
=
CS
t
CSWS
WR
D7–D0
INT
RD
DOUT
Figure 5. Conversion Timing Using Internal Acquisition Mode
Figure 6. Conversion Timing Using External Acquisition Mode
t
DS
ACQMOD = "1"
t
WR
CONTROL
BYTE
t
t
CSHW
DH
t
ACQI
CONTROL
BYTE
ACQMOD = "0"
Clock Modes
The MAX196/MAX198 operate with either an internal or
an external clock. Control bits (D6, D7) select either
internal or external clock mode. Once the desired clock
mode is selected, changing these bits to program
power-down will not affect the clock mode. In each
mode, internal or external acquisition can be used. At
power-up, external clock mode is selected.
Internal Clock Mode
Select internal clock mode to free the µP from the
burden of running the SAR conversion clock. To select
this mode, write the control byte with D7 = 0 and D6 =
1. A 100pF capacitor between the CLK pin and ground
sets this frequency to 1.56MHz nominal. Figure 7
shows a linear relationship between the internal clock
period and the value of the external capacitor used.
External Clock Mode
Select external clock mode by writing the control byte
with D7 = 0 and D6 = 0. Figure 8 shows CLK and WR
timing relationships in internal and external acquisition
modes, with an external clock. A 100kHz to 2.0MHz
external clock with 45% to 55% duty cycle is required for
proper operation. Operating at clock frequencies lower
than 100kHz will cause a voltage droop across the hold
capacitor, and subsequently degrade performance.
t
CSRS
t
CONV
t
INT1
t
D0
DATA VALID
2000
1500
1000
500
INTERNAL CLOCK PERIOD (ns)
0
0 50250350
100 150 200300
CLOCK PIN CAPACITANCE (pF)
Figure 7. Internal Clock Period vs. Clock Pin Capacitance
At power-up, the internal power-on reset circuitry sets
INT high and puts the device in normal operation/external clock mode. This state is selected to keep the internal clock from loading the external clock driver when
the part is used in external clock mode.
Internal or External Reference
The MAX196/MAX198 can operate with either an internal or external reference. An external reference can be
connected to either the REF pin or the REFADJ pin
(Figure 9).
To use the REF input directly, disable the internal buffer
by tying REFADJ to VDD. Using the REFADJ input eliminates the need to buffer the reference externally. When
the reference is applied at REFADJ, bypass REFADJ with
a 0.01µF capacitor to AGND.
The REFADJ internal buffer gain is trimmed to 1.6384 to
provide 4.096V at the REF pin from a 2.5V reference.
Internal Reference
The internally trimmed 2.50V reference is gained
through the REFADJ buffer to provide 4.096V at REF.
Bypass the REF pin with a 4.7µF capacitor to AGND
and the REFADJ pin with a 0.01µF capacitor to AGND.
The internal reference voltage is adjustable to ±1.5%
(±65 LSBs) with the reference-adjust circuit of Figure 1.
External Reference
At REF and REFADJ, the input impedance is a minimum of 10kΩ for DC currents. During conversions, an
external reference at REF must be able to deliver
400µA DC load currents, and must have an output
impedance of 10Ω or less. If the reference has higher
output impedance or is noisy, bypass it close to the
REF pin with a 4.7µF capacitor to AGND.
With an external reference voltage of less than 4.096V
at the REF pin or less than 2.5V at the REFADJ pin, the
increase in the ratio of the RMS noise to the LSB value
(FS / 4096) results in performance degradation (loss of
effective bits).
Power-Down Mode
To save power, you can put the converter into lowcurrent shutdown mode between conversions. Two
programmable power-down modes are available:
STBYPD and FULLPD. Select STBYPD or FULLPD by
programming PD0 and PD1 in the input control byte.
When power-down is asserted, it becomes effective
only after the end of conversion. In all power-down
modes, the interface remains active and conversion
4.096V
REF
26
MAX196
MAX198
AV = 1.638
10k
2.5V
Figure 9a. Internal Reference
REF
MAX196
MAX198
A
= 1.638
V
10k
2.5V
Figure 9b. External Reference, Reference at REF
REF
MAX196
MAX198
A
= 1.638
V
10k
2.5V
Figure 9c. The external reference overdrives the internal reference.
Multirange, Single +5V, 12-Bit DAS
with 12-Bit Bus Interface
results may be read. Input overvoltage protection is
active in all power-down modes. The device returns to
normal operation on the first WR falling edge during
write operation.
Choosing Power-Down Modes
The bandgap reference and reference buffer remain
active in STBYPD mode, maintaining the voltage on the
4.7µF capacitor at the REF pin. This is a “DC” state that
does not degrade after power-down of any duration.
Therefore, you can use any sampling rate with this
mode, without regard to start-up delays.
However, in FULLPD mode, only the bandgap reference is active. Connect a 33µF capacitor between REF
and AGND to maintain the reference voltage between
conversions and to reduce transients when the buffer is
MAX196/MAX198
enabled and disabled. Throughput rates down to 1ksps
can be achieved without allotting extra acquisition time
for reference recovery prior to conversion. This allows
conversion to begin immediately after power-down
ends. If the discharge of the REF capacitor during
FULLPD exceeds the desired limits for accuracy (less
OUTPUT CODE
11... 111
11... 110
11... 101
FULL-SCALE
TRANSITION
1 LSB =
4096
than a fraction of an LSB), run a STBYPD power-down
cycle prior to starting conversions. Take into account
that the reference buffer recharges the bypass capacitor at an 80mV/ms slew rate, and add 50µs for settling
time. Throughput rates of 10ksps offer typical supply
currents of 470µA, using the recommended 33µF
capacitor value.
Auto-Shutdown
Selecting STBYPD on every conversion automatically
shuts the MAX196/MAX198 down after each conversion
without requiring any start-up time on the next conversion.
Transfer Function
Output data coding for the MAX196/MAX198 is binary
in unipolar mode with 1LSB = (FS / 4096) and twoscomplement binary in bipolar mode with 1LSB = [(2 x
) / 4096]. Code transitions occur halfway between
|FS|
successive-integer LSB values. Figures 10 and 11
show the input/output (I/O) transfer functions for unipolar and bipolar operations, respectively. For full-scale
(FS) values, refer to Table 1.
Careful printed circuit board layout is essential for best
Layout, Grounding, and Bypassing
system performance. For best performance, use a
ground plane. To reduce crosstalk and noise injection,
keep analog and digital signals separate. Digital
ground lines can run between digital signal lines to
minimize interference. Connect analog grounds and
DGND in a star configuration to AGND. For noise-free
operation, ensure the ground return from AGND to the
supply ground is low impedance and as short as possible. Connect the logic grounds directly to the supply
ground. Bypass VDDwith 0.1µF and 4.7µF capacitors
to AGND to minimize high- and low-frequency fluctuations. If the supply is excessively noisy, connect a 5Ω
resistor between the supply and VDD, as shown in
Figure 12.
+5V
R* = 5Ω
* OPTIONAL
** CONNECT AGND AND DGND WITH A GROUND PLANE OR A SHORT TRACE
Multirange, Single +5V, 12-Bit DAS
with 12-Bit Bus Interface
_Ordering Information (continued)
PIN-PACKAGETEMP. RANGEPART
Dice*0°C to +70°CMAX196BC/D
MAX196AENI
MAX196BENI
MAX198ACNI
-40°C to +85°C
-40°C to +85°CMAX196AEWI
MAX196/MAX198
MAX198ACWI
MAX198ACAI
MAX198BCAI
MAX198AENI
MAX198BENI
* Dice are specified at TA= +25°C, DC parameters only.
** Contact factory for availability and processing to MIL-STD-883.
0°C to +70°C
0°C to +70°CMAX198BCWI
0°C to +70°C
0°C to +70°CMAX198BC/D
-40°C to +85°C
-40°C to +85°CMAX198AEWI
28 Narrow Plastic DIP-40°C to +85°C
28 Narrow Plastic DIP
28 Wide SO
28 Wide SO-40°C to +85°CMAX196BEWI
28 SSOP-40°C to +85°CMAX196AEAI
28 SSOP-40°C to +85°CMAX196BEAI
28 Narrow Ceramic SB**-55°C to +125°CMAX196AMYI
28 Narrow Ceramic SB**-55°C to +125°CMAX196BMYI
28 Narrow Plastic DIP0°C to +70°C
28 Narrow Plastic DIP0°C to +70°CMAX198BCNI
28 Wide SO
28 Wide SO
28 SSOP0°C to +70°C
28 SSOP
Dice*
28 Narrow Plastic DIP-40°C to +85°C
28 Narrow Plastic DIP
28 Wide SO
28 Wide SO-40°C to +85°CMAX198BEWI
28 SSOP-40°C to +85°CMAX198AEAI
28 SSOP-40°C to +85°CMAX198BEAI
28 Narrow Ceramic SB**-55°C to +125°CMAX198AMYI
28 Narrow Ceramic SB**-55°C to +125°CMAX198BMYI
___________________Chip Topography
V
V
CLKD11
CS
D10
D9
D8
D7
D6
D5
D4
D3
D2
0.144"
(3.659mm)
TRANSISTOR COUNT: 2956
SUBSTRATE CONNECTED TO GND
DD
CH0
CC
WRDGND
RD
INT
REF
0.231"
(5.870mm)
REFADJ
CH5
CH4
CH3
CH2
CH1D0D1AGND
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
16
__________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 (408) 737-7600