Datasheet MAX1609EEE, MAX1608EEE Datasheet (Maxim)

General Description
The MAX1608/MAX1609 provide remote input/output (I/O) expansion through an SMBus™ 2-wire serial interface. Each device has eight high-voltage open-drain outputs that double as TTL-level logic inputs, providing continuous bidirectional capabilities. The open-drain outputs tailor the MAX1608/MAX1609 for use in load-switching and other level-shifting applications as well as general-purpose I/O applications.
Two complete sets of registers allow the device and its outputs to be toggled between two states using the SMBSUS input, without the inherent latency of reprogram­ming outputs over the serial bus. The eight I/O lines are continuously monitored and can be used as inputs. Each line can generate asynchronous maskable interrupts on the falling edge, the rising edge, or both edges.
For load-switching applications, the MAX1608 is designed to drive N-channel MOSFETs, and its outputs are low upon power-up; the MAX1609 is designed to drive P­channel MOSFETs, and its I/Os are high impedance upon power-up. Other features of both devices include thermal­overload and output-overcurrent protection, ultra-low sup­ply current, and a wide +2.7V to +5.5V supply range. The MAX1608/MAX1609 are available in space-saving 16-pin QSOP packages.
Applications
Parallel I/O Expansion Power-Plane Switching Notebook and Desktop Computers Servers and Workstations Notebook Docking Stations Industrial Equipment
Features
Serial-to-Parallel or Parallel-to-Serial Conversions
8 General-Purpose Digital I/O Pins
(withstand +28V)
SMBus 2-Wire Serial InterfaceSupports SMBSUS Asynchronous Suspend
9 Pin-Selectable Slave Addresses
Outputs High Impedance on Power-Up (MAX1609)
Outputs Low on Power-Up (MAX1608)
2.5µA Supply Current
+2.7V to +5.5V Supply Range
16-Pin QSOP Package
MAX1608/MAX1609
Octal SMBus-to-Parallel I/O Expanders
________________________________________________________________ Maxim Integrated Products 1
19-1639; Rev 0; 1/00
PART
MAX1608EEE
MAX1609EEE
-40°C to +85°C
-40°C to +85°C
TEMP. RANGE PIN-PACKAGE
16 QSOP
16 QSOP
Ordering Information
Typical Operating Circuits
Typical Operating Circuits continued at end of data sheet.
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
IO0 V+
SMBSUS
SMBCLK
ALERT
SMBDATA
ADD1
ADD0
GND
TOP VIEW
MAX1608 MAX1609
QSOP
IO1
IO2
IO5
IO3
IO4
IO6
IO7
Pin Configuration
SMBus is a trademark of Intel Corp.
For free samples and the latest literature, visit www.maxim-ic.com or phone 1-800-998-8800. For small orders, phone 1-800-835-8769.
+2.7V TO +5.5V
V+
MAX1609
100k
0.1µF
100k 100k
P-CH
GND
IO1
IO2
IO3
LOAD1 LOAD2 LOAD3
IO7
TO/
ALERT
SMBDATA
SMBCLK
SMBSUS
ADD1
ADD
SMBUS
FROM
HOST
MAX1608/MAX1609
Octal SMBus-to-Parallel I/O Expanders
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V+ = +2.7V to +5.5V, TA= -40°C to +85°C, unless otherwise noted. Typical values are at TA= +25°C.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
V+ to GND ................................................................-0.3V to +6V
IO_ to GND .............................................................-0.3V to +30V
IO_ Sink Current..................................................-1mA to +50mA
SMBCLK, SMBDATA, SMBSUS
and ALERT to GND .............................................-0.3V to +6V
ADD_ to GND ...............................................-0.3V to (V+ + 0.3V)
SMBDATA and ALERT Sink Current...................-1mA to +50mA
Continuous Power Dissipation (T
A
= +70°C)
16-Pin QSOP (derate 8.3mW/°C above +70°C)...........667mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
10°C typical hysteresis
ALERT forced to 5.5V
Static, all IOs low or pulled to 0
ALERT forced to 0.4V
SMBDATA forced to 0.6V
Static, outputs in any combination of on or off states up to 28V
IO_, SMBSUS, SMBCLK, SMBDATA
IO_, SMBSUS, SMBCLK, SMBDATA
SMBSUS, SMBCLK, SMBDATA (Note 2)
(Note 3)
IO_ forced to 28V
10% or 90% of I/O to 10% of SMBCLK (Note 3)
IO_ to ALERT
IO_, V+ = 4.5V
IO_ forced to 1.0V, V+ = 4.5V
SMBus interface operating, clock frequency = 100kHz
Falling edge of V+
SMBSUS to IO_
IO_ forced to 0.4V
SMBCLK to IO_
CONDITIONS
°C
140
Thermal Shutdown
µA
1
ALERT Output High Leakage Current
mA
1
ALERT Output Low Sink Current
mA
6
SMBus Output Low Sink Current
V
0.8
Logic Input Low Voltage
V
2.1
Logic Input High Voltage
V
0 5.5
SMBus Logic Input Voltage Range
µs
3
IO_ Data Hold Time
µs
10
IO_ Data Set-Up Time
10
1
µs
2.5
Propagation Delay
3.5 9
µA
718
V
2.7 5.5
Supply Voltage Range
Supply Current (Note 2)
µA
0.5 2
I/O Leakage Current
mA
15 25 50
I/O Current Limit
813
7
V
1.2 1.8 2.5
POR Threshold Voltage
mA
2
I/O Sink Current
UNITSMIN TYP MAXPARAMETER
SMBCLK, SMBDATA
SMBDATA, SMBCLK, SMBUS, ADD_
ADD_ during address sampling (POR, SPOR, and RAP) to V+ and GND (Note 4)
pF
5
SMBus Input Capacitance
µA
-1 1
Logic Input Current
k
20
Sample Address Input Impedance
MAX1608/MAX1609
Octal SMBus-to-Parallel I/O Expanders
_______________________________________________________________________________________ 3
TIMING CHARACTERISTICS
(V+ = +2.7V to +5.5V, TA= -40°C to +85°C, unless otherwise noted. Typical values are at TA= +25°C.) (Note 1)
Note 1: Specifications from 0°C to -40°C are guaranteed by design, not production tested. Note 2: For supply current, SMBus logic inputs driven to 0 or V+. Note 3: Data hold and set-up times measured from falling edge of 9th clock. Note 4: Must be driven to GND, V+, or floating. See SMBus Addressing section. Note 5: The SMBus logic block is a static design and will work with clock frequencies down to DC. While slow operation is possible,
it violates the 10kHz minimum clock frequency and SMBus specifications and may use excessive space on the bus.
90% to 90% points
10% to 10% points
(Note 5)
10% or 90% of SMBDATA to 10% of SMBCLK
90% of SMBCLK to 10% of SMBDATA
10% of SMBDATA to 90% of SMBCLK
SMBCLK, SMBDATA; 10% to 90% points
SMBCLK, SMBDATA; 90% to 10% points
90% to 90% points
Master clocking in data
CONDITIONS
µs
3
SMBCLK Falling Edge to SMBDATA Valid Time
µs
4
t
HIGH
SMBCLK Clock High Time
µs
4.7
t
LOW
kHz
DC 100
SMBus Clock Frequency
SMBCLK Clock Low Time
ns
300
t
HD:DAT
SMBus Data Hold Time
ns
250
t
SU:DAT
SMBus Data Valid to SMBCLK Rising Edge Time
µs
4
t
SU:STO
SMBus Stop-Condition Setup Time
µs
4
t
HD:STA
SMBus Start-Condition Hold Time
µs
1
SMBus Rise Time
ns
300
SMBus Fall Time
µs
4.7
SMBus Start-Condition Setup Time
ns
500
t
SU:STA
SMBus Repeated Start­Condition Setup Time
UNITSMIN TYP MAXSYMBOLPARAMETER
0
5.0
2.5
10.0
7.5
12.5
15.0
2.5 3.5 4.03.0 4.5 5.0 5.5
SUPPLY CURRENT vs. SUPPLY VOLTAGE
MAX1608/9 tTOC01
SUPPLY VOLTAGE (V)
SUPPLY CURRENT (µA)
IOs = 1111 1111 PULLED UP TO +28V
IOs = 0000 0000
0
5.0
2.5
10.0
7.5
12.5
15.0
-40 20 40-20 0 60 80 100
SUPPLY CURRENT vs. TEMPERATURE
MAX1608/9 TOC02
TEMPERATURE (°C)
SUPPLY CURRENT (µA)
IOs = 1111 1111 PULLED UP TO +28V
IOs = 0000 0000
0
2
4
6
8
10
12
14
16
021 3456
IO_ SINK CURRENT
vs. SUPPLY VOLTAGE
MAX1608/9 TOC03
SUPPLY VOLTAGE (V)
SINK CURRENT (mA)
V
IO_
= 1.0V
V
IO_
= 0.4V
Typical Operating Characteristics
(V+ = +5V, TA= +25°C, unless otherwise noted.)
MAX1608/MAX1609
Octal SMBus-to-Parallel I/O Expanders
4 _______________________________________________________________________________________
Typical Operating Characteristics (continued)
(V+ = +5V, TA= +25°C, unless otherwise noted.)
IO_ 2V/div
ALERT 5V/div
MAX1608/9 TOC011
40ns/div
IO_ DRIVEN EXTERNALLY
ALERT DELAY
(IO_ RISING)
0
10
5
20
15
35
30
25
40
-40 0-20 20 40 60 80 100
IO_ CURRENT LIMIT vs. TEMPERATURE
MAX1608/9 TOC04
TEMPERATURE (°C)
IO_ CURRENT LIMIT (mA)
IO_ = 0 PULLED UP TO +28V
0
10
5
20
15
25
30
010155 202530
IO_ CURRENT LIMIT vs. IO_ VOLTAGE
MAX1608/9 TOC05
V
IO_
(V)
IO_ CURRENT LIMIT (mA)
V+ = 4.5V IO_ = 0
0
5
10
15
20
25
30
35
40
2.5 3.53.0 4.0 4.5 5.0 5.5
IO_ CURRENT LIMIT vs. SUPPLY VOLTAGE
MAX1608/9 TOC06
SUPPLY VOLTAGE (V)
IO_ CURRENT LIMIT (mA)
V
IO_
= 15V
IO_ = 0
0
0.3
0.2
0.1
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0105 15202530
IO_ BIAS CURRENT vs. IO_ VOLTAGE
MAX1608/9 TOC07
V
IO_
(V)
IO_ BIAS CURRENT (µA)
IO_ = 1
0
0.2
0.6
0.4
0.8
1.0
-40 0-20 20 40 60 80 100
IO_ BIAS CURRENT vs. TEMPERATURE
MAX1608/9 TOC08
TEMPERATURE (°C)
IO_ BIAS CURRENT (µA)
V+ = 5V IO_ = 1 PULLED UP TO 28V
IO_ 10V/div
SMBSUS 5V/div
SUSPEND-STATE DELAY
(IO_ RISING)
MAX1608/9 TOC09
100ns/div
PULL-UP = 10k to 28V
IO_ 10V/div
SMBSUS 5V/div
MAX1608/9 TOC010
100ns/div
SUSPEND-STATE DELAY
(IO_ FALLING)
PULL-UP = 10k to 28V
MAX1608/MAX1609
Octal SMBus-to-Parallel I/O Expanders
_______________________________________________________________________________________ 5
Typical Operating Characteristics (continued)
(V+ = +5V, TA= +25°C, unless otherwise noted.)
IO_ 2V/div
ALERT 5V/div
MAX1608/9 TOC012
200ns/div
IO_ DRIVEN EXTERNALLY
ALERT DELAY (IO_ FALLING)
NAME FUNCTION
1–8 IO0 –IO7 Combined Input/Output. Open-drain output. Can withstand +28V.
9 GND Ground
PIN
10, 11 ADD0, ADD1 SMBus Address Select. See Table 1.
12 SMBDATA SMBus Serial-Data Input/Output. Open-drain output. Requires external pull-up resistor.
16 V+ Supply Voltage Input, +2.7V to +5.5V. Bypass to GND with a 0.1µF capacitor.
15
SMBSUS
SMBus Suspend-Mode Control Input. The device will enter the state previously stored in the suspend-mode registers if low, or enter the state previously stored in the normal-mode registers if high.
14 SMBCLK SMBus Serial Clock Input
13
ALERT
Active-Low Interrupt Output. Open-drain output. Requires external pull-up resistor.
Pin Description
Detailed Description
The MAX1608/MAX1609 convert 2-wire SMBus serial data into eight latched parallel outputs (IO0–IO7). These devices are intended for general-purpose remote I/O expansion. Each device has eight high-voltage open­drain outputs that double as TTL-level logic inputs. Typical applications range from high-side MOSFET load­switch drivers in power-management systems, to push­button switch monitors, to general-purpose digital I/Os.
The MAX1608/MAX1609 include two complete sets of registers, each consisting of one output data register to
set the output states and two interrupt mask registers. The SMBSUS line selects which set of registers control the device state. The input register is used to perform readback of the actual IO states.
The MAX1608/MAX1609 operate from a single +2.7V to +5.5V supply with a typical quiescent current of
2.5µA, making them ideal for portable applications. Additionally, the devices include an ALERT function to alert the master of change of condition (Figure 1).
IO_ POWER-UP RESPONSE
MAX1608
PULL-UP = 10k to V+
MAX1608/9 TOC013
V
IO_
500mV/div
V+ 2V/div
MAX1608/MAX1609
Octal SMBus-to-Parallel I/O Expanders
6 _______________________________________________________________________________________
Figure 1. Functional Diagram
SMBCLK
SMBDATA
ADD0
ADD1
ALERT
SMB
8
ADDRESS DECODER
7
ALERT
RESPONSE
REGISTER
R
FAULT
LATCH
S
8
COMMAND
DECODER
INPUT
REGISTER
NORMAL RISING
INTERRUPT
MASK REGISTER
SUSPEND RISING
INTERRUPT
MASK REGISTER
NORMAL FALLING
INTERRUPT
MASK REGISTER
SUSPEND FALLING
INTERRUPT
MASK REGISTER
NORMAL
OUTPUT
REGISTER
8
8
8
TRANSITION DETECTORS
8
IO1
IO2
IO7
1
1
THERMAL
SHUTDOWN
SUSPEND
OUTPUT
REGISTER
8
SMBSUS
1
MAX1608/MAX1609
Octal SMBus-to-Parallel I/O Expanders
_______________________________________________________________________________________ 7
SMBus Interface Operation
The SMBus serial interface is a 2-wire interface with multi-mastering capability. The MAX1608/MAX1609 are 2-wire slave-only devices and employ standard SMBus write-byte, send-byte, read-byte, and receive-byte protocols (Figure 2) as documented in “System Management Bus Specification v1.08” (available at www.sbs-forum.org). SMBDATA and SMBCLK are Schmitt-triggered inputs that can accommodate slower edges; however, the rising and falling edges should still be faster than 1µs and 300ns, respectively.
Communication starts with the master signaling the beginning of a transmission with a START condition, which is a high-to-low transition on SMBDATA while SMBCLK is high. When the master has finished com­municating with the slave, it issues a STOP condition, which is a low-to-high transition on SMBDATA while SMBCLK is high (Figures 3 and 4). The bus is then free for another transmission from any master on the bus.
The address byte, command byte, and data byte are transmitted between the START and STOP conditions. Figures 3 and 4 show the timing diagrams for signals on the 2-wire interface. The SMBDATA state is allowed to change only while SMBCLK is low, except for the START and STOP conditions. Data is transmitted in 8­bit words and is sampled on the rising edge of SMB­CLK. Nine clock cycles are required to transfer each byte in or out of the MAX1608/MAX1609 (Figure 2), since either the master or the slave acknowledges receipt of the correct byte during the ninth clock. The IC responds to the address selected by the ADD0 and ADD1 pins (Table 1).
If the MAX1608/MAX1609 receive the correct slave address followed by RW = 0, the selected device expects to receive one or two bytes of information. If the device detects a START or STOP condition prior to clocking in a full additional byte of data, it considers this an error condition and disregards all of the data. If no error occurs, the registers are updated immediately after the falling edge of the acknowledge clock pulse (Figure 5). If the MAX1608/MAX1609 receive the cor­rect slave address followed by RW = 1, the selected device expects to clock out the contents of the previ­ously accessed register during the next byte transfer.
A third interface line (SMBSUS) is used to execute com­mands asynchronously from previously stored registers (see
SMBSUS
(Suspend-Mode) Input section).
SMBus Addressing
After the START condition, the master transmits a 7-bit address followed by the RW bit (Figure 2). If the
MAX1608/MAX1609 recognizes its own address, it sends an acknowledgment pulse by pulling SMBDATA low.
Each slave responds to only two addresses: its own unique address (set by ADD1 and ADD0, Table 1), and the alert response address (0x19). The device’s unique address is determined at power-up, with a software sample-address-pin command (SAP), or a software power-on-reset command (SPOR). The MAX1608/ MAX1609 address pins (ADD1–ADD0) are high imped­ance except when ADD1–ADD0 are sampled, which occurs during power-up and when requested (SPOR, RAP). During sampling, the equivalent input circuit can be described as a resistor-divider from V+ to GND (20keach), which momentarily bias the pins to mid­supply if they are left floating. To set the ADD_ pins high or low, connect or drive the pins to the rails (V+ or GND) to guarantee a correct level detection. During sampling, the pins draw a momentary input bias cur­rent (V+ / 20k). Also, stray capacitance in excess of 50pF on the ADD_ pins when floating may cause address recognition problems.
SMBus Commands
The 8-bit command byte (Table 2) is the master index that points to the registers within the MAX1608/MAX1609. The devices include ten registers: the data registers (NDR1–NDR3, SDR1–SDR3) are accessed through both the read-byte and write-byte protocols (Figure 2), the RSB and MDIF registers are accessed with the read-byte protocols, and the RAP and SPOR registers
GND 0010 100
GND V+ 0010 110
High-Z GND 1100 100
GND
High-Z High-Z 1100 101
High-Z V+ 1100 110
V+ V+ 0111 010
ADD1
ADDRESS (A6–A0)
ADD0
V+ High-Z 0111 001
V+ GND 0111 000
High-Z 0010 101GND
MAX1608 MAX1609
0110 010
0100 100
0100 110
1101 100
1101 101
1101 110
0110 001
0110 000
0100 101
Table 1. Slave Addresses
MAX1608/MAX1609
use the send-byte protocol. The shorter receive-byte protocol can be used instead of the read-byte protocol, provided the correct data register was previously selected by a read-byte or write-byte instruction. Use caution with the shorter protocols in multimaster sys­tems, since a second master could overwrite the com­mand byte without informing the first master. The register selected at POR is 0b0000 0000 so that a receive-byte transmission that occurs immediately after initial power-up returns the setting of NDR1. SPOR does not reset the register pointer.
Data Registers
The MAX1608/MAX1609 each have seven data regis­ters, three normal registers, three suspend registers, and one readback register. The SMBUS line deter­mines which registers controls the output states and the interrupt mask states (normal registers if SUSBUS = 1, suspend registers if SMBSUS = 0).
Registers 1 (NDR1 and SDR1) set the state of each of the eight outputs to either low or high impedance.
When using an external pull-up, high impedance corre­sponds to an output high. To use the IO_ pins as TTL inputs only, set the corresponding bit high. The MAX1608 powers up with all IO_ pins set low; the MAX1609 powers up with all IO_ pins set to high impedance (Table 3).
Register 2 (NDR2 and SDR2) are used to mask rising­edge triggered interrupts, while Register 3 are used to mask falling-edge triggered interrupts. On power-up, all interrupts are masked (Tables 4 and 5).
The IO_ Status Data Register (RSB, Table 6) reads the actual TTL-logic level of the IO_ pins. The IO_ pins are sampled on the falling edge of the third byte’s acknowl­edge (ACK) for a read-byte format, or on the falling edge of the first byte’s ACK for a receive-byte protocol (Figure 5). There is a 15µs data-setup time require­ment, due to the slow level translators needed for high­voltage (28V) operation. Data-hold time is 300ns. Do not write to the RSB register because writes to read­only registers are redirected to NDR1. SMBus sends
Octal SMBus-to-Parallel I/O Expanders
8 _______________________________________________________________________________________
1b
ACK
1b7 bits
ADDRESS ACK
1b
WR
8 bits
DATA
1b
ACK P
8 bits
S COMMAND
Write-Byte Format
Receive-Byte Format
Slave Address Command Byte: selects
which register you are writing to
Data Byte: data goes into the register set by the command byte
1b
ACK
1b7 bits
ADDRESS ACK
1b
WR S
1b
ACK
8 bits
DATA
7 bits
ADDRESS1bRD
1b8 bits
/// PS COMMAND
Slave Address
Slave Address
Command Byte: sends command with no data; usually used for one­shot command
Command Byte: selects which register you are reading from
Slave Address: repeated due to change in data­flow direction
Data Byte: reads from the register set by the command byte
1b
ACK
7 bits
ADDRESS1bRD
8 bits
DATA
1b
/// PS
Data Byte: reads data from the register commanded by the last read-byte or write-byte transmission; also used for SMBus Alert Response return address
S = Start condition Shaded = Slave transmission WR = Write = 0 P = Stop condition Ack= Acknowledged = 0 RD = Read =1
/// = Not acknowledged = 1
Figure 2. SMBus Protocols
1b
ACK
7 bits
ADDRESS1bWR
8 bits
COMMAND1bACK PS
Send-Byte Format
Read-Byte Format
data MSB first; therefore, IO7, MASK7, and data 7 bit correspond to the MSB (first bit of the data byte).
Other Registers
RAP uses the send-byte protocol to resample the address pins. Do not use read- and write-byte proto­cols to RAP because data is redirected to NDR1 although the ADD_ pins will be sampled.
SPOR uses the send-byte protocol to resample the address pins and reset the registers to the POR state. Do not use read- and write-byte protocols to SPOR because data is redirected to NDR1 although the func­tion will be performed.
MFID uses the read-byte protocol to access the ID reg­ister. Do not use write-byte protocol to MFID because data is redirected to NDR1.
SMBSUS
(Suspend-Mode) Input
The state of the SMBSUS input selects which register contents (NDR1 or SDR1) are applied to the IO_ pins and which set of registers are used to mask the inter­rupts (NDR2, NDR3 or NDR2, SDR3). Driving SMBSUS low selects the suspend-mode registers, while driving SMBSUS high selects the normal registers. This feature allows the system to select between two different I/O
MAX1608/MAX1609
Octal SMBus-to-Parallel I/O Expanders
_______________________________________________________________________________________ 9
SMBCLK
Figure 3. SMBus Write Timing
Figure 4. SMBus Read Timing
SMBDATA
AB CDEFG HIJ
t
LOWtHIGH
t
t
SU:STA
HD:STA
t
SU:DAT
t
HD:DAT
t
HD:DAT
K
t
SU:STO
M
L
t
BUF
A = START CONDITION B = MSB OF ADDRESS CLOCKED INTO SLAVE C = LSB OF ADDRESS CLOCKED INTO SLAVE D = R/W BIT CLOCKED INTO SLAVE E = SLAVE PULLS SMBDATA LINE LOW
AB CDEFG H
t
LOW
SMBCLK
SMBDATA
t
SU:STAtHD:STA
A = START CONDITION B = MSB OF ADDRESS CLOCKED INTO SLAVE C = LSB OF ADDRESS CLOCKED INTO SLAVE D = R/W BIT CLOCKED INTO SLAVE
t
HIGH
F = ACKNOWLEDGE BIT CLOCKED INTO MASTER G = MSB OF DATA CLOCKED INTO SLAVE H = LSB OF DATA CLOCKED INTO SLAVE I = SLAVE PULLS SMBDATA LINE LOW
t
SU:DAT
E = SLAVE PULLS SMBDATA LINE LOW F = ACKNOWLEDGE BIT CLOCKED INTO MASTER G = MSB OF DATA CLOCKED INTO MASTER H = LSB OF DATA CLOCKED INTO MASTER
t
HD:DAT
J = ACKNOWLEDGE CLOCKED INTO MASTER K = ACKNOWLEDGE CLOCK PULSE L = STOP CONDITION, DATA EXECUTED BY SLAVE M = NEW START CONDITION
t
SU:STO
J
K
t
BUF
I
t
SU:DAT
I = ACKNOWLEDGE CLOCK PULSE J = STOP CONDITION K = NEW START CONDITION
MAX1608/MAX1609
configurations asynchronously, eliminating latencies introduced by the serial bus.
ALERT
The MAX1608/MAX1609 can generate hardware inter­rupts whenever the logic states of the IO_ pins change or when thermal shutdown occurs. Interrupts are sig­naled on the ALERT pin. The IO_ interrupts can be masked individually through the mask registers. Registers NDR2 and SDR2 mask the IO_ rising-edge interrupts, while NDR3 and SDR3 mask the IO_ falling­edge interrupts. The power-on-reset state masks all interrupts (Tables 4 and 5).
The thermal-shutdown protection also generates an interrupt. This interrupt cannot be masked (see Thermal Shutdown section). An interrupt can be cleared with a SPOR or an Alert Response. However, after an interrupt has occurred, masking will not clear it.
Alert Response Address (0b00011001)
The alert response (interrupt pointer) address provides quick fault identification for simple slave devices that cannot initiate communication as a bus master. When a slave device generates an interrupt, the host (bus mas­ter) interrogates the bus slave devices through a special receive-byte operation that includes the alert response address (0x19). The offending slave device returns its own address during this receive-byte operation.
The interrupt pointer address can activate several dif­ferent slave devices simultaneously. If more than one
Octal SMBus-to-Parallel I/O Expanders
10 ______________________________________________________________________________________
Figure 5. Registers/IO_ Update Timing Diagram
NDR2 01h 1111 1111
NDR3 02h 1111 1111
SDR1 03h 0000 0000
SDR2 04h 1111 1111
RAP 07h
COMMAND
POR STATE
REGISTER
RSB 06h
SDR3 05h 1111 1111
00h 0000 0000NDR1
08h
MAX1608
MAX1609
1111 1111
1111 1111
1111 1111
1111 1111
SPOR
1111 1111
1111 1111
Sample the address pins.
Normal Data Register 2. Masks the L/H interrupt.
Normal Data Register 3. Masks the H/L interrupt.
Suspend Data Register 1. Sets the IO_ states.
Suspend Data Register 2. Masks the L/H interrupt.
IO_ Status Data Register. Read pin state.
Suspend Data Register 3. Masks the H/L interrupt.
Normal Data Register 1. Sets the IO_ states.
FUNCTION
FEh 4DhMFID
4Dh
Execute software POR and samples address pins.
Read manufacturer ID (ASCII code for "M"axim).
Table 2. Command-Byte/Register Assignment
LAST BIT
CLOCKED
INTO SLAVE**
SCL
SDA
IO_
*NDR#, SDR# ARE LOADED. RAP, SPOR ARE INITIATED. RSB IS SAMPLED.
**DURING A RECEIVE-BYTE PROTOCOL, CORRESPONDS TO THE R/W BIT. DURING A READ/WRITE-BYTE PROTOCOL, CORRESPONDS TO LAST BIT OF DATA.
ACKNOWLEDGE
BIT CLOCKED INTO MASTER
t
DH:DAT
SLAVE PULLING
SDA LOW
REGISTERS UPDATED*
t
DH:DAT
t
SCL:IO
STOP
IO_TRANSITION
slave attempts to respond, bus arbitration rules apply, with the lowest address code going first. The other device(s) will not generate an acknowledge and will continue to hold the ALERT pin low until it is allowed to clear its own interrupt.
Clearing the interrupt has no effect on the state of the status registers.
Input/Output Pins
Each IO_ pin is protected by an internal 20mA (typical) current-limit circuit. Typical pull-down on-resistance at V
CC
= +2.7V and +5.5V is 100and 66, respectively.
When the IO_ is high impedance, it actually has a
0.5µA pull-down current source included as part of the read-back functionality.
External pull-up resistors and IO_ sink capability can affect the outputs’ rise and fall times. When using the MAX1608/MAX1609 to control an external MOSFET in power-switching applications, pull-up and/or series resis­tance can be used together with the MOSFET’s gate capacitance or additional external capacitance (Figure 6) to control the transition time of the switched source.
The input logic levels are TTL compatible and are sam­pled during a readback SMBus transmission (see RSB register in Data Registers section ).
Power-On Reset
The MAX1608/MAX1609’s power-on-reset circuit ensures that the IO_ states are defined when V+ is first applied or when the supply dips below the UVLO
MAX1608/MAX1609
Octal SMBus-to-Parallel I/O Expanders
______________________________________________________________________________________ 11
POR STATE
7 IO7 0
6 IO6 0
5 IO5 0
4 IO4 0
1 IO1 0
NAMEBIT
2 IO2 0
3 IO3 0
IO0
MAX16080MAX1609
1
1
1
1
1
0
1
1
Sets IO1 state. 0 = on (low state), 1 = off (high-impedance).
Sets IO7 state. 0 = on (low state), 1 = off (high-impedance).
Sets IO6 state. 0 = on (low state), 1 = off (high-impedance).
Sets IO5 state. 0 = on (low state), 1 = off (high-impedance).
Sets IO4 state. 0 = on (low state), 1 = off (high-impedance).
Sets IO2 state. 0 = on (low state), 1 = off (high-impedance).
Sets IO3 state. 0 = on (low state), 1 = off (high-impedance).
FUNCTION
1 Sets IO0 state. 0 = on (low state), 1 = off (high-impedance).
Table 3. Data Register 1 (NDR1 and SDR1) Bit Assignments (read or write)
POR STATE
7 MASKH7 1
6 MASKH6 1
5 MASKH5 1
4 MASKH4 1
1 MASKH1 1
NAMEBIT
2 MASKH2 1
3 MASKH3 1
MASKH0 10
Masks IO1 low-to-high interrupt. 0 = interrupts, 1 = masked.
Masks IO7 low-to-high interrupt. 0 = interrupts, 1 = masked.
Masks IO6 low-to-high interrupt. 0 = interrupts, 1 = masked.
Masks IO5 low-to-high interrupt. 0 = interrupts, 1 = masked.
Masks IO4 low-to-high interrupt. 0 = interrupts, 1 = masked.
Masks IO2 low-to-high interrupt. 0 = interrupts, 1 = masked.
Masks IO3 low-to-high interrupt. 0 = interrupts, 1 = masked.
FUNCTION
Masks IO0 low-to-high interrupt. 0 = interrupts, 1 = masked.
Table 4. Data Register 2 (NDR2 and SDR2) Bit Assignments (read or write)
threshold. The power-on states can also be reset with the SPOR command through the SMBus.
The MAX1608’s outputs reset to a low state, while the MAX1609’s outputs reset to a high-impedance state. Below V+ = 0.8V (typical), the POR states can’t be enforced, and the I/O pins of both devices exhibit increasingly weak pull-down current capability, eventu­ally becoming high impedance.
The MAX1608 is designed for applications that control N-channel MOSFETs, while the MAX1609 is designed to control P-channel MOSFETs. The power-on state keeps the external MOSFETs off at power-up. Both devices are suited for applications that use the parallel input for serial functionality, although IO_s serving as inputs must first be programmed to high impedance when using the MAX1608.
Thermal Shutdown
These devices have internal thermal-shutdown circuitry that sets all outputs to a high-impedance state (IO_ pins) when the junction temperature exceeds +140°C typical. Thermal shutdown only occurs during an over­load condition on the IO_ pins. The device cycles between thermal shutdown and the overcurrent condi­tion (with 10°C hysteresis) until the overload condition is removed. The device asserts ALERT low while it is in thermal shutdown, indicating this fault status. ALERT will be reasserted immediately after it is cleared if the device is still hot. ALERT can only be completely cleared once the fault condition is removed and the device has cooled. Alternatively, forcing the IO_ to high impedance will allow the junction to cool down.
MAX1608/MAX1609
Octal SMBus-to-Parallel I/O Expanders
12 ______________________________________________________________________________________
POR STATE
7 MASKL7 1
6 MASKL6 1
5 MASKL5 1
4 MASKL4 1
1 MASKL1 1
NAMEBIT
2 MASKL2 1
3 MASKL3 1
MASKL0 10
Masks IO1 high-to-low interrupt. 0 = interrupts, 1 = masked.
Masks IO7 high-to-low interrupt. 0 = interrupts, 1 = masked.
Masks IO6 high-to-low interrupt. 0 = interrupts, 1 = masked.
Masks IO5 high-to-low interrupt. 0 = interrupts, 1 = masked.
Masks IO4 high-to-low interrupt. 0 = interrupts, 1 = masked.
Masks IO2 high-to-low interrupt. 0 = interrupts, 1 = masked.
Masks IO3 high-to-low interrupt. 0 = interrupts, 1 = masked.
FUNCTION
Masks IO0 high-to-low interrupt. 0 = interrupts, 1 = masked.
Table 5. IO_ Status Data Register (RSB) Bit Assignments (read only)
Table 6. Data Register 3 (NDR3 and SDR3) Bit Assignments (read or write)
7 DATA7
6 DATA6
5 DATA5
4 DATA4
1 DATA1
NAMEBIT
2 DATA2
3 DATA3
DATA00
Indicates the current state of IO1. 1 = high, 0 = low.
Indicates the current state of IO7. 1 = high, 0 = low.
Indicates the current state of IO6. 1 = high, 0 = low.
Indicates the current state of IO5. 1 = high, 0 = low.
Indicates the current state of IO4. 1 = high, 0 = low.
Indicates the current state of IO2. 1 = high, 0 = low.
Indicates the current state of IO3. 1 = high, 0 = low.
FUNCTION
Indicates the current state of IO0. 1 = high, 0 = low.
Application Examples
P-Channel/N-Channel High-Side Load
Switch with Controlled Turn-On
In load-switching applications, when a controlled volt­age ramp or inrush current limiting is required, add a series resistor to slow the switch turn-on and turn-off times. The external MOSFET gate has a typical capaci­tance of 150pF to 2000pF, but an optional external capacitance can be added to further slow the switching time (Figure 6). If a slow turn-on time is required, simply use an N-channel MOSFET with a high-value pull-up resistor and no series resistor. Similarly, if a fast turn-on and a slow turn-off are desired, use a P-channel MOS­FET with a high-value pull-up resistor and no series resistor.
Battery Switch with
Back-to-Back MOSFETs
Many battery-operated applications use back-to-back MOSFETs to prevent reverse currents from the load to the supply (Figure 7). This protects the battery from potential damage and isolates the load from the power source.
LED Driver
A MAX1608/MAX1609 can be used as programmable LED drivers (Figure 8). With their low quiescent current, these devices are ideal for use as indicator light drivers on the front panel of a notebook computer.
MAX1608/MAX1609
Octal SMBus-to-Parallel I/O Expanders
______________________________________________________________________________________ 13
Figure 6. Load Switch with Controlled Turn-On
+5V
TO/FROM
HOST
+5V
TO/FROM
HOST
10k
10k
10k
10k
10k
10k
0.1µF
MAX1609
ALERT
SMBDATA
SMBCLK
SMBSUS
ADD0
ADD1
V+
GND
ALERT
SMBDATA
SMBCLK
SMBSUS ADD0
ADD1
IO0
IO1
IO2
IO7
V+
MAX1608
GND
IO0
IO1
IO2
IO7
10k
0.1µF
0.01µF* 0.01µF*
200k 200k 200k
10k
200k 200k 200k
10k 10k
IRF7406
LOAD1 LOAD2 LOAD3
10k 10k
IRF7413
0.01µF*0.01µF* 0.01µF*
LOAD1 LOAD2 LOAD3
IRF7406
IRF7413
0.01µF*
IRF7406
+12V
IRF7413
*OPTIONAL
MAX1608/MAX1609
Mechanical Switch Monitor
The MAX1608/MAX1609’s ability to perform IO_ logic­state readback makes them suitable for checking sys­tem status. They can be used as an “open-lid indicator,” sensing a change in the IO_ and sending an interrupt to the master to indicate a change in status (Figure 9). The same can be done to detect a chassis intrusion, a reset switch, or a card insertion.
Simple High-Voltage Switch
For applications requiring a higher voltage, use a sim­ple resistive divider to protect the gate from breakdown yet allow the MOSFETs to handle higher voltage appli­cations (Figure 10).
Octal SMBus-to-Parallel I/O Expanders
14 ______________________________________________________________________________________
Figure 7. Battery Switch with Back-to-Back MOSFETs
Figure 8. LED Driver
___________________Chip Information
TRANSISTOR COUNT: 5762
+5V +3.3V TO +28V
100k
10k 10k 10k
TO/FROM
HOST
NOTE: OTHER OUTPUTS CAN BE CONFIGURED SIMILARLY. *75k RESISTOR FOR VOLTAGES GREATER THAN +12V.
MAX1609
ALERT
SMBDATA
SMBCLK
SMBSUS ADD0
ADD1
V+
GND
IO0
IO7
75k*
0.1µF IRF7406
1M
IRF7406
LOAD
+5V
P
P
10k
10k
MAX1608 MAX1609
ALERT
TO/FROM
HOST
SMBDATA
SMBCLK
SMBSUS
ADD0
ADD1
GND
1k 1k
1k
V+
IO0
IO1
IO2
IO7
0.1µF
MAX1608/MAX1609
Octal SMBus-to-Parallel I/O Expanders
______________________________________________________________________________________ 15
Figure 9. Mechanical Switch Monitor
MAX1609
IO1
TO/FROM
HOST
+5V
V
CC
IO3
IO2
GND
LOAD
ALERT
0.1µF
0.01µF*
IRF7406
V
IN
= 10V TO 28V
200k
IO4
IO7
SMBCLK
SMBDATA
SMBSUS
ADD0
ADD1
10k 10k 10k
200k
Figure 10. Simple High-Voltage Switch
+5V
10k 10k 10k
TO/FROM
HOST
ALERT
SMBDATA
SMBCLK
SMBSUS
ADD0
ADD1
V+
MAX1608 MAX1609
GND
0.1µF
I/O0
I/O1
I/O2
IO7
100k
100k 100k
MAX1608/MAX1609
Octal SMBus-to-Parallel I/O Expanders
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
16 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2000 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.
Note: MAX1608/MAX1609 do not have a heat slug.
Package Information
Typical Operating Circuits (continued)
+2.7V TO +5.5V
TO/
ALERT
SMBDATA
SMBCLK
SMBSUS
ADD0
ADD1
SMBUS
FROM
HOST
V+
MAX1608
GND
100k
0.1µF
I00
I01
I02
I07
100k 100k
LOAD1 LOAD2 LOAD3
+12V
N-CH
QSOP.EPS
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