MAXIM MAX104, MAX106, MAX108 Technical data

General Description
The MAX104/MAX106/MAX108 evaluation kits (EV kits) are designed to simplify evaluation of the devices’ ana­log-to-digital converters (ADCs). Each EV kit contains all circuitry necessary to evaluate the dynamic perfor­mance of these ultra-high-speed converters, including the power-supply generation for the PECL termination voltage (PECLVTT). Since the design combines high­speed analog and digital circuitry, the board layout calls for special precautions and design features.
Connectors for the power supplies (VCCA/VCCI, VCCD, VCCO, VEE), SMA connectors for analog and clock inputs (VIN+, VIN-, CLK+, CLK-), and all digital PECL outputs simplify connection to the EV kit. The four-layer board layout (GETek™ material) is optimized for best dynamic performance of the MAX104 family.
The EV kits come with a MAX104/MAX106/MAX108 installed on the board with a heatsink attached for oper­ation over the full commercial temperature range.
Features
50Ω Clock and Analog Inputs Through SMA
Coaxial Connectors
±250mV Input Signal RangeDemultiplexed Differential PECL OutputsOn-Board Generation of PECL Termination
Voltage (PECLV
TT
)
On-Board Generation of ECL Termination Voltage
(ECLV
TT
)
Separate Analog and Digital Power and Ground
Connections with Optimized Four-Layer PCB
Square-Pin Headers for Easy Connection of Logic
Analyzer to Digital Outputs
Fully Assembled and Tested
Evaluate: MAX104/MAX106/MAX108
MAX104/MAX106/MAX108 Evaluation Kits
________________________________________________________________
Maxim Integrated Products
1
19-1503; Rev 0; 6/99
Component List
PART
MAX104EVKIT MAX106EVKIT
0°C to +70°C
0°C to +70°C
TEMP.
RANGE
PIN-
PACKAGE
192 ESBGA 192 ESBGA
For free samples & the latest literature: http://www.maxim-ic.com, or phone 1-800-998-8800. For small orders, phone 1-800-835-8769.
Ordering Information
Not populated; see text for descrip­tion of reset input operation.
2R3, R4
DESIGNATION
10kpotentiometer 1R2
1N5819 Schottky diode1D1
47pF ±10% ceramic capacitors (0402)
20
C3–C6, C15, C16,
C22–C25, C33–C37,
C42–C45, C50
0.01µF ±10% ceramic capacitors (0603)
30
C2, C7–C12, C14,
C17, C18, C19, C21, C26–C30, C32, C41, C47,
C49, C51–C59
10µF ±10%, 16V tantalum caps AVX TAJD106D016
7
C1, C13, C20, C31,
C40, C46, C48
DESCRIPTIONQTY
MAX108EVKIT*
0°C to +70°C 192 ESBGA
SAMPLING
RATE
1Gsps 600Msps
1.5Gsps
GETek is trademark of GE Electromaterials.
49.9±1% resistors (0603)38
R5–R38,
R44–R47
DESIGNATION DESCRIPTIONQTY
2-pin headers41
JU2, JU4, JU5,
JUA0- to JUA7-,
JUA0+ to JUA7+,
JUP0- to JUP7-,
JUP0+ to JUP7+,
JUOR+, JUOR-, JUDR-, JUDR+,
JURO-, JURO+
3-pin headers5JU3, JU6–JU9
SMA connectors (edge mounted)10J1–J10
158±1% resistors (0603)2R52, R54
243±1% resistors (0603)2R51, R53
*
Future product—contact factory for availability.
查询MAX104EVKIT供应商
_________________________Quick Start
The EV kit is delivered fully assembled, tested, and sealed in an antistatic bag. To ensure proper operation, open the antistatic bag only at a static-safe work area and follow the instructions below. Do not turn on the
power supplies until all power connections to the EV kit are established. Figure 1 shows a typical evalu-
ation setup with differential analog inputs and single­ended sine- wave (CLK- is 50reverse-terminated to GNDI) clock drive. Figure 2 shows a typical evaluation setup with single-ended analog inputs (VIN- is 50 reverse-terminated to GNDI) and a single-ended sine­wave clock drive.
1) Connect a -5V power supply capable of providing
-250mA to the pad marked VEE. Connect the sup­ply’s ground to the GNDI pad. Set the current limit
to 500mA or less.
2) Connect a +5V power supply capable of providing 600mA to the VCCI pad. Connect the supply’s ground to the GNDI pad.
3) Connect a +5V power supply capable of providing 250mA to the VCCD pad. Connect the supply’s ground to the GNDD pad.
4) Connect a +3.3V or +5V power supply capable of providing approximately 600mA to the VCCO pad. Connect the supply’s ground to the GNDD pad.
5) Connect GNDI to GNDD at the power supplies.
6) Connect an RF source with low phase jitter, such as an HP8662A (up to 1.28GHz) or an HP8663A (up to
2.56GHz), to clock inputs CLK- and CLK+. For sin­gle-ended clock inputs, feed a +4dBm (500mV amplitude) power level from the signal generator into the CLK+ input and terminate the unused CLK­input with 50to GNDI.
7) Connect a ±225mV (approximately -1dB below FS) sine-wave test signal to the analog inputs. Use VIN+ and VIN- through a balun if the test signal is differential, or either VIN+ or VIN- if the signal is sin­gle-ended (see the sections
Single-Ended Analog
Inputs
and
Differential Analog Inputs
in the devices’ data sheets). For best results, use a narrow band­pass filter designed for the frequency of interest to reduce the harmonic distortion from the signal gen­erator.
8) Connect a logic analyzer, such as an HP16500C with an HP16517A plug-in card for monitoring all 16 output channels (8 channels for primary and 8 channels for auxiliary outputs) of the device.
9) Connect the logic analyzer clock to the DREADY+ output on the EV kit, and set the logic analyzer to trigger on the falling edge of the acquisition clock. Set the logic analyzer’s threshold voltage to the VCCO supply voltage -1.3V. For example, if VCCO = +3.3V, the threshold voltage should be set to +2.0V.
10) Turn on the supplies and signal sources. Capture the digitized outputs from the ADC with the logic analyzer and transfer the digital record to a PC for data analysis.
Evaluate: MAX104/MAX106/MAX108
MAX104/MAX106/MAX108 Evaluation Kits
2 _______________________________________________________________________________________
Component List (continued)
Shunts7None
Test points24
VCCO, VCCD,
GNDD, PECLVTT,
GNDA, VCCA,
VCCI, GNDI, VEE,
ECLV
TT
Protective feet4None
Heatsink International Electronic Research Corp. BDN09-3CB/A01
1None
MAX104CHC, MAX106CHC, or MAX108CHC (192-contact ESBGA™)
1U1
LM2991S, low-dropout adjustable linear regulator
2U3, U4
MAX104EVKIT circuit board1None MAX104, MAX106, or MAX108 data
sheet
1None
DESIGNATION DESCRIPTIONQTY
ESBGA is a trademark of Amkor/Anam.
Evaluate: MAX104/MAX106/MAX108
MAX104/MAX106/MAX108 Evaluation Kits
_______________________________________________________________________________________ 3
MAX104 MAX106 MAX108
EV KIT
BALUN
HP8662/3A
SINE-WAVE SOURCE
PHASE
LOCKED
f
SAMPLE
, + 4dBm
EXTERNAL 50 TERMINATION TO GNDI
HP8662/3A
SINE-WAVE SOURCE
POWER
SUPPLIES
GNDD
+5V ANALOG
VIN+VIN-
CLK+
CLK-
16 DATA
DREADY+
-5V ANALOG
+5V DIGITAL
+3.3V DIGITAL
GNDI
HP16500C
DATA ANALYSIS
SYSTEM
GPIB
PC
BPF
Figure 1. Typical Evaluation Setup with Differential Analog Inputs and Single-Ended Clock Drive
MAX104 MAX106 MAX108
EV KIT
HP8662/3A
SINE-WAVE SOURCE
PHASE
LOCKED
f
SAMPLE
, + 4dBm
EXTERNAL 50 TERMINATION TO GNDI
EXTERNAL 50
TERMINATION
TO GNDI
HP8662/3A
SINE-WAVE SOURCE
POWER
SUPPLIES
GNDD
+5V ANALOG
VIN+VIN-
CLK+
CLK-
16 DATA
DREADY+
-5V ANALOG
+5V DIGITAL
+3.3V DIGITAL
GNDI
HP16500C
DATA ANALYSIS
SYSTEM
GPIB
PC
BPF
Figure 2. Typical Evaluation Setup with Single-Ended Analog Inputs and Single-Ended Clock Drive
Evaluate: MAX104/MAX106/MAX108
MAX104/MAX106/MAX108 Evaluation Kits
4 _______________________________________________________________________________________
_______________Detailed Description
Clock Input Requirements
The MAX104/MAX106/MAX108 feature clock inputs designed for either single-ended or differential opera­tion with very flexible input drive requirements. Each clock input is terminated with an on-chip, laser-trimmed 50Ω resistor to CLKCOM (clock termination return). The traces from the SMA inputs to the high-speed data con­verter are 50microstrip transmission lines.
The CLKCOM termination voltage may be connected anywhere between ground and -2V for compatibility with standard ECL drive levels. The side-launched SMA connectors for the clock signals are located at the lower left corner of the EV board and are labeled J3 (CLK+) and J4 (CLK-).
An on-board bias generator, located between the ana­log and clock inputs, creates a -2V termination voltage (ECLVTT) for operation with ECL clock sources. The voltage is generated by an LM2991 voltage regulator operated from the board’s -5V VEEpower supply. To enable this ECLVTTbias generator, first remove short­ing jumper JU2, then move jumper JU3 into its ON position.
The voltage regulator has a shutdown control that requires a TTL logic-high level to enter the shutdown state. This logic level is derived from the +5V analog supply (VCCI). The EV kits are delivered with the ECLVTTbias generator turned off and CLKCOM tied to GNDI (JU2 installed).
NOTE: If the regulator’s shutdown logic level is not present (VCCI on first) before the VEEsupply is turned on, the regulator will momentarily turn on until the VCCI supply is energized. If JU2 is installed, this will momentarily short the regulator’s output to ground. The regulator is short-circuit protected so no damage will result. The regulator is further pro­tected by limiting the V
EE
supply current to 500mA.
Single-Ended Clock Inputs
(Sine-Wave Drive)
To obtain the lowest jitter clock drive, AC- or DC-couple a low-phase-noise sine-wave source into a single clock input. Clock amplitudes of up to 1V (2Vp-p or +10dBm) can be accommodated with CLKCOM connected to GNDI.
The dynamic performance of the data converter is essentially unaffected by clock-drive power levels from
-10dBm to +10dBm (100mV to 1V clock signal ampli-
tude). The dynamic performance specifications are measured with a single-ended clock drive of +4dBm (500mV clock signal amplitude). To avoid saturation of the input amplifier stage, limit the clock power level to a maximum of +10dBm.
Differential Clock Inputs (ECL Drive)
The MAX104/MAX106/MAX108 clock inputs may also be driven with standard ground-referenced ECL logic levels by using the on-board ECLVTT-2V bias genera­tor as described above. It is also possible to drive the clock inputs with positive supply referenced (PECL) levels if the clock inputs are AC-coupled. With AC-cou­pled clock inputs, the CLKCOM termination voltage should be grounded. Single-ended DC-coupled ECL drive is possible as well, if the undriven clock input is tied to the ECL VBBvoltage (-1.3V nominal).
Analog Input Requirements
The analog inputs to the ADC on the EV board are pro­vided by two side-launch SMA connectors located on the middle left side of the EV kit. They are labeled J1 (VIN+) and J2 (VIN-). The analog inputs are terminated on-chip with precision laser-trimmed 50NiCr resistors to GNDI. Although the analog (and clock) inputs are ESD protected, good ESD practices should always be observed. The traces from the SMA inputs to the device are 50microstrip transmission lines. The analog inputs can be driven either single-ended or differential. Optimal performance is obtained with differential input drive due to reduction of even-order harmonic distor­tion. Table 1 represents single-ended input drive, and Table 2 displays differential input drive.
Table 1. Input Setup and Output Code Results for Single-Ended Analog Inputs
0V+250mV - 1LSB
0V+250mV
VIN+ VIN-
0
1
OVERRANGE BIT
11111111
11111111 (full scale)
OUTPUT CODE
00V-250mV + 1LSB
0
00000001
01111111
toggles 10000000
0V0V
00V-250mV 00000000 (zero scale)
Evaluate: MAX104/MAX106/MAX108
MAX104/MAX106/MAX108 Evaluation Kits
_______________________________________________________________________________________ 5
Internal Reference
The MAX104 family features an on-chip +2.5V precision bandgap reference, which can be used by shorting jumper JU5 to connect REFOUT with REFIN. If required, REFOUT can also source up to 2.5mA to sup­ply other peripheral circuitry.
To use an external reference, remove the shorting jumper on JU5 and connect the new reference voltage source to the REFIN side of JU5. Leave the REFOUT side of JU5 floating. Connect the ground of the external reference to GNDI on the EV kit. REFIN accepts an input voltage range of +2.3V to +2.7V.
CAUTION: With an external reference connected, JU5 must not be installed at any time to avoid dam­aging the internal reference with the external refer­ence supply.
Offset Adjust
The devices also provide a control input (VOSADJ) to eliminate any offset from additional preamplifiers dri­ving the ADC. The VOSADJ control input is a self­biased voltage divider from the internal +2.5V precision reference. Under normal-use conditions, the control input is left floating.
The EV kits include a 10kpotentiometer that is biased from the ADC’s +2.5V reference. The wiper of the potentiometer connects to the VOSADJ control input through JU4. To enable the offset-adjust function, install a shorting jumper on JU4 and adjust potentiometer R2 while observing the resulting offset in the reconstructed digital outputs. The offset-adjust potentiometer offers about ±5.5LSB of adjustment range. The EV kits are shipped from the factory without a shorting jumper installed on JU4.
Primary and Auxiliary
PECL Outputs
All PECL outputs on the EV kits are powered from the VCCO power supply, which may be operated from any voltage between +3.0V to +5.0V for flexible interfacing with either +3.3V or +5V systems. The nominal VCCO supply voltage is +3.3V.
The PECL outputs are standard open-emitter types and require external 50termination resistors to the PECLV
TT
voltage for proper biasing. The termination resistors are located at the far end of each 50 microstrip transmission line, very close to the square pin headers for the logic analyzer interface. Every EV board is delivered with the PECL termination resistors installed on the back side of the board. Each output links to a 0.100 inch square 2-pin header to ease the connection to a high-speed logic analyzer such as Hewlett Packard’s HP16500C.
To capture the digital data from the device in demulti­plexed 1:2 format, each of the 16 channels from the logic analyzer is connected to the eight primary (P0 to P7) and eight auxiliary (A0 to A7) outputs. The ADC provides differential PECL outputs, but most logic ana­lyzers (such as the HP16500C) have single-ended acquisition pods. Connect all single-ended logic ana­lyzer pods to the same phase (either “+” or “-”) of the PECL outputs.
Data Ready (DREADY) Output
The clock pod from the logic analyzer should be con­nected to the DREADY+ output at JUDR+ on the EV kits. Since both the primary and auxiliary outputs change on the rising edge of DREADY+, set the logic analyzer to trigger on the falling edge. The DREADY and data outputs are internally time-aligned, which places the falling edge of DREADY+ in the approximate center of the valid data window, resulting in the maxi­mum setup and hold time for the logic analyzer. Set the logic analyzer’s threshold voltage to VCCO - 1.3V. For example, if VCCO is +3.3V, the threshold voltage should be set to +2.0V. The sample offset (trigger delay) of the logic analyzer should be set to 0ps under these conditions.
It is also possible to use the DREADY- output for the acquisition clock. Under this condition, set the logic analyzer to trigger on the rising edge of the clock. Table 3 summarizes the digital outputs and their func­tions.
Table 2. Input Setup and Output Code Results for Differential Analog Inputs
0-125mV + 0.5LSB+125mV - 0.5LSB
1
OVERRANGE BIT
11111111
11111111 (full scale)-125mV+125mV
OUTPUT CODE
0+125mV - 0.5LSB-125mV + 0.5LSB
0
00000001
01111111
toggles 10000000
0V0V
0+125mV-125mV 00000000 (zero scale)
VIN+ VIN-
Evaluate: MAX104/MAX106/MAX108
MAX104/MAX106/MAX108 Evaluation Kits
6 _______________________________________________________________________________________
Demultiplexer Settings
Demultiplexed DIV2 Mode
This mode reduces the output data rate to one-half the sample clock rate. The demultiplexed outputs are pre­sented in dual 8-bit format with two consecutive sam­ples in the primary and auxiliary output ports on the ris­ing edge of the data ready clock. To activate this mode, jumpers JU7 (DEMUXEN), JU8 (AUXEN2), and JU9 (AUXEN1) have to be in the ON position, and DIVSELECT (JU6) must be set to position 2.
NOTE: Each EV kit is shipped with jumpers JU7, JU8, and JU9 installed in the ON position and JU6 set to 2.
Non-Demultiplexed DIV1 Mode
It is also possible to operate the ADC in a non-demulti­plexed mode. In this mode, the internal demultiplexer is disabled and the sampled data is presented to the pri­mary output port only. To consume less power, the aux­iliary port can be shut down by two separate inputs (AUXEN1 and AUXEN2). To enter this mode, place jumpers JU7 (DEMUXEN), JU8 (AUXEN2), and JU9 (AUXEN1) in the OFF position. The position of the DIVS­ELECT (JU6) jumper is a don’t care. To save additional power, remove all the 50pull-down resistors (R5–R20) on the auxiliary output port. It is not necessary to remove the resistors; however, both the true and com­plementary PECL outputs will pull up to the VOHlevel.
Table 3. PECL Outputs and Functions
JUA0+ to JUA7+, JUA0- to JUA7-
A0+ to A7+,
A0- to A7-
JUP0+ to JUP7+,
JUP0- to JUP7-
P0+ to P7+,
P0- to P7-
JUOR+, JUOR-OR+, OR­JUDR+, JUDR-DREADY+, DREADY-
PECL OUTPUT
SIGNALS
EV KIT JUMPER
LOCATION
Auxiliary Port Differential Outputs from LSB to MSB. A “+” indicates the true value; a “-” denotes the complementary outputs.
Primary Port Differential Outputs from LSB to MSB. A “+” indicates the true value; a “-” denotes the complementary outputs.
Overrange’s True and Complementary Outputs. Data-Ready PECL Output Latch Clock. Output
data changes on the rising edge of DREADY+.
FUNCTION
Demux Reset Input Signals. Resets the internal demux when asserted.
Reset Outputs—for resetting additional external demux devices.
J5, J6 (SMA connectors)RSTIN+, RSTIN-
JURO+, JURO-RSTOUT+, RSTOUT-
DEMUXEN (JU7)
OFF ON
AUXEN2 (JU8)
OFF ON
AUXEN1 (JU9)
OFF ON
DIVSELECT (JU6)
24
DEMUXEN (JU7)
OFF ON
AUXEN2 (JU8)
OFF ON
AUXEN1 (JU9)
OFF ON
DIVSELECT (JU6)
X 2
X = Leave open or don’t care
X
X
4
Evaluate: MAX104/MAX106/MAX108
MAX104/MAX106/MAX108 Evaluation Kits
_______________________________________________________________________________________ 7
Decimation DIV4 Mode
In this special decimated, demultiplexed output mode, the ADC discards every other input sample and outputs data at one-quarter the input sampling rate. This mode is useful for system debugging at the resulting slower output data rates, and may be required to capture data successfully when testing the MAX108. To activate the EV board’s DIV4 mode, jumpers JU7 (DEMUXEN), JU8 (AUXEN2), and JU9 (AUXEN1) have to be in the ON position, and DIVSEL has to be in position 4. Since every other sample at the input is discarded, the con­verter’s effective sample rate will be f
SAMPLE
/2.
Overrange Operation
A single differential PECL overrange output bit (OR+, OR-) is provided for both primary and auxiliary demulti­plexed outputs. The operation of the overrange bit depends on the status of the internal demultiplexer. In demultiplexed DIV2 mode and decimation DIV4 mode, the OR bit will flag an overrange condition if either the primary or auxiliary port contains an overranged sam­ple (Table 4). In non-demultiplexed DIV1 mode, the OR port will flag an overrange condition only when the pri­mary output port contains an overranged sample.
Reset Operation Requirements
A detailed description of the reset circuitry and its oper­ation is located in each device’s data sheet. To use the reset input function, install two 50pull-down resistors at positions R3 and R4 on the back side of the EV board. These resistors are connected to the on-board PECLVTTtermination generator. The RSTIN logic levels are compatible with standard PECL levels referenced from the VCCO power supply.
The signals associated with the demultiplexer reset operation and the control of this section are listed in Table 5. Consult the data sheet for a more detailed description of the demultiplexer reset function, includ­ing timing diagrams.
Reset Inputs
The reset circuitry accepts differential PECL inputs ref­erenced to the same VCCO power supply that powers the ADC’s PECL outputs. The reset input side-launched SMA connectors are located at the lower left side of the EV kits and are labeled RSTIN+ and RSTIN-.
For applications that do not require a synchronizing reset, the reset inputs must be left open and resistors R3 and R4 removed. In this case, they will self-bias to a proper level with internal 50kresistors and a 20µA current source. This combination creates a -1V voltage difference between RSTIN+ and RSTIN- to disable the internal reset circuitry. When driven with PECL logic levels terminated with 50to VCCO - 2V, the internal biasing network can easily be overdriven. The EV kits are shipped with these resistor positions open to allow the internal self-bias circuitry to disable the reset con­trol input.
NOTE: Do not install the 50RSTIN termination resistors R3 and R4 unless the RSTIN input is dri­ven with valid PECL logic levels. If the RSTIN inputs are open circuited with the 50resistors installed, intermittent resetting of the internal demultiplexer will occur and unpredictable operation will result.
Table 4. Selection Table for Demultiplexer Operation
DIV22ON
DIV1
DEMUX
MODE
Primary OR auxiliary port
Only primary port active (auxiliary port off)
XOFF
OVERRANGE BIT
OUTPUT MODE
DIV44ON
Primary OR auxiliary port
DEMUXEN DIVSELECT
X = Don’t care
DEMUXEN
OFF ON
AUXEN2
OFF ON
AUXEN1
OFF ON
DIVSELECT
24
Evaluate: MAX104/MAX106/MAX108
MAX104/MAX106/MAX108 Evaluation Kits
8 _______________________________________________________________________________________
Reset Outputs
With a single device, no synchronizing reset is required since the order of the samples in the output ports is unchanged regardless of the phase of the DREADY (DREADY+, DREADY-) clock (as described in the data sheets). DREADY+ (jumper JUDR+) and DREADY­(jumper JUDR-) can be found in the middle of the PECL output arc in the right center of the EV board.
On the EV kits, the reset output 2-pin headers for RSTOUT+ (jumper JURO+) and RSTOUT- (jumper JURO-) are located above the reset input SMA connec­tors on the lower left side of the board.
Power Supplies
The EV kits feature separate analog and digital power supplies and grounds for best dynamic performance. The power-supply connectors are located at the top of the board and require the power supplies listed in Table 6.
To simplify use of the EV kits and reduce the number of power sources required to drive the EV board, VCCA and VCCI, as well as GNDA and GNDI, are connected together by shorting straps SP1 and SP2. To separate the supplies, cut the traces at SP1 and SP2. Be sure to observe the absolute maximum voltage difference of ±0.3V between the supplies if separate supplies are used. This may require back-to-back Schottky diodes between VCCA and VCCI to prevent violation of the absolute maximum ratings during power-up/down.
The EV kits are tested with the V
CC
A and VCCI supplies shorted by SP1 and SP2. There is no measurable differ­ence in the parts’ dynamic performance with the sup­plies separated, therefore Maxim recommends leaving the supplies connected together.
CAUTION: There are no connections between GNDA/GNDI and GNDD on the EV kits. These grounds must be referenced together at the power supply to the board, or damage to the device may result!
Referencing analog (GNDA/GNDI) and digital (GNDD) grounds together at a single point avoids ground loops and reduces noise pickup from the digital signals or power lines.
To avoid a possible latchup condition when disassem­bling an application, a high-speed Schottky diode (D1, 1N5819) was added between V
EE
and GNDI. This diode prevents the substrate (which is connected to VEE) from forward biasing and possibly causing a latchup condition when the VEEconnector is opened.
Board Layout
Each EV kit is a four-layer board design, optimized for high-speed signals. The board is constructed from low­loss GETek core material, which has a relative dielec­tric constant of 3.9 (εr= 3.9). The GETek material used for the EV board offers improved high-frequency and thermal properties over standard FR4 board material. All high-speed signals are routed with 50microstrip
Table 6. Power-Supply and Ground Requirements and Location
J11VCCD = +5V
J17VEE= -5V
J13, J15VCCA = VCCI = +5V
POWER SUPPLY
EV KIT JUMPER
LOCATION
GNDD
GNDI
GNDA/GNDI
GROUND
REFERENCE
J12
J16
J14, J16
EV KIT JUMPER
LOCATION
J18VCCO = +3.0V to +5V J12GNDD
Table 5. Demultiplexer Operation and Reset Control Signals
JURO+, JURO-
JUDR+, JUDR-DREADY+, DREADY-
RSTOUT+, RSTOUT- Reset Output—for resetting additional external demux devices.
Data-Ready PECL Output. Output data changes on the rising edge of DREADY+.
Master ADC Timing Signal. The ADC samples on the rising edge of CLK+.J3, J4CLK+, CLK-
FUNCTION
J5, J6RSTIN+, RSTIN- Demux Reset Input Signal. Resets the internal demux when asserted.
SIGNAL NAME
EV KIT JUMPER
LOCATION
Evaluate: MAX104/MAX106/MAX108
MAX104/MAX106/MAX108 Evaluation Kits
_______________________________________________________________________________________ 9
transmission lines. The line width for 50microstrip is 18 mils with a ground plane height of 10 mils, which is a standard GETek core thickness. Figure 3 shows a cross-section of the EV kit layer profile.
The board also features a de-embedding fixture formed from two lengths of microstrip transmission line con­nected between SMA connectors J9-10 and J7-8, located on the right edge of the board. The 1.50-inch line length difference between the two paths exactly matches the line length of the microstrip connecting the analog inputs. By measuring the power-loss difference between the two paths at the frequency of interest, it is possible to estimate the attenuation of the analog inputs caused by PCB losses. Figure 4 shows the mea­sured attenuation vs. frequency for the microstrip lines connecting the analog inputs.
Special Layout Considerations
A special effort was made in the board layout to sepa­rate the analog and digital portions of the circuit. 50 microstrip transmission lines are used for the analog and clock inputs as well as for the high-speed PECL digital outputs. The analog and clock transmission lines are formed on the top side of the board, while the digi­tal transmission lines are located on the back side of the board. This reduces coupling of the high-speed digital outputs to the analog inputs. The analog and clock inputs provide on-chip, laser-trimmed 50Ω termi- nation resistors for the best VSWR performance.
Wherever large ground or power planes are used, care was taken to ensure that the analog planes were not overlapping with any digital planes. This eliminates the possibility of capacitively coupling digital noise through the circuit board to sensitive analog areas.
Table 7. EV Kit PCB Layers
LAYER #1 (TOP)
18 MILS
50
1 oz. Cu
LAYER #2
18 MILS
50
10 MIL GETek CORE
GETek PREPREG AS NEEDED
10 MIL GETek CORE
LAYER #3
LAYER #4 (BOTTOM)
Figure 3. EV Kit Layer Profile for 50ΩMicrostrip Design
0
-0.05
-0.10
-0.15
-0.20
-0.25
-0.30
-0.35
-0.40
-0.45
-0.50 1 500 1500 2500
BOARD LOSS vs. INPUT FREQUENCY
ANALOG INPUT FREQUENCY (MHz)
AMPLITUDE (dB)
Figure 4. Analog Input Attenuation from PCB Losses
VEE, PECLVTT(VCCO - 2V), GNDD VCCA, VCCO, GNDI, digital 50microstrip lines, 50termination resistorsLayer IV, bottom layer
Layer III, power plane
Components, jumpers, connectors, test pads, VCCO, GNDD, GNDI, analog 50 microstrip lines, de-embedding fixtures
Layer I, top layer
Ground for analog 50microstrips, GNDA, GNDD, GNDI, VCCDLayer II, ground plane
LAYER DESCRIPTION
Evaluate: MAX104/MAX106/MAX108
All differential digital outputs are properly terminated with 50termination resistors on both phases of the output, even though most logic analyzers are single ended. By terminating both sides of the differential out­puts, the AC current in the VCCO and GNDD supplies is reduced. This also reduces coupling of the ADC out­puts back to the analog inputs and preserves the excellent SNR performance of the converter.
The PECL digital outputs are arranged in an arc to match the line lengths between the ADC outputs and the logic analyzer connectors. The lengths of the 50microstrip lines are matched to within 0.050 inch to minimize layout­dependent data skew between the bits. The propagation delay on the EV board is about 134ps per inch.
ESBGA Device Pad Design
An excellent reference on the assembly and design of PCBs with BGA devices is “
Application Notes on Surface Mount Assembly of Amkor/Anam BGA Packages
.” This publication is available from Amkor/Anam, 1900 S. Price Road, Chandler AZ, 85248, phone: (602) 821-5000.
As described in the above applications note, there are two possibilities for defining PCB pads for mounting BGA devices: solder mask defined (SMD) and nonsol­der mask defined (non-SMD, copper defined). The EV kits’ design employs nonsolder mask defined pads. Figure 5 shows the layout of each of these pad types.
The non-SMD (Figure 5b) pad has a solder-mask open­ing that is larger than the copper land area. This means that the size of the mounting pad is controlled by the
copper etch quality control. The SMD pad (Figure 5a) has a solder-mask opening that is smaller than the cop­per land area. This means that the solder-mask align­ment and etch quality will control the pad dimensions.
Since the edges of the copper do not need to extend under the solder mask as with the SMD pad, the pad can either be made larger or can provide more line routing space between adjacent pads. There is room to route a single 50microstrip trace (18 mils wide) between the BGA mounting pads on the EV kits. The copper land diameter is 25 mils, while the solder mask opening is 30 mils.
Die Temperature Measurement
It is possible to determine the die temperature of the ADC under normal operating conditions by observing the currents I
CONST
and I
PTAT
. These are two nominally 100µA currents designed to be equal at 27°C. The cur­rents are derived from the internal precision +2.5V bandgap reference of the ADC. Their test pads (J21 and J22) are labeled ICONST and IPTAT and are locat­ed just above the analog inputs.
The simplest method of determining die temperature is to measure each current with an ammeter referenced to GNDI, as described in the data sheets. The die temper­ature in °C is then calculated by the expression:
T 300
I
I
273
DIE
PTAT
CONST
=
 
 
MAX104/MAX106/MAX108 Evaluation Kits
10 ______________________________________________________________________________________
Figure 5a. BGA PCB Pad Designs (SMD Pad) Figure 5b. BGA PCB Pad Designs (Non-SMD Pad)
Evaluate: MAX104/MAX106/MAX108
MAX104/MAX106/MAX108 Evaluation Kits
______________________________________________________________________________________ 11
C1
10µF
C7
0.01µF
C2
0.01µF
C3
47pF
C4
47pF
C6
47pF
C5
47pF
V
CC
D
J11
J12
GNDD
C20
10µF
C21
0.01µF
C9
0.01µF
C22
47pF
C23
47pF
C25
47pF
C24
47pF
V
CC
I
J15
J16
GNDI
C13
10µF
C14
0.01µF
C8
0.01µF
C15
47pF
C16
47pF
V
CC
A
J13
GNDA
J14
C40
10µF
C41
0.01µF
C11
0.01µF
C42
47pF
C43
47pF
C45
47pF
C44
47pF
V
CC
O
J18
R53
243
R54
158
U4
LM2991
GND
OUT
IN
ADJ
1
2
3
5
4
J19
PECLV
TT
C46
10µF
C47
0.01µF
GNDD
SP2
SP1
V
EE
GNDD
J17
J20
GNDI
D1
C31
10µF
R51
243
R52
158
U3
LM2991
ADJ IN
OUT
GND
4
2
5
3
1
GNDI
3
1
2
V
CC
I
ON OFF
JU3
GNDI
C37
47pF
C32
0.01µF
C10
0.01µF
C33
47pF
C34
47pF
C35
47pF
C36
47pF
C48
10µF
C49
0.01µF
C50
47pF
ECLV
TT
ON/OFF
ON/OFF
GNDD
Figure 6. MAX104/MAX106/MAX108 EV Kits Schematic
Evaluate: MAX104/MAX106/MAX108
MAX104/MAX106/MAX108 Evaluation Kits
12 ______________________________________________________________________________________
VCCO
V
TT
GNDD
C12
0.01µF
C51
0.01µF
VCCO
V
TT
GNDD
C29
0.01µF
C58
0.01µF
VCCO
NOTE: THESE JUMPERS FORM THE DE-EMBEDDING FIXTURE.
J7
J9
J8
J10
V
TT
GNDD
C18
0.01µF
C53
0.01µF
VCCO
V
TT
GNDD
C17
0.01µF
C52
0.01µF
EXAMPLE FOR PECL OUTPUT JUMPER AND TERMINATION. (EACH OUTPUT ON THE EV KIT IS TERMINATED LIKE THIS.)
VCCO
V
TT
GNDD
GNDD
PECLV
TT
JUOR+
R28
49.9
C30
0.01µF
C59
0.01µF
VCCO
V
TT
GNDD
C28
0.01µF
C57
0.01µF
VCCO
V
TT
GNDD
C27
0.01µF
C58
0.01µF
VCCO
V
TT
GNDD
C26
0.01µF
C55
0.01µF
VCCO
V
TT
GNDD
C19
0.01µF
C54
0.01µF
JUOR+ JUOR­JUP7+ JUP7­JUP6+ JUP6­JUP5+ JUP5­JUP4+ JUP4­JUP3+ JUP3­JUP2+ JUP2­JUP1+ JUP1­JUP0+ JUP0­JUA7+ JUA7­JUA6+ JUA6­JUA5+ JUA5­JUA4+ JUA4­JUA3+ JUA3­JUA2+ JUA2­JUA1+ JUA1­JUA0+ JUA0­JUDR­JUDR+ JURO­JURO+
R28 R29 R30 R38 R37 R36 R35 R34 R33 R32 R31 R27 R26 R25 R24 R23 R22 R21 R20 R19 R18 R17 R16 R15 R14 R13 R12 R11 R10
R9 R8 R7 R6
R5 R44 R45 R46 R47
JUMPER
TERMINATION
RESISTOR TO V
TT
JUOR+
Figure 6. MAX104/MAX106/MAX108 EV Kits Schematic (continued)
Evaluate: MAX104/MAX106/MAX108
MAX104/MAX106/MAX108 Evaluation Kits
______________________________________________________________________________________ 13
MAX104 MAX106 MAX108
U1
JUOR+ JUOR­JUP7+ JUP7­JUP6+ JUP6­JUP5+ JUP5­JUP4+ JUP4­JUP3+ JUP3­JUP2+ JUP2­JUP1+ JUP1­JUP0+ JUP0­JUA7+ JUA7­JUA6+ JUA6­JUA5+ JUA5­JUA4+ JUA4­JUA3+ JUA3­JUA2+ JUA2­JUA1+ JUA1­JUA0+ JUA0-
JUDR­JUDR+ JURO­JURO+
OR+
OR­P7+ P7­P6+ P6­P5+ P5­P4+ P4­P3+ P3­P2+ P2­P1+ P1­P0+ P0­A7+ A7­A6+ A6­A5+ A5­A4+ A4­A3+ A3­A2+ A2­A1+ A1­A0+ A0-
OFF
ON
JU7
GNDD
1
2
3
VCCD
D17 E18 V12 U12 V14 U14 V16 U16 N18 N17 L18 L17 H18 H17 F18 F17 B14 C14 B12 C12 V13 U13 V15 U15 P18 P17 M18 M17 J18 J17 G18 G17 B15 C15 B13 C13
DIVSEL
DEMUXEN
24
JU5
GNDD
1
2
3
VCCD
GNDD
V11
U11
K18
K17
RSTOUT+
RSTOUT-
DREADY+
DREADY-
GNDI
P2
T.P. VOSADJ
ICONST IPTAT VIN+ VIN­CLK+ CLK­CLKCOM RSTIN+ RSTIN-
V
CC
A
V
CC
I
V
CC
D AUXEN1 AUXEN2 V
CC
O
F1 E1
E2 L1 J1 T1 P1
R1 V10 U10
A9
B5 B10 R19 D18 A12
VEEVEEVEEVEEGNDA
REFOUT
REFIN
GNDR
GNDI
U2
A8
A1
C6
B6
ICONST
REFOUT
1
R2
10k
GNDI
2
3
J5
R3*
49.9
J6
R4*
49.9
V
TT
GNDI
GNDI
J4
GNDI
V
TT
J3
GNDI
J2
GNDI
J1
GNDI
V
CLKCOM
JU2
GNDI
IPTAT
JU4
J21
J22
VCCA
*NOT INSTALLED
VCCI
VCCD
SP1
1
32
ON
OFF
JU9
1
32
ON
OFF
JU8
VCCO
GNDD
GNDD
GNDD
V
EE
GNDI
SP2
JU5
REFOUT
GNDA
F3
B11
C7
B3
E3
GNDD
GNDD
Figure 6. MAX104/MAX106/MAX108 EV Kits Schematic (continued)
Evaluate: MAX104/MAX106/MAX108
MAX104/MAX106/MAX108 Evaluation Kits
14 ______________________________________________________________________________________
Figure 7. MAX104/MAX106/MAX108 EV Kits Component Placement Guide—Component Side (Layer I)
1.0"
Evaluate: MAX104/MAX106/MAX108
MAX104/MAX106/MAX108 Evaluation Kits
______________________________________________________________________________________ 15
Figure 8. MAX104/MAX106/MAX108 EV Kits Component Placement Guide—Solder Side (Layer IV)
1.0"
Evaluate: MAX104/MAX106/MAX108
MAX104/MAX106/MAX108 Evaluation Kits
16 ______________________________________________________________________________________
Figure 9. MAX104/MAX106/MAX108 EV Kits PC Board Layout—Component Side (Layer I)
1.0"
Evaluate: MAX104/MAX106/MAX108
MAX104/MAX106/MAX108 Evaluation Kits
______________________________________________________________________________________ 17
Figure 10. MAX104/MAX106/MAX108 EV Kits PC Board Layout—GND Plane (Layer II)
1.0"
Evaluate: MAX104/MAX106/MAX108
MAX104/MAX106/MAX108 Evaluation Kits
18 ______________________________________________________________________________________
Figure 11. MAX104/MAX106/MAX108 EV Kits PC Board Layout—Power Plane (Layer III)
1.0"
Evaluate: MAX104/MAX106/MAX108
MAX104/MAX106/MAX108 Evaluation Kits
______________________________________________________________________________________ 19
Figure 12. MAX104/MAX106/MAX108 EV Kits PC Board Layout—Solder Side (Layer IV)
1.0"
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
20
____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 1999 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.
Evaluates: MAX104/MAX106/MAX108
MAX104/MAX106/MAX108 Evaluation Kits
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
20
____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 1999 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.
NOTES
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