General Description
The DS3234 is a low-cost, extremely accurate SPI™ bus
real-time clock (RTC) with an integrated temperaturecompensated crystal oscillator (TCXO) and crystal. The
DS3234 incorporates a precision, temperature-compensated voltage reference and comparator circuit to monitor V
CC
. When VCCdrops below the power-fail voltage
(V
PF
), the device asserts the RST output and also dis-
ables read and write access to the part when V
CC
drops
below both V
PF
and V
BAT
. The RST pin is monitored as
a pushbutton input for generating a reset externally. The
device switches to the backup supply input and maintains accurate timekeeping when main power to the
device is interrupted. The integration of the crystal resonator enhances the long-term accuracy of the device
as well as reduces the piece-part count in a manufacturing line. The DS3234 is available in commercial and
industrial temperature ranges, and is offered in an
industry-standard 300-mil, 20-pin SO package.
The DS3234 also integrates 256 bytes of battery-backed
SRAM. In the event of main power loss, the contents of
the memory are maintained by the power source connected to the V
BAT
pin. The RTC maintains seconds,
minutes, hours, day, date, month, and year information.
The date at the end of the month is automatically adjusted for months with fewer than 31 days, including corrections for leap year. The clock operates in either the
24-hour or 12-hour format with AM/PM indicator. Two
programmable time-of-day alarms and a programmable
square-wave output are provided. Address and data are
transferred serially by an SPI bidirectional bus.
Applications
Servers Utility Power Meters
Telematics GPS
Features
♦ Accuracy ±2ppm from 0°C to +40°C
♦ Accuracy ±3.5ppm from -40°C to +85°C
♦ Battery Backup Input for Continuous
Timekeeping
♦ Operating Temperature Ranges
Commercial: 0°C to +70°C
Industrial: -40°C to +85°C
♦ Low-Power Consumption
♦ Real-Time Clock Counts Seconds, Minutes,
Hours, Day, Date, Month, and Year with Leap Year
Compensation Valid Up to 2099
♦ Two Time-of-Day Alarms
♦ Programmable Square-Wave Output
♦ 4MHz SPI Bus Supports Modes 1 and 3
♦ Digital Temp Sensor Output: ±3°C Accuracy
♦ Register for Aging Trim
♦ RST Input/Output
♦ 300-Mil, 20-Pin SO Package
♦ Underwriters Laboratory (UL) Recognized
DS3234
Extremely Accurate SPI Bus RTC with
Integrated Crystal and SRAM
______________________________________________
Maxim Integrated Products
1
Rev 1; 7/07
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
Ordering Information
SPI is a trademark of Motorola, Inc.
Typical Operating Circuit
#
Denotes a RoHS-compliant device that may include lead that
is exempt under the RoHS requirements. Lead finish is JESD97
Category e3, and is compatible with both lead-based and
lead-free soldering processes. A "#" anywhere on the top mark
denotes a RoHS-compliant device.
TOP VIEW
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
SCLK
DOUT
SCLK
DINV
CC
32kHz
N.C.
CS
V
BAT
GND
N.C.
N.C.N.C.
N.C.
RST
INT/SQW
12
11
9
10
N.C.
N.C.N.C.
N.C.
SO
DS3234
PART TEMP RANGE
DS3234S# 0°C to +70°C 20 SO DS3234S
DS3234SN# -40°C to +85°C 20 SO DS3234SN
PINPACKAGE
TOP
MARK
V
V
CC
SS
SCLK
MOSI
MISO
RST
CPU
PUSH-
BUTTON
RESET
CS
SCLK
DIN
DOUT
RST
N.C.
N.C.
N.C.
N.C.
N.C.
CC
V
CC
INT/SQW
DS3234
GND
32kHz
V
BAT
N.C.
N.C.
N.C.
N.C.
V
PU
DS3234
Extremely Accurate SPI Bus RTC with
Integrated Crystal and SRAM
2 _____________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED DC OPERATING CONDITIONS
(TA= -40°C to +85°C, unless otherwise noted.) (Notes 1, 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Voltage Range on Any Pin Relative to Ground......-0.3V to +6.0V
Operating Temperature Range
(noncondensing) .............................................-40°C to +85°C
Junction Temperature......................................................+125°C
Storage Temperature Range ...............................-40°C to +85°C
Soldering Temperature
(leads, 10s) ...........................................................+260°C/10s
Soldering Temperature (reflow, 2 times max) .......See IPC/JEDEC
J-STD-020 Specification
ELECTRICAL CHARACTERISTICS
(VCC= 2.0V to 5.5V, VCC= active supply (see Table 1), TA= -40°C to +85°C, unless otherwise noted.) (Typical values are at VCC=
3.3V, V
BAT
= 3.0V, and TA= +25°C, unless otherwise noted. TCXO operation guaranteed from 2.3V to 5.5V on VCCand 2.3V to 3.8V on
V
BAT
.) (Notes 1, 2)
Supply Voltage
Logic 1 Input CS, SCLK, DIN V
Logic 0 Input CS, SCLK, DIN,
RST
Pullup Voltage INT/SQW V
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
V
CC
V
BAT
IH
V
PU
2.0V ≤ VCC ≤ 3.63V -0.3
IL
3.63V < VCC ≤ 5.5V -0.3 +0.7
VCC = 0V 5.5 V
2.0 3.3 5.5
2.0 3.0 3.8
0.7 x
V
CC
VCC +
0.3
+0.2 x
V
CC
V
V
V
Active Supply Current I
Standby Supply Current I
Temperature Conversion Current I
Power-Fail Voltage V
V
BAT
(VCC = 2.0V to 5.5V, TA = -40°C to +85°C, unless otherwise noted.) (Notes 1 and 2)
Logic 1 Output, 32kHz
I
OH
I
OH
I
OH
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
VCC = 3.63V 400
V
= 5.5V 700
CC
VCC = 3.63V 120
V
= 5.5V 160
CC
VCC = 3.63V 500
V
= 5.5V 600
CC
2.45 2.575 2.70 V
25 100 nA
0.85 x V
CC
Leakage Current I
= -500µA
= -250µA
= -125µA
CCA
CCS
CCSCONV
PF
BATLKG
V
OH
SCLK = 4MHz, BSY = 0
(Notes 3, 4)
CS = VIH, 32kHz output off,
SQW output off
(Note 4)
SPI bus inactive, 32kHz
output off, SQW output off
VCC > 3.63V,
3.63V > V
2.7V > (V
(BB32kHz = 1)
CC
CC
> 2.7V,
or V
BAT
) > 2.0V
µA
µA
µA
V
DS3234
Extremely Accurate SPI Bus RTC with
Integrated Crystal and SRAM
_____________________________________________________________________ 3
ELECTRICAL CHARACTERISTICS (continued)
(VCC= 2.0V to 5.5V, VCC= active supply (see Table 1), TA= -40°C to +85°C, unless otherwise noted.) (Typical values are at VCC=
3.3V, V
BAT
= 3.0V, and TA= +25°C, unless otherwise noted. TCXO operation guaranteed from 2.3V to 5.5V on VCCand 2.3V to 3.8V on
V
BAT
.) (Notes 1, 2)
ELECTRICAL CHARACTERISTICS
(VCC= 0V, V
BAT
= 2.0V to 3.8V, TA= -40°C to +85°C, unless otherwise noted.) (Note 1)
Logic 0 Output, 32kHz V
Logic 1 Output, DOUT V
Logic 0 Output, DOUT, INT/SQW V
Logic 0 Output, RST V
Output Leakage Current 32kHz,
INT/SQW, DOUT
Input Leakage DIN, CS, SCLK I
RST Pin I/O Leakage I
TCXO (V
Output Frequency f
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
I
= 1mA 0.4 V
OL
I
= -1.0mA 0.85 x V
OH
I
= 3mA 0.4 V
OL
I
= 1.0mA 0.4 V
OL
CC
Output high impedance -1 0 +1 µA
-1 +1 µA
RST high impedance (Note 5) -200 +10 µA
V
= 3.3V or V
CC
= 3.3V 32.768 kHz
BAT
= 2.3V to 5.5V, V
CC
OL
OH
OL
OL
I
LO
LI
OL
= 2.3V to 3.8V, TA = -40°C to +85°C, unless otherwise noted.) (Notes 1 and 2)
BAT
OUT
V
0°C to +40°C -2 +2
Frequency Stability vs.
Temperature
Δf/f
OUT
V
V
CC
BAT
= 3.3V or
= 3.3V
-40°C to 0°C and
+40°C to +85°C
-3.5 +3.5
ppm
Frequency Stability vs. Voltage Δf/V 1 ppm/V
-40°C 0.7
Trim Register Frequency
Sensitivity per LSB
Δf/LSB Specified at:
+25°C 0.1
+70°C 0.4
ppm
+85°C 0.8
Temperature Accuracy Temp -3 +3 °C
Crystal Aging Δf/f
OUT
After reflow,
not production tested
First year ±1.0
0–10 years ±5.0
ppm
Battery Current
(Note 4)
Temperature Conversion Current I
Data-Retention Current I
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
I
BAT
TC
BATTC
V
= 3.4V 1.5 2.3
EOSC = 0, BBSQW = 0
EOSC = 0, BBSQW = 0 400 µA
EOSC = 1 100 nA
BAT
= 3.8V 1.5 2.5
V
BAT
µA
DS3234
Extremely Accurate SPI Bus RTC with
Integrated Crystal and SRAM
4 _____________________________________________________________________
AC ELECTRICAL CHARACTERISTICS
(VCC= 2.0V to 5.5V, TA= -40°C to +85°C, unless otherwise noted.) (Note 1)
POWER-SWITCH CHARACTERISTICS
(TA= -40°C to +85°C)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
SCLK Clock Frequency f
Data to SCLK Setup t
SCLK to Data Hold t
SCLK to CS Setup t
SCLK to Data Valid (Note 6) t
SCLK Low Time t
SCLK High Time t
SCLK Rise and Fall tR, t
CS to SCLK Setup t
SCLK to CS Hold t
CS Inactive Time t
CS to Output High Impedance t
Pushbutton Debounce PBDB 250 ms
Reset Active Time t
Oscillator Stop Flag (OSF) Delay t
Temperature Conversion Time t
SCL
DC
CDH
CCS
CDD
CL
CH
CC
CCH
CWH
CDZ
RST
OSF
CONV
2.7V ≤ VCC ≤ 5.5V 4
2.0V ≤ V
2.7V ≤ VCC ≤ 5.5V 80
2.0V ≤ V
2.7V ≤ VCC ≤ 5.5V 110
2.0V ≤ V
2.7V ≤ VCC ≤ 5.5V 110
2.0V ≤ V
F
2.7V ≤ VCC ≤ 5.5V 100
2.0V ≤ V
(Note 7) 40 ns
(Note 8) 100 ms
< 2.7V 2
CC
30 ns
30 ns
30 ns
< 2.7V 160
CC
< 2.7V 220
CC
< 2.7V 220
CC
400 ns
< 2.7V 200
CC
250 ms
125 200 ms
MHz
ns
ns
ns
200 ns
ns
400 ns
VCC Fall Time; V
V
PF(MIN)
VCC Rise Time; V
V
PF(MAX)
Recovery at Power-Up t
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
to
PF(MAX)
PF(MIN)
to
t
VCCF
t
VCCR
REC
(Note 9) 125 300 ms
Capacitance on All Input Pins C
Capacitance on All Output Pins C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
(Note 10) 10 pF
IN
Outputs high impedance (Note 10) 10 pF
IO
300 µs
0µs
DS3234
Extremely Accurate SPI Bus RTC with
Integrated Crystal and SRAM
_____________________________________________________________________ 5
Pushbutton Reset Timing
Note 1: Limits at -40°C are guaranteed by design and not production tested.
Note 2: All voltages are referenced to ground.
Note 3: Measured at V
IH
= 0.8 x VCCor VIL= 0.2 x VCC, 10ns rise/fall time, DOUT = no load.
Note 4: Current is the averaged input current, which includes the temperature conversion current. CRATE1 = CRATE0 = 0.
Note 5: The RST pin has an internal 50kΩ (nominal) pullup resistor to V
CC
.
Note 6: Measured at V
OH
= 0.8 x VCCor VOL= 0.2 x VCC. Measured from the 50% point of SCLK to the VOHminimum of DOUT.
Note 7: With 50pF load.
Note 8: The parameter t
OSF
is the period of time the oscillator must be stopped for the OSF flag to be set over the voltage range of
0V ≤ V
CC
≤ V
CC(MAX)
and 2.3V ≤ V
BAT
≤ V
BAT(MAX)
.
Note 9: This delay only applies if the oscillator is enabled and running. If the EOSC bit is 1, t
REC
is bypassed and RST immediately
goes high.
Note 10: Guaranteed by design and not production tested.
WARNING: Negative undershoots below -0.3V while the part is in battery-backed mode may
cause loss of data.
V
PF(MAX)
V
PF(MIN)
RST
PB
DB
t
RST
V
CC
t
VCCF
V
PF
V
PF
t
VCCR
t
REC
RST
DS3234
Extremely Accurate SPI Bus RTC with
Integrated Crystal and SRAM
6 _____________________________________________________________________
Timing Diagram—SPI Read Transfer
Timing Diagram—SPI Write Transfer
t
CS
CCS
t
SCLK
DIN
DOUT
NOTE: SCLK CAN BE EITHER POLARITY, SHOWN FOR CPOL = 1.
SCLK
CC
t
DC
W/R
CS
t
CC
t
t
CL
t
CDH
WRITE ADDRESS BYTE
t
R
A6
HIGH IMPEDANCE
R
t
F
t
t
CH
t
CDD
A0
D7
READ DATA BYTE
D0
CDZ
t
CWH
t
t
F
CCH
t
DOUT
DIN
CL
t
t
DC
W/R
CDH
WRITE ADDRESS BYTE
t
CH
A6
A0
HIGH IMPEDANCE
D7 D0
WRITE DATA BYTE