MAXIM MAX1840, MAX1841 Technical data

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General Description

The MAX1840/MAX1841 subscriber identity module
(SIM)/smart card level translators provide level shifting
and electrostatic discharge (ESD) protection for SIM and
smart card ports. These devices integrate two unidirec­tional level shifters for the reset and clock signals, a bidi­rectional level shifter for the serial data stream, and
±10kV ESD protection on all card contacts.

The MAX1840 includes a SHDN control input to aid
insertion and removal of SIM and smart cards, while the
MAX1841 includes a system-side data driver to support
system controllers without open-drain outputs. The logic
supply voltage range is +1.4V to +5.5V for the “controller
side” and +1.7V to +5.5V for the “card side.” Total sup­ply current is 1.0µA. Both devices automatically shut
down when either power supply is removed. For a com­plete SIM card interface, combine the MAX1840/
MAX1841 with the MAX1686H 0V/3V/5V regulated
charge pump.

The MAX1840/MAX1841 are available in ultra-small
10-pin µMAX packages that are only 1.09mm high and
half the area of an 8-pin SO.

The MAX1840/MAX1841 are compliant with GSM test
specifications 11.11 and 11.12.

Applications

SIM Interface in GSM Cellular Telephones

Smart Card Readers

Logic Level Translation

SPI™/QSPI™/MICROWIRE™ Level Translation

Features

♦ SIM/Smart Card Level Shifting

♦ +1.4V to +5.5V Controller Voltage Range

♦ +1.7V to +5.5V Card Voltage Range

♦ ±10kV ESD Card Socket Protection

♦ Allows Level Translation with DV

CC

≥ V

CC

or

DV

CC

≤ V

CC

♦ Automatically Shuts Down When Either Supply Is

Removed

♦ Card Contacts Actively Pulled Low During

Shutdown

♦ 1µA Total Quiescent Supply Current

♦ 0.01µA Total Shutdown Supply Current

♦ Ultra-Small 10-Pin µMAX Package

♦ Compliant with GSM Test Specifications 11.11

and 11.12

MAX1840/MAX1841

Low-Voltage SIM/Smart Card

Level Translators in µMAX

________________________________________________________________ Maxim Integrated Products 1

Typical Operating Circuit

19-1716; Rev 0; 4/00

PART

MAX1840EUB

MAX1841EUB

-40°C to +85°C

-40°C to +85°C

TEMP. RANGE PIN-PACKAGE

10 µMAX

10 µMAX

Pin Configuration

Ordering Information

SPI and QSPI are trademarks of Motorola, Inc.
MICROWIRE is a trademark of National Semiconductor Corp.

DV

SYSTEM

CONTROLLER

GND

CC

DV

CC

OPTIONAL

OPTIONAL

DV

CC

RIN

MAX1840
MAX1841

CIN

DATA

SHDN*

DDRV*

*

SHDN FOR MAX1840 ONLY;
DDRV FOR MAX1841 ONLY.

CLK

GND GND

V

CC

V

CC

IO

V

RSTRST

CLK

IO

CC

SIM OR
SMART

CARD

TOP VIEW

IO1DATA

10

DV

2

CC

CIN

3

MAX1840

4

5

MAX1841

µMAX

RIN

( ) ARE FOR MAX1841.

9

V

CC

CLK

8

RST

7

GNDSHDN (DDRV)

6

MAX1840/MAX1841

Low-Voltage SIM/Smart Card
Level Translators in µMAX

2 _______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(Figure 1, DVCC= +1.8V; VCC= +1.8V, +3.0V, or +5.0V; SHDN = DVCC, CIN = RIN = GND or DVCC, IO = VCC, DATA = DDRV = DVCC,
C

IO

= C

CLK

= C

RST

= C

DATA

= 30pF, TA= -40°C to +85°C, unless otherwise noted. Typical values are at TA= +25°C.) (Note1)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.

DVCC, VCCto GND................................................-0.3V to +6.0V

RIN, CIN, DATA, DDRV,

SHDN to GND......................................-0.3V to (DV

CC

+ 0.3V)

RST, CLK, IO to GND .................................-0.3V to (V

CC

+ 0.3V)

Continuous Power Dissipation (T

A

= +70°C)

10-Pin µMAX (derate 5.6mW/°C above +70°C) ...........444mW

Operating Temperature Range ...........................-40°C to +85°C

Storage Temperature Range .............................-65°C to +150°C

Junction Temperature......................................................+150°C

Lead Temperature (soldering, 10s) .................................+300°C

UNITS

DVCCOperating Range DV

CC

1.4 5.5

V

V

CC

Operating Range V

CC

1.7 5.5

V

DVCCOperating Current I

DVCC

CIN static

0.1 0.5

µA

CIN clocked at 1.625MHz from GND to DV

CC

with 50% duty cycle

CONDITIONS

2.5

CIN clocked at 3.25MHz from GND to DV

CC

with 50% duty cycle

5

VCCOperating Current I

VCC

CIN static

0.9 3.0

mA

CIN clocked at 1.625MHz from GND to DV

CC

with 50% duty cycle

0.4

CIN clocked at 3.25MHz from GND to DV

CC

with 50% duty cycle

0.8

Total Shutdown Current I

SHDN

I

OFF

= I

VCC

+ I

DVCC

, SHDN = GND

(MAX1840 only), or DV

CC

= GND

or VCC= GND

0.01 1

µA

Digital Input Low Threshold V

IL

0.2 ✕DV

CC

V

Digital Input High Threshold V

IH

0.7 ✕DV

CC

V

Input Leakage Current

0.01 1

µA

Digital Output Low Level V

OL

I

SINK

= 200µA

0.4

V

Digital Output High Level V

OH

I

SOURCE

= 20µA

0.9 ✕V

CC

V

I

SOURCE

= 200µA

0.8 ✕ VCC

DATA Pullup Resistance R

DATA

Between DATA and DV

CC

13 20 28

kΩ

Input Low Threshold V

IL(DATA)

(Note 2)

0.3

V

Input High Threshold V

IH(DATA)

(Note 3)

DVCC- 0.6

V

Input Low Current I

IL

VCC= 5.0V

1

mA

MIN TYP MAXSYMBOLPARAMETER

Input High Current I

IH

2

µA

POWER SUPPLIES

CIN, RIN, SHDN, DDRV LOGIC INPUTS

CLK, RST OUTPUTS

DATA INPUT/OUTPUT

µA

MAX1840/MAX1841

Low-Voltage SIM/Smart Card

Level Translators in µMAX

_______________________________________________________________________________________ 3

ELECTRICAL CHARACTERISTICS (continued)

(Figure 1, DVCC= +1.8V; VCC= +1.8V, +3.0V, or +5.0V; SHDN = DVCC, CIN = RIN = GND or DVCC, IO = VCC, DATA = DDRV = DVCC,
C

IO

= C

CLK

= C

RST

= C

DATA

= 30pF, TA= -40°C to +85°C, unless otherwise noted. Typical values are at TA= +25°C.) (Note1)

UNITSCONDITIONS MIN TYP MAXSYMBOLPARAMETER

Output Low Level V

OL(DATA)

IO = GND, I

SINK

= 100µA

0.4
V

DVCC= 3.0V, IO = GND, I

SINK

= 200µA

0.4

Output High Level

I

SOURCE

= 10µA

0.7 ✕DV

CC

V

DVCC= 3.0V, I

SOURCE

= 20µA

0.7 ✕DV

CC

V

OH(DATA)

IO Pullup Resistance R

IO

Between IO and V

CC

6.5 10 14

kΩ

Input Low Threshold V

IL(IO)IIL(MAX)

= 1mA (Note 2)

0.3

V

Input High Threshold V

IH(IO)IIH(MAX)

= ±20µA (Note 3)

0.7 ✕V

CC

V

Input Low Current I

IL

1

mA

Input High Current I

IH

20

µA

Output Low Level V

OL(IO)

DATA = GND or DDRV = GND,
I

SINK

= 200µA

0.4

V

Output High Level V

OH(IO)ISOURCE

= 20µA

0.8 ✕V

CC

V

Shutdown Output Levels
(IO, CLK, RST)

I

SINK

= 200µA, SHDN = GND, DATA = CIN =

RIN = DV

CC

(MAX1840 only)

0.4

V

I

SINK

= 200µA, DVCC= GND, SHDN
(MAX1840) = DDRV (MAX1841) = DATA =
CIN = RIN = DV

CC

0.4

V

I

SINK

= 200µA, VCC= GND, SHDN
(MAX1840) = DDRV (MAX1841) = DATA =
CIN = RIN = DV

CC

0.4

V

Maximum CLK Frequency
(Notes 4, 5)

f

CLK

VCC= 2.7V to 5.5V, DVCC= 1.4V to 2.7V

520

MHz

VCC= 1.7V to 3.6V, DVCC= 1.4V to 2.25V

515

IO (INPUT/OUTPUT)

SHUTDOWN OUTPUT LEVELS

TIMING

Note 1: Specifications to -40°C are guaranteed by design, not production tested.
Note 2: V

IL

is defined as the voltage at which the output (DATA/IO) voltage equals 0.5V.

Note 3: V

IH

is defined as the voltage at which the output (DATA/IO) voltage exceeds the input (IO/DATA) voltage by 100mV.

Note 4: Timing specifications are guaranteed by design, not production tested.
Note 5: The maximum CLK frequency is defined as the output duty cycle remaining in the 40% to 60% range when the 50% CIN is

applied. CIN has 5ns rise and fall times; levels are GND to DV

CC

. Input and output levels are measured at 50% of the waveform.

MAX1840/MAX1841

Low-Voltage SIM/Smart Card
Level Translators in µMAX

4 _______________________________________________________________________________________

Typical Operating Characteristics

(Circuit of Figure 1, DVCC= 3.0V, VCC= +5.0V, DDRV or DATA = DVCC, RIN = CIN = GND, TA= +25°C, unless otherwise noted.)

0

1.0

0.5

2.0

1.5

2.5

3.0

0426810

TOTAL OPERATING SUPPLY CURRENT

vs. CLOCK FREQUENCY (DATA STATIC)

MAX1840/1-01

FREQUENCY (MHz)

SUPPLY CURRENT, I

VCC

+ I

DVCC

(mA)

DATA OR DDRV = DV

CC

CIN CLOCKED WITH A
0 TO DV

CC

SQUARE WAVE

VCC = 5V

VCC = 3V

VCC = 1.8V

0

0.4

1.2

0.8

1.6

2.0

TOTAL OPERATING SUPPLY CURRENT

vs. CARD-SIDE SUPPLY VOLTAGE

(DATA STATIC)

MAX1840/1-02

VCC (V)

SUPPLY CURRENT, I

VCC

+ I

DVCC

(mA)

1.5 3.52.5 4.5 5.5

DATA OR DDRV = DV

CC

CIN CLOCKED WITH A
0 TO DV

CC

SQUARE WAVE

f

CIN

= 5MHz

f

CIN

= 3.25MHz

f

CIN

= 1.625MHz

1.6

1.2

0.8

0.4

0

-40 10-15 35 60 85

TOTAL OPERATING SUPPLY CURRENT

vs. TEMPERATURE (DATA STATIC)

MAX1840/1-03

TEMPERATURE (°C)

SUPPLY CURRENT, I

VCC

+ I

DVCC

(mA)

DATA OR DDRV = DV

CC

CIN CLOCKED WITH A
0 TO DV

CC

SQUARE WAVE

VCC = 5V

VCC = 3V

VCC = 1.8V

f

CIN

= 5MHz

0

1.0

0.5

2.0

1.5

2.5

3.0

0426810

TOTAL OPERATING SUPPLY CURRENT

vs. CLOCK FREQUENCY (DATA ACTIVE)

MAX1840/1-04

FREQUENCY (MHz)

SUPPLY CURRENT, I

VCC

+ I

DVCC

(mA)

f

DATA

OR f

DDRV

= f

CIN

/372
CIN CLOCKED WITH A
0 TO DV

CC

SQUARE WAVE

VCC = 5V

VCC = 3V

VCC = 1.8V

0

0.4

1.2

0.8

1.6

2.0

TOTAL OPERATING SUPPLY CURRENT

vs. CARD-SIDE SUPPLY VOLTAGE

(DATA ACTIVE)

MAX1840/1-05

VCC (V)

SUPPLY CURRENT, I

VCC

+ I

DVCC

(mA)

1.5 3.52.5 4.5 5.5

f

DATA

OR f

DDRV

= f

CIN

/372
CIN CLOCKED WITH A
0 TO DV

CC

SQUARE WAVE

f

CIN

= 5MHz

f

CIN

= 3.25MHz

f

CIN

= 1.625MHz

0

0.4

1.2

0.8

1.6

2.0

-40 10-15 35 60 85

TOTAL OPERATING SUPPLY CURRENT

vs. TEMPERATURE (DATA ACTIVE)

MAX1840/1-06

TEMPERATURE (°C)

SUPPLY CURRENT, I

VCC

+ I

DVCC

(mA)

f

DATA

OR f

DDRV

= f

CIN

/372
CIN CLOCKED WITH A
0 TO DV

CC

SQUARE WAVE

VCC = 5V

VCC = 3V

VCC = 1.8V

f

CIN

= 5MHz

CIN TO CLK OR RIN TO RST

WAVEFORM (3V TO 5V)

MAX1840/1-07

20ns/div

CIN OR RIN
2V/div

f

CIN

= 5MHz

0

0

3V

5V

CLK OR RST
2V/div

CIN TO CLK OR RIN TO RST

WAVEFORM (3V TO 1.8V)

MAX1840/1-08

20ns/div

CIN OR RIN
2V/div

f

CIN

= 5MHz

0

3V

1.8V

CLK OR RST
1V/div

0

CIN TO CLK OR RIN TO RST

WAVEFORM (1.8V TO 1.8V)

MAX1840/1-09

20ns/div

CIN OR RIN
1V/div

0

1.8V

1.8V
CLK OR RST

1V/div

0

f

CIN

= 5MHz

MAX1840/MAX1841

Low-Voltage SIM/Smart Card

Level Translators in µMAX

_______________________________________________________________________________________ 5

Typical Operating Characteristics (continued)

(Circuit of Figure 1, DVCC= 3.0V, VCC= +5.0V, DDRV or DATA = DVCC, RIN = CIN = GND, TA= +25°C, unless otherwise noted.)

NAME

2 2 DV

CC

3 3 CIN

4 4 RIN

— 5 DDRV

8 8 CLK

7 7 RST

6 6 GND

5 —

SHDN

1 DATA1

System Controller Data Input/Output. An open-drain IO with a 20kΩ pull-up
resistor to DVCC. For bidirectional data transfer, connect to an open-drain controller output
capable of sinking 1mA while pulling DATA low. If the controller is not open-drain, use
DDRV to send data and DATA to receive data.

MAX1840 MAX1841

10 10 IO

9 9 V

CC

Card-Side Bidirectional Input/Output. An open-drain output with a 10kΩ pull-up resistor to
V

CC

. For bidirectional data transfer, connect to an open-drain card output capable of sink-

ing 1mA while pulling IO low. Actively pulled low during shutdown.

Supply Voltage for Card-Side Digital Pins. Set at +1.7V to +5.5V. Proper supply bypassing
is required to meet ±10kV ESD specifications.

Clock Output to Card. Actively pulled low during shutdown.

Reset Output to Card. Actively pulled low during shutdown.

System Controller and Card Ground

Shutdown Mode Input. Driving SHDN low reduces the total supply current to less than
1µA. In shutdown mode, RST, CLK, and IO are actively pulled low and the transfer gate
between DATA and IO is disabled. When not used, connect SHDN to DV

CC

.

Optional System Controller Data Input. Connect to controllers without an open-drain out­put. When not used, connect DDRV to DVCC.

System Controller Reset Input

System Controller Clock Input

Supply Voltage for System Controller Digital Pins. Set at +1.4V to +5.5V.

FUNCTION

PIN

Pin Description

1.5V

UNDERVOLTAGE

SHUTDOWN WAVEFORM

0

1V

0

1ms/div

MAX1840/1-10

V

CC

0.5V/div

CLK, RST, OR IO

0.5V/div

DDRV TO IO AND DATA WAVEFORM

(MAX1841 ONLY)

3V

0

3V

0

5V

0

1µs/div

MAX1840/1-11

DDRV
2V/div

DATA
2V/div

IO
2V/div

MAX1840/MAX1841

Low-Voltage SIM/Smart Card
Level Translators in µMAX

6 _______________________________________________________________________________________

Detailed Description

The MAX1840/MAX1841 provide the necessary level
translation for interfacing with SIMs and smart cards in
multivoltage systems. These devices operate with logic
supply voltages between +1.4V and +5.5V on the con­troller side (DVCC) and between +1.7V and +5.5V on the
card side (VCC). The total supply current (I

DV

CC

+ I

V

CC

)
is 1µA while operating in an idle state (see Electrical
Characteristics). Figure 1 shows the MAX1840/MAX1841
test circuit. The Typical Application Circuit appears at the
end of this data sheet.

Level Translation

The MAX1840/MAX1841 provide level translators for a
clock input, a reset input, and a bidirectional data IO.
The clock and reset inputs (CIN and RIN) are level shift­ed from the controller-side supply rails (DVCCto GND)
to the card-side supply rails (VCCto GND). When con­nected to an open-drain controller output, DATA and IO
provide bidirectional level translation. All level transla­tion is valid for DVCC≥ VCCor DVCC≤ VCC. The
MAX1840/MAX1841 contain internal pull up resistors
from DATA to the controller-side supply (DVCC) and
from IO to the card-side supply (VCC). For push-pull
controller outputs, see the Data Driver section for bidi­rectional data translation.

Data Driver (MAX1841 Only)

When using a microcontroller (µC) without an open-drain
output, use the data driver (DDRV) input to send data to
the SIM/smart card, while DATA provides the controller­side output for bidirectional data transfer. When not
used, connect DDRV to DVCCto reduce total supply cur­rent.

Shutdown Mode

For the MAX1840, drive SHDN low to activate shut­down. Connect SHDN to DVCCor drive high for normal
operation. To allow for card insertion and removal, shut­down mode actively pulls CLK, RST, and IO low; it also
disconnects the internal 10kΩ pull up resistor from V

CC

to prevent excessive current draw. Shutdown mode
reduces the total supply current (I

DVCC

+ I

VCC

) to

0.01µA.

SIM/Smart Card Insertion/Removal

The SIM/smart card specifications require that the card­side pins (V

CC

, CLK, RST, IO) be at ground potential
prior to inserting the SIM/smart card. For applications
using the MAX1686H (Figure 3), the easiest way to
achieve this is by shutting down the MAX1686H or by

driving SHDN (MAX1840 only) low. If specific sequenc­ing is desired, pull IO low by driving either DATA or
DDRV (MAX1841 only) low, and pull CLK and RST low
by driving CIN and RIN low, respectively.

ESD Protection

As with all Maxim devices, ESD-protection structures on
all pins protect against ESDs encountered during han­dling and assembly. For further protection during card
insertion and removal, the pins that connect to the card
socket (CLK, RST, IO, VCC, and GND) provide protec­tion against ±10kV of ESD. The ESD structures with­stand high ESD in all states: normal operation,
shutdown, and power-down. After an ESD event, the
MAX1840/MAX1841 continue working without latchup.
A 1µF bypass capacitor from VCCto GND is required to
exceed ±10kV ESD specifications.

ESD Test Conditions

ESD performance depends on a variety of conditions.
Contact Maxim for a reliability report documenting test
setup, test methodology, and test results.

Applications Information

SIM/Smart Card Interface

To provide 5V when interfacing with a 5V SIM/smart card,
+3V systems require a DC-DC converter. The MAX1686H
+5V regulating charge pump for SIM cards provides

Figure 1. MAX1840/MAX1841 Test Circuit

+1.8V

30pF

DV

CC

SHDN*

RIN
CIN
DDRV*
DATA

MAX1840
MAX1841

V

RST

CLK

GND

+1.8V,

CC

IO

30pF

+3.0V, OR
+5.0V

30pF 30pF

*

SHDN FOR MAX1840 ONLY;
DDRV FOR MAX1841 ONLY.

NOTE: ALL CAPACITANCES INCLUDE CAPACITIVE LOADS OF
TEST PROBES AND BOARD LAYOUT.

MAX1840/MAX1841

Low-Voltage SIM/Smart Card

Level Translators in µMAX

_______________________________________________________________________________________ 7

0V/3V/5V for full compatibility with SIM/smart-card specifi­cations. Figure 2 shows the charge pump for SIM card
applications. Alternatively, the MAX619 generates a regu­lated 5V from input voltages as low as 2V.

SPI/QSPI/MICROWIRE Interface

The MAX1840/MAX1841 are also useful as 3V/5V level
shifters in SPI, QSPI, and MICROWIRE applications
(Figure 3). On the slave side, connect CLK to SCLK,
RST to CS, and IO to DOUT and DIN. The unidirectional

level shifters transfer chip select and clock signals to
the slave device(s), while the bidirectional level shifter
transfers data.

___________________Chip Information

TRANSISTOR COUNT: 211

Figure 2. Using MAX1840/MAX1841 and MAX1686/MAX1686H
Charge Pump for SIM Card Applications

Figure 3. MAX1840/MAX1841 with SPI/QSPI/MICROWIRE
Interfaces

+3.0V

DV

SYSTEM

CONTROLLER

GND

CC

OPTIONAL

OPTIONAL

*

SHDN FOR MAX1840 ONLY;
DDRV FOR MAX1841 ONLY.

CXN CXP

IN

MAX1686

MAX1686H

3/5

SHDN

MAX1840
MAX1841

DV

CC

RIN

CIN

DATA

SHDN*

DDRV*

3.0V OR 5.0V

OUT

GND

PGND

V

CC

RST

CLK

IO

GND GND

V

RST

CLK

IO

CC

SIM OR
SMART

CARD

+5.0V

DV

SYSTEM

CONTROLLER

GND

CC

OPTIONAL

OPTIONAL

*

SHDN FOR MAX1840 ONLY;
DDRV FOR MAX1841 ONLY.

IN

MAX8867
MAX8860

SHDN

DV

CC

RIN

CIN

DATA

SHDN*

DDRV*

MAX1840
MAX1841

OUT

SET

PGND

V

CC

RST

CLK

IO

GND GND

+3.3V

SPI/QSPI/

MICROWIRE

SYSTEM

V

CC

CS

SCLK

DOUT

DIN

MAX1840/MAX1841

Low-Voltage SIM/Smart Card
Level Translators in µMAX

Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.

8 _____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600

© 2000 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.

Note: The MAX1840/MAX1841 do not have an exposed pad.

Packaging Information

Typical Application Circuit

V

CC

SIM OR

SMART CARD

SYSTEM

CONTROLLER

CLK

RST

1µF

GND

GND

CLK

RST

GND

V

CC

DV

CC

DV

CC

MAX1840
MAX1841

SHDN*

OPTIONAL

RIN

CIN

20k 10k

OPTIONAL

DATA

DDRV*

SHDN FOR MAX1840 ONLY;
DDRV FOR MAX1841 ONLY.

*

SHUTDOWN

CONTROL

IO

IO

1µF

DV

CC

V

CC

10LUMAX.EPS