The MAX14770E is a half-duplex, Q35kV high ESDprotected transceiver for PROFIBUS-DP and RS-485
applications. In addition, it can be used for RS-422/V.11
communications. The MAX14770E is designed to meet
IEC 61158-2, TIA/EIA-422-B, TIA/EIA-485-A, V.11, and
X.27 standards.
The MAX14770E operates from a +5V supply and has
true fail-safe circuitry that guarantees a logic-high receiver output when the receiver inputs are open or shorted.
The MAX14770E features a 1/4 standard-unit load
receiver input impedance, allowing up to 128 1/4 unit
load transceivers on the bus. Drivers are short-circuit
current limited and are protected against excessive
power dissipation by thermal-shutdown circuitry.
The MAX14770E is available in 8-pin SO and tiny TDFN
(3mm x 3mm) packages, and is specified over the extended (-40NC to +85NC) and automotive (-40NC to +125NC)
temperature ranges.
Features
SMeets EIA 61158-2 Type 3 PROFIBUS-DP
S
+4.5V to +5.5V Supply Voltage
S
20Mbps Data Rate
S
Short-Circuit Protected
S
True Fail-Safe Receiver
S
Thermal-Shutdown Protected
S
Hot Swappable
S
High ESD Protection
±35kV Human Body Model (HBM)
±20kV IEC 61000-4-2 Air Gap
±10kV IEC 61000-4-2 Contact
S
-40NC to +125NC Automotive Temperature Range
in Tiny 8-Pin (3mm x 3mm) TDFN
Ordering Information
MAX14770E
Applications
PROFIBUS-DP Networks
Industrial Fieldbuses
Motion Controllers
RS-485 Networks
Machine Encoders
Typical PROFIBUS-DP Operating Circuit appears at end of
data sheet.
PARTTEMP RANGE
MAX14770EESA+T
MAX14770EATA+T
+Denotes a lead(Pb)-free/RoHS-compliant package.
T = Tape and reel.
*EP = Exposed pad.
RO
RE
DE
DI
-40NC to +85NC
-40NC to +125NC
SHUTDOWN
MAX14770E
PINPACKAGE
8 SO—
8 TDFN-EP*BMG
R
A
B
D
TOP
MARK
The PROFI BUS PROCESS FIELD BUS logo is a registered
trademark of PROFIBUS and PROFINET International (PI).
SO
Junction-to-Ambient Thermal Resistance (q
Junction-to-Case Thermal Resistance (q
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer towww.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
= +70NC)
A
JA
)...............38°C/W
JC
+ 0.3V)
CC
) ........132°C/W
ELECTRICAL CHARACTERISTICS
(VCC = +5V Q10%, TA = T
PARAMETERSYMBOLCONDITIONSMINTYPMAXUNITS
Power-Supply Range V
Supply CurrentI
Shutdown Supply
Current
DRIVER
Differential Driver
Output
Differential Driver
Peak-to-Peak Output
Change in Magnitude
of Differential Output
Voltage
Driver CommonMode Output Voltage
Change in CommonMode Voltage
Driver Short-Circuit
Output Current
(Note 5)
MIN
to T
I
|V
V
ODPP
DV
V
DV
I
OSD
, unless otherwise noted. Typical values are at VCC = +5V, T
MAX
CC
DE = 1, RE = 0 or
CC
SH
OD
OD
OC
OC
DE = 0, RE = 0 or
DE = 1, RE = 1; no load
DE = 0, RE = 1
|
= 54I, DI = VCC or GND; Figure 1
R
L
Figure 2 (Note 3)4.06.8V
RL = 54I; Figure 1 (Note 4)
RL = 54I; Figure 1
RL = 54I; Figure 1 (Note 4)
0V P V
-7V P V
P +12V; output low
OUT
P VCC; output high
OUT
Operating Temperature Range
SO .................................................................. -40NC to +85NC
TDFN ............................................................ -40NC to +125NC
Storage Temperature Range ............................ -65NC to +150NC
Junction Temperature Range ........................... -40NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Note 2: Devices are production tested at TA = +25NC. Specifications over temperature limits are guaranteed by design.
Note 3: V
Note 4: DV
Note 5: The short-circuit output current applies to peak current just prior to foldback current limiting; the short-circuit foldback out-
Note 6: Shutdown is enabled by bringing RE high and DE low. If the enable inputs are in this state for less than 50ns, the device
Note 7: Capacitive load includes test probe and fixture capacitance.
Note 8: Guaranteed by characterization; not production tested.
is the difference in VOD, with the DI at high and DI at low.
ODPP
and DVOC are the changes in |VOD| and |VOC|, respectively, with the DI at high and DI at low.
OD
put current applies during current limiting to allow a recovery from bus contention.
is guaranteed not to enter shutdown. If the enable inputs are in this state for at least 800ns, the device is guaranteed to
have entered shutdown.
to T
MIN
t
RPLH
t
RPHL
t
RSKEW
t
RZH
t
RZL
t
RLZ
t
RHZ
t
RZL(SHDN)
t
RZH(SHDN)
SHDN
, unless otherwise noted. Typical values are at VCC = +5V, T