MAXIM MAX148, MAX149 Technical data

General Description
The MAX148/MAX149 10-bit data-acquisition systems combine an 8-channel multiplexer, high-bandwidth track/hold, and serial interface with high conversion speed and low power consumption. They operate from a single +2.7V to +5.25V supply, and sample to 133ksps. Both devices’ analog inputs are software configurable for unipolar/bipolar and single-ended/differential operation.
The MAX149 has an internal 2.5V reference, while the MAX148 requires an external reference. Both parts have a reference-buffer amplifier with a ±1.5% voltage­adjustment range.
These devices provide a hard-wired SHDN pin and a software-selectable power-down, and can be pro­grammed to automatically shut down at the end of a con­version. Accessing the serial interface automatically powers up the MAX148/MAX149, and the quick turn-on time allows them to be shut down between all conver­sions. This technique can cut supply current to under 60µA at reduced sampling rates.
The MAX148/MAX149 are available in a 20-pin DIP and a 20-pin SSOP.
For 4-channel versions of these devices, see the MAX1248/MAX1249 data sheet.
________________________Applications
Portable Data Logging Data Acquisition Medical Instruments Battery-Powered Instruments Pen Digitizers Process Control
____________________________Features
8-Channel Single-Ended or 4-Channel
Differential Inputs
Single-Supply Operation: +2.7V to +5.25V Internal 2.5V Reference (MAX149)Low Power: 1.2mA (133ksps, 3V supply)
54µA (1ksps, 3V supply) 1µA (power-down mode)
SPI/QSPI/MICROWIRE/TMS320-Compatible
4-Wire Serial Interface
Software-Configurable Unipolar or Bipolar Inputs20-Pin DIP/SSOP Packages
MAX148/MAX149
+2.7V to +5.25V, Low-Power, 8-Channel,
Serial 10-Bit ADCs
________________________________________________________________
Maxim Integrated Products
1
V
DD
I/O SCK (SK) MOSI (SO) MISO (SI)
V
SS
SHDN
SSTRB
DOUT
DIN
SCLK
CS
COM
AGND
DGND
V
DD
CH7
4.7µF
0.1µF
CH0
0V TO
+2.5V
ANALOG
INPUTS
MAX149
CPU
+3V
VREF
0.01µF
REFADJ
__________Typical Operating Circuit
19-0464; Rev 2; 5/98
PART
MAX148ACPP MAX148BCPP MAX148ACAP 0°C to +70°C
0°C to +70°C
0°C to +70°C
TEMP. RANGE PIN-PACKAGE
20 Plastic DIP 20 Plastic DIP 20 SSOP
EVALUATION KIT
AVAILABLE
Ordering Information
Ordering Information continued at end of data sheet.
Contact factory for availability of alternate surface-mount packages.
MAX148BCAP 0°C to +70°C 20 SSOP
INL
(LSB)
±1/2 ±1 ±1/2 ±1
SPI and QSPI are trademarks of Motorola, Inc. MICROWIRE is a trademark of National Semiconductor Corp.
Pin Configuration appears at end of data sheet.
For free samples & the latest literature: http://www.maxim-ic.com, or phone 1-800-998-8800. For small orders, phone 408-737-7600 ext. 3468.
查询MAX148ACAP供应商
MAX148/MAX149
+2.7V to +5.25V, Low-Power, 8-Channel, Serial 10-Bit ADCs
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
VDD= +2.7V to +5.25V; COM = 0V; f
SCLK
= 2.0MHz; external clock (50% duty cycle); 15 clocks/conversion cycle (133ksps);
MAX149—4.7µF capacitor at VREF pin; MAX148—external reference, VREF = 2.500V applied to VREF pin; T
A
= T
MIN
to T
MAX
; unless
otherwise noted.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
VDDto AGND, DGND................................................. -0.3V to 6V
AGND to DGND...................................................... -0.3V to 0.3V
CH0–CH7, COM to AGND, DGND............ -0.3V to (V
DD
+ 0.3V)
VREF, REFADJ to AGND........................... -0.3V to (V
DD
+ 0.3V)
Digital Inputs to DGND.............................................. -0.3V to 6V
Digital Outputs to DGND........................... -0.3V to (V
DD
+ 0.3V)
Digital Output Sink Current.................................................25mA
Continuous Power Dissipation (T
A
= +70°C)
Plastic DIP (derate 11.11mW/°C above +70°C) ......... 889mW
SSOP (derate 8.00mW/°C above +70°C) ................... 640mW
CERDIP (derate 11.11mW/°C above +70°C).............. 889mW
Operating Temperature Ranges
MAX148_C_P/MAX149_C_P.............................. 0°C to +70°C
MAX148_E_P/MAX149_E_P............................ -40°C to +85°C
MAX148_MJP/MAX149_MJP........................ -55°C to +125°C
Storage Temperature Range............................ -60°C to +150°C
Lead Temperature (soldering, 10sec)............................ +300°C
µs1.5t
ACQ
Differential Nonlinearity
Track/Hold Acquisition Time
ns30Aperture Delay
6
µs
35 65
t
CONV
Conversion Time (Note 5)
5.5 7.5
ps
MHz1.0Full-Power Bandwidth
MHz2.25Small-Signal Bandwidth
dB-75Channel-to-Channel Crosstalk
dB70SFDRSpurious-Free Dynamic Range
dB-70THDTotal Harmonic Distortion
dB66SINADSignal-to-Noise + Distortion Ratio
LSB±0.05
Channel-to-Channel Offset Matching
ppm/°C±0.25Gain Temperature Coefficient
±0.5
<50
Bits10Resolution
Gain Error (Note 3)
±1
Aperture Jitter
Offset Error
LSB
±1.0
INLRelative Accuracy (Note 2)
LSB±1DNL
±0.15 ±1
LSB
±0.15 ±2
UNITSMIN TYP MAXSYMBOLPARAMETER
External clock = 2MHz, 12 clocks/conversion
Internal clock, SHDN = V
DD
Internal clock, SHDN = FLOAT
MAX14_A
-3dB rolloff
65kHz, 2.500V
p-p
(Note 4)
Up to the 5th harmonic
MAX14_A
MAX14_B No missing codes over temperature MAX14_A MAX14_B
CONDITIONS
LSB
±2MAX14_B
DC ACCURACY (Note 1)
DYNAMIC SPECIFICATIONS (10kHz sine-wave input, 0V to 2.500Vp-p, 133ksps, 2.0MHz external clock, bipolar input mode)
CONVERSION RATE
MAX148/MAX149
+2.7V to +5.25V, Low-Power, 8-Channel,
Serial 10-Bit ADCs
_______________________________________________________________________________________ 3
Multiplexer Leakage Current
µA0.01 10Shutdown VREF Input Current
k18 25VREF Input Resistance
µA100 150VREF Input Current
V
1.0
V
DD
+
50mV
VREF Input Voltage Range (Note 9)
pF16Input Capacitance
1.8 MHz
0.225
Internal Clock Frequency
µA±0.01 ±1
UNITSMIN TYP MAXSYMBOLPARAMETER
SHDN = FLOAT
VREF = 2.500V
SHDN = V
DD
On/off leakage current, V
CH_
= 0V or V
DD
CONDITIONS
ELECTRICAL CHARACTERISTICS (continued)
VDD= +2.7V to +5.25V; COM = 0V; f
SCLK
= 2.0MHz; external clock (50% duty cycle); 15 clocks/conversion cycle (133ksps);
MAX149—4.7µF capacitor at VREF pin; MAX148—external reference, VREF = 2.500V applied to VREF pin; T
A
= T
MIN
to T
MAX
; unless
otherwise noted.)
V2.470 2.500 2.530VREF Output Voltage TA= +25°C (Note 7)
mA30VREF Short-Circuit Current
±30MAX149
mV0.35Load Regulation (Note 8) 0mA to 0.2mA output load
0Internal compensation mode
µF
4.7
Capacitive Bypass at VREF
External compensation mode
µF0.01Capacitive Bypass at REFADJ
%±1.5REFADJ Adjustment Range
V
VDD-
0.5
REFADJ Buffer-Disable Threshold
µF
0
Capacitive Bypass at VREF
Internal compensation mode
2.00
V/V
2.06
Reference Buffer Gain
4.7
MAX148
MAX149
External compensation mode
±10
µA
±50
REFADJ Input Current
MAX148
MAX149
ppm/°CVREF Temperature Coefficient
0 to VREF
V
±VREF / 2
Input Voltage Range, Single­Ended and Differential (Note 6)
Unipolar, COM = 0V Bipolar, COM = VREF / 2
0.1 2.0 MHz
0 2.0
External Clock Frequency
Data transfer only
CONVERSION RATE (continued)
ANALOG/COM INPUTS
INTERNAL REFERENCE (MAX149 only, reference buffer enabled)
EXTERNAL REFERENCE AT VREF (Buffer disabled)
EXTERNAL REFERENCE AT REFADJ
I
DD
MAX148/MAX149
+2.7V to +5.25V, Low-Power, 8-Channel, Serial 10-Bit ADCs
4 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS (continued)
VDD= +2.7V to +5.25V; COM = 0V; f
SCLK
= 2.0MHz; external clock (50% duty cycle); 15 clocks/conversion cycle (133ksps);
MAX149—4.7µF capacitor at VREF pin; MAX148—external reference, VREF = 2.500V applied to VREF pin; T
A
= T
MIN
to T
MAX
; unless
otherwise noted.)
V
3.0
V
IH
DIN, SCLK, CS Input High Voltage
VDD> 3.6V
mV±0.3PSRSupply Rejection (Note 12)
Full-scale input, external reference = 2.500V, VDD= 2.7V to 5.25V
pF15C
IN
DIN, SCLK, CS Input Capacitance
µA±0.01 ±1I
IN
DIN, SCLK, CS Input Leakage
V0.2V
HYST
DIN, SCLK, CS Input Hysteresis
V0.8V
IL
DIN, SCLK, CS Input Low Voltage
2.0
µA±4.0I
S
SHDN Input Current
V0.4V
SL
SHDN Input Low Voltage
VVDD- 0.4V
SH
SHDN Input High Voltage
SHDN = 0V or V
DD
nA±100
SHDN Maximum Allowed Leakage, Mid Input
VV
DD
/ 2V
FLT
SHDN Voltage, Floating
SHDN = FLOAT
SHDN = FLOAT
UNITSMIN TYP MAXSYMBOLPARAMETER
(Note 10)
VIN= 0V or V
DD
V
DD
3.6V
CONDITIONS
µA±0.01 ±10I
L
Three-State Leakage Current
VVDD- 0.5V
OH
Output Voltage High
V
0.8
V
OL
Output Voltage Low
0.4
pF15C
OUT
Three-State Output Capacitance
CS = VDD(Note 10)
CS = V
DD
I
SOURCE
= 0.5mA
I
SINK
= 16mA
I
SINK
= 5mA
2.70 5.25
1.2 2.0
Operating mode, full-scale input (Note 11)
3.5 15
Full power-down
1.2 10
mA
1.6 3.0
V1.1 VDD- 1.1V
SM
SHDN Input Mid Voltage
Positive Supply Current
V
DD
Positive Supply Voltage V
I
DD
µA
30 70
DIGITAL INPUTS (DIN, SCLK, CS, SHDN)
DIGITAL OUTPUTS (DOUT, SSTRB)
POWER REQUIREMENTS
Fast power-down (MAX149)I
DD
VDD= 5.25V VDD= 3.6V VDD= 5.25V VDD= 3.6V
MAX148/MAX149
+2.7V to +5.25V, Low-Power, 8-Channel,
Serial 10-Bit ADCs
_______________________________________________________________________________________ 5
Figure 1
__________________________________________Typical Operating Characteristics
(VDD= 3.0V, VREF = 2.500V, f
SCLK
= 2.0MHz, C
LOAD
= 20pF, TA = +25°C, unless otherwise noted.)
0 256 512 768 1024
INTEGRAL NONLINEARITY
vs. CODE
0.10
0.05
-0.10
-0.05
0
MAX148/9-01
CODE
INL (LSB)
0.125
0
2.25 2.75 4.25
INTEGRAL NONLINEARITY
vs. SUPPLY VOLTAGE
0.100
0.075
0.050
0.025
SUPPLY VOLTAGE (V)
INL (LSB)
3.75 5.253.25 4.75
MAX148/9-02
MAX149
MAX148
0
0.025
0.050
0.075
0.100
0.125
-60 -20 20 60 100 140
INTEGRAL NONLINEARITY
vs. TEMPERATURE
TEMPERATURE (°C)
INL (LSB)
MAX148/9-03
MAX148
MAX149
VDD = 2.7V
TIMING CHARACTERISTICS
(VDD= +2.7V to +5.25V, TA= T
MIN
to T
MAX
, unless otherwise noted.)
Note 1: Tested at V
DD
= 2.7V; COM = 0V; unipolar single-ended input mode.
Note 2: Relative accuracy is the deviation of the analog value at any code from its theoretical value after the full-scale range has
been calibrated.
Note 3: MAX149—internal reference, offset nulled; MAX148—external reference (VREF = +2.500V), offset nulled. Note 4: Ground “on” channel; sine wave applied to all “off” channels. Note 5: Conversion time defined as the number of clock cycles multiplied by the clock period; clock has 50% duty cycle. Note 6: The common-mode range for the analog inputs is from AGND to V
DD
.
Note 7: Sample tested to 0.1% AQL. Note 8: External load should not change during conversion for specified accuracy. Note 9: ADC performance is limited by the converter’s noise floor, typically 300µVp-p. Note
10:
Guaranteed by design. Not subject to production testing.
Note
11:
The MAX148 typically draws 400µA less than the values shown.
Note
12:
Measured as |VFS(2.7V) - VFS(5.25V)|.
Internal clock mode only (Note 7)
External clock mode only, Figure 2
External clock mode only, Figure 1
DIN to SCLK Setup
Figure 1
Figure 2
Figure 1
MAX14_ _C/E
CONDITIONS
MAX14_ _M
ns
20 240
Figure 1
ns
t
CSH
ns240t
STR
CS Rise to SSTRB Output Disable
ns240t
SDV
CS Fall to SSTRB Output Enable
240t
SSTRB
SCLK Fall to SSTRB ns
200t
CL
SCLK Pulse Width Low
ns200SCLK Pulse Width High
ns0
CS to SCLK Rise Hold
ns100t
CSS
CS to SCLK Rise Setup
ns240t
TR
CS Rise to Output Disable
ns240t
DV
CS Fall to Output Enable
t
CH
20 200
t
DO
SCLK Fall to Output Data Valid
ns0t
DH
DIN to SCLK Hold
ns
µs1.5t
ACQ
Acquisition Time
0t
SCK
SSTRB Rise to SCLK Rise
ns100t
DS
UNITSMIN TYP MAXSYMBOLPARAMETER
MAX148/MAX149
+2.7V to +5.25V, Low-Power, 8-Channel, Serial 10-Bit ADCs
6 _______________________________________________________________________________________
2.00
0.50
2.25 2.75
SUPPLY CURRENT
vs. SUPPLY VOLTAGE
1.75
1.25
1.50
1.00
0.75
SUPPLY VOLTAGE (V)
SUPPLY CURRENT (mA)
3.75 5.253.25 4.25 4.75
MAX148/9-04
RL = CODE = 1010101000
C
LOAD
= 50pF
MAX148
MAX149
C
LOAD
= 20pF
0
2.25 2.75
SHUTDOWN SUPPLY CURRENT
vs. SUPPLY VOLTAGE
3.0
2.5
1.5
2.0
1.0
0.5
SUPPLY VOLTAGE
(V)
SHUTDOWN SUPPLY CURRENT (µA)
3.75 5.253.25 4.25 4.75
MAX148/9-05
FULL POWER-DOWN
2.5020
2.4990
2.25 2.75
MAX149
INTERNAL REFERENCE VOLTAGE
vs. SUPPLY VOLTAGE
2.5015
2.5005
2.5010
2.5000
2.4995
SUPPLY VOLTAGE
(V)
INTERNAL REFERENCE VOLTAGE (V)
3.75 5.253.25 4.25 4.75
MAX148/9-06
0.8
0.9
1.0
1.1
1.2
1.3
-60 -20 20 60 100 140
SUPPLY CURRENT vs. TEMPERATURE
TEMPERATURE (°C)
SUPPLY CURRENT (mA)
MAX148/9-07
MAX148
MAX149
R
LOAD
=
CODE = 1010101000
0
0.4
0.8
1.2
1.6
2.0
-60 -20 20 60 100 140
SHUTDOWN CURRENT
vs. TEMPERATURE
TEMPERATURE (°C)
SHUTDOWN CURRENT (µA)
MAX148/9-08
2.494
2.495
2.496
2.497
2.498
2.499
2.500
2.501
-60 -20 20 60 100 140
MAX149
INTERNAL REFERENCE VOLTAGE
vs. TEMPERATURE
TEMPERATURE (°C)
INTERNAL REFERENCE VOLTAGE (V)
MAX148/9-09
VDD = 2.7V
VDD = 3.6V
VDD = 5.25V
____________________________Typical Operating Characteristics (continued)
(VDD= 3.0V, VREF = 2.500V, f
SCLK
= 2.0MHz, C
LOAD
= 20pF, TA = +25°C, unless otherwise noted.)
MAX148/MAX149
+2.7V to +5.25V, Low-Power, 8-Channel,
Serial 10-Bit ADCs
_______________________________________________________________________________________ 7
______________________________________________________________Pin Description
V
DD
6k
DGND
DOUT
C
LOAD
50pF
C
LOAD
50pF
DGND
6k
DOUT
a) High-Z to V
OH
and VOL to V
OH
b) High-Z to VOL and VOH to V
OL
Figure 1. Load Circuits for Enable Time Figure 2. Load Circuits for Disable Time
Input to the Reference-Buffer Amplifier. To disable the reference-buffer amplifier, tie REFADJ to VDD.REFADJ12
Serial-Strobe Output. In internal clock mode, SSTRB goes low when the MAX148/MAX149 begin the A/D conversion, and goes high when the conversion is finished. In external clock mode, SSTRB pulses high for one clock period before the MSB decision. High impedance when CS is high (external clock mode).
SSTRB16
Serial-Data Input. Data is clocked in at SCLK’s rising edge.DIN17 Active-Low Chip Select. Data will not be clocked into DIN unless CS is low. When CS is high, DOUT is
high impedance.
CS
18
Serial-Clock Input. Clocks data in and out of serial interface. In external clock mode, SCLK also sets the conversion speed. (Duty cycle must be 40% to 60%.)
SCLK19
Reference-Buffer Output/ADC Reference Input. Reference voltage for analog-to-digital conversion. In internal reference mode (MAX149 only), the reference buffer provides a 2.500V nominal output, externally adjustable at REFADJ. In external reference mode, disable the internal buffer by pulling REFADJ to VDD.
VREF11
Analog GroundAGND13 Digital GroundDGND14 Serial-Data Output. Data is clocked out at SCLK’s falling edge. High impedance when CS is high.
DOUT15
Three-Level Shutdown Input. Pulling SHDN low shuts the MAX148/MAX149 down; otherwise, they are fully operational. Pulling SHDN high puts the reference-buffer amplifier in internal compensation mode. Letting SHDN float puts the reference-buffer amplifier in external compensation mode.
SHDN
10
Ground reference for analog inputs. COM sets zero-code voltage in single-ended mode. Must be stable to ±0.5LSB.
COM9
PIN
Sampling Analog InputsCH0–CH71–8
FUNCTIONNAME
Positive Supply VoltageV
DD
20
DOUT
C
LOAD
50pF
6k
DGND
a) V
to High-Z b) VOL to High-Z
OH
DOUT
V
DD
6k
C
LOAD
50pF DGND
MAX148/MAX149
+2.7V to +5.25V, Low-Power, 8-Channel, Serial 10-Bit ADCs
8 _______________________________________________________________________________________
_______________Detailed Description
The MAX148/MAX149 analog-to-digital converters (ADCs) use a successive-approximation conversion technique and input track/hold (T/H) circuitry to convert an analog signal to a 10-bit digital output. A flexible seri­al interface provides easy interface to microprocessors (µ Ps). Figure 3 is a block diagram of the MAX148/ MAX149.
Pseudo-Differential Input
The sampling architecture of the ADC’s analog com­parator is illustrated in the equivalent input circuit (Figure 4). In single-ended mode, IN+ is internally switched to CH0–CH7, and IN- is switched to COM. In differential mode, IN+ and IN- are selected from the fol­lowing pairs: CH0/CH1, CH2/CH3, CH4/CH5, and CH6/CH7. Configure the channels with Tables 2 and 3.
In differential mode, IN- and IN+ are internally switched to either of the analog inputs. This configuration is pseudo-differential to the effect that only the signal at IN+ is sampled. The return side (IN-) must remain stable within ±0.5LSB (±0.1LSB for best results) with respect to AGND during a conversion. To accomplish this, connect a 0.1µF capacitor from IN- (the selected analog input) to AGND.
During the acquisition interval, the channel selected as the positive input (IN+) charges capacitor C
HOLD
. The acquisition interval spans three SCLK cycles and ends on the falling SCLK edge after the last bit of the input control word has been entered. At the end of the
acquisition interval, the T/H switch opens, retaining charge on C
HOLD
as a sample of the signal at IN+.
The conversion interval begins with the input multiplexer switching C
HOLD
from the positive input (IN+) to the negative input (IN-). In single-ended mode, IN- is simply COM. This unbalances node ZERO at the comparator’s input. The capacitive DAC adjusts during the remainder of the conversion cycle to restore node ZERO to 0V within the limits of 10-bit resolution. This action is equiv­alent to transferring a 16pF x [(V
IN
+
) - (VIN-)] charge
from C
HOLD
to the binary-weighted capacitive DAC, which in turn forms a digital representation of the analog input signal.
Track/Hold
The T/H enters its tracking mode on the falling clock edge after the fifth bit of the 8-bit control word has been shifted in. It enters its hold mode on the falling clock edge after the eighth bit of the control word has been shifted in. If the converter is set up for single-ended inputs, IN- is connected to COM, and the converter samples the “+” input. If the converter is set up for dif­ferential inputs, IN- connects to the “-” input, and the difference of |IN+ - IN-
| is sampled. At the end of the
conversion, the positive input connects back to IN+, and C
HOLD
charges to the input signal.
The time required for the T/H to acquire an input signal is a function of how quickly its input capacitance is charged. If the input signal’s source impedance is high, the acquisition time lengthens, and more time must be
INPUT SHIFT
REGISTER
CONTROL
LOGIC
INT
CLOCK
OUTPUT
SHIFT
REGISTER
+1.21V
REFERENCE
(MAX149)
T/H
ANALOG
INPUT
MUX
10+2-BIT
SAR ADC
IN
DOUT SSTRB
V
DD
DGND AGND
SCLK
DIN
COM
REFADJ
VREF
OUT
REF
CLOCK
+2.500V
20k
*A 2.00 (MAX148)
10
11
12
9
15 16
17
18 19
CH6
7
CH4
5
CH2
3
CH0
1
CH7
8
CH5
6
CH3
4
CH1
2
MAX148 MAX149
CS
SHDN
20 14
13
2.06*
A
Figure 3. Block Diagram
CH0
CH2
CH4
CH6
CH1
CH3
CH5
CH7
COM
C
SWITCH
TRACK
T/H
SWITCH
R
IN
9k
C
HOLD
HOLD
CAPACITIVE DAC
VREF
ZERO
COMPARATOR
+
16pF
SINGLE-ENDED MODE: IN+ = CH0–CH7, IN- = COM. DIFFERENTIAL MODE: IN+ AND IN- SELECTED FROM PAIRS OF
CH0/CH1, CH2/CH3, CH4/CH5, AND CH6/CH7.
AT THE SAMPLING INSTANT, THE MUX INPUT SWITCHES FROM THE SELECTED IN+ CHANNEL TO THE SELECTED IN- CHANNEL.
INPUT
MUX
Figure 4. Equivalent Input Circuit
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