MAXIM MAX1954A Technical data

General Description
The MAX1954A synchronous current-mode, pulse­width modulation (PWM) buck controller is pin compati­ble with the popular MAX1954 and is suitable for applications where cost and size are critical.
The MAX1954A operates from an input voltage range of
3.0V to 13.2V, independent of the IC supply. The output voltage is adjustable down to 0.8V. The IC operates at a fixed 300kHz switching frequency and provides up to 25A of output current with efficiency up to 95%. This controller has excellent transient response resulting in smaller output capacitance.
The MAX1954A features foldback current limiting that greatly reduces input current and component power dissipation during output overload or short-circuit conditions.
The compensation and shutdown control (COMP) input, in addition to providing compensation to the error amplifier, can be pulled low to shut down the converter. An input undervoltage lockout is provided to ensure proper operation during power sags to prevent the external power MOSFETs from overheating. Internal digital soft-start is included to reduce inrush current and save an external capacitor.
The MAX1954A is available in a tiny 10-pin µMAX
®
package to minimize PC board space.
Applications
Printers and Scanners
Graphic Cards and Video Cards
PCs and Servers
Microprocessor Cores
Low-Voltage Distributed Power
Telecom/Networks
Features
Current-Mode Controller
Fixed-Frequency PWM
Foldback Current LimitOutput Down to 0.8V with ±1% FB Accuracy
3.0V to 13.2V Input Voltage
300kHz Switching Frequency
25A Output-Current Capability
93% Efficiency
All-N-Channel-MOSFET Design for Low Cost
No Current-Sense Resistor Needed
Internal Digital Soft-Start
Small 10-Pin µMAX Package
MAX1954A
Low-Cost, Current-Mode PWM Buck
Controller with Foldback Current Limit
________________________________________________________________ Maxim Integrated Products 1
Pin Configuration
19-3154; Rev 1; 5/05
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
Ordering Information
EVALUATION KIT
AVAILABLE
µMAX is a registered trademark of Maxim Integrated Products, Inc.
+Denotes lead-free package.
PART TEMP RANGE PIN-PACKAGE
MAX1954AEUB -40°C to +85°C 10 µMAX MAX1954AEUB+ -40°C to +85°C 10 µMAX
TOP VIEW
HSD
COMP
1
2
MAX1954A
3
FB
4
5
µMAX
10
BST
9
LX
8
DH
7
PGNDGND
DLIN
6
MAX1954A
Low-Cost, Current-Mode PWM Buck Controller with Foldback Current Limit
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
IN, FB to GND...........................................................-0.3V to +6V
LX to BST..................................................................-6V to +0.3V
BST to GND ............................................................-0.3V to +20V
DH to LX................................................... -0.3V to (V
BST
+ 0.3V)
DL, COMP to GND.......................................-0.3V to (V
IN
+ 0.3V)
HSD to GND..............................................................-0.3V to 14V
PGND to GND .......................................................-0.3V to +0.3V
Continuous Power Dissipation (T
A
= +70°C)
10-Pin µMAX (derate 5.6mW/°C above +70°C) ...........444mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range............................+65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
ELECTRICAL CHARACTERISTICS
(V
IN
= 5V, V
BST
- V
LX
= 5V, TA= 0°C to +85°C, unless otherwise noted.)
PARAMETER CONDITIONS
UNITS
GENERAL
Operating Input Voltage Range
3.0 5.5 V
HSD Voltage Range (Note 1) 3.0
V
Quiescent Supply Current V
FB
= 1.5V 1 2
mA
Standby Supply Current
V
IN
= V
BST
= 5.5V, V
HSD
= 13.2V, LX = unconnected,
COMP = GND
2
mA
Undervoltage-Lockout Trip Level
Falling V
IN
, 50mV (typ) hysteresis 2.5 2.7 2.9 V
DC-DC CONTROLLER Output-Voltage Adjust Range
(V
OUT
)
Maximum output voltage depends on external components
and maximum duty cycle
0.8 V
ERROR AMPLIFIER FB Regulation Voltage
%
Transconductance 70
µS
Voltage Gain
V/ V
FB Input Leakage Current V
FB
= 0.9V 50
NA
FB Input Common-Mode Range
V
COMP Output-Voltage Swing
V
Current-Sense Amplifier
Voltage Gain
3.5
V / V
V
FB
= 0.8V
Current-Limit Threshold V
PGND
- V
LX
V
FB
= 0V 21 36 51
mV
OSCILLATOR Switching Frequency MAX1954A
kHz
Maximum Duty Cycle Measured at DH 89 91 93 % Minimum Duty Cycle V
COMP
= 1.25V, LX = GND, V
BST
= V
IN
= 3.3V 2.5 3 %
MIN TYP MAX
13.2
-1.0 +0.8 +1.0 110 160 200
500
-0.1
0.80
3.15
+1.5
2.36
3.85
110 135 145
240 300 360
MAX1954A
Low-Cost, Current-Mode PWM Buck
Controller with Foldback Current Limit
_______________________________________________________________________________________ 3
ELECTRICAL CHARACTERISTICS (continued)
(V
IN
= 5V, V
BST
- V
LX
= 5V, TA= 0°C to +85°C, unless otherwise noted.)
PARAMETER CONDITIONS
MIN
TYP
MAX
UNITS
SOFT-START Soft-Start Period 3.4 ms Soft-Start Levels
mV FET DRIVERS DH, DL Output Low Voltage I
SINK
= 10mA 0.1 V
DH, DL Output High Voltage I
SOURCE
= 10mA
V
IN
- 0.1V or
V
DH Pullup/Pulldown, DL Pullup On-Resistance
1.5 3
DL Pulldown On-Resistance 1 2 LX, BST, HSD Leakage Current V
BST
= 18.7V, VLX = 13.2V, VIN = 5.5V, V
HSD
= 13.2V 30 µA
THERMAL PROTECTION Thermal Shutdown Rising temperature, 15°C hysteresis
°C SHUTDOWN CONTROL COMP Logic-Level Low 3V < V
IN
< 5.5V
V
COMP Logic-Level High 3V < V
IN
< 5.5V 0.8 V
COMP Pullup Current
µA
ELECTRICAL CHARACTERISTICS
(V
IN
= 5V, V
BST
- V
LX
= 5V, TA= -40°C to +85°C, unless otherwise noted.) (Note 2)
PARAMETER CONDITIONS
UNITS
GENERAL
3.0 5.5 V
HSD Voltage Range (Note 1) 3.0
V
Quiescent Supply Current V
FB
= 1.5V 2
mA
Standby Supply Current
V
IN
= V
BST
= 5.5V, V
HSD
= 13.2V, LX = unconnected,
COMP = GND
2
mA
Rising V
IN
3% (typ) hysteresis
V
DC-DC CONTROLLER Output-Voltage Adjust Range
(V
OUT
)
0.8
V
ERROR AMPLIFIER FB Regulation Voltage
%
Transconductance 70
µS
FB Input Leakage Current V
FB
= 0.9V
NA
V
COMP Output-Voltage Swing 0.8 2.2 V
V
BS T
- 0.1V
12.5
+160
0.25
100
MIN
MAX
Operating Input Voltage Range
13.2
Undervoltage Lockout Trip Level
FB Input Common-Mode Range
2.50
2.93
0.9 x V
IN
-2.5
-0.1
+1.0
160 500
+1.5
MAX1954A
Low-Cost, Current-Mode PWM Buck Controller with Foldback Current Limit
4 _______________________________________________________________________________________
Note 1: HSD and IN are externally connected for applications where HSD < 5.5V. Note 2: Specifications to -40°C are guaranteed by design and not production tested.
ELECTRICAL CHARACTERISTICS (continued)
(V
IN
= 5V, V
BST
- V
LX
= 5V, TA= -40°C to +85°C, unless otherwise noted.) (Note 2)
PARAMETER CONDITIONS
UNITS
Current-Sense Amplifier
Voltage Gain
V/V
V
FB
= 0.8V
Current-Limit Threshold V
PGND
- V
LX
, MAX1954A
V
FB
= 0V 21 51
mV
OSCILLATOR Switching Frequency
kHz
Maximum Duty Cycle Measured at DH 89 93 % Minimum Duty Cycle V
COMP
= 1.25V, LX = GND, V
BST
= V
IN
= 3.3V 3 %
FET DRIVERS DH, DL Output Low Voltage I
SINK
= 10mA 0.1 V
DH, DL Output High Voltage I
SOURCE
= 10mA
V
IN
- 0.1V or
V
DH Pullup/Pulldown, DL Pullup On-Resistance
3
DL Pulldown On-Resistance 2 LX, BST, HSD Leakage Current V
BST
= 18.7V, VLX = 13.2V, VIN = 5.5V, V
HSD
= 13.2V 30 µA
SHUTDOWN CONTROL COMP Logic-Level Low 3V < V
IN
< 5.5V
V
COMP Logic-Level High 3V < V
IN
< 5.5V 0.8 V
COMP Pullup Current
µA
MIN
MAX
V
3.15
110
240
BS T
- 0.1V
3.85
145
360
0.25
100
MAX1954A
Low-Cost, Current-Mode PWM Buck
Controller with Foldback Current Limit
_______________________________________________________________________________________ 5
Typical Operating Characteristics
(TA = +25°C, unless otherwise noted.)
EFFICIENCY
vs. LOAD CURRENT
MAX1954A toc01
LOAD CURRENT (A)
EFFICIENCY (%)
100
40
50
60
70
80
90
0.1 1 10
V
OUT
= 2.5V
VIN = V
HSD
= 5V
V
OUT
= 1.5V
2.60
2.55
2.50
2.45
2.40 021 345
OUTPUT VOLTAGE
vs. LOAD CURRENT
MAX1954A toc02
LOAD CURRENT (A)
OUTPUT VOLTAGE (V)
VIN = V
HSD
= 5V
-70
-30
-50
10
-10
50
30
70
3.0 4.03.5 4.5 5.0 5.5
OUTPUT VOLTAGE CHANGE
vs. INPUT VOLTAGE
MAX1954A toc03
INPUT VOLTAGE (V)
CHANGE IN OUTPUT VOLTAGE (mV)
V
OUT
= 2.5V
V
OUT
= 0.8V
VIN = V
HSD
I
OUT
= 5A
0.81
0.81
0.80
0.80
0.79
10.8 12.011.4 12.6 13.2
OUTPUT VOLTAGE
vs. INPUT VOLTAGE
MAX1954A toc04
INPUT VOLTAGE (V)
OUTPUT VOLTAGE (V)
VIN = V
HSD
I
OUT
= 5A
250
270
310
290
330
350
3.0 4.03.5 4.5 5.0 5.5
OSCILLATOR FREQUENCY
vs. INPUT VOLTAGE
MAX1954A toc05
INPUT VOLTAGE (V)
OSCILLATOR FREQUENCY (kHz)
TA = -40°C
TA = +85°C
TA = +25°C
VIN = V
HSD
LOAD TRANSIENT
MAX1954A toc06
40µs/div
100mV/div
V
OUT
AC-COUPLED
I
OUT
5A/µs
5A
500mA
MAX1954A
Low-Cost, Current-Mode PWM Buck Controller with Foldback Current Limit
6 _______________________________________________________________________________________
Typical Operating Characteristics (continued)
(TA = +25°C, unless otherwise noted.)
LOAD TRANSIENT
MAX1954A toc07
40µs/div
100mV/div
V
OUT
AC-COUPLED
I
OUT
5A/µs
5A
2.5A
NO-LOAD SWITCHING WAVEFORMS
MAX1954A toc08
2µs/div
2A/div
I
L
DH
LX
DL
5V/div
10V/div
5V/div
HEAVY-LOAD SWITCHING WAVEFORMS
I
LOAD
= 5A
MAX1954A toc09
2µs/div
2A/div
I
L
DH
LX
DL
5V/div
10V/div
5V/div
SHORT CIRCUIT AND RECOVERY
MAX1954A toc11
200µs/div
1V/div
V
OUT
V
IN
I
LX
5A/div
2V/div
I
IN
2A/div
POWER-UP/POWER-DOWN WAVEFORMS
MAX1954A toc10
4ms/div
5V/div
V
IN
V
OUT
I
LX
5A/div
2V/div
STARTUP INTO PREBIASED OUTPUT
(OUTPUT PREBIASED AT ~1.7V)
MAX1954A toc12
2ms/div
1V/div
V
OUT
V
IN
DL
5V/div
5V/div
DH
5V/div
MAX1954A
Low-Cost, Current-Mode PWM Buck
Controller with Foldback Current Limit
_______________________________________________________________________________________ 7
Detailed Description
The MAX1954A single-output, current-mode, PWM, step­down DC-DC controller features foldback current limit and switches at 300kHz for high efficiency. The MAX1954A is designed to drive a pair of external N­channel power MOSFETs in a synchronous buck topolo­gy to improve efficiency and cost compared with a P-channel power-MOSFET topology. The on-resistance of the low-side MOSFET is used for short-circuit current­limit sensing, while the high-side MOSFET’s on-resis­tance is used for current-mode feedback, thus eliminating the need for current-sense resistors. The short-circuit current limit is fixed at 135mV. The foldback current scheme reduces the input current during short­circuit and severe-overload conditions. The MAX1954A is configured with a high-side drain input (HSD) allowing an extended input voltage range of 3V to 13.2V that is independent of the IC input supply (Figure 1).
DC-DC Converter Control Architecture
The MAX1954A step-down converter uses a PWM, cur­rent-mode control scheme. An internal transconductance amplifier establishes an integrated error voltage. An open-loop comparator compares the integrated voltage­feedback signal against the amplified current-sense sig­nal plus the slope compensation ramp, which is summed into the main PWM comparator to preserve inner-loop sta­bility and eliminate inductor staircasing. At each rising edge of the internal clock, the high-side MOSFET turns on until the PWM comparator trips or the maximum duty cycle is reached. During this on-time, current ramps up through the inductor, storing energy in a magnetic field and sourcing current to the output. The current-mode feedback system regulates the peak inductor current as a function of the output-voltage error signal. The circuit acts as a switch-mode transconductance amplifier because the average inductor current is close to the peak inductor current (assuming the inductor is large enough to provide a reasonably small ripple current). This pushes the output inductance-capacitance filter pole normally found in a voltage-mode PWM to a higher frequency.
Pin Description
PIN NAME FUNCTION
1 HSD
High-Side Drain Current-Sense Input. HSD senses the voltage at the drain of the high-side, N-channel MOSFET.
Connect to the high-side MOSFET drain using a Kelvin connection.
Compensation and Shutdown Control Pin. Connect appropriate RC networks to compensate the control loop.
2 COMP
3 FB
Pull to GND to shut down the IC. See the Compensation Design section for instructions on calculating the RC values.
Feedback Input. Regulates at V GND to set the output voltage.
= 0.8V. Connect FB to the center tap of a resistor-divider from the output to
FB
4 GND Ground
5 IN
6 DL
IC Supply Voltage. Provides power for the IC. Connect to a 3V to 5.5V power supply. Bypass to GND with a
0.22µF ceramic capacitor and to PGND with a 1µF ceramic capacitor.
Low-Side Gate-Drive Output. Drives the synchronous-rectifier MOSFET. Swings from 0 to V shutdown and UVLO.
7 PGND Power Ground
8 DH
9 LX
10 BST
High-Side Gate-Drive Output. Drives the high-side N-channel MOSFET. DH is a floating driver output that swings
to V
from V
LX
. DH is low in shutdown and UVLO.
BST
Controller Current-Sense Input. Connect LX to the junction of the MOSFETs and inductor. LX is the reference
point for the current limit.
High-Side MOSFET Supply Input. Connect a 0.1µF ceramic capacitor from BST to LX to supply the necessary gate drive for the high-side N-channel MOSFET.
. DL is low in
IN
MAX1954A
Low-Cost, Current-Mode PWM Buck Controller with Foldback Current Limit
8 _______________________________________________________________________________________
During the second half of the cycle, the high-side MOSFET turns off and the low-side MOSFET turns on. The inductor releases the stored energy as the current ramps down, providing current to the output. The output capaci­tor stores charge when the inductor current exceeds the required load current and discharges when the inductor current is lower, smoothing the voltage across the load. Under overload conditions, when the inductor current exceeds the current limit (see the Current-Limit Circuit section), the high-side MOSFET is not turned on at the ris­ing clock edge and the low-side MOSFET remains on to let the inductor current ramp down.
The MAX1954A operates in a forced-PWM mode; there­fore, the controller maintains a constant switching fre­quency, regardless of load, to allow for easier post­filtering of the switching noise.
Current-Sense Amplifier
The current-sense circuit amplifies the current-sense voltage (the high-side MOSFET’s on-resistance (R
DS(ON)
) multiplied by the inductor current). This ampli­fied current-sense signal and the internal slope-compen­sation signal are summed (V
SUM
) together and fed into the PWM comparator’s inverting input. The PWM com­parator shuts off the high-side MOSFET when V
SUM
exceeds the integrated feedback voltage (V
COMP
).
Functional Diagram
IN
COMP
FB
SHUTDOWN
COMPARATOR
0.5V
2.36V CLAMP
ERROR
AMPLIFIER
REFERENCE
AND
SOFT-START
DIGITAL-TO-ANALOG
CONVERTER
THERMAL
LIMIT
SLOPE
COMPENSATION
CLOCK
PWM
CONTROL
CIRCUITRY
UVLO
SHORT-CIRCUIT CURRENT-LIMIT
CIRCUITRY
CURRENT-
SENSE
CIRCUITRY
CURRENT-LIMIT
COMPARATOR
MAX1954A
HSD
BST
DH
LX
IN
DL
PGND
FOLDBACK CURRENT-
LIMIT CIRCUITRY
GND
MAX1954A
Low-Cost, Current-Mode PWM Buck
Controller with Foldback Current Limit
_______________________________________________________________________________________ 9
Place the high-side MOSFET as close as possible to the controller and connect HSD and LX to the MOSFET using Kelvin-sense connections to guarantee current­sense accuracy and improve stability.
Current-Limit Circuit
The current-limit circuit employs a lossless, foldback, valley current-limiting algorithm that uses the low-side MOSFET’s on-resistance as the sensing element. Once
the high-side MOSFET turns off, the voltage across the low-side MOSFET is monitored. If the voltage across the low-side MOSFET (R
DS(ON)
x I
INDUCTOR
) does not exceed the current limit, the high-side MOSFET turns on normally. In this condition, the output drops smoothly out of regulation. If the voltage across the low-side MOSFET exceeds the current-limit threshold at the beginning of a new oscillator cycle, the low-side MOSFET remains on and the high-side MOSFET remains off.
Typical Application Circuits
Figure 1. MAX1954A Typical Application Circuit
Figure 2. MAX1954A Circuit Capable of 20A Output
V
3V TO 5.5V
V
HSD
5.5V TO 13.2V
C
C
IN
C1 C2
HSD
R
C
COMP
C
F
GND
V
IN
3V TO 5.5V
0.22µF
C1
C15
HSD
IN
BST
DH
MAX1954A
560pF
R
C
270k
C
C
15pF
COMP
C
F
GND
LX
DL
PGND
FB
IN
MAX1954A
D1
N1
C7
0.1µF
N3 N4
BST
PGND
C3
D1
N1
DH
C4
LX
DL
FB
N2
R3
C14
R3
C6
L1
0.8µH
L1
C2–C6
10µF
10k
8.06k
V
OUT
C8–C13
270µF
1.8V
V
OUT
+1.8V AT 20A
R1
R2
R1
R2
C5
V
HSD
10.8V TO 13.2V
MAX1954A
Low-Cost, Current-Mode PWM Buck Controller with Foldback Current Limit
10 ______________________________________________________________________________________
When the output is shorted, the foldback current limit reduces the current-limit threshold linearly to 20% of the nominal value to reduce the power dissipation of components and the input current. Once the voltage across the low-side MOSFET drops below the current­limit threshold, the high-side MOSFET is turned on at the next clock cycle. During severe-overload and short­circuit conditions, the frequency of the MAX1954A appears to decrease because the on-time of the low-side MOSFET extends beyond a clock cycle. The current-limit threshold is preset to 135mV.
In addition to the valley current limit, the MAX1954A also features a cycle-by-cycle peak-current clamp that limits the voltage across the high-side MOSFET by ter­minating its on-time. This, together with the valley fold­back current limit, provides a very robust overload and short-circuit protection.
Synchronous-Rectifier Driver (DL)
Synchronous rectification reduces conduction losses in the rectifier by replacing the normal Schottky catch diode with a low-resistance MOSFET switch. The MAX1954A also uses the synchronous rectifier to ensure proper startup of the boost gate-driver circuit and to provide the current-limit signal. The DL low-side wave­form is always the complement of the DH high-side drive waveform (with controlled dead time to prevent crossconduction or shoot-through). A dead-time circuit monitors the DL output and prevents the high-side MOSFET from turning on until DL is fully off. For the dead-time circuit to work properly, there must be a low­resistance, low-inductance path from the DL driver to the MOSFET gate. Otherwise, the sense circuitry in the MAX1954A interprets the MOSFET gate as off although gate charge actually remains. Use very short, wide traces (50 mils to 100 mils wide if the MOSFET is 1in from the device). The dead time at the other edge (DH turning off) is also determined through gate sensing.
High-Side Gate-Drive Supply (BST)
Gate-drive voltage for the high-side, N-channel switch is generated by a flying-capacitor boost circuit (Figure
3). The capacitor between BST and LX is charged from the VINsupply up to VINminus the diode drop while the low-side MOSFET is on. When the low-side MOSFET is switched off, the stored voltage of the capacitor is stacked above LX to provide the necessary turn-on voltage (VGS) for the high-side MOSFET. The controller then closes an internal switch between BST and DH to turn the high-side MOSFET on.
Undervoltage Lockout (UVLO)
If VINdrops below 2.7V, the MAX1954A assumes that the supply voltage is too low for proper circuit opera­tion, so the UVLO circuitry inhibits switching and forces the DL and DH gate drivers low. After V
IN
rises above
2.7V, the controller goes into the startup sequence and resumes normal operation.
Startup
The MAX1954A begins switching when VINrises above the UVLO threshold. However, the controller is not enabled unless five conditions are met:
1) VINexceeds the 2.7V UVLO threshold.
2) The internal reference exceeds 92% of its nominal
value (V
REF
> 1V).
3) The internal bias circuitry powers up.
4) The thermal-overload limit is not exceeded.
5) The feedback voltage is below the regulation
threshold.
If these conditions are met, the step-down controller enables soft-start and begins switching. The soft-start cir­cuitry gradually ramps up the output voltage until the volt­age at FB is equal to the reference voltage. This controls the rate of rise of the output voltage and reduces input surge currents during startup. The soft-start period is 1024 clock cycles (1024 / f
S
). The output voltage is incre­mented through 64 equal steps. The output reaches reg­ulation when soft-start is completed, regardless of output capacitance and load.
The MAX1954A also has internal circuitry to prevent discharging of a precharged output capacitor during soft-start or in UVLO. This feature (monotonic startup) is needed in applications where the MAX1954A output is connected in parallel with another power-supply output, such as redundant-power or standby-power applications.
Figure 3. DH Boost Circuit
MAX1954A
IN
BST
DH
LX
DL
N
N
MAX1954A
Low-Cost, Current-Mode PWM Buck
Controller with Foldback Current Limit
______________________________________________________________________________________ 11
Table 1. Suggested Components
PART DESIGNATOR
C1
C2
C3
C4 0.1µF, 6.3V X7R ceramic capacitor
C5
C6
C7
C8
C9–C13
Cc
C
F
R1 16.9k ±1% resistor 10k ±1% resistor R2 8.06k ±1% resistor 8.06k ±1% resistor R3 2 ±5% resistor
R
C
D1
N1, N2
N3, N4
L1
0.22µF, 10V X7R ceramic capacitor Kemet C0603C224M8RAC
1µF, 6.3V X5R ceramic capacitor Taiyo Yuden JMK212BJ106MG
10µF, 16V X5R ceramic capacitor Taiyo Yuden EMK325BJ106MN
180µF, 4V SP polymer capacitor Panasonic EEFUEOG181R
1500pF, 50V X7R ceramic capacitor TDK C1608X7R1H152K
680pF, 10V X7R ceramic capacitor Kemet C0402C681M8RAC
62k ±5% resistor 270k ±5% resistor
Schottky diode Central Semiconductor CMPSH1-4
20V, 5A dual MOSFETs Fairchild FDS6898A
1µH, 3.6A inductor TOKO 817FY-1R0M
MAX1954A (FIGURE 1)
20A CIRCUIT
(FIGURE 2)
0.22µF, 10V X7R ceramic capacitor Kemet C0603C224M8RAC
10µF, 16V X5R ceramic capacitor Taiyo Yuden EMK325BJ106MN
10µF, 16V X5R ceramic capacitor Taiyo Yuden EMK325BJ106MN
10µF, 16V X5R ceramic capacitor Taiyo Yuden EMK325BJ106MN
10µF, 16V X5R ceramic capacitor Taiyo Yuden EMK325BJ106MN
10µF, 16V X5R ceramic capacitor Taiyo Yuden EMK325BJ106MN
0.1µF, 50V X7R ceramic capacitor Taiyo Yuden UMK107BJ104KA
270µF, 2V SP polymer capacitor Panasonic EEFUEOD271R
270µF, 2V SP polymer capacitors Panasonic EEFUEOD271R
560pF, 10V X7R ceramic capacitor Kemet C0402C561M8RAC
15pF, 10V C0G ceramic capacitor Kemet C0402C150K8GAC
Schottky diode Central Semiconductor CMPSH1-4
30V N-channel MOSFETs International Rectifier IRF7811
30V N-channel MOSFETs Siliconix Si4842DY
0.8µH, 27.5A inductor Sumida CEP125U-0R8
MAX1954A
Low-Cost, Current-Mode PWM Buck Controller with Foldback Current Limit
12 ______________________________________________________________________________________
Shutdown
The MAX1954A features a low-power shutdown mode. Use an open-collector, NPN transistor to pull COMP low and shut down the IC. COMP must be pulled below
0.25V to shut down the MAX1954A. Choose a transistor with a V
CE(SAT)
below 0.25V. During shutdown, the out­put is high impedance. Shutdown reduces the quies­cent current (IQ) to 220µA (typ). Note that implementing shutdown in this fashion discharges the output only until the inductor runs out of energy. Upon recovery, soft-start is not available. Only the foldback current limit results in pseudo-soft-start mode.
Thermal-Overload Protection
Thermal-overload protection limits total power dissipa­tion in the MAX1954A. When the junction temperature exceeds T
J
= +160°C, an internal thermal sensor shuts
down the IC, allowing the IC to cool. The thermal sensor turns the IC on again after the junction temperature cools by 15°C, resulting in a pulsed output during con­tinuous thermal-overload conditions.
Design Procedures
Setting the Output Voltage
To set the output voltage for the MAX1954A, connect FB to the center of an external resistor-divider from the output to GND (Figures 1 and 2). Select R2 between 8kand 24k, and calculate R1 by:
where VFB= 0.8V. R1 and R2 should be placed as close as possible to the IC.
Inductor Value
There are several parameters that must be examined when determining which inductor to use. Input voltage, output voltage, load current, switching frequency, and LIR. LIR is the ratio of inductor current ripple to DC load current. A higher LIR value allows for a smaller induc­tor, but results in higher losses and higher output rip­ple. A good compromise between size and efficiency is an LIR of 30%. Once all of the parameters are chosen, the inductor value is determined as follows:
where fS is the switching frequency. Choose a standard value close to the calculated value. The exact inductor value is not critical and can be adjusted to make trade­offs among size, cost, and efficiency. Lower inductor val-
ues minimize size and cost, but they also increase the output ripple and reduce the efficiency due to higher peak currents. On the other hand, higher inductor values increase efficiency, but eventually resistive losses, due to extra turns of wire, exceed the benefit gained from lower AC levels. Find a low-loss inductor with the lowest possi­ble DC resistance that fits the allotted dimensions. Ferrite cores are often the best choice. However, powdered iron is inexpensive and can work well at 300kHz. The chosen inductor’s saturation current rating must exceed the peak inductor current determined as:
Setting the Current Limit
The MAX1954A uses a valley current-sense method for current limiting. The voltage drop across the low-side MOSFET due to its on-resistance is used to sense the inductor current. The voltage drop across the low-side MOSFET at the valley point and at I
LOAD(MAX)
is:
The calculated V
VALLEY
must be less than the minimum
current-limit threshold specified.
Additionally, the high-side MOSFET R
DS(ON)
must meet the following equation to avoid tripping the internal peak-current clamp circuit prematurely:
R
DS(ON)
< 0.8V / (3.65 x (I
LOAD(MAX)
x ( 1 + LIR / 2)))
Use the maximum R
DS(ON)
value at the desired maxi­mum operating junction temperature of the MOSFET. A good general rule is to allow 0.5% additional resistance for each °C of MOSFET junction-temperature rise.
MOSFET Selection
The MAX1954A drives two external, logic-level, N-chan­nel MOSFETs as the circuit-switch elements. The key selection parameters are:
1) On-resistance (R
DS(ON)
): the lower, the better.
However, the current-sense signal (RDSx I
PEAK
)
must be greater than 16mV at maximum load.
2) Maximum drain-to-source voltage (V
DSS
): it should be at least 20% higher than the input supply rail at the high-side MOSFET’s drain.
3) Gate charges (Qg, Qgd, Qgs): the lower, the better.
For a 3.3V input application, choose a MOSFET with a rated R
DS(ON)
at VGS= 2.5V. For a 5V input application,
choose the MOSFETs with rated R
DS(ON)
at VGS≤ 4.5V.
For a good compromise between efficiency and cost,
VR I
LIR
I
VALLEY DS ON LOAD MAX LOAD MAX
=× −
×
()
()
() ( )
2
II
LIR
I
PEAK LOAD MAX LOAD MAX
=+
⎛ ⎝
⎞ ⎠
×
() ()
2
L
VVV
V f I LIR
OUT IN OUT
IN S LOAD MAX
=
×−
()
×× ×
()
RR
V
V
OUT
FB
12 1
⎛ ⎝
⎞ ⎠
MAX1954A
Low-Cost, Current-Mode PWM Buck
Controller with Foldback Current Limit
______________________________________________________________________________________ 13
choose the high-side MOSFET (N1) that has conduction losses equal to switching loss at nominal input voltage and output current. The selected MOSFETs must have an R
DS(ON)
that satisfies the current-limit setting condition above. For N2, ensure that it does not spuriously turn on due to dV/dt caused by N1 turning on, as this would result in shoot-through current degrading the efficiency. MOSFETs with a lower Qgd/Q
gs
ratio have higher immuni-
ty to dV/dt.
For proper thermal-management design, the power dis­sipation must be calculated at the desired maximum operating junction temperature, T
J(MAX)
. N1 and N2 have different loss components due to the circuit oper­ation. N2 operates as a zero-voltage switch; therefore, major losses are the channel-conduction loss (P
N2CC
)
and the body-diode conduction loss (P
N2DC
).
where VFis the body-diode forward-voltage drop, tdtis the dead time between N1 and N2 switching transitions, fSis the switching frequency, and tdtis 20ns (typ).
N1 operates as a duty-cycle control switch and has the following major losses: the channel-conduction loss (P
N1CC
), the VL overlapping switching loss (P
N1SW
),
and the drive loss (P
N1DR
). N1 does not have body­diode conduction loss, because the diode never con­ducts current.
where I
GATE
is the average DH-driver output current
capability determined by:
where R
DS(ON)(N2)
is the high-side MOSFET driver’s
on-resistance (1.5typ) and R
GATE
is the internal gate
resistance of the MOSFET (~2).
where VGS~V
IN.
In addition to the losses above, allow approximately 20% for additional losses due to MOSFET output capac­itances and N2 body-diode reverse-recovery charge dissipated in N1 that exists, but is not well defined, in the MOSFET data sheet. Refer to the MOSFET data sheet for thermal-resistance specification to calculate the PC board area needed to maintain the desired maxi­mum operating junction temperature with the above cal­culated power dissipations.
To reduce electromagnetic interference (EMI) caused by switching noise, add a 0.1µF ceramic capacitor from the high-side switch drain to the low-side switch source or add resistors in series with DH and DL to slow down the switching transitions. However, adding series resis­tors increases the power dissipation of the MOSFET, so be sure this does not overheat the MOSFET.
The minimum load current must exceed the high-side MOSFET’s maximum leakage-current overtemperature if fault conditions are expected.
MOSFET Snubber Circuit
Fast-switching transitions cause ringing because of resonating circuit parasitic inductance and capaci­tance at the switching nodes. This high-frequency ring­ing occurs at LX’s rising and falling transitions and can interfere with circuit performance and generate EMI. To dampen this ringing, a series RC snubber circuit is added across each switch. Below is the procedure for selecting the value of the series RC circuit:
1) Connect a scope probe to measure the voltage from LX to GND, and observe the ringing frequen­cy, fR.
2) Find the capacitor value (connected from LX to GND) that reduces the ringing frequency by half.
The circuit parasitic capacitance (C
PAR
) at LX is then equal to 1/3rd of the value of the added capacitance above. The circuit parasitic inductance (L
PAR
) is calculat-
ed by:
The resistor for critical dampening (R
SNUB
) is equal to
2π x fR x L
PAR
. Adjust the resistor value up or down to tailor the desired damping and the peak voltage excur­sion. The capacitor (C
SNUB
) should be at least two to
four times the value of the C
PAR
to be effective. The
power loss of the snubber circuit (P
RSNUB
) is dissipat-
ed in the resistor R
SNUB
and can be calculated as:
PCVf
RSNUB SNUB IN S
()
×
2
L
fC
PAR
R PAR
=
()
×
1
22π
PQVf
R
RR
NDR g GS
S
GATE
GATE DS ON N12
=× ××
+
()()
I
V
RR
GATE
IN
DS ON N GATE
.
()()
≅×
+
05
2
.
()
() ( )
P
V
V
IR
Use R at T
PVI
QQ
I
f
NCC
OUT
IN
LOAD
DS ON
DS ON J MAX
N SW IN LOAD
gs gd
GATE
S
1
2
1
=
××
×
+
⎜ ⎜
⎟ ⎟
×
(
.
() ( )
() ( )
VR I
LIR
I
Use R at T
PIVtf
VALLEY DS ON LOAD MAX LOAD MAX
DS ON J MAX
N DC LOAD F dt S
×
=× × × ×
()
2
2
2
MAX1954A
Low-Cost, Current-Mode PWM Buck Controller with Foldback Current Limit
14 ______________________________________________________________________________________
where VINis the input voltage and fSis the switching frequency. Choose a R
SNUB
power rating that meets the specific application’s derating rule for the power dissipation calculated.
Input Capacitor
The input filter capacitor reduces peak currents drawn from the power source and reduces noise and voltage ripple on the input caused by the circuit’s switching. The input capacitor must meet the ripple current requirement (I
RMS
) imposed by the switching currents
defined by the following equation:
I
RMS
has a maximum value when the input voltage
equals twice the output voltage (VIN= 2 x V
OUT
); there-
fore, I
RMS(MAX)
= I
LOAD
/ 2. Ceramic capacitors are recommended due to their low equivalent series resis­tance (ESR) and equivalent series inductance (ESL) at high frequencies, and their relatively low cost. Choose a capacitor that exhibits less than 10°C temperature rise at the maximum operating root-mean-square (RMS) current for optimum long-term reliability.
Output Capacitor
The key selection parameters for the output capacitor are the actual capacitance value, ESR, ESL, and the voltage-rating requirements. These parameters affect the overall stability, output voltage ripple, and transient response. The output ripple has three components: vari­ations in the charge stored in the output capacitor, and the voltage drop across the capacitor’s ESR and ESL caused by the current into and out of the capacitor. The equation below estimates the maximum ripple voltage:
The output voltage ripple as a consequence of the ESR, output capacitance, and ESL are as follows:
where I
P-P
is the peak-to-peak inductor current (see the Inductor Value section). These equations are suitable for initial capacitor selection, but final values should be chosen based on a prototype or evaluation circuit. As a general rule, a smaller current ripple results in less out­put voltage ripple. Since the inductor ripple current is a factor of the inductor value and input voltage, the out­put voltage ripple decreases with larger inductance, and increases with higher input voltages. For the MAX1954A polymer, tantalum, or aluminum electrolytic capacitors are recommended. Lower-cost aluminum electrolytic capacitors with relatively low ESR are avail­able and can be used for the MAX1954A, if the larger physical size is acceptable. For reliable and safe oper­ation, ensure that the capacitor’s voltage and ripple­current ratings exceed the calculated values.
The devices’ response to a load transient depends on the selected output capacitors. After a load transient, the output voltage instantly changes by ESR x ∆I
LOAD
. Before the controller can respond, the output voltage deviates further depending on the inductor and output capacitor values. After a short period of time (see the Typical Operating Characteristics), the controller responds by regulating the output voltage back to its nominal state. The controller response time depends on its closed-loop bandwidth. With a higher bandwidth, the response time is faster, thus preventing the output volt­age from deviating further from its regulation value.
Compensation Design
The MAX1954A uses an internal transconductance error amplifier whose output compensates the control loop. The external inductor, high-side MOSFET, output capacitor, compensation resistor, and compensation capacitors determine the loop stability. The inductor and output capacitors are chosen based on perfor­mance, size, and cost. Additionally, the compensation resistor and capacitors are selected to optimize control­loop stability. The component values in Figures 1 and 2 yield stable operation over the given range of input-to­output voltages and load currents. The controller uses a current-mode control scheme that regulates the output voltage by forcing the required current through the external inductor. The MAX1954A uses the voltage across the high-side MOSFET’s on-resistance (R
DS(ON)
) to sense the inductor current. Current-mode control eliminates the double pole in the feedback loop caused by the inductor and output capacitor, resulting in a smaller phase shift and requiring less elaborate error-amplifier compensation. A single-series compen­sation resistor (RC) and compensation capacitor (CC) is all that is needed to have a stable high-bandwidth loop in applications where ceramic capacitors are used for
V I ESR
V
I
Cf
V
V
L
ESL
I
VV
fL
V
V
RIPPLE
ESR
PP
RIPPLE C
PP
OUT
S
RIPPLE ESL
IN
PP
IN OUT
S
OUT
IN
()
()
()
=
××
×
=
− ×
×
=
8
VV V V
RIPPLE RIPPLE
ESR
RIPPLE C RIPPLE ESL
=++
()
() ( )
I
IVVV
V
RMS
LOAD OUT IN OUT
IN
=
××
()
MAX1954A
Low-Cost, Current-Mode PWM Buck
Controller with Foldback Current Limit
______________________________________________________________________________________ 15
output filtering. For other types of capacitors, due to the higher capacitance and ESR, the frequency of the zero created by the capacitance and ESR is lower than the desired closed-loop crossover frequency. Another compensation capacitor should be added to cancel this zero.
The basic regulator loop can be thought of as a power modulator, output feedback divider, and an error ampli­fier. The power modulator has DC gain set by gmcx R
LOAD
, with a pole and zero pair set by R
LOAD
, the out-
put capacitor (C
OUT
) and its equivalent series resis-
tance (R
ESR
). Below are equations that define the
power modulator:
where R
LOAD
= V
OUT
/ I
OUT(MAX)
, and gmc= 1 / (ACSx
R
DS(ON)
), where ACSis the gain of the current-sense
amplifier and R
DS(ON)
is the on-resistance of the high­side power MOSFET. ACSis 3.5. The frequencies at which the pole and zero due to the power modulator occur are determined as follows:
The feedback voltage-divider used has a gain of GFB= V
FB
/ V
OUT
, where VFBis equal to 0.8V. The transcon-
ductance error amplifier has DC gain, G
EA(DC)
= gmx
RO. The amplifier output resistance (RO) is typically 10M. The CC, RO, and the RCset a dominant pole. The RCand the CCset a zero. There is an optional pole set by CFand RCto cancel the output-capacitor ESR zero if it occurs before crossover frequency (fC):
The fCshould be much higher than the power modula­tor pole f
PMOD
. Also, the crossover frequency should
be less than 1/8th of the switching frequency:
Therefore, the loop-gain equation at the crossover fre­quency is:
When f
zMOD
is greater than fC:
then RCis calculated as:
where g
mEA
= 110µs.
The error-amplifier compensation zero formed by R
C
and CCshould be set at the modulator pole f
pMOD
. C
C
is calculated by:
If f
zMOD
is less than 5 x fC, add a second compensa­tion capacitor, Cf, from COMP to GND to cancel the ESR zero. Cf is calculated by:
As the load current decreases, the modulator pole also decreases. However, the modulator gain increases accordingly and the crossover frequency remains the same.
When f
zMOD
is less than fC, the power-modulator gain
at fCis:
GG
f
f
MOD fC MOD DC
pMOD
zMOD
() ( )
C
Rf
f
C zMOD
=
××
1
2π
C
RfLC
RfLR
C
LOAD
S
OUT
LOAD
S
C
=
×××
()
×
( )
R
V
gVG
C
OUT
mEA FB MOD fC
=
××
()
G g R and G g R
f
f
EA fC mEA C MOD fC mc LOAD
pMOD
C
() ()
=××
GG
V
V
EA fC MOD fC
FB
OUT
() ()
××=1
ff
f
pMOD C
S
<< <
8
f
CRR
f
CR
f
CR
pdEA
COC
zEA
CC
pEA
FC
=
××+
=
××
=
××
1
2
1
2
1
2
π
π
π
()
f
C
RfL
RfL
R
f
CR
pMOD
OUT
LOAD
S
LOAD
S
ESR
zMOD
OUT ESR
=
××
××
+
=
××
1
2
1
2ππ
Gg
RfL RfL
MOD mc
LOAD
S
LOAD
S
×× +×
MAX1954A
Low-Cost, Current-Mode PWM Buck Controller with Foldback Current Limit
16 ______________________________________________________________________________________
The error-amplifier gain at fCis:
RCis then calculated as:
C
C
and Cfcan then be calculated as:
Applications Information
See Table 2 for suggested manufacturers of the com­ponents used with the MAX1954A.
PC Board Layout Guidelines
Careful PC board layout is critical to achieve low switching losses and clean, stable operation. The switching power stage requires particular attention. Follow these guidelines for good PC board layout:
1) Place IC decoupling capacitors as close as possible to IC pins. Keep separate the power-ground plane (connected to pin 7) and the signal-ground plane (connected to pin 4). The IN pin has two decoupling capacitors. One connects to pin 7 and one connects to pin 4.
2) Place the MOSFETs’ decoupling capacitors as close as possible and place them directly across from the high-side MOSFET drain and the low-side MOSFET source.
3) Input and output capacitors are connected to the power-ground plane; all other capacitors are con­nected to the signal-ground plane.
4) Keep the high-current paths as short as possible.
5) Connect the drain leads of the power MOSFET to a large copper area to help cool the device. Refer to the power MOSFET data sheet for recommended copper area.
6) Connect HSD directly to the drain leads of the high­side MOSFET.
7) Connect LX directly to the drain of the low-side MOSFET.
8) Place the low-side MOSFET so that its source is as close as possible to pin 7.
9) Ensure all feedback connections are short and direct. Place the feedback resistors as close as possible to the IC.
10) Route high-speed switching nodes away from sen­sitive analog areas (FB, COMP).
11)The trace length from the gates of the low-side and high-side MOSFETs to DH and DL should be no longer than 700 mils.
To aid design, a sample layout is available in the MAX1954A evaluation kit.
C
RfLC
RfLR
C
Rf
C
LOAD
S
OUT
LOAD
S
C
f
C zMOD
=
×××
()
×
=
××
1
2π
R
V
V
f
gf G
C
OUT
FB
C
mEA zMOD MOD fC
××
()
GgR
f
f
EA fC mEA C
zMOD
C
()
×
Table 2. Suggested Manufacturers
MANUFACTURER COMPONENT PHONE WEBSITE
Central Semiconductor Diodes 631-435-1110 www.centralsemi.com
Coilcraft Inductors 800-322-2645 www.coilcraft.com
Fairchild MOSFETs 800-341-0392 www.fairchildsemi.com
Kemet Capacitors 864-963-6300 www.kemet.com
Panasonic Capacitors 714-373-7366 www.panasonic.com
Taiyo Yuden Capacitors 408-573-4150 www.t-yuden.com
TOKO Inductors 800-745-8656 www.toko.com
MAX1954A
Low-Cost, Current-Mode PWM Buck
Controller with Foldback Current Limit
______________________________________________________________________________________ 17
Typical Operating Circuit Chip Information
TRANSISTOR COUNT: 2963
PROCESS: BiCMOS
V
IN
3V TO 5.5V
V
HSD
5.5V TO 13.2V
IN
HSD
MAX1954A
COMP
GND
BST
PGND
DH
LX
DL
FB
N
N
V
OUT
0.8V TO 0.93 V
IN
MAX1954A
Low-Cost, Current-Mode PWM Buck Controller with Foldback Current Limit
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
18 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2005 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc.
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages
.)
e
10
0.6±0.1
1
0.6±0.1
TOP VIEW
A2
FRONT VIEW
Ø0.50±0.1
D2
D1
4X S
10
DIM
A1 A2 0.030 0.037 0.75 0.95 D1
H
1
BOTTOM VIEW
D2 E1 E2 H L L1 b e
S
α
E2
GAGE PLANE
A
b
A1
α
E1
L
L1
INCHES
MAX
MIN
0.043
-A
0.006
0.002
0.120
0.116
0.118
0.114
0.120
0.116
0.118
0.114
0.199
0.187
0.0275
0.0157
0.037 REF
0.0106
0.007
0.0197 BSC
0.0078
0.0035
c
0.0196 REF 6°
c
MILLIMETERS
MAX
MIN
1.10
-
0.15
0.05
3.05
2.95
3.00
2.89
3.05
2.95
2.89
3.00
4.75
5.05
0.40
0.70
0.940 REF
0.177
0.270
0.500 BSC
0.090
0.200
0.498 REF
10LUMAX.EPS
SIDE VIEW
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE, 10L uMAX/uSOP
REV.DOCUMENT CONTROL NO.APPROVAL
21-0061
1
I
1
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