The MAX13325/MAX13326 dual audio line drivers provide
a reliable differential interface between automotive audio
components. The devices feature differential inputs and
outputs, integrated output diagnostics, and are controlled
using an I2C interface or operate in stand-alone mode.
The outputs can deliver up to 4V
The MAX13325 buffers analog audio signals for transmission over long cable distances with a fixed gain of
12dB, whereas the MAX13326 provides a 0dB fixed
gain. The diagnostics on the outputs report conditions
on a per channel basis, including short to GND, short
to battery, overcurrent, overtemperature, and excessive
offset. The output amplifiers can drive capacitive loads
up to 4nF to ground and 3nF differentially.
The outputs are protected according to IEC 61000-4-2
Q8kV Contact Discharge, and Q15kV Air Gap. The
MAX13325/MAX13326 are specified from -40NC to
+105NC and are available in a 28-pin TSSOP package
with an exposed pad.
Applications
Automotive Radio and Rear Seat Entertainment
Professional Remote Audio Amplifiers
into 100I loads.
RMS
Features
SComprehensive Programmability and Diagnostics
Using I2C Interface
SAutoretry Function in Stand-Alone Mode
SDrive Capacitive Loads ≤ 3nF Differentially, ≤ 4nF
to Ground
S112dB Signal-to-Noise Ratio
SLow 0.002% THD at 4V
SHigh PSRR (70dB at 1kHz)
SHigh CMRR (80dB at 1kHz)
SLow Output Noise (3µV
SExcellent Channel-to-Channel Matching
SLoad-Dump Transient Protection
SProtected Output Against Various Short-Circuit
Conditions
SESD Protection for ±8kV Contact Discharge,
±15kV Air Gap
SLong-Distance Drive Capability Typically Up to
15m or Greater
SNoise-Rejecting Differential Inputs and Outputs
SLow-Power Shutdown Mode < 10µA
SHardware or Software MUTE Function
S28-Pin TSSOP Package with Exposed Pad
into 2.7kI Loads
RMS
), MAX13326
RMS
MAX13325/MAX13326
Typical Operating Circuit
V
C6
100nF
MICROPROCESSOR
FROM AUDIO
SOURCE
FROM AUDIO
SOURCE
C1
DIAGNOSTIC
MAX13325
MAX13326
OUTPUT
470nF
CHARGE
PUMP
BIAS
CHOLDCMCP
PROTECTION
+5V
V
L
ADD1
ADD0
SDA
2
C INTERFACE
I
SCL
AND
DIGITAL CONTROL
TO
FLAG
SHDN
MUTE
C7
2.2µF
INLP
INLM
C8
2.2µF
C9
2.2µF
INRP
INRM
C10
2.2µF
*OPTIONAL : NEEDED FOR AUTOMOTIVE LOAD DUMP PROTECTION ONLY
**USE D2 WHEN CHARGE PUMP IS OFF AND EXTERNAL SUPPLY IS PROVIDED TO C HOLD
LEFT
RIGHT
SUP
D2**
V
DD
PGND
BIAS
CSS
GND
OUTLP
OUTLM
OUTRP
OUTRM
* OPTIONAL
C2
µF
1
ESD
+12V
C4
10µF
C5
220nF
Q1
1nF
1nF
R1
1kI
D1
1nF
1nF
1nF
1nF
Ordering Information
PART
MAX13325GUI/V+ 28 TSSOP-EP*
C3
1µF
MAX13326GUI/V+ 28 TSSOP-EP*
/V Denotes an automotive qualified part.
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
Dual Automotive, Audio Line Drivers
with I2C Control and Diagnostic
ABSOLUTE MAXIMUM RATINGS
VDD to PGND ........................................................-0.3V to +28V
CHOLD .................................................................-0.3V to +28V
VL to GND ...............................................................-0.3V to +6V
GND, PGND ........................................................-0.3V to +0.3V
OUT_ to PGND ........................................................ -0.3V to 28V
IN_, BIAS to AGND ..................................-0.3V to (VDD + 0.3V)
SCL, SDA, ADD0, ADD1, MUTE, SHDN,
FLAG to GND ..........................................................-0.3V to +6V
OUT_ Short Circuit to PGND or VDD .........................Continuous
Short Circuits Between Any OUT_ ............................ Continuous
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
MAX13325/MAX13326
(VDD = 14.4V, VL = 5V, RL = J, load impedance from OUT_+ to OUT_-, TA = TJ = -40NC to +105NC, typical values are TA = +25NC,
unless otherwise noted.) (Note 2)
12SHDNShutdown Input. Drive SHDN low to power down the device.
13MUTEMute Input. Drive MUTE low to mute the outputs. The outputs are low impedance in mute.
Logic Supply Voltage. Connect VL to a 2.7V to 5V logic supply. Bypass VL to GND with a 0.1FF
capacitor.
Left Audio Positive Input. Either input of each pair can be used as a single-ended input, with the
complementary input bypassed to GND.
Left Audio Negative Input. Either input of each pair can be used as a single-ended input, with the
complementary input bypassed to GND.
Power-Supply Input. Connect VDD to the supply voltage. Bypass VDD to GND through a 1FF
capacitor.
Right Audio Negative Input. Either input of each pair can be used as a single-ended input, with the
complementary input bypassed to GND.
Right Audio Positive Input. Either input of each pair can be used as a single-ended input, with the
complementary input bypassed to GND.
18GNDAnalog Ground. Ground connection for the input bias and gain circuits.
19OUTRMRight Audio Negative Output. Each output is current limited.
20OUTRPRight Audio Positive Output . Each output is current limited.
21PGNDPower Ground. Ground connection for the output stage drivers.
22CHOLD
23OUTLMLeft Audio Negative Output. Each output is current limited.
24OUTLPLeft Audio Positive Outputs. Each output is current limited.
25CPCharge-Pump Flying Capacitor, Positive Connection
26CMCharge-Pump Flying Capacitor, Negative Connection
27FLAG
28CSS
—EPExposed Pad. Connect to PGND.
I2C Address Inputs. Connect ADD0 and ADD1 to VL, GND, SCL, or SDA to select 7 I2C addresses.
Connect ADD0 and ADD1 to GND for stand-alone mode.
I2C Address Inputs. Connect ADD0 and ADD1 to VL, GND, SCL, or SDA to select 7 I2C addresses.
Connect ADD0 and ADD1 to GND for stand-alone mode.
Charge-Pump Output (When Charge Pump is On; CPOFF = 0). When the charge pump is off,
provide an external supply through a diode to the CHOLD input. Bypass CHOLD with 1µF to PGND.
Open-Drain Fault Flag Output. FLAG indicates a fault on any one channel. In stand-alone mode,
FLAG is stretched to a typical pulse width of 100ms.
Soft-Start Capacitor Connection. CSS is charged/discharged by < 100FA current to get soft mute/
play transition. Bypass to GND through a 220nF capacitor.
MAX13325/MAX13326
Detailed Description
The MAX13325/MAX13326 audio line drivers are designed
to transmit audio data across noisy environments. The differential interface is highly resistant to noise injection from
external sources common to automotive applications.
The MAX13325/MAX13326 operate in stand-alone or
I2C-compatible mode with diagnostic outputs capable
of detecting short to GND or battery, overcurrent, overtemperature, or excessive offset. A short across another
audio output signal line is also protected.
Table 1. Register Address Map
ADDRESSREGISTER TYPENAMEREAD/WRITEDEFAULT
0x00Configuration CONFIGRead/Write0x00
0x01Command ByteCMDRead/Write0x00
0x02General Fault GFAULTRead0x00
0x03Left-Channel Fault LFAULTCleared on Read0x00
0x04Right-Channel Fault RFAULTCleared on Read0x00
Dual Automotive, Audio Line Drivers
with I2C Control and Diagnostic
Configuration Register
Table 2. Configuration Register Format
FUNCTION
Configuration
Register
DIAG: Set DIAG to 1 to enable diagnostic mode. Write '0' to disable diagnostic mode.
ENABLE: Set ENABLE bit to 1 to enable the device. Write ‘0’ disables the device. Low on the SHDN pin overrides the
ENABLE bit.
MUTE: Set the MUTE bit to 1 to mute both the output channels. Output is low impedance when in mute. Low on the
MUTE pin input overrides the MUTE bit.
CPOFF: Set the CPOFF bit to 1 to turn off the charge pump. CHOLD pin must be externally supplied (see the V
parameter in the Electrical Characteristics table). Charge pump is enabled when CPOFF = 0.
OLDL: Write 1 to the OLDL bit to initiate the open-load detection for the left channel. To run OLDL again, write ‘0’ and
‘1’ again.
OLDR: Write 1 to the OLDR bit to initiate the open-load detection for the right channel. To run OLDR again, write ‘0’
MAX13325/MAX13326
and ‘1’ again.
ADDRESS
CODE (HEX)
0x00DIAGENABLEMUTECPOFFOLDLOLDRCPF1CPF00x00
D7D6D5D4D3D2D1D0
Table 2a. Charge-Pump Frequency Bits
CPF1CPF0FREQUENCY (kHz)
00333
01190
10426
11260
REGISTER DATA
POR STATE
(HEX)
CPH
CPF[1:0]: Sets the frequency of the charge pump.
Command Byte Register
Table 3. Command Byte Register Format
FUNCTION
Command Byte
Register
RETRYR: The right-channel power amplifier switches off after a fault condition. Write ‘1’ to turn it back on after the fault
condition.
RETRYL: The left-channel power amplifier switches off after a fault condition. Write ‘1’ to turn on the left-channel power
amplifier after the fault condition.
TWARN: The TWARN bit is set to ‘1’ when the temperature warning threshold is reached.
TSHDN: The TSHDN is set to ‘1’ when the temperature shutdown threshold is reached.
DUMP: The DUMP bit is set to ‘1’ when the VDD voltage exceeds the overvoltage threshold.
Set the appropriate mask bit in the GMASK register to detect the general faults. See Table 8.
ADDRESS
CODE (HEX)
0x02xTWARNTSHDNDUMPxxxx0x00
D7D6D5D4D3D2D1D0
Table 5. Left-Channel Fault Register Format
ADDRESS
FUNCTION
Left-Channel
Fault Register
CODE
(HEX)
0x03SVDDLSGNDLLIMITLxOFFSETLOPENLxx0x00
D7D6D5D4D3D2D1D0
REGISTER DATA
REGISTER DATA
General Faults
MAX13325/MAX13326
POR STATE
(HEX)
Left-Channel Faults
POR STATE
(HEX)
SVDDL: The SVDDL bit is set to ‘1’ when a short to VDD is detected on the left channel.
SGNDL: The SGNDL bit is set to ‘1’ when a short to GND is detected on the left channel.
LIMITL: The LIMITL bit is set to ‘1’ when the current-limit threshold is tripped for left output.
OFFSETL: The OFFSETL bit is set to ‘1’ when excessive offset is detected on the left-channel output.
OPENL: The OPENL bit is set to ‘1’ when an open load is detected on the left channel.
Set the appropriate mask bit in the LMASK register to detect the faults on the left channel. See Table 9.
When any bit of the LFAULT register is high, the FLAG output is low.
Right-Channel Faults
Table 6. Right-Channel Fault Register Format
ADDRESS
FUNCTION
Right-Channel
Fault Register
SVDDR: The SVDDR bit is set to ‘1’ when a short to VDD is detected on the right channel.
SGNDR: The SGNDR bit is set to ‘1’ when a short to GND is detected on the right channel.
LIMITR: The LIMITR bit is set to ‘1’ when the current-limit threshold is tripped for right output.
OFFSETR: The OFFSETR bit is set to ‘1’ when excessive offset is detected on the right-channel output.
OPENR: The OPENR bit is set to ‘1’ when an open load is detected on the right channel.
Set the appropriate mask bit in the RMASK register to detect the faults on the right channel. See Table 10.
When any bit of the RFAULT register is high, the FLAG output is pulled low.
Dual Automotive, Audio Line Drivers
with I2C Control and Diagnostic
FLAG Register
Table 7. Flag Register Format
ADDRESS
FUNCTION
FLAG
Register
FLAG: FLAG bit is set to ‘1’ when the FLAG output is logic-low. The FLAG bit allows to quickly access the status of the
device without using the FLAG output and without having to read all the fault registers.
LHIGHZ: The LHIGHZ bit is set to ‘1’ when the left-channel output is high impedance; for example due to a short circuit.
RHIGHZ: The RHIGHZ bit is set to ‘1’ when the right-channel output is high impedance; for example due to a short
circuit.
OFFSETL: The OFFSETL bit is set to ‘1’ when excessive offset is detected on the left-channel output.
OFFSETR: The OFFSETR bit is set to ‘1’ when excessive offset is detected on the right-channel output.
ID[2:0]: The ID[2:0] bits indicate the device type (12dB = 100 and 0dB = 101).
MTWARN: Set MTWARN to ‘1’ to enable the TWARN fault detection. See Table 4.
MTSHDN: Set MTSHDN to ‘1’ to enable the TSHDN fault detection. See Table 4.
MDUMP: Set MDUMP to ‘1’ to enable the DUMP fault detection. See Table 4.
Left-Channel Mask Register
Table 9. Left-Channel Mask Register
ADDRESS
FUNCTION
Left-Channel
Mask Register
MSVDDL: Set MSVDDL to 1 to enable the short to VDD detection on the left channel.
MSGNDL: Set MSGNDL to 1 to enable the short to GND detection on the left channel.
MLIMITL: Set MLIMITL to 1 to enable overcurrent detection on the left channel.
MOFFSETL: Set MOFFSETL to 1 to enable excessive-offset detection on the left-channel output.
MOPENL: Set MOPENL to 1 to enable open-load detection on the left channel.
MSVDDR: Set MSVDDR to 1 to enable the short to VDD detection on the right channel.
MSGNDR: Set MSGNDR to 1 to enable the short to GND detection on the right channel.
MLIMITR: Set MLIMITR to 1 to enable overcurrent detection on the right channel.
MOFFSETR: Set MOFFSETR to 1 to enable excessive-offset detection on the right channel.
MOPENR: Set MOPENR to 1 to enable open-load detection on the right channel.
REGISTER DATA
MAX13325/MAX13326
POR
STATE
(HEX)
I2C and Stand-Alone Diagnostics
When the DIAG bit and the appropriate mask bits are set
to 1, the MAX13325/MAX13326 enter diagnostic mode.
In this mode, the MAX13325/MAX13326 detect short
to GND, short to battery, overcurrent condition, overtemperature condition, excessive offset, and report the
diagnosis using the I2C serial interface, FLAG bit, and
the FLAG output.
For stand-alone mode, there exists a 500ms stand-alone
fault retry function (for autoretry) until the fault goes
away. The FLAG output is pulsed to indicate a fault.
Output Short to V
When in diagnostic mode, the MAX13325/MAX13326
detect if any of the differential outputs is shorted to VDD
or battery. Upon detection of the short to VDD or battery,
the faulted channel is switched off and its output goes
into a high-impedance state. The fault is reported using
the I2C interface and the FLAG output. See Table 11.
Dual Automotive, Audio Line Drivers
with I2C Control and Diagnostic
Output Short to GND
When in diagnostic mode, the MAX13325/MAX13326
detect if any of the differential outputs is shorted to
ground. Upon detection of the short to ground, the
faulted channel is switched off and its output goes into a
When in diagnostic mode, if the MAX13325/MAX13326
exceed the overtemperature warning or temperature shutdown thresholds the device reports the condition using
the I2C interface and the FLAG output. See Table 13.
high-impedance state. The fault is reported using the I2C
interface and the FLAG output. See Table 12.
When in diagnostic mode with mute enabled, if there
is excessive offset on any output, the MAX13325/
MAX13326 reports the condition through the I2C interface and the FLAG output. See Table 14.
Overcurrent
When in diagnostic mode, if any of the output pairs is
excessively loaded, the MAX13325/MAX13326 issue a
warning and report the condition through the I2C interface and the FLAG output. The faulted channel is not
switched off. See Table 15.
Table 14. Excessive Offset Diagnostic
FAULT CONDITIONSTATUS REPORTUNMASKRECOVERY
Excessive Output
Offset on Left
Channel
Excessive Output
Offset on Right
Channel
FLAG is asserted low.
FLAG bit set. See Table 7.
OFFSETL bit is set in the LFAULT
register. See Table 5.
FLAG is asserted low.
FLAG bit set.
OFFSETR bit is set in the RFAULT
register. See Table 6.
When in diagnostic mode and the open-load detection is initiated, the selected channel is switched off for
1ms during which the diagnosis is taking place. Upon
detecting an open load on any channel, the MAX13325/
MAX13326 report the condition using the I2C interface
and the FLAG output. See Table 16.
When in diagnostic mode, if the MAX13325/MAX13326
exceed the VDD overvoltage threshold (for example
during a load-dump condition), the device reports the
condition using the I2C interface and the FLAG output.
See Table 17.
Dual Automotive, Audio Line Drivers
with I2C Control and Diagnostic
Table 17. Overvoltage Diagnostic
FAULT CONDITIONSTATUS REPORTUNMASKRECOVERY
FLAG is asserted low.
VDD voltage falls below overvoltage
threshold. Cleared on reading the
GFAULT register. Note: 500ms
autoretry in stand-alone mode.
Left channel is enabled by setting
the RETRYL bit to 1. Right channel
is enabled by setting the RETRYR
bit to 1. See Table 3.
Overvoltage
Shutdown
FLAG bit set. See Table 7.
DUMP bit is set in the GFAULT
register. See Table 4.
Left and right channels switch
off and output goes to a
high-impedance state.
In GMASK register, set
MDUMP bit to 1.
See Table 8.
Cannot be masked.
Applications Information
Serial Interface
Writing to the MAX13325/MAX13326 using I2C requires
MAX13325/MAX13326
that first the master sends a START (S) condition followed by the device’s I2C address. After the address,
the master sends the register address of the register
that is to be programmed. The master then ends communication by issuing a STOP (P) condition to relinquish
SDA
t
t
F
SCL
S
Figure 1. I2C Timing
t
LOW
t
HD:STA
t
LOW
t
HD:DAT
SU:DAT
t
HIGH
t
F
t
SU:STA
control of the bus, or a Repeated START (Sr) condition to
communicate to another I2C slave (see Figure 1).
Bit Transfer
Each SCL rising edge transfers one data bit. The data
on SDA must remain stable during the high portion of the
SCL clock pulse (see Figure 2). Changes in SDA while
SCL is high are read as control signals (see the START and STOP Conditions section). When the serial interface
is inactive, SDA and SCL idle high.
A master device initiates communication by issuing
a START condition, which is a high-to-low transition
on SDA with SCL high. A START condition from the
master signals the beginning of a transmission to the
MAX13325/MAX13326. The master terminates transmission by a STOP condition (see the Acknowledge Bit
section). A STOP condition is a low-to-high transition
on SDA while SCL is high (Figure 3). The STOP condition frees the bus. If a Repeated START condition is
generated instead of a STOP condition, the bus remains
active. When a STOP condition or incorrect slave ID is
detected, the device internally disconnects SCL from the
serial interface until the next START or Repeated START
MAX13325/MAX13326
condition, minimizing digital noise and feedthrough.
Acknowledge Bit
The acknowledge (ACK) bit is a clocked 9th bit that
the MAX13325/MAX13326 use to handshake receipt of
each byte of data when in write mode. The MAX13325/
MAX13326 pull down SDA during the entire mastergenerated 9th clock pulse if the previous byte is successfully received (see Figure 4). Monitoring ACK
allows for detection of unsuccessful data transfers. An
unsuccessful data transfer occurs if a receiving device
is busy or if a system fault has occurred. In the event
Dual Automotive, Audio Line Drivers
with I2C Control and Diagnostic
of an unsuccessful data transfer, the bus master may
retry communication. The master must pull down SDA
during the 9th clock cycle to acknowledge receipt of
data when the MAX13325/MAX13326 are in read mode.
An acknowledge must be sent by the master after each
read byte to allow data transfer to continue. A notacknowledge is sent when the master reads the final
byte of data from the MAX13325/MAX13326, followed by
a STOP condition.
Slave Address
The MAX13325/MAX13326 are programmable to one of
seven I2C slave addresses. These slave addresses are
unique device IDs. Connect ADD_ to GND, VL, SCL, or
SDA to set the I2C slave address. The address is defined
as the seven most significant bits (MSBs) followed by
the read/write bit. Set the read/write bit to 1 to configure
the MAX13325/MAX13326 to read mode. Set the read/
write bit to 0 to configure the device to write mode. The
address is the first byte of information sent after the
MAX13325/MAX13326
START condition.
Register Address Map
Single-Byte Write Operation
For a single-byte write operation, send the slave address
as the first byte followed by the register address and
then a single data byte (see Figure 5).
Burst Write Operation
For a burst write operation, send the slave address as
the first byte followed by the register address and then
the data bytes (see Figure 6).
Single-Byte Read Operation
For a single-byte read operation, send the slave address
with the read bit set, as the first byte followed by the register address. Then send a Repeated START condition
followed by the slave address. After the slave sends the
data byte, send a not-acknowledge followed by a STOP
condition (see Figure 7).
Burst Read Operation
For a burst read operation, send the slave address with
a write as the first byte followed by the register address.
Then send a Repeated START condition followed by the
slave address. The slave sends data bytes until a notacknowledge condition is sent (see Figure 8).
The MAX13325/MAX13326 charge pump can be disabled depending on application requirements. When
charge pump is enabled [CPOFF = 0], please follow the
charge-pump capacitor selections. When the charge
pump is disabled [CPOFF = 1], the flying capacitor
(C1) is not needed. There are internal diodes between
V
OUT_ to CHOLD, so it is important that CHOLD
DD/
not be forced below VDD or any of the outputs. A series
diode needs to be placed between the external supply
(V
) and CHOLD. See D2 in the Typical Operating
SUP
Circuit.
Charge-Pump Capacitor Selection
Use ceramic capacitors with a low ESR for optimum performance. For optimal performance over the extended
temperature range, select capacitors with an X7R
dielectric. Table 19 lists suggested manufacturers.
DATA N
Flying Capacitor (C1)
The value of the flying capacitor (see the Typical
Operating Circuit) affects the charge pump’s load regu-
lation and output resistance. A C1 value that is too small
degrades the device’s ability to provide sufficient current
drive, which leads to a loss of output voltage. Increasing
the value of C1 improves load regulation and reduces
the charge-pump output resistance. For optimum performance, use a 470nF capacitor for C1. When the charge
pump is disabled [CPOFF = 1], the flying capacitor (C1)
is not needed.
Hold Capacitor (C2)
The hold capacitor value (see the Typical Operating
Circuit) and ESR directly affect the ripple at the internal
negative rail. Increasing the value of C2 reduces output
ripple. Likewise, decreasing the ESR of C2 reduces both
ripple and output resistance. Lower capacitance values
can be used in systems with low maximum output power
levels. For optimum performance, use a 1FF capacitor
for C2.
Dual Automotive, Audio Line Drivers
with I2C Control and Diagnostic
Power-Supply Bypass Capacitor (C3)
The power-supply bypass capacitor (see the Typical
Operating Circuit) lowers the output impedance of the
power supply, and reduces the impact of the MAX13325/
MAX13326 charge-pump switching transients. Bypass
VDD with C3, the same value as C2, and place it physically close to the VDD and PGND pins.
Load-Dump Protection
With minimal external components, the MAX13325/
MAX13326 can be protected against automotive loaddump conditions. See the Typical Operating Circuit.
nMOSFET (Q1)
Q1 should be selected to withstand the full-voltage exposure (BV
should be chosen to be less than V
startup. Using an external nMOS, RTR020N05, 300ms
duration component provides 50V load-dump protection.
> 45V). The gate-source turn-on voltage
DSS
to ensure initial
CPS
MAX13325/MAX13326
Chip Information
PROCESS: BCD
Zener Diode (D1)
During short-to-battery condition, OUT_ lifts up CHOLD
using an internal diode. In order not to violate the maximum gate-source voltage of Q1, a zener diode of appropriate clamping voltage should be added between the
gate and source terminals.
Series Resistor (R1)
Normally, a series resistor for current limitation is needed
during short-to-battery condition. R1 should be chosen
according to (18V - V
excessive current is being drawn from CHOLD.
DD(min)
- V
)/1mA so that no
ZENER
Layout and Grounding
Proper layout and grounding are essential for optimum
performance. Connect the EP and GND together at a
single point on the PCB. Ensure ground return resistance
is minimized for optimum crosstalk performance.
Package Information
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that
a “+”, “#”, or “-” in the package code indicates RoHS
status only. Package drawings may show a different suffix character, but the drawing pertains to the package
regardless of RoHS status.
01/10Initial release—
13/10Updated the Typical Operating Circuit1
24/10
36/10
REVISION
DATE
DESCRIPTION
Added new register bits to Tables 1, 2, and 7. Revised FLAG Register section and added Table 2a and Charge Pump section.
Introduced the MAX13326. Updated the Electrical Characteristics table
and added new Typical Operating Characteristics graphs.
PAGES
CHANGED
1, 4, 7, 8–12, 19, 20
1, 4, 5, 7
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied.
Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 21