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DS8007A
User Manual
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MAXIM DS8007A User Manual

DS8007A
Multiprotocol Dual Smart Card Interface
________________________________________________________________
Maxim Integrated Products
1
Rev 0; 4/08
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device may be
simultaneously available through various sales channels. For information about device errata, go to: www.maxim-ic.com/errata
.
EVALUATION KIT
AVAILABLE
General Description
The DS8007A multiprotocol dual smart card interface is an automotive grade, low-cost, dual smart card reader interface supporting all ISO 7816, EMV™, and GSM11­11 requirements. Through its 8-bit parallel bus and dedi­cated address selects (AD3–AD0), the DS8007A can easily and directly connect to the nonmultiplexed byte­wide bus of a Maxim secure microcontroller. Optionally, the parallel bus can be multiplexed to allow direct access to the multiplexed bus of an 80C51-compatible microcontroller through MOVX memory addressing.
One integrated UART is multiplexed among the inter­faces to allow high-speed automatic smart card pro­cessing with each card-possessing, independent, variable, baud-rate capability. The card interface is con­trolled by internal sequencers that support automatic activation and deactivation sequencing, handling all actions required for T = 0, T = 1, and synchronous pro­tocols. Emergency deactivation is also supported in case of supply dropout. A third card is supported through the auxiliary I/O. The same set of I/O can option­ally be used as additional serial interface for the UART.
The DS8007A provides all electrical signals necessary to interface with two smart cards. The integrated volt­age converter ensures full cross-compatibility between
1.8V/3V/5V cards and a 1.8V/3V/5V environment, and allows operation within a 2.7V to 6V supply voltage range. The standard DS8007 revision is available for nonautomotive applications.
Applications
Banking Applications (Point-of-Sale Terminals, Debit/Credit Payment Terminals, PIN Pads, Automated Teller Machines)
Telecommunications
Pay Television
Access Control
Features
♦ Complete Interface/Control for Two Separate
Smart Card Devices
♦ 8kV (min) ESD Protection on Card Interfaces ♦ Internal IC Card Supply Voltage Generation
5.0V ±5%, 65mA (max)
3.0V ±8%, 50mA (max)
1.8V ±10%, 30mA (max)
♦ Automatic Card Activation, Deactivation, and Data
Communication Controlled by Dedicated Internal Sequencer
♦ Host Interface Through an 8-Bit Parallel Bus (User-
Selectable Multiplexed or Nonmultiplexed Modes)
♦ Chip Select and Three-State Bus Allow Multiple
Devices (Card Readers and Memories) on Bus
♦ 8-Character Receive FIFO with Optional
Programmable Depth/Threshold
♦ I/O Interface Pin to External ISO 7816 UART ♦ Separate Card Clock Generation (Up to 10MHz)
with 2x Frequency Doubling
♦ Selectable Card Clock Stop High, Stop Low, or
Internally Generated 1.25MHz (for Card Power-Down)
♦ EMV-Certified Reference Design and Evaluation
Kit Available (DS8007-KIT)
Ordering Information
Typical Operating Circuit appears at end of data sheet.
+
Denotes a lead(Pb)-free/RoHS-compliant device.
EMV is a trademark owned by EMVCo LLC.
RD D7 D6 D5 D4 D3 D2 D1 D0 V
DD
CPA2 AGND
RSTOUT
I/OAUX
I/OA C8A
PRESA
C4A
GNDA
CLKA
V
CCA
RSTA
I/OB C8B
1
2
3
4
5
6
7
8
9
10
11
12
1314151617181920212223
24
4847464544434241403938
37
36
35
34
33
32
31
30
29
28
27
26
25
PRESB
C4B
GNDB
CLKB
V
CCB
RSTB
GND
V
UP
CPA1
CPB1
V
DDA
CPB2
DELAY
XTAL1
XTAL2
AD0
AD1
AD2
AD3
INTAUX
INT
ALECSWR
LQFP
DS8007A
+
Pin Configuration
PART TEMP RANGE
DS8007A-EAG+ -40°C to +125°C
SMART CARDS
SUPPORTED
2 + auxiliary
PIN­PACKAGE
48 LQFP
DS8007A
Multiprotocol Dual Smart Card Interface
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VDD= +3.3V, V
DDA
= +3.3V, TA= +25°C, unless otherwise noted.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Voltage Range on VDDRelative to Ground ...........-0.5V to +6.5V
Voltage Range on V
DDA
Relative to Ground .........-0.5V to +6.5V
Voltage Range on Any Pin Relative to Ground
Pins CPA1, CPA2, CPB1, CPB2, and V
UP
.........-0.5V to +7.5V
All Other Pins...........................................-0.5V to (V
DD
+ 0.5V)
Maximum Junction Temperature .....................................+150°C
Maximum Power Dissipation (T
A
= -25°C).......................900mW
Storage Temperature Range .............................-55°C to +150°C
Soldering Temperature...........................Refer to the IPC/JEDEC
J-STD-020 Specification.
PARAMETER S YMBOL CONDITIONS MIN TYP MAX UNITS
Digital Supply Voltage VDD 2.7 6.0 V
Step-Up Converter Supply Voltage
Power-Down V
Current
DD
Sleep Mode VDD Current (Cards Active)
Active VDD Current 5V Cards
V
VDD 6.0 V
DDA
Cards Inactive f
Cards Acti ve
I
I
STOP
PD
f
= 0MHz 0.9
XTAL
f
= 0MHz, f
XTAL
= 0MH z, V
CLK
3x VDD step-up:
I
DD
I
CCA
f
XTAL
+ I
CCB
= 20MH z, f
= 0MH z, V
CLK
= 5V 24 mA
CCx
= 80mA, VDD = 2.7V,
= 10MHz
CLK
= 5V 2.2
CCx
325 mA
mA
2x VDD step-up:
+ I
Active VDD Current 3V Cards
Power-Fail Reset Voltage
Reset Threshold
Output Voltage VDO
Delay Pin
Output Current I
Output Capacitance
I
CCA
f
I
DD
CLK
= 80mA, f
CCB
= 10MHz, VDD = 2.7V
No step-up: I
+ I
CCA
f
CLK
V
Threshold voltage (fall ing) 2.1 2.5 V
RST
Hysteresis 50 170 mV
V
HYS
1.25
V
DRST
V
DO
C
DO
DELAY
V
DELAY
1 nF
= 80mA, f
CCB
= 10MHz, VDD = 5V
= 0V -2 μA
= VDD +2 mA
= 20MHz,
XTAL
= 20MHz,
XTAL
225
mA
120
V
V
+
DD
0.3
RSTOUT PIN
Output High Voltage V
Output Low Voltage V
IOH = -1mA
OHRSTO
IOL = 2mA -0.3 +0.4 V
OLRSTO
0.8 x V
DD
VDD +
0.3
V
Leakage Current IL VOL = 0V, VOH = 5V -10 +10 μA
DS8007A
Multiprotocol Dual Smart Card Interface
_______________________________________________________________________________________ 3
ELECTRICAL CHARACTERISTICS (continued)
(VDD= +3.3V, V
DDA
= +3.3V, TA= +25°C, unless otherwise noted.) (Note 1)
PARAMETER S YMBOL CONDITIONS MIN TYP MAX UNITS
Alarm Pulse Width tW C
External Cloc k Frequenc y f
Internal Oscillator f
Voltage on VUP Pin V
Voltage Detection of V 3x Step-Up
Shutdown Temperature TSD +150 °C
Card Inactive Mode
RSTx
Pins
Card Active Mode
Card Inactive Mode
CLKx
Card
Pins
Active Mode
Cloc k Frequency f
Duty Factor  CL = 30pF 45 55 %
= 22nF 10 ms
DELAY
External cry stal 4 20
External oscillator 0 20
1.6 2.5 3.7 MHz
3x step-up 5.7
2x step-up 4.1
3.25 3.50 3.60 V
I
V
I
I
= 1mA 0 0.3 V
OLRST
= 0V 0 -1 mA
OLRST
= +200μA 0 0.3
OLRST
= -200μA
OHRST
CL = 30pF 0.1
CL = 30pF 0.1
-25
-30 +30
I
V
I
I
= 1mA 0 0.3 V
OLCLK
= 0V 0 -1 mA
OLCLK
= +200μA 0 0.3
OLCLK
= -200μA
OHCLK
CL = 30pF (Note 2) 8
CL = 30pF (Note 2) 8
-90 +90 mA
Idle configuration (1MHz) 1 1.85
Operational 0 10
for 2x,
DDA
Output Low Voltage
Output Current I
Output Low Voltage
Output High Voltage
V
V
Rise Time t
Fal l Time t
Shutdown Current
Current Limitation
I
I
RST(LIMIT)
Output Low Voltage
Output Current I
Output Low Voltage
Output High Voltage
Rise Time t
Fal l Time t
Current Limitation
I
CLK(LIMIT)
XTAL
INT
UP
V
DET
V
OLRST
OLRST
OLRSTL
OHRSTH
RRST
FRST
RST(SD)
V
OLCLK
OLCLK
V
OLCLK
V
OHCLK
RCLK
FCLK
CLK
MHz
V
V
V
–
CCx
0.5
V
CCx
μs
mA
V
V
–
CCx
0.5
V
CCx
ns
MHz
DS8007A
Multiprotocol Dual Smart Card Interface
4 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS (continued)
(VDD= +3.3V, V
DDA
= +3.3V, TA= +25°C, unless otherwise noted.) (Note 1)
PARAMETER S YMBOL CONDITIONS MIN TYP MAX UNITS
Card Inactive Mode
V
CCx
Pins
Card Active Mode
Card Inactive Mode
I/Ox
Pins
Card Active Mode
Output Low Voltage
Output Current I
Output Low Voltage
V
ICC = 1mA 0 0.3 V
CCx
V
CC
V
CCx
= 0V 0 -1 mA
CCx
I
< 65mA 4.72 5.00 5.25
CC(5V)
I
< 50mA 2.75 3.00 3.22
CC(3V)
I
< 30mA 1.62 1.80 1.95
CC(1.8V)
5V card, current pulses of 40nC with I < 200mA, t < 400ns, f < 20MHz
3V card, current pulses of 24nC with I < 200mA, t < 400ns, f < 20MHz
1.8V card, current pulses of 12nC with I < 200mA, t < 400ns, f < 20MHz
Output Current I
Total Current (Two Cards) Shutdown Current
I
CC(A+ B)
I
Slew Rate V
Output Low Voltage
Output Current I
Internal Pul lup Resistor
R
Output Low Voltage
Output High Voltage
Output Rise/Fall Time
Input Low Voltage
Input High Voltage
Input Low Current Input High Current Input Ri se/Fall Time
Current Limitation
I
IO(LIMIT)
V
CC
V
V
-80
-100
CC(SD)
Up/down, C < 300nF (Note 3) 0.05 0.16 0.5 V/μs
CCSR
V
I
OLIO
V
OLIO
To V
PULLUP
I
V
OLIO
V
OHIO
t
V
V
I
ILIO
I
IHIO
OT
ILI O
IHIO
t
I
I
CL = 30pF 0.1 μs
-0.3 +0.8
1.5 V
V
V
CL = 30pF 1.2 μs
IT
-25 +25 mA
= 0 to 5V -65
CCx(5V)
= 0 to 3V -50
CCx(3V)
CCx(1.8 V)
OLIO
OLIO
OLIO
OHIO
OHIO
ILI O
IHIO
= 0 to 1.8V -30
= 1mA 0 0.3 V
= 0V 0 -1 mA
9 14 19 k
CCx
= 1mA 0 0.3
-20μA 0.8 x V
-40μA (3V/5V) 0.75 x V
= 0V 700
= V
20
CCx
4.6 5.4
2.75 3.25
1.62 1.98
V
CCx
V
CCx
CCx
CCx
CC
V
mA
V
V
μA
DS8007A
Multiprotocol Dual Smart Card Interface
_______________________________________________________________________________________ 5
ELECTRICAL CHARACTERISTICS (continued)
(VDD= +3.3V, V
DDA
= +3.3V, TA= +25°C, unless otherwise noted.) (Note 1)
PARAMETER S YMBOL CONDITIONS MIN TYP MAX UNITS
Card Inactive Mode
C4x,
C8x Pins
Card Active Mode
TIMING
Activat ion Sequence Duration t
Deactivation Sequence Duration tDE See Figure 9 150 μs
PRESA/PRESB PINS
Input Low Voltage V
Input High Voltage V
Input Low Current I
Input High Current I
I/OAUX PIN
Internal Pul lup Re sistor R
Output Low Voltage V
Output High Voltage V
Output Rise/Fall Time tOT CL = 30pF 0.1 μs
Output Low Voltage
Output Current I
Internal Pul lup Resistor
Output Low Voltage
Voltage
Output Rise/Fall Time
Input Low Voltage
Input High Voltage
Input Low Current
Input High Current
Input Ri se/Fall Time
Pullup Pulse Width
Oper ating Frequency
V
I
OLC48
V
OLC48
R
V
Between C4 or C8 and V
PULLUP
I
V
OLC48
OHC48
t
CL = 30pF 0.1 μs
OT
-0.3 +0.8
V
ILC48
1.5 V
V
IHC48
I
V
ILC48
V
I
IHC48
CL = 30pF 1.2 μs
t
IT
Active pullup 200 ns
t
WPU
f
On card contact pins 1 MHz
MAX
See Figure 9 130 μs
ACT
0.25 x VDD V
ILPR ES
0.7 x VDD V
IHPRES
V
ILPRES
V
IHPRES
Between I/OAUX and VDD 9 14 19 k
PULLUP
I
OLAUX
I
OHAUX
= 1mA 0 0.3 V
OLC48
= 0V 0 -1 mA
OLC48
= 1mA 0 0.35
OLC48
I
-20μA 0.8 x V
OHC48
I
-40μA (3V/5V) 0.75 x V
OHC48
= 0V 850
ILI O
= V
IHIO
ILPR ES
IHPRES
OLAUX
OHAUX
20
CCx
= 0V 40 μA
= VDD 40 μA
= 1mA 0.3 V
= 40μA (3V/5V) 0.75 x VDD V
6 10 14 k
CCx
V
CCx
V
CCx
CCxOutput High
CCx
CCx
DD
V
V
μA
V
DS8007A
Multiprotocol Dual Smart Card Interface
6 _______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS (continued)
(VDD= +3.3V, V
DDA
= +3.3V, TA= +25°C, unless otherwise noted.) (Note 1)
Note 1: Operation guaranteed at -40°C but not tested. Note 2: Parameters are guaranteed to meet all ISO 7816, GSM11-11, and EMV 2000 requirements. For the 1.8V card, the maxi-
mum rise and fall time is 10ns.
Note 3: Parameter is guaranteed to meet all ISO 7816, GSM11-11, and EMV 2000 requirements. For the 1.8V card, the minimum
slew rate is 0.05V/µs and the maximum slew rate is 0.5V/µs.
PARAMETER S YMBOL CONDITIONS MIN TYP MAX UNITS
Input Low Voltage V
Input High Voltage V
Input Low Current I
Input High Current I
Input Ri se/Fall Time tIT CL = 30pF 1.2 μs
INTERRU PT PIN
Output Low Voltage V
Input High Leakage Current I
D7 TO D0, ALL OTHER LOGIC PINS
Output Low Voltage V
Output High Voltage V
Output Rise/Fall Time tOT CL = 50pF 25 ns
Input Low Voltage V
Input High Voltage V
Input Low Current I
Input High Current I
Load Capacitance CLD 10 pF
-0.3
ILAUX
IHAUX
V
ILAUX
V
IHAUX
IOH = 2mA 0.3 V
OLINT
10 μA
LIHINT
I
OLD
I
OHD
ILD
IHD
-20 +20 μA
ILD
-20 +20 μA
IHD
= 0V 700 μA
ILAUX
= VDD -20 +20 μA
IHAUX
= +5mA
OLD
= -5mA
OHD
0.7 x V
DD
0.8 x V
DD
0.7 x V
DD
0.3 x V
DD
VDD V
0.2 x V
DD
VDD V
0.3 x V
DD
V
V
V
V
DS8007A
Multiprotocol Dual Smart Card Interface
_______________________________________________________________________________________ 7
AC ELECTRICAL SPECIFICATIONS—TIMING PARAMETERS FOR MULTIPLEXED PARALLEL BUS
(VDD= 3.3V, V
DDA
= 3.3V, TA= +25°C, unless otherwise noted.) (Figure 1)
Figure 1. Multiplexed Parallel Bus Timing
PARAMETER S YMBOL CONDITIONS MIN TYP MAX UNITS
XTAL1 Cycle Time t
ALE Pulse Width t
Address Valid to ALE Low t ALE Low to RD or WR Low t
RD Pulse Width t
RD Low to Data Read Valid t WR/RD High to ALE High t WR Pulse Width t Data Write Valid to WR Low t
ALE
CS
50 ns
20 ns
10 ns
AVLL
10 ns
W(RD)
Register URR 2 x t
Other registers 10
50 ns
10 ns
10 ns
W(WR)
10 ns
t
(AL-RWL)
t
W(ALE)
t
AVLL
CY(XTAL1)
W(ALE)
(AL-RWL)
(RL-DV)
(RWH-AH)
(DV-WL)
CY(XTAL1)
ns
D7–D0
RD
WR
ADDRESS ADDRESS
t
W(RD)
t
(RL-DV)
DATA
(READ)
t
(RWH-AH)
t
(DV-WL)
DATA
(WRITE)
t
W(WR)
t
(RWH-AH)
DS8007A
Multiprotocol Dual Smart Card Interface
8 _______________________________________________________________________________________
Figure 2. Nonmultiplexed Parallel Bus Timing (Read and Write)
AC ELECTRICAL SPECIFICATIONS—TIMING PARAMETERS FOR NONMULTIPLEXED PARALLEL BUS (READ AND WRITE)
(VDD= 3.3V, V
DDA
= 3.3V, TA= +25°C, unless otherwise noted.) (See Figure 2.)
RD High to CS Low t1 10 ns Access Time CS Low to Data Out Valid t2 50 ns
CS High to Data Out High Impedance t3 10 ns
Data Valid to End of Write t4 10 ns
Data Hold Time t5 10 ns RD Low to CS or WR Low t6 10 ns Address Stable to CS or WR High t7 10 ns Address to CS Low t8 10 ns
READ
CS
WR (EN)
RD (R/W)
PARAMETER S YMBOL CONDITIONS MIN TYP MAX UNITS
t
1
t
8
t
2
t
3
AD3–AD0
D7–D0
WRITE
CS
WR (EN)
CS
WR (EN)
t
6
RD (R/W)
t
7
AD3–AD0
D7–D0
ADDRESS
DATA OUT
ADDRESS
WRITE RELEASE WITH CS
WRITE RELEASE WITH EN
t
4
DATA IN
t
5
DS8007A
Multiprotocol Dual Smart Card Interface
_______________________________________________________________________________________ 9
AC ELECTRICAL SPECIFICATIONS—TIMING PARAMETERS FOR CONSECUTIVE READ/WRITE TO URR/UTR/TOC
(VDD= 3.3V, V
DDA
= 3.3V, TA = +25°C, unless otherwise noted.)
Figure 3. Timing Between Two Read Operations in Register URR
Note 4: Depends on the leading edge of WR or CS (whichever is deasserted first). Reference this specification to the rising edge
of CS/WR instead of the falling edge.
Note 5: PSC is the programmed prescaler value (31 or 32).
PARAMETER S YMBOL CONDITIONS MIN TYP MAX UNITS
SEE FIGURE 3
RD Pulse Width t
RD Low to Bit CRED = 1 t
Set Time Bit FE t
Set Time Bit RBF t
SEE FIGURE 4
WR/CS Pulse Width t
WR/CS Low to I/Ox Low t
SEE FIGURE 5
WR/CS Pulse Width t WR/CS High to Bit CRED = 1 t
10 ns
W(RD)
RD(URR)
10.5 ETU
SB(FE)
10.5 ETU
SB(RBF)
(Note 4) 10 ns
W(WR)
WR(UTR)
10 ns
W(WR)
WR(TOC)
(Notes 4 and 5) 1 / PSC 2 / PSC ETU
t
W(RD)
2t
CY(CLK)
t
W(WR)
2t
CY(CLK)
+
+
t
W(RD)
3t
CY(CLK)
t
W(WR)
3t
CY(CLK)
+
+
ns
ns
I/Ox
RBF BIT
FE BIT
INT
RD
CRED BIT
t
SB(FE)
t
SB(RBF)
t
W(RD)
t
RD(URR)
DS8007A
Multiprotocol Dual Smart Card Interface
10 ______________________________________________________________________________________
Figure 4. Timing Between Two Write Operations in Register UTR
Figure 5. Timing Between Two Write Operations in Register TOC
I/Ox
TBE BIT
INT
WR/CS
CRED BIT
t
W(WR)
t
WR(UTR)
t
WR/CS
CRED BIT
W(WR)
t
WR(TOC)
DS8007A
Multiprotocol Dual Smart Card Interface
______________________________________________________________________________________ 11
Pin Description
PIN NAME FUNCTION
Reset Output. This active-high output is provided for resetting external devices. The RSTOUT pin is driven
1 RSTOUT
2 I/OAUX Auxiliary I/O. This I/O pin allows connection to an auxiliary smart card interface.
3 I/OA
4 C8A
5 PRESA Smart Card A Presence Contact. This is the active-high presence contact associated with smart card A.
6 C4A
7 GNDA Smart Card A Ground. This must be connected to GND.
8 CLKA
9 V
10 RSTA
11 I/OB
12 C8B
13 PRESB Smart Card B Presence Contact. This is the active-high presence contact associated with smart card B.
14 C4B
15 GNDB Smart Card B Ground. This must be connected to GND.
16 CLKB
17 V
18 RSTB
19 GND Ground
20 VUP Step-Up Converter Connection. Connect a low-ESR capacitor of 220nF between this pin and ground.
CCA
CCB
high until the DELAY pin reaches V so it can externally be pulled down. The SUPL bit is set for each RSTOUT pulse.
Smart Card A I/O Data Line. This is the I/O data line a ssociated with smart card A. This is als o referred to as the ISO C7 contact.
Smart Card A Auxiliary I/O. This is an auxiliary I/O associated with smart card A. This is also referred to as the ISO C8 contact. This can be associated with synchronous cards.
Smart Card A Auxiliary I/O. This is an auxiliary I/O associated with smart card A. This is also referred to as the ISO C4 contact. This can be associated with synchronous cards.
Smart Card A Clock Output. This is the clock output associated with smart card A. This is also referred to as the ISO C3 contact.
Smart Card A Supply Voltage. This is the suppl y vo ltage output as soc iated with smart card A. Th i s is a lso referred to as the ISO C1 contact.
Smart Card A Reset. Th is is the reset output a ssoc iated with smart card A. This i s als o referred to as the ISO C2 contact.
Smart Card B I/O Data Line. This is the I/O data line a ssociated with smart card B. This is als o referred to as the ISO C7 contact.
Smart Card B Auxiliary I/O. This is an auxiliary I/O associated with smart card B. This is also referred to as the ISO C8 contact. This can be associated with synchronous cards.
Smart Card B Auxiliary I/O. This is an auxiliary I/O associated with smart card B. This is also referred to as the ISO C4 contact. This can be associated with synchronous cards.
Smart Card B Clock Output. This is the clock output associated with smart card B. This is also referred to as the ISO C3 contact.
Smart Card B Supply Voltage. This is the suppl y vo ltage output as soc iated with smart card B. Th i s is a lso referred to as the ISO C1 contact.
Smart Card B Reset. Th is is the reset output a ssoc iated with smart card B. This i s als o referred to as the ISO C2 contact.
. Once the DELAY pin reache s V
DRST
, the RSTOUT pin is tri-stated
DRST
DS8007A
Multiprotocol Dual Smart Card Interface
12 ______________________________________________________________________________________
Pin Description (continued)
PIN NAME FUNCTION
21 CPA1 Step-Up Converter Contact 1. Connect a low-ESR capacitor of 220nF between CPA1 and CPA2.
22 CPB1 Step-Up Converter Contact 3. Connect a low-ESR capacitor of 220nF between CPB1 and CPB2.
23 V
24 CPB2 Step-Up Converter Contact 4. Connect a low-ESR capacitor of 220nF between CPB1 and CPB2.
25 AGND Analog Ground
26 CPA2 Step-Up Converter Contact 2. Connect a low-ESR capacitor of 220nF between CPA1 and CPA2.
27 VDD Digital Supply Voltage. This pin should be decoupled to GND with a good quality capacitor.
28–35 D0–D7
36 RD
37 WR
38 CS Active-Low Chip-Select Input. This input indicates when the DS8007A is active on the parallel bus.
39 ALE
40 INT Active-Low Interrupt. Thi s output indicate s an interrupt is act ive.
41 INTAUX Auxiliary Interrupt Input. This pin serves as an auxiliary interrupt.
42–45 AD3 – AD0
46, 47
DDA
XTAL2,
XTAL1
Analog Supply Voltage. Positive ana log-supply voltage for the step-up converter; can be higher but not lower than V
8-Bit Digital I/O. This port functions as the data or address/data communication lines between the host controller and the DS8007A for the nonmultiplexed and multiplexed operating modes, respectively.
Active-Low Paralle l Bu s Read Strobe Input. In multiple xed mode, this input indicate s when the host processor is reading information from the DS8007A. In nonmultiplexed mode, this pin signals the current operation is a read (RD = 1) or a write (RD = 0) when CS and WR are low.
Active-Low Parallel Bus Write Strobe Input. In multiplexed mode, this input indicates when the host processor is writing information to the DS8007A. In nonmultiplexed mode, a low on this pin signals the bus is engaged in a read or write operation.
Address Latch Enable Input. This signal monitors the ALE signal when the host processor bus is operating in multiplexed mode. Connect this signal to V
Register Selection Address Inputs. These pins function as the address input lines for the nonmultiplexed configuration and shou ld be connected to ground or V
Crystal Oscillators. Place a crystal with appropriate load capacitors between these pins if that is the desired clock source. XTAL1 also acts as an input if there is an external clock source in place of a crystal.
This pin should be decoupled to AGND with a good quality capacitor.
DD.
when operating in nonmultiplexed mode.
DD
in the multiple xed conf iguration.
DD
48 DELAY
External Delay Capacitor Connection. Connect a capacitor from th is pin to ground to set the power-on reset delay.
DS8007A
Multiprotocol Dual Smart Card Interface
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Detailed Description
The following describes the major functional features of the device. Use of this document requires the reader have a basic understanding of ISO 7816 terminology.
Parallel Bus Interface
The device interfaces to a host computer/processor through a multiplexed or demultiplexed, parallel, 8-bit data bus (D0–D7). The parallel bus interface monitors the ALE signal and automatically detects whether a multiplexed or nonmultiplexed external bus interface is intended. The nonmultiplexed external bus interface is the default configuration and is maintained so long as
no edge (activity) is detected on the ALE pin. Once a rising edge is detected on the ALE pin, the DS8007A is placed into the multiplexed mode of operation. Once in the multiplexed mode of operation, a reset/power cycle or the deassertion of CS forces the device to the non­multiplexed mode. Connecting the ALE pin to V
DD
or ground forces the device into nonmultiplexed parallel bus mode. Figure 7 shows that the bus recognition dic­tates whether the external address lines (AD3–AD0) can be used directly or whether the external data lines (D7–D0) must be latched according to the ALE input signal. In the multiplexed mode of operation, a new address is latched irrespective of the state of CS.
Figure 6. Block Diagram
GNDB
I/OB
C4B C8B
PRESB
RSTB
CLKB
V
CCB
GNDA
I/OA C4A C8A
PRESA
RSTA
CLKA
V
CCA
RSTOUT
DELAY
V
GND
DD
POWER-SUPPLY
SUPERVISOR
ANALOG
INTERFACE
DS8007A
ISO
UART
DIGITAL
INTERFACE
TIMEOUT COUNTER
INT CS
INTAUX I/OAUX
AD0 AD1 AD2 AD3 ALE RD WR
D0 D1 D2 D3
D4 D5 D6
D7
CPA1 CPA2 CPB1
CPB2
V
DDA
AGND
V
UP
DC-DC
CONVERTER
CONTROL
SEQUENCERS
CLOCK
GENERATION
XTAL1
XTAL2
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