MAXIM DS8113 User Manual
General Description
The DS8113 smart card interface is a low-cost, analog
front-end for a smart card reader, designed for all ISO
7816, EMV™, and GSM11-11 applications. The DS8113
supports 5V, 3V, and 1.8V smart cards. The DS8113
provides options for low active- and stop-mode power
consumption, with as little as 10nA stop-mode current.
The DS8113 is designed to interface between a system
microcontroller and the smart card interface, providing
all power supply, ESD protection, and level shifting
required for IC card applications.
An EMV Level 1 library (written for the MAXQ2000
microcontroller) and hardware reference design is
available. Contact Maxim technical support at
https://support.maxim-ic.com/micro
regarding
requirements for other microcontroller platforms. An
evaluation kit, DS8113-KIT, is available to aid in prototyping and evaluation.
Applications
Consumer Set-Top Boxes
Access Control
Banking Applications
POS Terminals
Debit/Credit Payment Terminals
PIN Pads
Automated Teller Machines
Telecommunications
Pay/Premium Television
Features
♦ Analog Interface and Level Shifting for IC Card
Communication
♦ 8kV (min) ESD (IEC) Protection on Card Interface
♦ Ultra-Low Stop-Mode Current, Less Than 10nA
Typical
♦ Internal IC Card Supply-Voltage Generation:
5.0V ±5%, 80mA (max)
3.0V ±8%, 65mA (max)
1.8V ±10%, 30mA (max)
♦ Automatic Card Activation and Deactivation
Controlled by Dedicated Internal Sequencer
♦ I/O Lines from Host Directly Level Shifted for
Smart Card Communication
♦ Flexible Card Clock Generation, Supporting
External Crystal Frequency Divided by 1, 2, 4, or 8
♦ High-Current, Short-Circuit and High-Temperature
Protection
♦ Low Active-Mode Current
DS8113
Smart Card Interface
________________________________________________________________
Maxim Integrated Products
1
Ordering Information
19-5216; Rev 3; 4/10
Note: Contact the factory for availability of other variants and
package options.
+
Denotes a lead(Pb)-free/RoHS-compliant package.
EMV is a trademark owned by EMVCo LLC.
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device may be
simultaneously available through various sales channels. For information about device errata, go to: www.maxim-ic.com/errata
.
Selector Guide appears at end of data sheet.
PGND
28
27
26
25
24
23
22
AUX2IN
AUX1IN
I/OIN
XTAL2
TOP VIEW
DS8113
XTAL1
OFF
GND
21 VDD
20 RSTIN
19 CMDVCC
18 1_8V
17 VCC
16 RST
15 CLK
5V/3V
CLKDIV2
CLKDIV1
CP1
VDDA
VUP
PRES
PRES
I/O
AUX2
AUX1
4
1
2
3
5
6
7
8
9
10
11
12
13
14CGND
CP2
SO/TSSOP
Pin Configuration
EVALUATION KIT
AVAILABLE
PART TEMP RANGE PIN-PACKAGE
DS8113-RNG+ -40°C to +85°C 28 SO
DS8113-JNG+ -40°C to +85°C 28 TSSOP
DS8113
Smart Card Interface
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED DC OPERATING CONDITIONS
(VDD= +3.3V, V
DDA
= +5.0V, TA= +25°C, unless otherwise noted.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Voltage Range on VDD Relative to GND...............-0.5V to +6.5V
Voltage Range on VDDA Relative to PGND ..........-0.5V to +6.5V
Voltage Range on CP1, CP2, and VUP
Relative to PGND...............................................-0.5V to +7.5V
Voltage Range on All Other Pins
Relative to GND......................................-0.5V to (V
DD
+ 0.5V)
Maximum Junction Temperature .....................................+125°C
Maximum Power Dissipation (T
A
= -25°C to +85°C) .......700mW
Storage Temperature Range .............................-55°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
POWER SUPPLY
Digital Supply Voltage VDD 2.7 6.0 V
Card Voltage-Generator Supply Voltage V
Reset Voltage Thresholds
CURRENT CONSUMPTION
Active VDD Current 5V Cards
(Including 80mA Draw from 5V Card)
Active VDD Current 5V Cards
(Current Consumed by DS8113 Only)
Active VDD Current 3V Cards
(Including 65mA Draw from 3V Card)
Active VDD Current 3V Cards
(Current Consumed by DS8113 Only)
Active VDD Current 1.8V Cards
(Including 30mA Draw from 1.8V Card)
Active VDD Current 1.8V Cards
(Current Consumed by DS8113 Only)
Inactive-Mode Current I
Stop-Mode Current I
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
V
DDA
V
Threshold voltage (fall ing) 2.35 2.45 2.60 V
TH2
Hysteresis 50.0 100 150 mV
V
HYS2
I
DD_50V
I
DD_IC
I
DD_30V
I
DD_IC
I
DD_18V
I
DD_IC
DD
DD_STOP
> VDD 5.0 6.0 V
DDA
ICC = 80mA, f
f
= 10MHz, V
CLK
ICC = 80mA, f
f
= 10MHz, V
CLK
ICC = 65mA, f
= 10MHz, V
f
CLK
ICC = 65mA, f
= 10MHz, V
f
CLK
ICC = 30mA, f
= 10MHz, V
f
CLK
ICC = 30mA, f
= 10MHz, V
f
CLK
Card inactive, active-high PRES,
DS8113 not in stop mode
= 20MH z,
XTAL
DDA
= 20MHz,
XTAL
= 5.0V (Note 2)
DDA
= 20MH z,
XTAL
DDA
= 20MHz,
XTAL
= 5.0V (Note 2)
DDA
= 20MH z,
XTAL
DDA
= 20MHz,
XTAL
= 5.0V (Note 2)
DDA
= 5.0V
= 5.0V
= 5.0V
80.75 85.00 mA
0.75 5.00 mA
65.75 70.00 mA
0.75 5.00 mA
30.75 35.00 mA
0.75 5.00 mA
50.0 200 μA
DS8113 in ultra-low-power stop
mode (CMDVCC, 5V/3V, and 1_8V
0.01 2.00 μA
set to logic 1) (Note 3)
DS8113
Smart Card Interface
_______________________________________________________________________________________ 3
RECOMMENDED DC OPERATING CONDITIONS (continued)
(VDD= +3.3V, V
DDA
= +5.0V, TA= +25°C, unless otherwise noted.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
CLOCK SOURCE
Crystal Frequenc y f
XTAL1 Operating Conditions
External Capacitance for Crystal
Internal Oscillator f
External crystal 0 20 MHz
XTAL
f
XTAL1
V
IL_XTAL1
V
IH_XTAL1
C
XTAL1
C
XTAL2
INT
0 20 MHz
Low-level input on XTAL1 -0.3
High-level input on XTAL1
,
15 pF
0.7 x
V
DD
0.3 x
V
DD
VDD +
0.3
2.7 MHz
V
SHUTDOWN TEMPERATURE
Shutdown Temperature TSD +150 °C
RST PIN
Card-Inactive Mode
Card-Active Mode
Output Low Voltage V
Output Current I
Output Low Voltage V
Output High
Voltage
V
Rise Time t
Fal l Time t
Shutdown Current
Threshold
Current Limitation I
RSTIN to RS T Delay t
RST(LIMIT)
D(RSTIN-RST)
OL_RST1
OL_RST1
OL_RST2
OH_RST2
I
RST(SD)
I
V
I
I
CL= 30pF 0.1 μs
R_RST
CL= 30pF 0.1 μs
F_RST
= 1mA 0 0.3 V
OL_RST
= 0V 0 -1 mA
O_LRST
= 200μA 0 0.3 V
OL_RST
V
-
OH_RST
= -200μA
CC
0.5
V
CC
-20 mA
-20 +20 mA
2 μs
V
CLK P IN
Card-Inactive Mode
Card-Active Mode
Output Low Voltage V
Output Current I
Output Low Voltage V
Output High
Voltage
Rise Time t
Fal l Time t
Current Limitation I
Cloc k Frequency f
OL_CLK1 IOLCLK
OL_CLK1
V
CLK(LIMIT)
V
OL_CLK2
OH_CLK2 IOHCLK
I
CL= 30pF (Note 4) 8 ns
R_CLK
CL= 30pF (Note 4) 8 ns
F_CLK
-70 +70 mA
Operational 0 10 MHz
CLK
Duty Factor C
Slew Rate SR C
= 1mA 0 0.3 V
= 0V 0 -1 mA
OLCLK
= 200μA 0 0.3 V
OLCLK
V
-
= -200μA
= 30pF 45 55 %
L
= 30pF 0.2 V/ns
L
CC
0.5
V
V
CC
VCC PIN
Card-Inactive Mode
Output Low Voltage V
Output Current I
I
CC1
VCC = 0V 0 -1 mA
CC1
= 1mA 0 0.3 V
CC
DS8113
Smart Card Interface
4 _______________________________________________________________________________________
RECOMMENDED DC OPERATING CONDITIONS (continued)
(VDD= +3.3V, V
DDA
= +5.0V, TA= +25°C, unless otherwise noted.) (Note 1)
Card-Active Mode
DATA LINES (I/O AND I/OIN)
I/O I/OIN Falling Edge Delay t
Pullup Pulse Active Time tPU 100 ns
Maximum Frequency f
Input Capacitance CI 10 pF
I/O, AUX1, AUX2 PINS
Card-Inactive Mode
Card-Active Mode
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
65mA < I
I
< 65mA 4.75 5.00 5.25
CC(5V)
I
< 65mA 2.78 3.00 3.22
CC(3V)
I
CC(1.8V)
< 80mA 4.55 5.00 5.25
CC(5V)
< 30mA 1.65 1.80 1.95
5V card; current pulses of 40nC
Output Low Voltage V
CC2
with I < 200mA, t < 400ns,
f < 20MHz
4.6 5.4
V
3V card; current pulses of 24nC
with I < 200mA, t < 400ns,
2.75 3.25
f < 20MHz
1.8V card; current pulses of 12nC
with I < 200mA, t < 400ns,
1.62 1.98
f < 20MHz
Output Current I
Shutdown Current
Threshold
Slew Rate V
D(IO-I OIN)
Output Low Voltage V
Output Current I
Internal Pul lup
Resistor
Output Low Voltage V
Voltage
V
Output Rise/Fall
Time
Input Low Voltage V
Input High Voltage V
Input Low Current I
Input High Current I
V
CC2
V
V
I
CC(SD)
CCSR
120 mA
Up/down; C < 300nF (Note 5) 0.05 0.16 0.25 V/μs
200 ns
1 MHz
IOMAX
I
OL_IO1
V
OL_I O1
R
To VCC 9 11 19 k
PU_I O
OL_IO2 IOL_I O
OH_IO2
t
OT
IL_IO
IH_IO
IL_IO
IH_IO
I
I
CL= 30pF 0.1 μs
-0.3 +0.8
1.5 V
V
V
= 0 to 5V -80
CC(5V)
= 0 to 3V -65
CC(3V)
CC(1.8V)
OL_I O
OL_IO
= 0 to 1.8V -30
= 1mA 0 0.3 V
= 0V 0 -1 mA
mA
= 1mA 0 0.3 V
= < -20μA 0.8 x VCC V
OH_IO
= < -40μA (3V/5V) 0.75 x VCC V
OH_IO
CCOutput High
CC
V
V
CC
= 0V 600 μA
IL_IO
= VCC 20 μA
IH_IO
Input Rise/Fall Time tIT 1.2 μs
Current Limitation I
Current When
Pullup Active
IO(LIMIT)
CL= 30pF -15 +15 mA
I
CL= 80pF, VOH = 0.9 x VDD -1 mA
PU
DS8113
Smart Card Interface
_______________________________________________________________________________________ 5
RECOMMENDED DC OPERATING CONDITIONS (continued)
(VDD= +3.3V, V
DDA
= +5.0V, TA= +25°C, unless otherwise noted.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
I/OIN, AUX1IN, AUX2IN PINS
Output Low Voltage VOL IOL = 1mA 0 0.3 V
Output High Voltage V
OH
No Load
IOH < -40μA
0.9 x
V
DD
0.75 x
V
DD
VDD +
0.1
VDD +
0.1
V
Output Rise/Fall Time tOT CL= 30pF, 10% to 90% 0.1 μs
Input Low Voltage VIL -0.3
Input High Voltage V
Input Low Current I
Input High Current I
Input Ri se/Fall Time tIT V
IH
VIL = 0V 700 μA
IL_IO
VIH = VDD 10 μA
IH_IO
to VIH 1.2 μs
IL
0.7 x
V
DD
0.3 x
V
DD
VDD +
0.3
V
V
Integrated Pullup Res istor RPU Pullup to VDD 9 11 13 k
Current When Pul lup Active IPU CL= 30pF, VOH = 0.9 x VDD -1 mA
CONTROL PINS (CLKDIV1, CLKDIV2, CMDVCC, RSTIN, 5V/3V, 1_8V)
Input Low Voltage V
Input High Voltage V
Input Low Current I
Input High Current I
IL
IH
IL_IO
IH_IO
-0.3
0.7 x
V
DD
0 < VIL < VDD 5 μA
0 < VIH < VDD 5 μA
0.3 x
V
DD
VDD +
0.3
V
V
INTERRUPT OUTPUT PIN (OFF)
Output Low Voltage VOL IOL = 2mA 0 0.3 V
Output High Voltage VOH IOH = -15μA
0.75 x
V
DD
V
Integrated Pullup Res istor RPU Pullup to VDD 16 20 24 k
PRES, PRES PINS
Input Low Voltage V
Input High Voltage V
Input Low Current I
Input High Current I
IL_PRES
IH_PRES
IL_PRES
IH_PRES
0.7 x
V
DD
V
V
= 0V 40 μA
IL_PR ES
= VDD 40 μA
IH_PRES
0.3 x
V
DD
V
V
DS8113
Smart Card Interface
6 _______________________________________________________________________________________
RECOMMENDED DC OPERATING CONDITIONS (continued)
(VDD= +3.3V, V
DDA
= +5.0V, TA= +25°C, unless otherwise noted.) (Note 1)
Note 1: Operation guaranteed at -40°C and +85°C but not tested.
Note 2: IDD_IC measures the amount of current used by the DS8113 to provide the smart card current minus the load.
Note 3: Stop mode is enabled by setting CMDVCC, 5V/3V, and 1_8V to a logic-high.
Note 4: Parameters are guaranteed to meet all ISO 7816, GSM11-11, and EMV 2000 requirements. For the 1.8V card, the maximum
rise and fall time is 10ns.
Note 5: Parameter is guaranteed to meet all ISO 7816, GSM11-11, and EMV 2000 requirements. For the 1.8V card, the minimum
slew rate is 0.05V/µs and the maximum slew rate is 0.5V/µs.
TIMING
Activation Time t
Deactivation Time t
CLK to Card Start
Time
PRES/PRES Debounce Time t
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
50 220 μs
ACT
50 80 100 μs
DEACT
Window Start t3 50 130
Window End t
140 220
5
DEB OUNCE
5 8 11 ms
μs
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