EVALUATION KIT AVAILABLE
19-6052; Rev 0; 9/11
MAX14760/MAX14762/MAX14764
Above- and Below-the-Rails
Low-Leakage Analog Switches
General Description
The MAX14760/MAX14762/MAX14764 analog switches
are capable of passing bipolar signals that are beyond
their supply rails. These devices operate from a single
+3.0V to +5.5V supply, and support signals in the -25V
to +25V range.
The MAX14760 is a single-pole/single-throw (SPST) analog switch, while the MAX14762 is a dual-SPST analog
switch. The MAX14764 is a single-pole/double-throw
(SPDT) analog switch.
The MAX14760/MAX14762/MAX14764 feature 20I (max)
on-resistance with a Q10nA (max) on-leakage current for
MAX14760/MAX14762.
The MAX14760/MAX14764 are available in 8-pin (3mm x
3mm) TDFN packages. The MAX14762 is available in a
10-pin (3mm x 3mm) TDFN package. These devices are
specified over the -40NC to +85NC extended operating
temperature range.
Ordering Information/Selector Guide appears at end of data
sheet.
For related parts and recommended products to use with this part, refer
to www.maxim-ic.com/MAX14760.related.
Benefits and Features
S Simplify Power-Supply Requirements
3.0V to 5.5V Supply Range
-25V to +25V Signal Range
S High Performance
Q10nA (max) On-Leakage Current (MAX14760/
MAX14762)
20I (max) On-Resistance
Low On-Resistance Flatness, 58mI (typ)
Thermal Shutdown Protection
-40NC to +85NC Operating Temperature Range
High Bandwidth:115MHz (typ)
S Save Space on Board
Small 8-Pin and 10-Pin TDFN Packages
Applications
Industrial Measurement Systems
Instrumentation Systems
Opto-Relay Replacement
Medical Systems
ATE Systems
Audio Signal Routing and Switching
Functional Diagrams/Truth Tables
V
CC
MAX14760
V
EN
P
A
SUPPLY
GENERATION
GND
EN A
OPEN
0
1
CLOSED
V
N
B
V
P
A1
EN1
A2
EN2
EN1 A1
0
1
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For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
GENERATION
CLOSED
OPEN
V
CC
MAX14762
SUPPLY
GND
V
N
B1
B2
EN2 A2
OPEN
0
1
CLOSED
V
CC
MAX14764
V
P
A1
A2
SEL
SUPPLY
GENERATION
GND
SEL A1 A2
CLOSED OPEN
0
1
OPEN CLOSED
V
N
COM
MAX14760/MAX14762/MAX14764
Above- and Below-the-Rails
Low-Leakage Analog Switches
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND, unless otherwise noted.)
VCC .......................................................................... -0.3V to +6V
EN, EN1, EN2, SEL ................................ -0.3V to +(VCC + 0.3V)
A, A1, A2, B, B1, B2, COM ................... (VN - 0.3V) to Lesser of
(VP + 0.3V) or (VN + 52V)
VP ................................ -0.3V to Lesser of (+52V) or (VN + 70V)
VN ........................Greater of (VCC - 40V) or (VP - 70V) to +0.3V
VP to V
Continuous Current ......................................................... Q25mA
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
...................................................................
N
-0.3V to 70V
PACKAGE THERMAL CHARACTERISTICS (Note 1)
8 TDFN
Junction-to-Ambient Thermal Resistance (qJA) ...........41°C/W
Junction-to-Case Thermal Resistance (qJC) ..................8°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Continuous Power Dissipation (TA = +70NC)
8-Pin TDFN Package (derate 24.4mW/NC
above +70NC)..........................................................1951.2mW
10-Pin TDFN Package (derate 24.4mW/NC
above +70NC)..........................................................1951.2mW
Operating Temperature Range .......................... -40NC to +85NC
Storage Temperature Range ............................ -65NC to +160NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
10 TDFN
Junction-to-Ambient Thermal Resistance (qJA) ...........41°C/W
Junction-to-Case Thermal Resistance (qJC) ..................9°C/W
ELECTRICAL CHARACTERISTICS
(VCC = 3.0V to 5.5V, TA = -40NC to +85NC, unless otherwise noted. Typical values are at VCC = 5V, and TA = +25NC.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DC CHARACTERISTICS
Power Supply Range V
Continuous Current Through
Switch
Supply Current I
Analog Signal Range
On-Resistance R
On-Resistance Flatness DR
A, A1, A2 Off-Leakage Current I
COM, B, B1, B2 Off-Leakage
Current
V
V
A_, VB_
A_(OFF)VA_
I
COM(OFF)
I
B_(OFF)
CC
I
A
CC
COM,
ON
ON
V
= V
EN_
VCC P 4.7V
VCC > 4.7V
Switch open or closed -25 +25 V
I
or IB_ = Q25mA, VA_= Q25V 8 20
COM
-25V < VA_< +25V, I
= +25V, V
V
COM
(MAX14764)
,
VB_ = 15V, V
MAX14762)
COM
or VB_ = 15V, V
A_
V
V
V
COM
or VB_= 0V, Figure 1 -30 +30 nA
A_
= 0V, Figure 1 (MAX14760/
CC
= VCC/2 4.1 10
EN_
= V
EN_
CC
= VCC/2 2.5 6
EN_
or IB_ = Q25mA 58 mI
= 0V, Figure 1
3.0 5.5 V
-25 +25 mA
4.1 10
2.5 6
-10 +10
-10 +10
mA
I
nA
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MAX14760/MAX14762/MAX14764
Above- and Below-the-Rails
Low-Leakage Analog Switches
ELECTRICAL CHARACTERISTICS (continued)
(VCC = 3.0V to 5.5V, TA = -40NC to +85NC, unless otherwise noted. Typical values are at VCC = 5V, and TA = +25NC.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
V
= Q25V, B/COM is unconnected,
A_
On-Leakage Current I
DIGITAL LOGIC
Input-Voltage Logic-Low V
Input-Voltage Logic-High V
Input Current I
AC CHARACTERISTICS
Power-On Time t
Enable Turn-On Time t
Enable Turn-Off Time t
Break-Before-Make Interval t
Off-Isolation V
Crosstalk V
-3dB Bandwidth BW RS = 50I, RL = 1kI , V
Total Harmonic Distortion THD+N RS = RL = 1kI, f = 20Hz to 20kHz 0.005 %
Charge Injection Q VA_= GND, CL = 1nF, Figure 7 19 pC
Input Capacitance C
THERMAL PROTECTION
Thermal Shutdown Temperature t
Shutdown Temperature Hysteresis t
ESD PROTECTION
All Pins Human Body Model Q2 kV
Note 2: All devices are 100% production tested at TA = +25°C. Specifications over operating temperature range are guaranteed
by design.
Note 3: The power-on time is defined as the settling time for the charge pump’s output to reach steady-state value within 1%.
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ON
PWRONVA_
ON
OFF
BBM
ISO
HYST
SHUT
Figure 1 (MAX14760/MAX14762)
V
= Q25V, B/COM is unconnected,
A_
Figure 1 (MAX14764)
VCC = 3.0V 0.7
VCC = 3.6V 0.7
IL
VCC = 4.5V 0.8
VCC = 5.5V 0.8
VCC = 3.0V 1.7
VCC = 3.6V 1.9
IH
VCC = 4.5V 2.0
VCC = 5.5V 2.1
L
= Q10V, CVP = CVN = 1FF (Note 3) 320 ms
V
= Q10V, RL = 10kI, Figure 2
A_
(MAX14760/MAX14762)
V
= Q10V, RL = 10kI, Figure 2
A_
(MAX14764)
(Figure 2) 110 400 Fs
V
= 1V
A_
Figure 3 (MAX14764)
VA_= 1V
CL = 15pF, Figure 4
RS = RL = 50I, f = 100kHz, V
CT
Figure 5 (MAX14764)
At A, A1, A2, B, B1, B2, and COM pins 32 pF
IN
, RL = 10kI,
RMS
, f = 100kHz, RL = 50I,
RMS
= 1V
A_
= 1V
COM
P-P,
RMS
Figure 6 115 MHz
-10 +10
-30 +30
-1 +1 FA
100 200 Fs
1.04 1.6 ms
740 Fs
-77 dB
,
-92 dB
+154 NC
24 NC
nA
V
V
MAX14760/MAX14762/MAX14764
Above- and Below-the-Rails
Low-Leakage Analog Switches
Test Circuits/Timing Diagrams
+5V
V
CC
MAX14760
MAX14762
MAX14764
A_
EN_/SEL
SWITCH
OPEN
OFF-LEAKAGE CURRENT ON-LEAKAGE CURRENT
GND
Figure 1. Leakage Current Measurement
+5V
0.1µF
B_/COM
0.1µF
+5V
0.1µF
V
CC
MAX14760
MAX14762
MAX14764
GND
B_/COM
UNCONNECTED
AA
SWITCH
CLOSED
A_
A
EN_/SEL
LOGIC
INPUT
Figure 2. Switching Time
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A_+10V
EN_/SEL
V
CC
MAX14760
MAX14762
MAX14764
GND
B_/COM V
R
L
OUT
LOGIC
INPUT
SWITCH
OUTPUT
(V
OUT
50%
0
)
t
ON
0.9 x V
OUT
50%
t
OFF
0.1 x V
OUT