MAXIM MAX14548E, MAX14548AE User Manual

19-5248; Rev 0; 4/10
EVALUATION KIT
AVAILABLE
100Mbps, 16-Channel LLTs
General Description
The MAX14548E/MAX14548AE 16-channel, bidirectional level translators (LLTs) provide the level shifting neces­sary for 100Mbps data transfer in multivoltage systems. Externally applied voltages, VCC and VL, set the logic levels on either side of the device. Logic signals present on the VL side of the device appear as a high-voltage logic signal on the VCC side of the device and vice versa.
The devices feature a programming frequency input (PF) that adjusts the one-shot accelerator on-time to guaran­tee a bit rate of 100Mbps with a load capacitance < 15pF and VL > 1.1V (MAX14548E) or VL > 1.4V (MAX14548AE) when driven low. The MAX14548E can drive capacitive loads up to 50pF with a guaranteed bit rate of 40Mbps when VL R 1.1V and PF is driven high. The MAX14548AE can drive capacitive loads up to 50pF with a guaranteed bit rate of 40Mbps when VL R 1.1V and PF is driven high.
The device operate at full speed with external drivers that source as low as 4mA output current. Each I/O chan­nel is pulled up to VCC or VL by an internal 35FA current source, allowing both devices to be driven by either push-pull or open-drain drivers.
The devices feature multiple power-saving features including an enable input (EN) that places the device into a low-power shutdown mode when driven low and an automatic shutdown mode that disables the part when VCC is less than VL. The MAX14548AE output driv­er is designed to operate at full speed (100Mbps) with VL > 1.4V, which reduces the dynamic supply current vs. the MAX14548E. The state of I/O V high-impedance state during shutdown.
The devices operate with VCC voltages from +1.7V to +3.6V and VL voltages from +1.1V to +3.6V, making them ideal for data transfer between low-voltage ASICs/ PLDs and higher voltage systems. The devices are avail­able in a 40-bump WLP (2.16mm x 3.46mm) package with 0.4mm ball pitch, and operate over the extended
-40NC to +85NC temperature range.
and I/O VL_are in
CC_
Features
S Bidirectional Level Translation
S 100Mbps Guaranteed Data Rate
S +1.7V to +3.6V Supply Voltage Range for V
S +1.1V to +3.6V Supply Voltage Range for V
(VCC > VL)
S -40NC to +85NC Extended Operating Temperature
Range
CC
L
Applications
CMOS Logic-Level Translation
Low-Voltage ASIC Level Translation
Smart Card Readers
Portable Communication Devices
Cell Phones
GPS
Telecommunications Equipment
Typical Operating Circuit appears at end of data sheet.
MAX14548E/MAX14548AE
Ordering Information/Selector Guide
PART
MAX14548EEWL+ 40 WLP 100 40 MAX14548AEEWL+ 40 WLP 100 40 Yes (VL > 1.1V)
Note: All devices operate over the -40°C to +85°C operating temperature range.
+Denotes a lead(Pb)-free/RoHS-compliant package.
_______________________________________________________________ Maxim Integrated Products 1
PIN-
PACKAGE
BIT RATE (PF = LOW)
LOAD CAPACITANCE < 15pF
(Mbps)
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
BIT RATE (PF = HIGH)
LOAD CAPACITANCE < 50pF
(Mbps)
LOW DYNAMIC
SUPPLY
CURRENT
100Mbps, 16-Channel LLTs
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND.)
VCC, VL, EN, PF....................................................... -0.3V to +4V
I/O V
................................................... -0.3V to (VCC + 0.3V)
CC_
I/O VL_ ......................................................... -0.3V to (VL + 0.3V)
Short-Circuit Duration I/O VL_, I/O V
to GND ....................................................Continuous
CC_
Continuous Power Dissipation (TA = +70NC)
40-Bump WLP (derate 17.2mW/NC above +70NC) ....1379mW
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = +1.7V to +3.6V, VL = +1.1V to +3.6V, VCC > VL, EN = VL, C noted. Typical values are at VCC = +2.8V, VL = +1.8V and TA = +25NC.) (Notes 2, 3)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
POWER SUPPLIES
VL Supply Range V
MAX14548E/MAX14548AE
VCC Supply Range V Supply Current from V Supply Current from V
CC
L
VCC Shutdown Supply Current
VL Shutdown Mode Supply Current
Dynamic Supply Current I
I/O V
, I/O VL_ Three-State
CC_
Leakage Current
EN, PF Input Leakage Current I VL Shutdown Threshold V
VL - VCC Shutdown Threshold High
VL - VCC Shutdown Threshold Low
I/O VL_ Pullup Current I I/O V
I/O VL_ to I/O V
Pullup Current I
CC_
DC
CC_
Resistance
L
CC
I
QVCC
I
QVL
I
SHDN-VCC
I
SHDN-VL
D
I
LEAK
LEAK_EN_PF
TH_VL
V
TH_H
V
TH_L
VL_PU_
VCC_PU_
R
IOVL_IOVCC
I/O V
CC_
I/O V
CC_
TA = +25NC, EN = GND, unconnected I/O pins
TA = +25NC, EN = GND, unconnected I/O pins
TA = +25NC, EN = VL, VCC = GND, unconnected I/O pins
One I/O switching at 25MHz; all other I/O connected to VCC or VL; C
LOAD
TA = +25NC, EN = GND
TA = +25NC
VCC rising (VL = 3.6V) (Note 4) 0.05 0.3 0.65 V
VCC falling (VL = 3.6V) (Note 4) 0.2 0.52 0.85 V
I/O VL_ = GND, I/O V I/O V
CC_
(Note 5) 3
Junction-to-Ambient Thermal Resistance (BJA)
(Note 1) ........................................................................58NC/W
Operating Temperature Range .......................... -40NC to +85NC
Storage Temperature Range ............................ -65NC to +150NC
Junction Temperature .....................................................+150NC
Soldering Temperature (reflow) ......................................+260NC
= 1FF, CVL = 1FF, TA = -40NC to +85NC, unless otherwise
VCC
1.1 3.6 V
1.7 3.6 V = VCC, I/O VL_ = V = VCC, I/O VL_ = V
L
L
40 20
0.1 1
0.1 1
0.1 2
MAX14548E 2.9
= 0pF
MAX14548AE 2.6
0.1 6
0.3 V
= GND 10 125
CC_
= GND, I/O VL_ = GND 15 90
1
FA FA
FA
FA
mA
FA
FA
FA FA
kI
2
100Mbps, 16-Channel LLTs
ELECTRICAL CHARACTERISTICS (continued)
(VCC = +1.7V to +3.6V, VL = +1.1V to +3.6V, VCC > VL, EN = VL, C noted. Typical values are at VCC = +2.8V, VL = +1.8V and TA = +25NC.) (Notes 2, 3)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
ESD PROTECTION
Human Body
I/O V
CC_
, I/O V
L_
Model, C
VCC
C
= 1FF
VL
= 1FF,
All Other Pins
LOGIC LEVELS
I/O VL_ Input-Voltage High Threshold
I/O VL_ Input-Voltage Low Threshold
I/O V
Input-Voltage High
CC_
Threshold
I/O V
Input-Voltage Low
CC_
Threshold
EN, PF Input-Voltage High Threshold
EN, PF Input-Voltage Low Threshold
I/O VL_ Output-Voltage High V
I/O VL_ Output-Voltage Low, Drop to GND
I/O V
I/O V
Output-Voltage High V
CC_
Output-Voltage Low,
CC_
Drop to GND
V
V
V
V
V
V
IHL
ILL
IHC
ILC
V
IH
V
IL
OHL
OLL
OHC
OLC
(Note 6)
(Note 6) 0.15 V
(Note 6)
(Note 6) 0.2 V
1.1V < VL < 1.3V
VL = 1.8V
1.1V < VL < 1.3V 0.4 VL = 1.8V 0.4
I/O VL_ source current = 10FA
I/O VL_ sink current = 20FA, I/O V
I/O V
I/O V I/O V
< 0.05V
CC_
source current = 10FA
CC_
sink current = 20FA,
CC_
< 0.05V
L_
RISE/FALL TIME ACCELERATOR STAGE
PF = low
Accelerator Pulse Duration
PF = high
VL Output Accelerator Source Impedance
VCC Output Accelerator Source Impedance
VL Output Accelerator Sink Impedance
VCC Output Accelerator Sink Impedance
VL = 1.62V 7 VL = 3.2V 4.43 VCC = 2.2V 14.2 VCC = 3.6V 11.2 VL = 1.62V 15.3 VL = 3.2V 15.3 VCC = 2.2V 20.3 VCC = 3.6V 19.5
= 1FF, CVL = 1FF, TA = -40NC to +85NC, unless otherwise
VCC
Unpowered device
Powered device
On rising edge 2.65 On falling edge 2.5 On rising edge 4 On falling edge 3.7
VL -
0.2
VCC -
0.4
VL -
0.25
VL -
0.4
4/5 x
V
4/5 x V
CC
MAX14548E/MAX14548AE
Q12
kV
Q5
Q2
L
1/3 x
V
L
1/3 x
V
CC
kV
V
V
V
V
V
V
V
V
ns
ns
I
I
I
I
3
100Mbps, 16-Channel LLTs
HIGH-SPEED TIMING CHARACTERISTICS—MAX14548E
(VCC = +1.7V to +3.6V, VL = +1.1V to +3.6V, VCC > VL, EN = VL, PF = low, C TA = -40NC to +85NC, unless otherwise noted. Typical values are at VCC = +2.8V, VL = +1.8V and TA = +25NC.) (Notes 2, 3)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
I/O V I/O V I/O VL_ Rise Time t I/O VL_ Fall Time t
Propagation Delay (Driving I/O VL_)
Propagation Delay (Driving I/O V
Channel-to-Channel Skew t
Propagation Delay from I/O VL_ to I/O V
Propagation Delay from I/O V
Maximum Data Rate
MAX14548E/MAX14548AE
HIGH-SPEED TIMING CHARACTERISTICS—MAX14548AE
Rise Time t
CC_
Fall Time t
CC_
)
CC_
After EN
CC_
to I/O VL_ After EN
CC_
RVCC
FVCC
RVL
FVL
t
PVL-VCC
t
PVCC-VL
SKEW
t
EN-VCC
t
EN-VL
Input rise time < 2ns, Figure 1 2 ns Input fall time < 2ns, Figure 1 2 ns Input rise time < 2ns, Figure 2 2 ns Input fall time < 2ns, Figure 2 2 ns
Input rise time < 2ns, Figure 1 2.75 ns
Input rise time < 2ns, Figure 2 2.26 ns
Input rise time/fall time < 2ns 0.2 ns
R
= 1MI, Figure 3
LOAD
R
= 1MI, Figure 3
LOAD
Push-pull operation 100 Open-drain operation 0.3
(VCC = +1.7V to +3.6V, VL = +1.4V to +3.6V, VCC > VL, EN = VL, PF = low, C TA = -40NC to +85NC, unless otherwise noted. Typical values are at VCC = +2.8V, VL = +1.8V and TA = +25NC.) (Notes 2, 3)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
I/O V I/O V I/O VL_ Rise Time t I/O VL_ Fall Time t
Propagation Delay (Driving I/O VL_)
Propagation Delay (Driving I/O V
Channel-to-Channel Skew t
Propagation Delay from I/O VL_ to I/O V
Propagation Delay from I/O V
Maximum Data Rate
Rise Time t
CC_
Fall Time t
CC_
)
CC_
After EN
CC_
to I/O VL_ After EN
CC_
RVCC
FVCC
RVL
FVL
t
PVL-VCC
t
PVCC-VL
SKEW
t
EN-VCC
t
EN-VL
Input rise time < 2ns, Figure 1 2 ns Input fall time < 2ns, Figure 1 2 ns Input rise time < 2ns, Figure 2 2 ns Input rise time < 2ns, Figure 2 2 ns
Input rise time < 2ns, Figure 1 2.75 ns
Input rise time < 2ns, Figure 2 2.26 ns
Input rise time/fall time < 2ns 0.2 ns
R
= 1MI, Figure 3
LOAD
R
= 1MI, Figure 3
LOAD
Push-pull operation 100 Open-drain operation 0.3
= 1FF, CVL = 1FF, C
VCC
= 1FF, CVL = 1FF, C
VCC
IOVL
27
0.05
IOVL
27
0.05
P 15pF, C
P 15pF, C
IOVCC
IOVCC
P 15pF,
Fs
Fs
Mbps
P 15pF,
Fs
Fs
Mbps
4
100Mbps, 16-Channel LLTs
LOW-SPEED TIMING CHARACTERISTICS—MAX14548E
(VCC = +1.7V to +3.6V, VL = +1.1V to +3.6V, VCC > VL, EN = VL, PF = high, C TA = -40NC to +85NC, unless otherwise noted. Typical values are at VCC = +2.8V, VL = +1.8V and TA = +25NC.) (Notes 2, 3)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
I/O V I/O V I/O VL_ Rise Time t I/O VL_ Fall Time t
Propagation Delay (Driving I/O VL_)
Propagation Delay (Driving I/O V
Channel-to-Channel Skew t
Propagation Delay from I/O V
Propagation Delay from I/O V
Maximum Data Rate
Rise Time t
CC_
Fall Time t
CC_
)
CC_
to I/O V
L_
to I/O VL_ After EN
CC_
CC_
After EN
RVCC
FVCC
RVL
FVL
t
PVL-VCC
t
PVCC-VL
SKEW
t
EN-VCC
t
EN-VL
Input rise time < 6ns, Figure 1 6 ns Input fall time < 6ns, Figure 1 6 ns Input rise time < 6ns, Figure 2 6 ns Input rise time < 6ns, Figure 2 6 ns
Input rise time < 6ns, Figure 1 4 ns
Input rise time < 6ns, Figure 2 3.37 ns
Input rise time/fall time < 6ns 0.2 0.5 ns
R
= 1MI, Figure 3
LOAD
R
= 1MI, Figure 3
LOAD
Push-pull operation 40 Open-drain operation 0.3
LOW-SPEED TIMING CHARACTERISTICS—MAX14548AE
(VCC = +1.7V to +3.6V, VL = +1.1V to +3.6V, VCC > VL, EN = VL, PF = high, C TA = -40NC to +85NC, unless otherwise noted. Typical values are at VCC = +2.8V, VL = +1.8V and TA = +25NC.) (Notes 2, 3)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
I/O V I/O V I/O VL_ Rise Time t I/O VL_ Fall Time t
Propagation Delay (Driving I/O VL_)
Propagation Delay (Driving I/O V
Channel-to-Channel Skew t
Propagation Delay from I/O VL_ to I/O V
Propagation Delay from I/O V
Maximum Data Rate
Note 2: All units are 100% production tested at TA = +25°C. Limits over the operating temperature range are guaranteed by
Note 3: VL must be less than or equal to VCC during normal operation. However, VL can be greater than VCC during startup and
Note 4: When VCC is below VL by more than the VL - VCC shutdown threshold, the device turns off its pullup generators and
Note 5: Guaranteed by design. Note 6: Input thresholds are referenced to the boost circuit.
Rise Time t
CC_
Fall Time t
CC_
)
CC_
After EN
CC_
to I/O VL_ After EN
CC_
design and not production tested.
shutdown conditions.
I/O V
CC_
and I/O V
enter their respective shutdown states.
L_
RVCC
FVCC
RVL
FVL
t
PVL-VCC
t
PVCC-VL
SKEW
t
EN-VCC
t
EN-VL
Input rise time < 6ns, Figure 1 6 ns Input fall time < 6ns, Figure 1 6 ns Input rise time < 6ns, Figure 2 6 ns Input rise time < 6ns, Figure 2 6 ns
Input rise time < 6ns, Figure 1 4 ns
Input rise time < 6ns, Figure 2 3.37 ns
Input rise time/fall time < 6ns 0.2 ns
R
= 1MI, Figure 3
LOAD
R
= 1MI, Figure 3
LOAD
Push-pull operation 40 Open-drain operation 0.3
= 1FF, CVL = 1FF, C
VCC
= 1FF, CVL = 1FF, C
VCC
IOVL
27
0.06
IOVL
27
0.06
P 50pF, C
P 50pF, C
IOVCC
IOVCC
P 50pF,
Fs
Fs
Mbps
P 50pF,
Fs
Fs
Mbps
MAX14548E/MAX14548AE
5
100Mbps, 16-Channel LLTs
V
L
V
EN
L
V
CC
V
CC
MAX14548E
MAX14548AE
I/O V
V
L
L_
V
CC
I/O V
CC_
C
IOVCC
NOTE: THE INPUT RISE/FALL TIMES ARE < 2ns FOR HIGH SPEED AND < 6ns FOR LOW SPEED.
Figure 1. Push-Pull Driving I/O VL_ Test Circuit and Timing
V
MAX14548E/MAX14548AE
L
V
EN
L
V
CC
MAX14548E
MAX14548AE
C
IOVCC
I/O V
V
L
L_
V
CC
I/O V
CC_
V
CC
I/O V
CC_
10%
50%
50%
10%
I/O V
t
PLH
t
RVCC
90%
L_
t
PVL-VCC
t
RVL
50%
50%
= t
I/O V
90%
PLH
CC_
OR t
PHL
50%
t
50%
90%
50%
PLH
t
FVCC
t
90%
FVL
50%
10%
I/O V
10%
L_
NOTE: THE INPUT RISE/FALL TIMES ARE < 2ns FOR HIGH SPEED AND < 6ns FOR LOW SPEED.
Figure 2. Push-Pull Driving I/O V
6
Test Circuit and Timing
CC_
t
PLH
t
PVCC-VL = tPLH OR tPHL
t
PLH
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