MAXIM MAX1740, MAX1741 User Manual

For free samples and the latest literature, visit www.maxim-ic.com or phone [phone].
For small orders, phone [phone].

General Description

The MAX1740/MAX1741 subscriber identity module
(SIM)/smart card level translators provide level shifting
and electrostatic discharge (ESD) protection for SIM and
smart card ports. These devices integrate two unidirec­tional level shifters for the reset and clock signals, a bidi­rectional level shifter for the serial data stream, and
±10kV ESD protection on all card contacts.

The MAX1740 includes a SHDN control input to aid
insertion and removal of SIM and smart cards, while the
MAX1741 includes a system-side data driver to support
system controllers without open-drain outputs. The logic
supply voltage range is +1.425V to +5.5V for the “con­troller side” and +2.25V to +5.5V for the “card side.”
Total supply current is 2.5µA max. Both devices automat­ically shut down when either power supply is removed.
For a complete SIM-card interface, combine the
MAX1740/MAX1741 with the MAX1686H 0V/3V/5V regu­lated charge pump.

The MAX1740/MAX1741 are available in ultra-small 10­pin µMAX packages that are only 1.09mm high and half
the area of an 8-pin SO.

The MAX1740/MAX1741 are compliant with GSM test
specifications 11.11 and 11.12.

Applications

SIM Interface in GSM Cellular Telephones

Smart Card Readers

Logic Level Translation

SPI™/QSPI™/MICROWIRE™ Level Translation

Features

♦ SIM/Smart Card Level Shifting

♦ ±10kV ESD Card Socket Protection

♦ Allows Level Translation with DV

CC

≥ V

CC

or

DV

CC

≤ V

CC

♦ Automatically Shuts Down When Either Supply Is

Removed

♦ Card Contacts Actively Pulled Low During

Shutdown

♦ +1.425V to +5.5V Controller Voltage Range

♦ +2.25V to +5.5V Card Voltage Range

♦ 2.5µA (max) Total Quiescent Supply Current

♦ 0.01µA Total Shutdown Supply Current

♦ Ultra-Small 10-Pin µMAX Package

♦ Compliant with GSM Test Specifications 11.11

and 11.12

MAX1740/MAX1741

SIM/Smart Card Level Translators

in µMAX

________________________________________________________________ Maxim Integrated Products 1

Typical Operating Circuit

19-1458; Rev 0; 1/00

PART

MAX1740EUB

MAX1741EUB

-40°C to +85°C

-40°C to +85°C

TEMP. RANGE PIN-PACKAGE

10 µMAX

10 µMAX

Pin Configuration

Ordering Information

SPI and QSPI are trademarks of Motorola, Inc.
MICROWIRE is a trademark of National Semiconductor Corp.

DV

SYSTEM

CONTROLLER

GND

CC

DV

CC

OPTIONAL

OPTIONAL

DV

CC

RIN

MAX1740
MAX1741

CIN

DATA

SHDN*

DDRV*

*

SHDN FOR MAX1740 ONLY
DDRV FOR MAX1741 ONLY

CLK

GND GND

V

CC

V

CC

IO

V

RSTRST

CLK

IO

CC

SIM OR
SMART

CARD

TOP VIEW

IO1DATA

10

DV

2

CC

CIN

3

MAX1740

RIN

( ) ARE FOR MAX1741.

MAX1741

4

5

µMAX

9

V

CC

CLK

8

RST

7

GNDSHDN (DDRV)

6

MAX1740/MAX1741

SIM/Smart Card Level Translators
in µMAX

2 _______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(Figure 1, DVCC= +1.8V, VCC= +3.0V or +5.0V, SHDN = DVCC, CIN = RIN = GND or DVCC, IO = VCC, DATA = DDRV = DVCC,
C

IO

= C

CLK

= C

RST

= C

DATA

= 30pF, TA= 0°C to +85°C, unless otherwise noted. Typical values are at TA= +25°C.)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.

DVCC, VCCto GND................................................-0.3V to +6.0V

RIN, CIN, DATA, DDRV,

SHDN to GND......................................-0.3V to (DV

CC

+ 0.3V)

RST, CLK, IO to GND ................................-0.3V to (V

CC

+ 0.3V)

Continuous Power Dissipation (T

A

= +70°C)

10-Pin µMAX (derate 5.6mW/°C above +70°C) ..........444mW

Operating Temperature Range ..........................-40°C to +85°C

Storage Temperature Range ............................-65°C to +150°C

Junction Temperature......................................................+150°C

Lead Temperature (soldering, 10s) ................................+300°C

UNITS

DVCCOperating Range DV

CC

1.425 5.5

V

V

CC

Operating Range V

CC

2.25 5.5

V

DVCCOperating Current I

DVCC

CIN static

1

µA

CIN clocked at 1.625MHz from GND to DV

CC

with 50% duty cycle

CONDITIONS

8

CIN clocked at 3.25MHz from GND to DV

CC

with 50% duty cycle

16

VCCOperating Current I

VCC

CIN static

1.5

mA

CIN clocked at 1.625MHz from GND to DV

CC

with 50% duty cycle

0.5

CIN clocked at 3.25MHz from GND to DV

CC

with 50% duty cycle

1

Total Shutdown Current I

SHDN

I

OFF

= I

VCC

+ I

DVCC

, SHDN = GND

(MAX1740 only), or DV

CC

= GND

or VCC= GND

0.01 2

µA

Digital Input Low Threshold V

IL

0.2 · DV

CC

V

Digital Input High Threshold V

IH

0.7 · DV

CC

V

Input Leakage Current

0.01 1

µA

Digital Output Low Level V

OL

I

SINK

= 200µA

0.4

V

Digital Output High Level V

OH

I

SOURCE

= 20µA

0.9 · V

CC

V

I

SOURCE

= 200µA

0.8 · V

CC

DATA Pull-Up Resistance R

DATA

Between DATA and DV

CC

13 20 28

kΩ

Input Low Threshold V

IL(DATA)

(Note 1)

0.3

V

Input High Threshold V

IH(DATA)

(Note 2)

DVCC- 0.6

V

Input Low Current I

IL

VCC= 5.0V

1

mA

MIN TYP MAXSYMBOLPARAMETER

Input High Current I

IH

2

µA

POWER SUPPLIES

CIN, RIN, SHDN, DDRV LOGIC INPUTS

CLK, RST OUTPUTS

DATA INPUT/OUTPUT

µA

MAX1740/MAX1741

SIM/Smart Card Level Translators

in µMAX

_______________________________________________________________________________________ 3

ELECTRICAL CHARACTERISTICS (continued)

(Figure 1, DVCC= +1.8V, VCC= +3.0V or +5.0V, SHDN = DVCC, CIN = RIN = GND or DVCC, IO = VCC, DATA = DDRV = DVCC,
C

IO

= C

CLK

= C

RST

= C

DATA

= 30pF, TA= 0°C to +85°C, unless otherwise noted. Typical values are at TA= +25°C.)

UNITS

DVCC= 2.7V

DVCC= 2.25V

CONDITIONS

DVCC= 1.7V

DVCC= 1.425V

DVCC= 2.25V

DVCC= 1.7V

DVCC= 1.425V

MIN TYP MAXSYMBOLPARAMETER

Output Low Level V

OL(DATA)

IO = GND, I

SINK

= 100µA

0.4

V

DVCC= 3.0V, IO = GND, I

SINK

= 200µA

0.4

V

Output High Level

I

SOURCE

= 10µA

0.7 · DV

CC

V

DVCC= 3.0V, I

SOURCE

= 20µA

0.7 · DV

CC

V

V

OH(DATA)

IO Pull-Up Resistance R

IO

Between IO and V

CC

6.5 10 14

kΩ

Input Low Threshold V

IL(IO)IIL(MAX)

= 1mA (Note 1)

0.3

V

Input High Threshold V

IH(IO)IIH(MAX)

= ±20µA (Note 2)

0.7 · V

CC

V

Input Low Current I

IL

1

mA

Input High Current I

IH

20

µA

Output Low Level V

OL(IO)

DATA = GND or DDRV = GND,
I

SINK

= 200µA

0.4

V

Output High Level V

OH(IO)ISOURCE

= 20µA

0.8 · V

CC

V

Shutdown Output Levels
(IO, CLK, RST)

I

SINK

= 200µA, SHDN = GND, DATA = CIN =

RIN = DV

CC

(MAX1740 only)

0.4

V

I

SINK

= 200µA, DVCC= GND, SHDN
(MAX1740) = DDRV (MAX1741) = DATA =
CIN = RIN = DV

CC

0.4

V

I

SINK

= 200µA, VCC= GND, SHDN
(MAX1740) = DDRV (MAX1741) = DATA =
CIN = RIN = DV

CC

0.4

V

Maximum CLK Frequency
(Notes 3, 4)

f

CLK

VCC= 2.7V to 5.5V

5

MHz

5

5

3.5

VCC= 2.25V to 3.6V

4

4

3.5

IO INPUT/OUTPUT

SHUTDOWN OUTPUT LEVELS

TIMING

MAX1740/MAX1741

SIM/Smart Card Level Translators
in µMAX

4 _______________________________________________________________________________________

ELECTRICAL CHARACTERISTICS

(Figure 1, DVCC= +1.8V, VCC= +3.0V or +5.0V, SHDN = DVCC, CIN = RIN = GND or DVCC, IO = VCC, DATA = DDRV = DVCC,
C

IO

= C

CLK

= C

RST

= C

DATA

= 30pF, TA= -40°C to +85°C, unless otherwise noted.) (Note 5)

UNITS

µAI

DVCC

DVCCOperating Current

µA

DVCCOperating Range DV

CC

1.425 5.5

V

VCCOperating Range V

CC

2.25 5.5

V

I

VCC

VCCOperating Current

CIN static

1

CIN static

1.5

CONDITIONS

Total Shutdown Current I

OFF

I

OFF

= I

VCC

+ I

DVCC

, SHDN = GND

(MAX1740 only), or DV

CC

= GND

or VCC= GND

2

µA

I

SOURCE

= 200µA

0.8 · V

CC

V

IO Pull-Up Resistance R

IO

Between IO and V

CC

6.5 14

Digital Input Low Threshold V

IL

0.2 · DV

CC

V

kΩ

Input Low Threshold V

IL(IO)

Input Leakage Current

1

µA

Digital Output Low Level V

OL

I

SINK

= 200µA

0.4

V

Digital Output High Level V

OH

I

SOURCE

= 20µA

0.9 · V

CC

MIN MAXSYMBOLPARAMETER

DATA Pull-Up Resistance R

DATA

Between DATA and DV

CC

13 28

kΩ

I

IL(MAX)

= 1mA (Note 1)

0.3

Input Low Threshold

V

(Note 1) 0.3 VV

IL(DATA)

Output Low Level

Input High Threshold V

IH(DATA)

(Note 2)

DV

CC

-

0.6

V

Output Low Level V

OL(DATA)

IO = GND, I

SINK

= 100µA

0.4

V

DVCC= 3.0V, IO = GND, I

SINK

= 200µA

0.4

V

Output High Level V

OH(DATA)

I

SOURCE

= 10µA

0.7 · DV

CC

V

DVCC= 3.0V, I

SOURCE

= 20µA

0.7 · DV

CC

V

V

OL(IO)

DATA = GND or DDRV = GND, I

SINK

= 200µA

0.4

V

Input High Threshold V

IH(IO)IIH(MAX)

= ±20µA (Note 2)

0.7 · V

CC

V

Output High Level V

OH(IO)ISOURCE

= 20µA

0.8 · V

CC

V

Digital Input High Threshold V

IH

0.75 · DV

CC

V

Input Low Current I

IL

VCC= 5.0V

1

mA

Input High Current I

IH

2

µA

Input Low Current I

IL

1

mA

Input High Current I

IH

20

µA

POWER SUPPLIES

CIN, RIN, SHDN, DDRV LOGIC INPUTS

CLK, RST OUTPUTS

DATA INPUT/OUTPUT

IO INPUT/OUTPUT

MAX1740/MAX1741

SIM/Smart Card Level Translators

in µMAX

_______________________________________________________________________________________ 5

ELECTRICAL CHARACTERISTICS (continued)

(Figure 1, DVCC= +1.8V, VCC= +3.0V or +5.0V, SHDN = DVCC, CIN = RIN = GND or DVCC, IO = VCC, DATA = DDRV = DVCC,
C

IO

= C

CLK

= C

RST

= C

DATA

= 30pF, TA= -40°C to +85°C, unless otherwise noted.) (Note 5)

UNITSCONDITIONS

I

SINK

= 200µA, SHDN = GND, DATA =
CIN = RIN = DV

CC

(MAX1740 only)

0.4

MIN MAXSYMBOLPARAMETER

V

Note 1: VILis defined as the voltage at which the output (DATA/IO) voltage equals 0.5V.
Note 2: V

IH

is defined as the voltage at which the output (DATA/IO) voltage exceeds the input (IO/DATA) voltage by 100mV.

Note 3: Timing specifications are guaranteed by design, not production tested.
Note 4: The maximum CLK frequency is defined as the output duty cycle remaining in the 40% to 60% range when the 50% CIN is

applied. CIN has 5ns rise and fall times; levels are GND to DV

CC

. Input and output levels are measured at 50% of the waveform.

Note 5: Specifications to -40°C are guaranteed by design, not production tested.

Typical Operating Characteristics

(Circuit of Figure 1, DVCC= 3.0V, VCC= 5.0V, DDRV or DATA = DVCC, RIN = CIN = GND, TA= +25°C, unless otherwise noted.)

0.5

0.7

0.9

1.1

1.3

1.7

1.5

-40 -15 10 35 60 85

TOTAL OPERATING SUPPLY

CURRENT vs. TEMPERATURE

MAX1740toc03

TEMPERATURE (°C)

SUPPLY CURRENT, I

VCC

+ I

DVCC

(mA)

V

DVCC

= 3.0V, fIN = 3.25MHz, CIN CLOCKED

WITH A 0 TO 3V SQUARE WAVE

DATA OR DDRV = DV

CC

V

VCC

= 3.0V

DATA OR DDRV = DV

CC

V

VCC

= 5.0V

f

DATA

= f

CIN

/372

V

VCC

= 5.0V

f

DATA

= f

CIN

/372

V

VCC

= 3.0V

0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

TOTAL OPERATING SUPPLY CURRENT

vs. SUPPLY VOLTAGE (VCC)

MAX1740/1toc01

VCC (V)

SUPPLY CURRENT, I

VCC

+ I

DVCC

(mA)

DATA OR DDRV = DV

CC

f

CIN

= 3.25MHz

DATA OR DDRV = DV

CC

f

CIN

= 1.625MHz

f

DATA

= f

CIN

/372

f

CIN

= 1.625MHz

f

DATA

= f

CIN

/372

f

CIN

= 3.25MHz

V

DVCC

= 3.0V
CIN CLOCKED WITH A
0 TO 3V SQUARE WAVE

0

0.5

1.0

1.5

2.0

2.5

0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

TOTAL OPERATING SUPPLY

CURRENT vs. CLOCK FREQUENCY

MAX1740toc02

f

CIN

(MHz)

SUPPLY CURRENT, I

VCC

+ I

DVCC

(mA)

V

DVCC

= 3.0V
CIN CLOCKED WITH A
0 TO 3V SQUARE WAVE

DATA OR DDRV = DV

CC

V

VCC

= 5.0V

DATA OR DDRV = DV

CC

V

VCC

= 5.0V

f

DATA

OR f

CIN

/372

V

VCC

= 5.0V

f

DATA

OR f

CIN

/372

V

VCC

= 5.0V

DVCC= 2.7V

VCC= 2.7V to 5.5V

DVCC= 1.7V

DV

CC

= 1.425V

DV

CC

= 2.25V

DVCC= 1.7V

DVCC= 2.25V

5

DVCC= 1.425V

3.5

Maximum CLK Frequency

(Notes 3, 4)

f

CLK

5

MHz

5

3.5

VCC= 2.25V to 3.6V

4

4

I

SINK

= 200µA, DVCC= GND, SHDN
(MAX1740) = DDRV (MAX1741) = DATA =
CIN = RIN = DV

CC

0.4

V

I

SINK

= 200µA, VCC= GND, SHDN
(MAX1740) = DDRV (MAX1741) = DATA =
CIN = RIN = DV

CC

0.4

V

SHUTDOWN OUTPUT LEVELS

TIMING

Shutdown Output Levels
(IO, CLK, RST)

MAX1740/MAX1741

SIM/Smart Card Level Translators
in µMAX

6 _______________________________________________________________________________________

Typical Operating Characteristics (continued)

(Circuit of Figure 1, DVCC= 3.0V, VCC= 5.0V, DDRV or DATA = DVCC, RIN = CIN = GND, TA= +25°C, unless otherwise noted.)

40ns/div

CIN TO CLK WAVEFORM

3V

0

0

5V

CIN
1V/div

CLK
2V/div

MAX1740/1toc04

f

CIN

= 3.25MHz

40ns/div

RIN TO RST WAVEFORM

0

0

3V

5V

RIN
1V/div

RST
2V/div

MAX1740/1toc05

f

RIN

= 3.25MHz

1ms/div

UNDERVOLTAGE

SHUTDOWN WAVEFORM

0

1V

1.5V

V

CC

0.5V/div

CLK, RST, OR IO

0.5V/div

0

MAX1740/1toc08

1µs/div

DDRV TO IO AND DATA WAVEFORM

(MAX1741 ONLY)

3V

5V

0

0

3V

0

DDRV
2V/div

DATA
2V/div

IO
2V/div

MAX1740/1toc09

MAX1740/MAX1741

SIM/Smart Card Level Translators

in µMAX

_______________________________________________________________________________________ 7

NAME

2 2 DV

CC

3 3 CIN

4 4 RIN

— 5 DDRV

8 8 CLK

7 7 RST

6 6 GND

5 —

SHDN

10 10 IO

9 9 V

CC

Pin Description

Card-Side Bidirectional Input/Output. An open-drain output with a 10kΩ pull-up resistor to
VCC. For bidirectional data transfer, connect to an open-drain card output capable of sink­ing 1mA while pulling IO low. Actively pulled low during shutdown.

Supply Voltage for Card-Side Digital Pins. Set at +2.25V to +5.5V. Proper supply bypass­ing is required to meet ±10kV ESD specifications.

Clock Output to Card. Actively pulled low during shutdown.

Reset Output to Card. Actively pulled low during shutdown.

System Controller and Card Ground

Shutdown Mode Input. Driving SHDN low reduces the total supply current to less than
2µA. In shutdown mode, RST, CLK, and IO are actively pulled low and the transfer gate
between DATA and IO is disabled. When not used, connect SHDN to DV

CC

.

Optional System Controller Data Input. Connect to controllers without an open-drain out­put. When not used, connect DDRV to DVCC.

System Controller Reset Input

System Controller Clock Input

Supply Voltage for System Controller Digital Pins. Set at +1.425V to +5.5V.

FUNCTION

1 DATA1

System Controller Data Input/Output. An open-drain input/output with a 20kΩ pull-up
resistor to DVCC. For bidirectional data transfer, connect to an open-drain controller output
capable of sinking 1mA while pulling DATA low. If the controller is not open drain, use
DDRV to send data and DATA to receive data.

MAX1740 MAX1741

PIN

Detailed Description

The MAX1740/MAX1741 provide the necessary level
translation for interfacing with subscriber identity mod­ules (SIMs) and smart cards in multivoltage systems.
These devices operate with logic supply voltages
between +1.425V and +5.5V on the controller side
(DVCC) and between +2.25V and +5.5V on the card side
(VCC). The total supply current (I

DV

CC

+ I

V

CC

) is 2.5µA
(max) while operating in an idle state (see Electrical
Characteristics). Figure 2 shows a typical application cir­cuit and functional diagram.

Level Translation

The MAX1740/MAX1741 provide level translators for a
clock input, a reset input, and a bidirectional data
input/output. The clock and reset inputs (CIN and RIN)
are level shifted from the controller-side supply rails
(DVCCto GND) to the card-side supply rails (VCCto
GND). When connected to an open-drain controller out­put, DATA and IO provide bidirectional level translation.

Figure 1. MAX1740/MAX1741 Test Circuit

MAX1740

+1.8V

30pF

*

SHDN FOR MAX1740 ONLY
DDRV FOR MAX1741 ONLY

NOTE: ALL CAPACITANCES INCLUDE CAPACITIVE LOADS OF
TEST PROBES AND BOARD LAYOUT.

DV

CC

SHDN*

RIN
CIN
DDRV*
DATA

MAX1741

V

RST

CLK

GND

CC

IO

30pF

+3.0V OR
+5.0V

30pF 30pF

MAX1740/MAX1741

All level translation is valid for DVCC≥ VCCor DVCC≤
VCC. The MAX1740/MAX1741 contain internal pull-up
resistors from DATA to the controller-side supply
(DVCC) and from IO to the card-side supply (VCC). For
push-pull controller outputs, see the Data Driver section
for bidirectional data translation.

Data Driver (MAX1741 only)

When using a microcontroller (µC) without an open-drain
output, use the data driver (DDRV) input to send data to
the SIM/smart card, while DATA provides the controller­side output for bidirectional data transfer. When not
used, connect DDRV to DVCCto reduce total supply cur­rent.

Shutdown Mode

For the MAX1740, drive SHDN low to activate shut­down. Connect SHDN to DVCCor drive high for normal
operation. To allow for card insertion and removal, shut­down mode actively pulls CLK, RST, and IO low; it also
disconnects the internal 10kΩ pull-up resistor from V

CC

to prevent excessive current draw. Shutdown mode
reduces the total supply current (I

DVCC

+ I

VCC

) to

0.01µA.

SIM/Smart Card Insertion/Removal

The SIM/smart card specifications require that the
card-side pins (V

CC

, CLK, RST, IO) be at ground
potential prior to inserting the SIM/smart card. For
applications using the MAX1686H (Figure 4), the easi-

est way to achieve this is by shutting down the
MAX1686H or by driving SHDN (MAX1740 only) low. If
specific sequencing is desired, pull IO low by driving
either DATA or DDRV (MAX1741 only) low, and pull
CLK and RST low by driving CIN and RIN low, respec­tively.

ESD Protection

As with all Maxim devices, ESD-protection structures
on all pins protect against electrostatic discharges
(ESDs) encountered during handling and assembly.
For further protection during card insertion and
removal, the pins that connect to the card socket (CLK,
RST, IO, V

CC

, and GND) provide protection against
±10kV of ESD, according to the Human Body Model.
The ESD structures withstand high ESD in all states:
normal operation, shutdown, and power-down. After an
ESD event, the MAX1740/MAX1741 continue working
without latchup.

ESD Test Conditions

ESD performance depends on a variety of conditions.
Contact Maxim for a reliability report documenting test
setup, test methodology, and test results.

Human Body Model

Figure 3a shows the Human Body Model, and Figure
3b shows the current waveform it generates when dis­charged into a low impedance. This model consists of
a 100pF capacitor charged to the ESD voltage of inter-

SIM/Smart Card Level Translators
in µMAX

8 _______________________________________________________________________________________

Figure 2. Typical Application Circuit and Functional Diagram

DV

CC

DV

1µF

CC

RIN

CIN

DATA

SHDN*

DDRV*

20k 10k

SHUTDOWN

CONTROL

MAX1740
MAX1741

DV

CC

SYSTEM

CONTROLLER

OPTIONAL

OPTIONAL

GND

*

SHDN FOR MAX1740 ONLY
DDRV FOR MAX1741 ONLY

V

RST

CLK

GND

CC

V

CC

V

CC

RST

1µF

CLK

SIM OR

SMART CARD

IO

IO

GND

MAX1740/MAX1741

SIM/Smart Card Level Translators

in µMAX

_______________________________________________________________________________________ 9

est, which is then discharged into the test device
through a 1.5kΩ resistor.

Applications Information

SIM/Smart Card Interface

To provide 5V when interfacing with a 5V SIM/smart
card, 3V systems require a DC-DC converter. The
MAX1686H +5V regulating charge pump for SIM cards
provides 0V/3V/5V for full compatibility with SIM/smart
card specifications. Figure 4 shows the charge pump
for SIM card applications. Alternatively, the MAX619
generates a regulated 5V from input voltages as low as
2V.

SPI/QSPI/MICROWIRE Interface

The MAX1740/MAX1741 are also useful as 3V/5V level
shifters in SPI, QSPI, and MICROWIRE applications
(Figure 5). On the slave side, connect CLK to SCLK,
RST to CS, and IO to DOUT and DIN. The unidirectional
level shifters transfer chip select and clock signals to
the slave device(s), while the bidirectional level shifter
transfers data.

HIGH-

Figure 3a. Human Body ESD Test Model

Figure 3b. Human Body Model Current Waveform

Figure 4. Using MAX1740/MAX1741 and MAX1686/MAX1686H
Charge Pump for SIM Card Applications

Figure 5. MAX1740/MAX1741 with SPI/QSPI/MICROWIRE
Interfaces

TRANSISTOR COUNT: 114

___________________Chip Information

VOLTAGE

DC

SOURCE

R

C

1M

CHARGE-CURRENT

LIMIT RESISTOR

C

100pF

R

D

1500Ω

DISCHARGE

RESISTANCE

STORAGE

s

CAPACITOR

DEVICE

UNDER

TEST

AMPERES

IP 100%

90%

36.8%

10%

0

0

t

RL

TIME

t

DL

CURRENT WAVEFORM

PEAK-TO-PEAK RINGING

I

r

(NOT DRAWN TO SCALE)

+3.0V

DV

SYSTEM

CONTROLLER

GND

CC

OPTIONAL

OPTIONAL

*

SHDN FOR MAX1740 ONLY
DDRV FOR MAX1741 ONLY

CXN CXP

IN

MAX1686

MAX1686H

3/5

SHDN

MAX1740
MAX1741

DV

CC

RIN

CIN

DATA

SHDN*

DDRV*

3.0V OR 5.0V

OUT

GND

PGND

V

CC

RST

CLK

IO

GND GND

IO

V

RST

CLK

SIM OR

CC

SMART

CARD

+5.0V

DV

SYSTEM

CONTROLLER

GND

CC

OPTIONAL

OPTIONAL

*

SHDN FOR MAX1740 ONLY
DDRV FOR MAX1741 ONLY

IN

MAX8867
MAX8860

SHDN

DV

CC

RIN

CIN

DATA

SHDN*

DDRV*

MAX1740
MAX1741

OUT

SET

PGND

V

CC

RST

CLK

IO

GND GND

+3.3V

SPI/QSPI/

MICROWIRE

SYSTEM

V

CC

CS

SCLK

DOUT

DIN

MAX1740/MAX1741

SIM/Smart Card Level Translators
in µMAX

10 ______________________________________________________________________________________

________________________________________________________Package Information

Note: The MAX1740/MAX1741 do not have an exposed pad.

10LUMAX.EPS

MAX1740/MAX1741

SIM/Smart Card Level Translators

in µMAX

______________________________________________________________________________________ 11

NOTES

MAX1740/MAX1741

SIM/Smart Card Level Translators
in µMAX

Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.

12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600

© 2000 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.

NOTES