Maxim MAX13045EETD+T, MAX13042E Datasheet

General Description
The MAX13042E–MAX13045E 4-channel, bidirectional level translators provide the level shifting necessary for 100Mbps data transfer in multivoltage systems. The MAX13042E–MAX13045E are ideally suited for level translation in systems with four channels. Externally applied voltages, VCCand VL, set the logic levels on either side of the device. Logic signals present on the VLside of the device appear as a high-voltage logic signal on the VCCside of the device and vice-versa.
The MAX13042E–MAX13045E operate at full speed with external drivers that source as little as 4mA output current or larger. Each input/output (I/O) channel is pulled up to V
CC
or VLby an internal 30µA current source, allowing the MAX13042E–MAX13045E to be driven by either push-pull or open-drain drivers.
The MAX13042E–MAX13045E feature an enable (EN) input that places the devices into a low-power shutdown mode when driven low. The MAX13042E–MAX13045E feature an automatic shutdown mode that disables the part when VCCis less than VL. The state of I/O V
CC_
and I/O VL_during shutdown is chosen by selecting the appropriate part version. (See the Ordering Information/ Selector Guide).
The MAX13042E–MAX13045E operate with VCCvolt­ages from +2.2V to +3.6V and VLvoltages from +1.62V to +3.2V, making them ideal for data transfer between low-voltage ASIC/PLDs and higher voltage systems. The MAX13042E–MAX13045E are available in 12-bump UCSP™ (1.54mm x 2.12mm) and 14-pin TDFN (3mm x 3mm) packages, and operate over the extended -40°C to +85°C temperature range.
Applications
Features
Compatible with 4mA Input Drivers or Larger
100Mbps Guaranteed Data Rate
Four Bidirectional Channels
Enable Input
±15kV ESD Protection on I/O V
CC_
Lines
+1.62V ≤ VL≤ +3.2V and +2.2V VCC≤ +3.6V
Supply Voltage Range
12-Bump UCSP (1.54mm x 2.12mm) and
14-Pin TDFN (3mm x 3mm) Lead-Free Packages
MAX13042E–MAX13045E
1.62V to 3.6V Improved High-Speed LLT
________________________________________________________________ Maxim Integrated Products 1
19-0792; Rev 0; 4/07
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
Ordering Information/Selector Guide
GND GND GND
+1.8V
SYSTEM
CONTROLLER
+3.3V
SYSTEM
V
L
V
CC
I/O V
L_
I/O V
CC_
DATA
DATA
+3.3V
+1.8V
EN
EN
1µF
0.1µF
0.1µF
MAX13042E–
MAX13045E
4
4
Typical Operating Circuit
PART
PIN­PACKAGE
I/O VL_ STATE DURING
SHUTDOWN
I/O V
CC_
STATE DURING
SHUTDOWN
TOP
MARK
PKG CODE
MAX13042EEBC+T
12 UCSP-12 High Impedance High Impedance
ADQ
B12-3
MAX13042EETD+T
14 TDFN-EP**
High Impedance High Impedance ADE T1433-2
Note: All devices operate over the -40°C to +85°C temperature range. +Denotes a lead-free package.
*Future product—contact factory for availability. **EP = Exposed paddle.
Pin Configurations appear at end of data sheet.
UCSP is a trademark of Maxim Integrated Products, Inc. SPI is a trademark of Motorola, Inc. MICROWIRE is a trademark of National Semiconductor Corp.
Ordering Information/Selector Guide continued at end of data sheet.
CMOS Logic-Level Translation
Low-Voltage ASIC Level Translation
Cell Phones
SPI, MICROWIRE Level Translation
Portable POS Systems
Portable Communication Devices
GPS
Telecommunications Equipment
MAX13042E–MAX13045E
1.62V to 3.6V Improved High-Speed LLT
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to GND.) V
CC
, VL.....................................................................-0.3V to +4V
I/O V
CC_
..................................................... -0.3V to (VCC+ 0.3V)
I/O V
L_
...........................................................-0.3V to (VL+ 0.3V)
EN.............................................................................-0.3V to +4V
Short-Circuit Duration I/O V
L_
, I/O V
CC_
to GND .......Continuous
Continuous Power Dissipation (T
A
= +70°C)
12-Bump UCSP (derate 6.5mW/°C above +70°C) ......519mW
14-Pin TDFN (derate 24.4mW/°C above +70°C) .......1951mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
ELECTRICAL CHARACTERISTICS
(VCC= +2.2V to +3.6V, VL= +1.62V to +3.2V, EN = VL, TA= -40°C to +85°C, unless otherwise noted. Typical values are at VCC= +3.3V, V
L
= +1.8V, and TA= +25°C.) (Notes 1, 2)
PARAMETER
SYMBOL
CONDITIONS MIN TYP
MAX
UNITS
POWER SUPPLIES
VL Supply Range V
L
1.62 3.2 V
VCC Supply Range V
CC
2.2 3.6 V
Supply Current from V
CC
I
QVCC
I/O V
CC_
= VCC, I/O VL_ = V
L
25 µA
Supply Current from V
L
I
QVL
I/O V
CC_
= VCC, I/O VL_ = V
L
10 µA
VCC Shutdown Supply Current
I
SHDN-VCC
TA = +25°C, EN = GND 0.1 1 µA
TA = +25°C, EN = GND 0.1 1
VL Shutdown-Mode Supply Current
I
SHDN-VL
TA = +25°C, EN = VL, VCC = GND 0.1 4
µA
I/O V
CC_
, I/O VL_ Tri-State
Leakage Current
I
LEAK
TA = +25°C, EN = GND 0.1 2 µA
EN Input Leakage Current I
LEAK_ENTA
= +25°C1µA
VL - VCC Shutdown Threshold High
V
TH_H
VCC rising (Note 3) 0
0.1V
L
0.8 V
VL - VCC Shutdown Threshold Low
V
TH_L
VCC falling (Note 3) 0
0.12V
L
0.8 V
I/O V
CC_
Pulldown Resistance
During Shutdown
R
VCC_PD_SD
MAX13043E/MAX13045E 10 16.5 23 k
I/O VL_ Pulldown Resistance During Shutdown
R
VL_PD_SD
MAX13044E/MAX13045E 10 16.5 23 k
I/O VL_ Pullup Current I
VL_PU_
I/O VL_ = GND, I/O V
CC_
= GND 20 65 µA
I/O V
CC_
Pullup Current I
VCC_PU_
I/O V
CC_
= GND, I/O V
L_
= GND 20 65 µA
I/O V
L_
to I/O V
CC_
DC
Resistance
R
IOVL_IOVCC
(Note 4) 3 k
MAX13042E–MAX13045E
1.62V to 3.6V Improved High-Speed LLT
_______________________________________________________________________________________ 3
PARAMETER
SYMBOL
CONDITIONS MIN TYP
MAX
UNITS
ESD PROTECTION
I/O VL_, EN Human Body Model ±2 kV
Human Body Model, C
VCC
= 1µF ±15
IEC 61000-4-2 Air-Gap Discharge, C
VCC
= 1µF
±15
I/O V
CC_
IEC 61000-4-2 Contact Discharge, C
VCC
= 1µF
±8
kV
LOGIC LEVELS
I/O VL_ Input-Voltage High Threshold
V
IHL
(Note 5)
VL - 0.2
V
I/O VL_ Input-Voltage Low Threshold
V
ILL
(Note 5) 0.15 V
I/O V
CC_
Input-Voltage High
Threshold
V
IHC
(Note 5)
V
CC
-
0.4
V
I/O V
CC_
Input-Voltage Low
Threshold
V
ILC
(Note 5) 0.2 V
EN Input-Voltage-High Threshold
V
IH
VL - 0.4
V
EN Input-Voltage-Low Threshold
V
IL
0.4 V
I/O VL_ Output-Voltage High V
OHL
I/O VL_ source current = 20µA
2/3 V
L
V
I/O VL_ Output-Voltage Low V
OLL
I/O V
L _
si nk cur r ent = 20µA, I/O V
C C _
< 0.2V 1/3 V
L
V
I/O V
CC_
Output-Voltage High V
OHC
I/O V
CC_
source current = 20µA
2/3 V
CC
V
I/O V
CC_
Output-Voltage Low V
OLC
I/O V
C C _
si nk cur r ent = 20µA,
I/O V
L _
< 0.15V
1/3 V
CC
V
RISE-/FALL-TIME ACCELERATOR STAGE
On falling edge 3.5
Accelerator Pulse Duration
On rising edge 3.5
ns
VL = 1.62V 24
VL Output Accelerator Source Impedance
V
L
= 3.2V 11
VCC = 2.2V 13
VCC Output Accelerator Source Impedance
V
CC
= 3.6V 9
VL = 1.62V 14
VL Output Accelerator Sink Impedance
V
L
= 3.2V 10
VCC = 2.2V 11
VCC Output Accelerator Sink Impedance
V
CC
= 3.6V 9
ELECTRICAL CHARACTERISTICS (continued)
(VCC= +2.2V to +3.6V, VL= +1.62V to +3.2V, EN = VL, TA= -40°C to +85°C, unless otherwise noted. Typical values are at VCC= +3.3V, V
L
= +1.8V, and TA= +25°C.) (Notes 1, 2)
MAX13042E–MAX13045E
1.62V to 3.6V Improved High-Speed LLT
4 _______________________________________________________________________________________
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX
UNITS
I/O V
CC_
Rise Time t
RVCC
Figure 1 2.5 ns
I/O V
CC_
Fall Time t
FVCC
Figure 1 2.5 ns
I/O VL_ Rise Time t
RVL
Figure 2 2.5 ns
I/O VL_ Fall Time t
FVL
Figure 2 2.5 ns
Propagation Delay (Driving I/O V
L_
)
t
PVL-VCC
Figure 1 6.5 ns
Propagation Delay (Driving I/O V
CC_
)
t
PVCC-VL
Figure 2 6.5 ns
Channel-to-Channel Skew t
SKEW
(Note 4) 0.7 ns
Propagation Delay From I/O V
L_
to I/O V
CC_
after EN
t
EN-VCC
Figure 3 5 µs
Propagation Delay From I/O V
CC_
to I/O VL_ after EN
t
EN-VL
Figure 3 5 µs
Maximum Data Rate Push-pull operation
100
Mbps
TIMING CHARACTERISTICS
(+2.2V ≤ VCC≤ +3.6V, +1.62V ≤ VL≤ +3.2V; C
IOVL_
15pF, C
IOVCC_
10pF; R
SOURCE
< 150, rise/fall time < 3ns, EN = VL,
T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at VCC= +3.3V, VL= +1.8V, and TA= +25°C.) (Notes 1, 2)
Note 1: All units are 100% production tested at T
A
= +25°C. Limits over the operating temperature range are guaranteed by
correlation and design and not production tested.
Note 2: V
L
must be less than or equal to VCCduring normal operation. However, VLcan be greater than VCCduring startup and
shutdown conditions.
Note 3: When V
CC
is below VLby more than the VL- VCCshutdown threshold, the device turns off its pullup generators and the I/Os
enter their respective shutdown states.
Note 4: Guaranteed by design. Note 5: Input thresholds are referenced to the boost circuit.
Typical Operating Characteristics
(VCC= 3.3V, VL= 1.8V, C
IOVCC_
= 10pF, C
IOVL_
= 15pF, R
SOURCE
= 150, data rate = 100Mbps, push-pull driver, TA= +25°C,
unless otherwise noted.)
350
360
380
370
390
400
2.2 2.62.4 2.8 3.0 3.2
VL SUPPLY CURRENT vs. VCC SUPPLY
VOLTAGE (DRIVING ONE I/O V
L_
)
MAX13042E toc01
VCC SUPPLY VOLTAGE (V)
V
L
SUPPLY CURRENT (µA)
340
330
320
310
300
3.4 3.6
0
2
6
4
8
10
1.6 2.42.0 2.8 3.2
VL SUPPLY CURRENT vs. VL SUPPLY
VOLTAGE (DRIVING ONE I/O V
CC_
)
MAX13042E toc02
VL SUPPLY VOLTAGE (V)
V
L
SUPPLY CURRENT (mA)
VCC = 3.6V
0
3
9
6
12
15
2.2 2.8 3.0 3.2
VCC SUPPLY CURRENT vs. VCC SUPPLY
VOLTAGE (DRIVING ONE I/O V
L_
)
MAX13042E toc03
VL SUPPLY VOLTAGE (V)
V
CC
SUPPLY CURRENT (mA)
2.4
2.6 3.4
3.6
MAX13042E–MAX13045E
1.62V to 3.6V Improved High-Speed LLT
_______________________________________________________________________________________ 5
Typical Operating Characteristics (continued)
(VCC= 3.3V, VL= 1.8V, C
IOVCC_
= 10pF, C
IOVL_
= 15pF, R
SOURCE
= 150, data rate = 100Mbps, push-pull driver, TA= +25°C,
unless otherwise noted.)
VCC SUPPLY CURRENT vs. VL SUPPLY VOLTAGE
(DRIVING ONE I/O V
CC
_)
VL SUPPLY VOLTAGE (V)
V
CC
SUPPLY CURRENT (mA)
MAX13042E toc04
1.6 2.0 2.4 2.8 3.2
0
2
4
6
8
10
VCC = 3.6V
SUPPLY CURRENT vs. TEMPERATURE
(DRIVING ONE I/O V
CC_
)
TEMPERATURE (°C)
SUPPLY CURRENT (mA)
MAX13042E toc05
-40 -15 10 35 60 85
0
1
2
3
4
5
6
7
I
VCC
I
VL
0
2
6
4
8
10
-40 35
SUPPLY CURRENT vs. TEMPERATURE
(DRIVING ONE I/O V
L_
)
MAX13042E toc06
TEMPERATURE (°C)
SUPPLY CURRENT (mA)
I
VCC
-15
60
85
I
VL
9
1
3
5
7
10
CAPACITIVE LOAD (pF)
V
L
SUPPLY CURRENT (µA)
MAX13042E toc07
10 15 20 25 30 35 40
0
1000
2000
3000
4000
5000
VL SUPPLY CURRENT vs. CAPACITIVE
LOAD ON I/O V
L_
(DRIVING ONE I/O V
CC_
)
V
CC
SUPPLY CURRENT vs. CAPACITIVE
LOAD ON I/O V
CC_
(DRIVING ONE I/O VL_)
CAPACITIVE LOAD (pF)
V
CC
SUPPLY CURRENT (mA)
MAX13042E toc08
10 15 20 25 30 35 40
0
2
4
6
8
10
12
14
16
CAPACITIVE LOAD (pF)
RISE/FALL TIME (ns)
MAX13042E toc09
10 15 20 25 30 35 40
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
RISE/FALL TIME vs. CAPACITIVE LOAD ON
I/O V
CC_
(DRIVING I/O VL_)
t
RVCC
t
FVCC
CAPACITIVE LOAD (pF)
RISE/FALL TIME (ns)
MAX13042E toc10
10 15 20 25 30 35 40
0
0.5
1.0
1.5
2.0
2.5
3.0
RISE/FALL TIME vs. CAPACITIVE LOAD ON
I/O V
L_
(DRIVING I/O V
CC_
)
t
FVL
t
RVL
PROPAGATION DELAY vs. CAPACITIVE
LOAD ON I/O V
CC_
(DRIVING I/O VL_)
CAPACITIVE LOAD (pF)
PROPAGATION DELAY (ns)
MAX13042E toc11
10 15 20 25 30 35 40
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
t
PHL
t
PLH
2.0
3.5
3.0
4.5
5.0
10 25 30
PROPAGATION DELAY vs. CAPACITIVE
LOAD ON I/O V
L_
(DRIVING I/O V
CC_
)
MAX13042E toc12
CAPACITIVE LOAD (pF)
PROPAGATION DELAY (ns)
15
20 35
40
4.0
2.5
1.5
1.0
0.5
0
t
PHL
t
PLH
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