Maxim MAX16051, MAX16050 Datasheet

General Description

The MAX16050 monitors up to 5 voltages and sequences up to 4 voltages, while the MAX16051 monitors up to 6 voltages and sequences up to 5 voltages. These devices provide an adjustable delay as each supply is turned on and they monitor each power-supply voltage. When all of the voltages reach their final values and the reset delay timer expires, a power-on-reset (POR) output deasserts allowing the microcontroller (µC) to operate. If any voltage falls below its threshold, the reset output asserts and all voltage supplies are turned off. The MAX16050/MAX16051 can be daisy-chained to control a higher number of voltages in a system.

During a power-down event, the MAX16050/MAX16051 can reverse sequence the outputs. In this situation, each voltage is turned off sequentially until it reaches a 250mV level, at which point, the next supply is turned off. The MAX16050/MAX16051 also provide internal pulldown circuitry that turns on during power-down, to help discharge large output capacitors.

The MAX16050/MAX16051 feature a charge-pump supply output that can be used as a pullup voltage for driving external n-channel MOSFETs and an overvoltage output that indicates when any of the monitored voltages exceeds its overvoltage threshold. The MAX16050 also provides three sequence control inputs for changing the sequence order, while the MAX16051 has a fixed sequence order.

The MAX16050/MAX16051 are available in a 28-pin (4mm x 4mm) thin QFN package and are fully specified over the -40°C to +85°C extended operating temperature range.

Applications

Features

♦ Monitor Up to 6 Voltages/Sequence Up to 5

Voltages

♦ Pin-Selectable Sequencing Order (MAX16050 Only)

♦ Reverse-Sequencing Capability on Shutdown

♦ Overvoltage Monitoring with Independent Output

♦ ±1.5% Threshold Accuracy

♦ 2.7V to 13.2V Operating Voltage Range

♦ Charge Pump to Fully Enhance External

n-Channel FETs

♦ Capacitor-Adjustable Sequencing Delay

♦ Fixed or Capacitor-Adjustable Reset Timeout

♦ Internal 85mA Pulldowns for Discharging

Capacitive Loads Quickly

♦ Daisy-Chaining Capability to Communicate

Across Multiple Devices

♦ Small 4mm x 4mm, 28-Pin TQFN Package

MAX16050/MAX16051

Voltage Monitors/Sequencer Circuits with

Reverse-Sequencing Capability

________________________________________________________________

Maxim Integrated Products

Ordering Information

GND

SET4

OUT4

DISC4

RESET

SET1

OUT1

FAULT

DISC1

REM

*EP = EXPOSED PAD

SEQ1

4567

2021 19 17 16 15

SEQ2

SEQ3

OUT2

SET2

DISC3

OUT3

MAX16050

ABP

OV_OUT

*EP

CP_OUT

SET3

TIMEOUT

DISC2

DELAY

EN_HOLD

SHDN

THIN QFN

(4mm x 4mm)

TOP VIEW

Pin Configurations

19-1013; Rev 0; 11/07

For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

Pin Configurations continued at end of data sheet.

PART

MONITORED

VOLTAGES

SEQUENCED

PIN-PACKAGE PACKAGE CODE

MAX16050ETI+ 5 4 28 TQFN-EP* T2844-1

MAX16051ETI+ 6 5 28 TQFN-EP* T2844-1

Note: All devices are specified over the -40°C to +85°C operating temperature range.

Denotes lead-free package.

EP = Exposed pad.

Typical Operating Circuit appears at end of data sheet.

Servers

Workstations

Networking Systems

Telecom Equipment

Storage Systems

MAX16050/MAX16051

Voltage Monitors/Sequencer Circuits with Reverse-Sequencing Capability

2 _______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

= 2.7V to 13.2V, VEN= V

ABP

, TA= TJ= -40°C to +85°C, unless otherwise noted. Typical values are at TA= +25°C.) (Note 1)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

(All voltages referenced to GND.) V

.........................................................................-0.3V to +30V

REM, OUT_, DISC_.................................................-0.3V to +30V

RESET, SHDN, SET_, FAULT, EN_HOLD, EN, DELAY,

OV_OUT, ABP, TIMEOUT, SEQ_...........................-0.3V to +6V

CP_OUT.........................................................-0.3V to (V

+ 6V)

RESET Current ....................................................................50mA

DISC_ Current ...................................................................180mA

Input/Output Current (all other pins) ...................................20mA

Continuous Power Dissipation (T

= +70°C) 28-Pin (4mm x 4mm) Thin QFN (derate 28.6mW/°C

above +70°C) ............................................................2285mW*

Operating Temperature Range ...........................-40°C to +85°C

Junction Temperature .....................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

As per JEDEC51 Standard (Multilayer Board).

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Operating Voltage Range (Note 2)

Voltage on VCC to ensure the device is fully operational

2.7 13.2 V

Operating Voltage V

CCR

DISC_

= V

OUT_

= V

RESET

= low, voltage on

rising

1.8 V

Regulated Supply Voltage V

ABP

= 1mA (external sourcing current from

ABP)

2.45 2.90 V

Undervoltage Lockout V

UVLO

Minimum voltage on ABP, ABP rising 2.1 2.3 V

Undervoltage Lockout Hysteresis V

UVLO_HYS

ABP falling 100 mV

Supply Current I

VCC = 3.3V, all OUT_ = high, no load 0.7 1.1 mA

MONITORED ANALOG INPUTS

SET_ Threshold V

SET_ falling 0.492 0.5 0.508 V

SET_ Threshold Hysteresis V

TH_HYS

SET_ rising 0.5 %V

SET1–SET4 Input Current I

SET

SET_

= 0.5V -100 +100 nA

SET5 Input Current I

SET5

= 0.5V (MAX16051 only) -30 +30 µA

SET_ Threshold Tempco ΔV

TH/_TC

30 ppm/°C

Overvoltage Threshold V

TH_OV

SET_ falling 0.541 0.55 0.558 V

Overvoltage Threshold Hysteresis SET_ rising 0.5 %V

TH_OV

EN Threshold V

TH_EN

EN_ falling 0.492 0.5 0.508 V

EN Threshold Hysteresis V

EN_HYS

EN_ rising 0.5 %V

TH_EN

EN Input Current I

VEN = 0.5V -100 +100 nA

SEQUENCING, CAPACITOR DISCHARGE, AND SEQUENCE TIMING OUTPUTS

VCC = 3.3V, I

SINK

= 3.2mA 0.3

OUT_ Output Low Voltage V

OL_OUT

VCC = 1.8V, I

SINK

= 100µA 0.3

OUT_ Leakage Current I

LKG_OUT

OUT_

= 12V, OUT_ asserted 1 µA

DISC_ Output Pulldown Current I

OL_DISC

Pulldown current during fault condition or power-down mode, V

DISC_

= 1V

85 mA

DISC_ Output Leakage Current I

LKG_DISCVDISC_

= 3.3V, not in power-down mode 1 µA

DISC_ Power Low Threshold V

TH_PL

DISC_ falling 200 250 300 mV

MAX16050/MAX16051

Voltage Monitors/Sequencer Circuits with

Reverse-Sequencing Capability

_______________________________________________________________________________________ 3

ELECTRICAL CHARACTERISTICS (continued)

= 2.7V to 13.2V, VEN= V

ABP

, TA= TJ= -40°C to +85°C, unless otherwise noted. Typical values are at TA= +25°C.) (Note 1)

Note 1: Specifications are guaranteed for the stated global conditions, unless otherwise noted. 100% production tested at T

+25°C and T

= +85°C. Specifications at TA= -40°C are guaranteed by design.

Note 2: When the voltage is below the V

UVLO

and above V

CCR

, OUT_ and RESET are asserted low.

Note 3: SEQ1–SEQ3 are inputs with three logic levels: high, low, and high-impedance.

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

DELAY, TIMEOUT Output Source Current

DELAY

= V

TIMEOUT

= 0V 1.7 2.5 3.0 µA

DELAY, TIMEOUT Threshold Voltage

TH_DT

1.218 1.250 1.281 V

DIGITAL INPUTS/OUTPUTS

SHDN, FAULT, EN_HOLD Input- Logic Low Voltage

0.4 V

SHDN, FAULT, EN_HOLD Input- Logic High Voltage

EN_HOLD Input Current I

1µA

EN_HOLD to OUT Delay t

EN_OUT

3µs

FAULT, SHDN to ABP Pullup Resistance

60 100 160 kΩ

SHDN to OUT_ Delay t

OUT

12 µs

VCC = 3.3V, I

SINK

= 3.2mA 0.3

RESET Output Low Voltage V

VCC = 1.8V, I

SINK

= 100µA 0.3

REM, FAULT Output Low Voltage V

OL_RFVCC

= 3.3V, I

SINK

= 3.2mA 0.3 V

FAULT Pulse Width t

FAULT_PW

1.9 µs

SET_ to FAULT Delay Time t

SET_FAULT

SET_ falling below respective threshold 2.5 µs

SEQ1–SEQ3 Logic-High Level V

IH_SEQ

MAX16050 only

ABP

0.35

SEQ1–SEQ3 Logic HighImpedance (No Connect) Level

IX_SEQ

MAX16050 only 0.92 1.45 V

SEQ1–SEQ3 Logic-Low Level V

IL_SEQ

MAX16050 only 0.33 V

SEQ1–SEQ3 High-Impedance State Tolerance Current

MAX16050 (Note 3) -6 +6 µA

RESET CIRCUIT

RESET, REM, OV_OUT Output Leakage

LKG

RESET

= V

REM

= V

OV_OUT

= 5V 1 µA

RESET Timeout Period t

TIMEOUT = ABP 50 128 300 ms

OUT_, FAULT, SHDN to RESET Delay

RST

TIMEOUT = unconnected 3 µs

CHARGE-PUMP OUTPUT

CP_OUT Voltage V

CP_OUTICP_OUT

= 0.5µA

4.6

VCC +5VCC +

5.8

CP_OUT Source Current I

CP_OUTVCP_OUT

= VCC + 2V 17 25 30 µA

MAX16050/MAX16051

Voltage Monitors/Sequencer Circuits with Reverse-Sequencing Capability

4 _______________________________________________________________________________________

Typical Operating Characteristics

= 5V; VEN= V

ABP

, TA= +25°C, unless otherwise noted.)

SUPPLY CURRENT

vs. SUPPLY VOLTAGE

MAX16050/51 toc01

SUPPLY VOLTAGE (V)

SUPPLY CURRENT (μA)

11.710.28.77.25.74.2

550

600

650

700

750

500

2.7 13.2

TA = -40°C

TA = +85°C

TA = +25°C

SUPPLY CURRENT

vs. TEMPERATURE

MAX16050/51 toc02

TEMPERATURE (°C)

SUPPLY CURRENT (μA)

603510-15

550

600

650

700

750

500

-40 85

VCC = 5V ALL OUT_ = HIGH NO LOAD

NORMALIZED SET_ THRESHOLD VOLTAGE

vs. TEMPERATURE

MAX16050/51 toc03

TEMPERATURE (°C)

NORMALIZED SET_ THRESHOLD VOLTAGE

603510-15

0.996

0.997

0.998

0.999

1.000

1.001

1.002

1.003

1.004

1.005

0.995

-40 85

NORMALIZED AT TA = +25°C V

SET_

FALLING

NORMALIZED SEQUENCE DELAY

vs. TEMPERATURE

MAX16050/51 toc04

TEMPERATURE (°C)

NORMALIZED SEQUENCE DELAY

6035-15 10

0.85

0.90

0.95

1.00

1.10

1.05

1.15

1.20

0.80

-40 85

NORMALIZED AT TA = +25°C

DELAY

= OPEN

DELAY

= 0.1μF

SEQUENCE DELAY vs. C

DELAY

MAX16050/51 toc05

DELAY

(nF)

SEQUENCE DELAY (ms)

400300200100

100

150

200

250

0 500

NORMALIZED RESET TIMEOUT PERIOD

vs. TEMPERATURE

MAX16050/51 toc06

TEMPERATURE (°C)

NORMALIZED RESET TIMEOUT PERIOD

603510-15

0.92

0.94

0.96

0.98

1.00

1.02

1.04

1.06

1.08

1.10

0.90

-40 85

NORMALIZED AT TA = +25°C

TIMEOUT = OPEN

TIMEOUT = ABP

RESET TIMEOUT PERIOD

vs. C

TIMEOUT

MAX16050/51 toc07

TIMEOUT

(nF)

RESET TIMEOUT PERIOD (ms)

400300200100

100

150

200

250

0500

CP_OUT VOLTAGE

vs. CP_OUT CURRENT

MAX16050/51 toc08

CP_OUT CURRENT (μA)

CP_OUT VOLTAGE (V)

2015105

025

MAX16050/MAX16051

Voltage Monitors/Sequencer Circuits with

Reverse-Sequencing Capability

_______________________________________________________________________________________

Typical Operating Characteristics (continued)

= 5V; VEN= V

ABP

, TA= +25°C, unless otherwise noted.)

OV_OUT LOW VOLTAGE

vs. SINK CURRENT

MAX16050/51 toc09

SINK CURRENT (mA)

OV_OUT LOW VOLTAGE (V)

16124 8

0.1

0.2

0.3

0.4

0.6

0.5

0.7

0.8

020

OUT_ LOW VOLTAGE

vs. SINK CURRENT

MAX16050/51 toc10

SINK CURRENT (mA)

OUT_ LOW VOLTAGE (V)

16124 8

0.1

0.2

0.3

0.4

0.6

0.5

0.7

0.8

020

RESET LOW VOLTAGE

vs. SINK CURRENT

MAX16050/51 toc11

SINK CURRENT (mA)

RESET LOW VOLTAGE (V)

16124 8

0.1

0.2

0.3

0.4

0.6

0.5

0.7

0.8

020

REVERSE SEQUENCE POWER-DOWN USING SHDN

DELAY

= C

TIMEOUT

= OPEN)

MAX1650/51 toc12

40μs/div

SHDN 5V/div

V1 5V/div

V2 5V/div

V3 5V/div

V4 5V/div

SIMULTANEOUS POWER-DOWN USING EN

DELAY

= C

TIMEOUT

= OPEN)

MAX1650/51 toc13

40μs/div

EN 5V/div

V1 5V/div

V2 5V/div

V3 5V/div

V4 5V/div

DAISY-CHAINING TWO DEVICES

WITH SHDN RISING (FIGURE 7)

MAX1650/51 toc14a

100μs/div

DELAY

(U1) = C

DELAY

(U2) = 100pF SHDN = 5V/div V1–V7 = 5V/div

SHDN

DAISY-CHAINING TWO DEVICES

WITH SHDN FALLING (FIGURE 7)

MAX1650/51 toc14b

10μs/div

DELAY

(U1) = C

DELAY

(U2) = 100pF SHDN = 5V/div V1–V7 = 5V/div

SHDN

MAX16050/MAX16051

Voltage Monitors/Sequencer Circuits with Reverse-Sequencing Capability

6 _______________________________________________________________________________________

Pin Description

MAX16050 MAX16051

NAME FUNCTION

11V

Device Power-Supply Input. Connect to 2.7V to 13.2V. Bypass VCC to GND with a 0.1µF capacitor.

2 2 GND Ground

3 3 ABP

Internal Supply Bypass Input. Connect a 1µF capacitor from ABP to GND. ABP is an internally generated voltage and must not be used to supply more than 1mA to external circuitry.

44EN

Analog Enable Input. Connect a resistive divider at EN to monitor a voltage. The EN threshold is 0.5V.

5 5 SET4

Set Monitored Threshold 4 Input. Monitor a voltage by setting the threshold with an external resistive divider. The SET4 threshold is 0.5V.

6 6 OUT4

Open-Drain Output 4. When the voltage at SET3* is above 0.5V, OUT4 goes high impedance. OUT4 requires an external pullup resistor and can be pulled up to 13.2V.

7 7 DISC4

Discharge Pulldown Input 4. During normal operation, DISC4 is high impedance. During a fault condition or power-down, DISC4 provides an 85mA sink current.

8 8 SET3

Set Monitored Threshold 3 Input. Monitor a voltage by setting the threshold with an external resistive divider. The SET3 threshold is 0.5V.

9 9 OUT3

Open-Drain Output 3. When the voltage at SET2* is above 0.5V, OUT3 goes high impedance. OUT3 requires an external pullup resistor and can be pulled up to 13.2V.

10 10 DISC3

Discharge Pulldown Input 3. During normal operation, DISC3 is high impedance. During a fault condition or power-down, DISC3 provides an 85mA sink current.

11 11 SET2

Set Monitored Threshold 2 Input. Monitor a voltage by setting the threshold with an external resistive divider. The SET2 threshold is 0.5V.

12 12 OUT2

Open-Drain Output 2. When the voltage at SET1* is above 0.5V, OUT2 goes high impedance. OUT2 requires an external pullup resistor and can be pulled up to 13.2V.

13 13 DISC2

Discharge Pulldown Input 2. During normal operation, DISC2 is high impedance. During a fault condition or power-down, DISC2 provides an 85mA sink current.

14 14 EN_HOLD

Enable Hold Input. When EN_HOLD is low, the device does not start the reversesequencing process regardless of the status of the SHDN input. Reverse sequencing is allowed when this input is pulled high. Connect to ABP if unused.

15 15 REM

Open-Drain Bus Removal Output. REM goes high impedance when all DISC_ inputs are below the DISC_ power low threshold (V

TH_PL

). REM goes low when any DISC_ input goes

above V

TH_PL

. REM requires an external pullup resistor and can be pulled up to 13.2V.

16 16 DISC1

Discharge Pulldown Input 1. During normal operation, DISC1 is high impedance. During a fault condition or power-down, DISC1 provides an 85mA sink current.

17 17 OUT1

Open-Drain Output 1. When the voltage at EN* is above 0.5V, OUT1 goes high impedance. OUT1 requires an external pullup resistor and can be pulled up to 13.2V.

This applies to the MAX16051. For the MAX16050, see Table 1 for the output sequence order.

MAX16050/MAX16051

Voltage Monitors/Sequencer Circuits with

Reverse-Sequencing Capability

_______________________________________________________________________________________ 7

Pin Description (continued)

MAX16050 MAX16051

NAME FUNCTION

18 18 SET1

Set Monitored Threshold 1 Input. Monitor a voltage by setting the threshold with an external resistive divider. The SET1 threshold is 0.5V.

19 19 OV_OUT

Open-Drain Overvoltage Output. When any of the SET_ voltages exceed their 0.55V overvoltage threshold, OV_OUT goes low. When all of the SET_ voltages are below their overvoltage threshold, OV_OUT goes high impedance after a short propagation delay.

20 20 RESET

Open-Drain Reset Output. When any of the monitored voltages (including EN) falls below its threshold, SHDN is pulled low, or FAULT is pulled low, RESET asserts and stays asserted for at least the minimum reset timeout period after all of these conditions are removed. The reset timeout is 128ms (typ) when TIMEOUT is connected to ABP or can be adjusted by connecting a capacitor from TIMEOUT to GND.

21 21 FAULT

FAULT Synchronization Input/Output. While EN = SHDN = high, FAULT is pulled low when any of the SET_ voltages falls below their respective threshold. Pull FAULT low manually to assert a simultaneous power-down. FAULT is internally pulled up to ABP by a 100kΩ resistor.

22 22 SHDN

Active-Low Shutdown Input. When SHDN is pulled low, the device will reverse sequence for power-down operation. SHDN is internally pulled up to ABP by a 100kΩ resistor.

23 23 DELAY

Adjustable Sequence Delay Timing Input. Connect a capacitor from DELAY to GND to set the sequence delay between each OUT_. Leave DELAY unconnected for a 10µs (typ) delay.

24 24 TIMEOUT

Adjustable Reset Timeout Input. Connect a capacitor from TIMEOUT to GND to set the reset timeout period. Connect TIMEOUT to ABP for the fixed timeout of 128ms (typ). Leave TIMEOUT unconnected for a 10µs (typ) delay.

25 — SEQ1

26 — SEQ2

27 — SEQ3

Sequence Order Select Inputs. SEQ1, SEQ2, and SEQ3 allow the order of sequencing for each supply to be programmable (Table 1).

28 28 CP_OUT

Charge-Pump Output. An internal charge pump boosts CP_OUT to (V

+ 5V ) to provide a pullup voltage that can be used to drive external n-channel MOSFETs. CP_OUT sources up to 25µA.

— 25 DISC5

Discharge Pulldown Input 5. During normal operation, DISC5 is high impedance. During a fault condition or power-down, DISC5 provides an 85mA sink current.

— 26 OUT5

Open-Drain Output 5. When the voltage at SET4 is above 0.5V, OUT5 goes high impedance. OUT5 requires an external pullup resistor and can be pulled up to 13.2V.

— 27 SET5

External Set Monitored Threshold 5. Monitor a voltage by setting the threshold with an external resistive divider. The SET5 threshold is 0.5V.

——EP

Exposed Pad. EP is internally connected to GND. Connect EP to the GND plane for improved heat dissipation. Do not use EP as the only ground connection.

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