MAXIM MAX13046E, MAX13047E User Manual

General Description

The MAX13046E/MAX13047E ±15kV ESD-protected
bidirectional level translators provide level shifting for
data transfer in a multivoltage system. The MAX13046E
is a single-channel translator, and the MAX13047E is a
dual-channel translator. Externally applied voltages,
VCCand VL, set the logic level on either side of the
device. The MAX13046E/MAX13047E utilize a transmis­sion-gate-based design to allow data translation in
either direction (V

L↔VCC

) on any single data line. The
MAX13046E/MAX13047E accept VLfrom +1.1V to the
minimum of either +3.6V or (V

CC

+ 0.3V), and VCCfrom
+1.65V to +5.5V, making these devices ideal for data
transfer between low-voltage ASICs/PLDs and higher
voltage systems.

The MAX13046E/MAX13047E feature a shutdown mode
that reduces supply current to less than 1µA thermal
short-circuit protection, and ±15kV ESD protection on the
VCCside for enhanced protection in applications that
route signals externally. The MAX13046E/MAX13047E
operate at a guaranteed data rate of 8Mbps when push­pull driving is used.

The MAX13046E is available in a 6-pin µDFN package,
and the MAX13047E is available in a 10-pin UTQFN.
Both devices are specified over the extended -40°C to
+85°C operating temperature range.

Applications

I2C and 1-Wire®Level Translation

CMOS Logic-Level Translation

Cell Phones

Portable Devices

Features

♦ Bidirectional Level Translation
♦ Operation Down to +1.1V on V

L

♦ Ultra-Low Supply Current in Shutdown Mode

1µA (max)

♦ Guaranteed Push-Pull Driving Data Rate

8Mbps (+1.2V ≤ V

L

≤ +3.6V, VCC≤ +5.5V)

16Mbps (+1.8V ≤ V

L

≤ VCC≤ +3.3V)

♦ Extended ESD Protection on the I/O VCCLines

±15kV Human Body Model
±15kV IEC61000-4-2 Air-Gap Discharge Method
±8kV IEC61000-4-2 Contact Discharge

♦ Low Supply Current
♦ Short-Circuit Protection
♦ Space-Saving µDFN and UTQFN Packages

MAX13046E/MAX13047E

Single- and Dual-Bidirectional

Low-Level Translator

________________________________________________________________

Maxim Integrated Products

1

Ordering Information/Selector Guide

19-4149; Rev 1; 8/08

For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.

Note: All devices are specified over the extended -40°C to +85°C operating temperature range.

+

Denotes a lead-free/RoHS-compliant package.

EP = Exposed pad.

PART PIN-PACKAGE NUMBER OF CHANNELS TOP MARK

MAX13046EELT+ 6 µDFN (1mm x 1.5mm) 1 OC

MAX13047EEVB+ 10 UTQFN (1.4mm x 1.8mm) 2 AAC

Pin Configurations

TOP VIEW

MAX13046E

µDFN

1mm × 1.5mm

2

5

SHDN

GND

1

6

V

CC

V

L1

3

4

I/O V

CC

I/O V

L

+

UTQFN

1.4mm × 1.8mm

MAX13047E

+

V

CC

N.C.

I/O V

L2VL

1 2

7

6

3

N.C.

4

SHDN

I/O V

CC2

I/O V

L1

GND

I/O V

CC1

5

10

9

8

Typical Application Circuits appear at end of data sheet.

1-Wire is a registered trademark of Maxim Integrated Products, Inc.

MAX13046E/MAX13047E

Single- and Dual-Bidirectional
Low-Level Translator

2 _______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(VCC= +1.65V to +5.5V, VL= +1.1V to minimum of either +3.6V or ((VCC+ 0.3V)), I/O VL and I/O VCCare unconnected, TA= -40°C to
+85°C, unless otherwise noted. Typical values are V

CC

= +3.3V, VL= +1.8V at TA= +25°C.) (Notes 2, 3)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.

(All voltages referenced to GND.)
V

CC

...........................................................................-0.3V to +6V

V

L

..............................................................................-0.3V to +4V

I/O V

CC

.......................................................-0.3V to (VCC+ 0.3V)

I/O V

L

............................................................-0.3V to (VL+ 0.3V)

SHDN........................................................................-0.3V to +6V

Short-Circuit Duration I/O V

L

, I/O VCCto GND...........Continuous

Power Dissipation (T

A

= +70°C)

6-Pin µDFN (derate 2.1mW/°C above +70°C) .............168mW

10-Pin UTQFN (derate 6.9mW/°C above +70°C).........559mW

Junction-to-Ambient Thermal Resistance (

θ

JA

) (Note 1)

6-Pin µDFN.................................................................477°C/W

10-Pin UTQFN ...........................................................20.1°C/W

Junction-to-Ambient Thermal Resistance (

θ

JC

) (Note 1)

6-Pin µDFN................................................................20.1°C/W

10-Pin UTQFN .........................................................143.1°C/W

Operating Temperature Range ...........................-40°C to +85°C

Junction Temperature......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

PARAMETER

CONDITIONS

POWER SUPPLY

VCC > 3.3V 1.1

VL Supply Range V

L

VCC ≤ 3.3V 1.1

V

VCC Supply Range V

CC

5.5 V

Supply Current from V

CC

I

QVCC

10 µA

Supply Current from V

L

I

QVL

15 µA

VCC Shutdown-Mode Supply Current I

SD-VCCTA

= +25°C, SHDN = GND

1µA

VL Shutdown-Mode Supply Current I

SD-VL

TA = +25°C, SHDN = GND

1µA

I/O VL and I/O VCC Shutdown-Mode
Leakage Current

I

SD-LKGTA

= +25°C, SHDN = GND

0.5 µA

SHDN Input Leakage TA = +25°C

0.1 µA

ESD PROTECTION

Human Body Model

IEC 61000-4-2 Air-Gap Discharge

I/O VCC (Note 4)

IEC 61000-4-2 Contact Discharge

kV

All Other Pins Human Body Model ±2 kV

LOGIC-LEVEL THRESHOLDS

I/O VL Input-Voltage High V

IHL

VL -

0.2

V

I/O VL Input-Voltage Low V

ILL

V

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial

.

SYMBOL

MIN TYP MAX UNITS

V

1.65

0.03

0.03

0.02

0.02

±15V

±15V

±8V

CC

3.6V

+ 0.3V

0.15

MAX13046E/MAX13047E

Single- and Dual-Bidirectional

Low-Level Translator

_______________________________________________________________________________________ 3

ELECTRICAL CHARACTERISTICS (continued)

(VCC= +1.65V to +5.5V, VL= +1.1V to minimum of either +3.6V or ((VCC+ 0.3V)), I/O VL and I/O VCCare unconnected, TA= -40°C to
+85°C, unless otherwise noted. Typical values are V

CC

= +3.3V, VL= +1.8V at TA= +25°C.) (Notes 2, 3)

PARAMETER

CONDITIONS

I/O VCC Input-Voltage High V

IHC

VCC -

0.4

V

I/O VCC Input-Voltage Low V

ILC

V

I/O VL Output-Voltage High V

OHL

I/O VL source current = 20µA,
V

I/O VCC

> VCC - 0.4V

0.67 x
V

L

V

I/O VL Output-Voltage Low V

OLL

I/O VL sink current = 1mA,
V

I/O VCC

< 0.15V

0.4 V

I/O VCC Output-Voltage High V

OHC

I/O VCC source current = 20µA,
V

I/O VL

> VL - 0.2V

0.67 x

V

I/O VCC Output-Voltage Low V

OLC

I/O VCC sink current = 1mA,
V

I/O VL

< 0.15V

0.4 V

VL > 1.2 VL - 0.2

SHDN Input-Voltage High

1.1 ≤ VL < 1.2 VL - 0.1

V

SHDN Input-Voltage Low

V

I/O VL-to-I/O V

CC

Resistance 80

Ω

V

CC

Shutdown Threshold Low

V

CC

falling, VL = +3.3V 0.5 0.8 1.1 V

V

CC

Shutdown Threshold High

V

CC

rising, VL = +3.3V 0.3 0.6 0.9 V

VL Shutdown Threshold V

TH_VL

V

Pullup Resistance V

CC

= VL = +3.3V 6 10

kΩ

RISE/FALL-TIME ACCELERATOR STAGE

Accelerator Pulse Duration 20 ns

I/O VL Output-Accelerator Source
Impedance

V

L

= 1.7V 13 Ω

I/O VCC Output-Accelerator Source
Impedance

V

CC

= 2.2V 17 Ω

I/O VL Output-Accelerator Source
Impedance

V

L

= 3.2V 6 Ω

I/O VCC Output-Accelerator Source
Impedance

V

CC

= 3.6V 10 Ω

SYMBOL

V

IH-SHDN

V

IL-SHDN

V

TH_L_VCC

V

TH_H_VCC

MIN TYP MAX UNITS

V

CC

0.35 0.75 1.06

0.15

0.15

250

15.5

MAX13046E/MAX13047E

Single- and Dual-Bidirectional
Low-Level Translator

4 _______________________________________________________________________________________

TIMING CHARACTERISTICS FOR +1.2V ≤ VL≤ MINIMUM OF EITHER +3.6V OR (V

CC

+ 0.3V)

(VCC≤ ±5.5V, +1.2V ≤ VL≤ minimum of either +3.6V or ((VCC+ 0.3V)), RS= 50Ω, RL= 1MΩ, CL= 15pF, TA= -40°C to +85°C, unless
otherwise noted. Typical values are V

CC

= +3.3V, VL= +1.8V at TA= +25°C.) (Notes 2, 3, 5)

PARAMETER

CONDITIONS

Push-pull driving, Figure 1a 7 25

I/O VCC Rise Time t

RVCC

Open-drain driving, Figure 1c

ns

Push-pull driving, Figure 1a 6 37

I/O VCC Fall Time t

FVCC

Open-drain driving, Figure 1c 20 50

ns

Push-pull driving, Figure 1b 8 30

I/O VL Rise Time t

RVL

Open-drain driving, Figure 1d

ns

Push-pull driving, Figure 1 3 56

I/O VL Fall Time t

FVL

Open-drain driving, Figure 1d 30 60

ns

Push-pull driving 5 30

Driving I/O V

L

Push-pull driving 4 30

Propagation Delay

Driving I/O V

CC

ns

Push-pull driving 20

Channel-to-Channel Skew t

SKEW

Each translator
equally loaded

50

ns

Push-pull driving 8

Maximum Data Rate

Open-drain driving

TIMING CHARACTERISTICS FOR +1.1V ≤ VL≤ +1.2V

(VCC≤ ±5.5V, +1.1V ≤ VL≤ +1.2V, RS= 50Ω, RL= 1MΩ, CL= 15pF, TA= -40°C to +85°C, unless otherwise noted. Typical values are
V

CC

= +3.3V, VL= +1.8V at TA= +25°C.) (Notes 2, 3, 5)

PARAMETER

CONDITIONS

Push-pull driving, Figure 1a 7

I/O VCC Rise Time t

RVCC

Open-drain driving, Figure 1c

ns

Push-pull driving, Figure 1a 6 37

I/O VCC Fall Time t

FVCC

Open-drain driving, Figure 1c 20 50

ns

Push-pull driving, Figure 1b 8 30

I/O VL Rise Time t

RVL

Open-drain driving, Figure 1d

ns

Push-pull driving, Figure 1 3 30

I/O VL Fall Time t

FVL

Open-drain driving, Figure 1d 30 60

ns

Push-pull driving 5

Driving I/O V

L

Push-pull driving 4

Propagation Delay

Driving I/O V

CC

ns

Push-pull driving 20

Channel-to-Channel Skew t

SKEW

Each translator
equally loaded

50

ns

Push-pull driving 1.2

Maximum Data Rate

Open-drain driving

SYMBOL

t

PD-VL-VCC

t

PD-VCC-VL

Open-drain driving 210 1000

Open-drain driving 190 1000

Open-drain driving

MIN TYP MAX UNITS

170 400

180 400

500 kbps

Mbps

SYMBOL

t

PD-VL-VCC

t

PD-VCC-VL

Open-drain driving 210 1000

Open-drain driving 190 1000

Open-drain driving

MIN TYP MAX UNITS

500 kbps

200

170 400

180 400

200

200

Mbps

MAX13046E/MAX13047E

Single- and Dual-Bidirectional

Low-Level Translator

_______________________________________________________________________________________ 5

TIMING CHARACTERISTICS FOR +1.8V ≤ VL≤ VCC≤ +3.3V

(+1.8V ≤ VL≤ VCC≤ +3.3V, RS= 50Ω, RL= 1MΩ, CL= 15pF, TA= -40°C to +85°C, unless otherwise noted. Typical values are VCC= +3.3V,
V

L

= +1.8V at TA= +25°C.) (Notes 2, 3, 5)

PARAMETER

CONDITIONS

I/O VCC Rise Time t

RVCC

Push-pull driving, Figure 1a 15 ns

I/O VCC Fall Time t

FVCC

Push-pull driving, Figure 1a 15 ns

I/O VL Rise Time t

RVL

Push-pull driving, Figure 1b 15 ns

I/O VL Fall Time t

FVL

Push-pull driving, Figure 1b 15 ns

Push-pull driving, driving I/O V

L

15

Propagation Delay

Push-pull driving, driving I/O V

CC

15

ns

Channel-to-Channel Skew t

SKEW

Push-pull driving, each translator
equally loaded

10 ns

Maximum Data Rate Push-pull driving 16

Note 2: All units are 100% production tested at TA= +25°C. Limits over the operating temperature range are guaranteed by design

and not production tested.

Note 3: For normal operation, ensure V

L

< (VCC+ 0.3V). During power-up, VL> (VCC+ 0.3V) does not damage the device.

Note 4: ESD protection is guaranteed by design. To ensure maximum ESD protection, place a 1µF ceramic capacitor between V

CC

and GND. See

Typical Application Circuits

.

Note 5: Timing is measured using 10% of input to 90% of output.

SYMBOL

t

PD-VL-VCC

t

PD-VCC-VL

MIN TYP MAX UNITS

Mbps