MAXIM DS3231 User Manual

Rev 1; 2/05

高精度、

_________________________________

DS3231

的温补晶体振荡器

是低成本、高精度

(TCXO)

端，断开主电源时仍可保持精确的计时。集成晶体振荡器提高了器件的长期精确度，并减少了生产线的元件数量。

DS3231

300mil的SO

保持秒、分、时、星期、日期、月和年信息。少于

RTC

天的月份，将自动调整月末日期，包括闰年补偿。时

31

提供商用级和工业级温度范围，采用16引脚、

封装。

钟的工作格式可以是24小时或带格式。提供两个可编程日历闹钟和一路可编程方波输出。

2

地址与数据通过

双向总线串行传输。

C

I

精密的、经过温度补偿的电压基准和比较器用来监视状态，检测电源故障、提供复位输出，并在必要时自动切换到备用电源。另外，输入以产生外部复位信号。

实时时钟

I2C

(RTC)

和晶体。该器件包含电池输入

AM/PM

监视引脚可以作为手动按钮

RST

指示的12小时

_________________________________

服务器电表

远程信息处理系统

GPS

概述

，具有集成

V

CC

应用

I2C

集成

RTC/TCXO/

_________________________________

♦ 0°C至+40°C

♦ -40°C至+85°C

为连续计时提供备用电池输入

♦

工作温度范围

♦

商用级：工业级：

低功耗

♦

实时时钟提供秒、分、时、星期、日期、月、

♦

年信息，并提供有效期到两个日历闹钟

♦

可编程方波输出

♦

快速

♦

♦ 3.3V

♦

♦ RST

(400kHz) I2C

工作电压数字温度传感器输出：精度为老化修正寄存器

输入/输出

______________________________

范围内精度为

0°C至+70°C

-40°C至+85°C

接口

±2ppm

±3.5ppm

年的闰年补偿

2100

±3°C

定购信息

晶体

DS3231

特性

PART TEMP RANGE PIN-PACKAGE

DS3231S 0°C to +70°C 16 SO DS3231S

DS3231SN -45°C to +85°C 16 SO DS3231SN

引脚配置在数据资料的最后部分给出。

_______________________________________________________________

V

CC

V

CC

INT/SQW

DS3231

GND

产品，即得到了

32kHz

V

BAT

Philips I2C

的专利许可、将这些产品用于符合

CPU

购买

Maxim Integrated Products, Inc.

定义的

标准规范的系统。

I2C

V

R

= tR/C

PU

V

CC

B

R

PU

或其从属授权关联公司的

CC

R

PU

SCL

SDA

RST

I2C

TOP

MARK

典型工作电路

Philips

______________________________________________ Maxim Integrated Products 1

本文是翻译错误，如需确认任何词语的准确性，请参考

正式英文资料的译文，

Maxim

不对翻译中存在的差异或由此产生的错误负责。请注意译文中可能存在文字组织或

Maxim

索取免费样品和最新版的数据资料，请访问

Maxim

提供的英文版资料。

的主页：

www.maxim-ic.com.cn

。

高精度、

I2C

集成

RTC/TCXO/

晶体

ABSOLUTE MAXIMUM RATINGS

Voltage Range on VCC, V

INT/SQW Relative to Ground.............................-0.3V to +6.0V

Operating Temperature Range ...........................-40°C to +85°C

Junction Temperature......................................................+125°C

DS3231

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

, 32kHz, SCL, SDA, RST,

BAT

Storage Temperature Range ...............................-40°C to +85°C

Lead Temperature

(Soldering, 10s).....................................................+260°C/10s

Soldering Temperature....................................See the Handling,

PC Board Layout, and Assembly section.

RECOMMENDED DC OPERATING CONDITIONS

(TA= T

Supply Voltage

Logic 1 Input SDA, SCL V

Logic 0 Input SDA, SCL V

Pullup Voltage (SDA, SCL, 32kHz, INT/SQW)

to T

MIN

, unless otherwise noted.) (Notes 1, 2)

MAX

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

V

CC

BAT

IH

IL

PU

VCC = 0V 5.5V V

2.3 3.3 5.5 V

2.3 3.0 5.5 V

0.7 x V

CC

-0.3

VCC +

0.3

+0.3 x

V

CC

V

ELECTRICAL CHARACTERISTICS

(VCC= 2.3V to 5.5V, VCC> V

= +25°C, unless otherwise noted.) (Notes 1, 2)

T

A

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Active Supply Current I

Standby Supply Current I

Temperature Conversion Current I

Power-Fail Voltage V

Logic 0 Output, 32kHz, INT/SQW,

SDA

Logic 0 Output, RST V

Output Leakage Current 32kHz,

INT/SQW, SDA

Input Leakage SCL I RST Pin I/O Leakage I

V

Leakage Current

BAT

Active)

(V

CC

2 _____________________________________________________________________

BAT

, TA= T

CCSCONV

I

BATLKG

MIN

CCA

CCS

PF

V

OL

I

LO

LI

OL

to T

, unless otherwise noted.) (Typical values are at V

MAX

(Notes 3, 4)

I2C bus inactive, 32kHz output on, SQW output off (Note 4)

I2C bus inactive, 32kHz output on, SQW output off

I

= 3mA 0.4 V

OL

I

= 1mA 0.4 V

OL

VCC = 3.63V 200

= 5.5V 300

V

CC

VCC = 3.63V 110

V

= 5.5V 170

CC

VCC = 3.63V 575

V

= 5.5V 650

CC

Output high impedance -1 0 +1 µA

-1 +1 µA RST high impedance (Note 5) -200 +10 µA

25 100 nA

= 3.3V, V

CC

2.35 2.575 2.70 V

= 3.0V, and

BAT

µA

高精度、

I2C

集成

RTC/TCXO/

晶体

ELECTRICAL CHARACTERISTICS (continued)

(VCC= 2.3V to 5.5V, VCC> V

= +25°C, unless otherwise noted.) (Notes 1, 2)

T

A

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Output Frequency f

Frequency Stability vs.

Temperature (Commercial)

Frequency Stability vs.

Temperature (Industrial)

BAT

, TA= T

∆f/f

MIN

OUT

to T

, unless otherwise noted.) (Typical values are at V

MAX

V

= 3.3V or V

CC

V

= 3.3V or

CC

= 3.3V

V

BAT

V

= 3.3V or

CC

V

= 3.3V

BAT

= 3.3V 32.768 kHz

BAT

0°C to +40°C ±2 >40°C to +70°C ±3.5

-40°C to <0°C ±3.5 0°C to +40°C ±2 >40°C to +85°C ±3.5

= 3.3V, V

CC

= 3.0V, and

BAT

ppm

Frequency Stability vs. Voltage ∆f/V 1 ppm/V

-40°C 0.7

Trim Register Frequency

Sensitivity per LSB

∆f/LSB Specified at:

+25°C 0.1 +70°C 0.4

ppm

+85°C 0.8

Temperature Accuracy Temp VCC = 3.3V or V

= 3.3V -3 +3 °C

BAT

ELECTRICAL CHARACTERISTICS

(VCC= 0V, V

Active Battery Current I

Timekeeping Battery Current I

Temperature Conversion Current I

Data-Retention Current I

= 2.3V to 5.5V, TA= T

BAT

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

to T

MIN

BATA

BATT

BATTC

BATTDR

, unless otherw.ise noted.) (Note 1)

MAX

V

= 3.63V 70

EOSC = 0, BBSQW = 0, SCL = 400kHz (Note 4)

EOSC = 0, BBSQW = 0, EN32kHz = 1, SCL = SDA = 0V or S C L = S D A = V

EOSC = 0, BBSQW = 0, SCL = SDA = 0V or SCL = SDA = V

EOSC = 1, SCL = SDA = 0V, +25°C 100 nA

BAT

( Note 4)

BAT

V

= 5.5V 150

BAT

V

= 3.63V 0.84 3.0

BAT

= 5.5V 1.0 3.5

V

BAT

V

= 3.63V 575

BAT

V

= 5.5V 650

BAT

DS3231

µA

_____________________________________________________________________ 3

高精度、

I2C

集成

RTC/TCXO/

AC ELECTRICAL CHARACTERISTICS

(VCC= V

CC(MIN)

SCL Clock Frequency f

to V

CC(MAX)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

or V

BAT

= V

BAT(MIN)

SCL

DS3231

Bus Free Time Between STOP and START Conditions

Hold Time (Repeated) START Condition (Note 6)

Low Period of SCL Clock t

High Period of SCL Clock t

Data Hold Time (Notes 7, 8) t

Data Setup Time (Note 9) t

Start Setup Time t

Rise Time of Both SDA and SCL Signals (Note 10)

Fall Time of Both SDA and SCL Signals (Note 10)

Setup Time for STOP Condition t

Capacitive Load for Each Bus Line (Note 10)

Capacitance for SDA, SCL C

Pulse Width of Spikes That Must Be Suppressed by the Input Filter

Pushbutton Debounce PB

Reset Active Time t

Oscillator Stop Flag (OSF) Delay t

Temperature Conversion Time t

t

BUF

t

HD:STA

LOW

HIGH

HD:DAT

SU:DAT

SU:STA

t

R

t

F

SU:STO

C

B

I/O

t

SP

DB

RST

OSF

CONV

晶体

to V

BAT(MAX)

Fast mode 100 400

Standard mode 0 100

Fast mode 1.3

Standard mode 4.7

Fast mode 0.6

Standard mode 4.0

Fast mode 1.3

Standard mode 4.7

Fast mode 0.6

Standard mode 4.0

Fast mode 0 0.9

Standard mode 0 0.9

Fast mode 100

Standard mode 250

Fast mode 0.6

Standard mode 4.7

Fast mode 300

Standard mode

Fast mode 300

Standard mode

Fast mode 0.6

Standard mode 4.7

(Note 11) 100 ms

, V

BAT

> VCC, TA= T

MIN

to T

, unless otherwise noted.) (Note 1)

MAX

20 +

0.1C

B 1000

20 +

0.1C

B 300

10 pF

30 ns

250 ms

125 200 ms

kHz

µs

ns

µs

ns

µs

400 pF

POWER-SWITCH CHARACTERISTICS

(TA= T

VCC Fall Time; V V

PF(MIN)

VCC Rise Time; V V

PF(MAX)

Recovery at Power-Up t

4 _____________________________________________________________________

to T

MAX

PF(MAX)

PF(MIN)

)

to

t

VCCF

t

VCCR

REC

(Note 12) 250 300 ms

MIN

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

300 µs

0µs

高精度、

I2C

集成

RTC/TCXO/

晶体

___________________________________________________________________

RST

PB

DB

t

RST

___________________________________________________________________

V

CC

V

PF(MAX)

V

PF(MIN)

t

VCCF

V

PF

V

PF

t

VCCR

按钮复位时序

DS3231

电源开关时序

RST

t

REC

_____________________________________________________________________ 5

高精度、

I2C

集成

RTC/TCXO/

晶体

________________________________________________________ I2C

DS3231

SDA

t

BUF

t

LOW

SCL

t

HD:STA

STOP START

Note 1: Limits at -40°C are guaranteed by design and not production tested. Note 2: All voltages are referenced to ground. Note 3: I Note 4: Current is the averaged input current, which includes the temperature conversion current. Note 5: The RST pin has an internal 50kΩ (nominal) pullup resistor to V Note 6: After this period, the first clock pulse is generated. Note 7: A device must internally provide a hold time of at least 300ns for the SDA signal (referred to the V

Note 8: The maximum t Note 9: A fast-mode device can be used in a standard-mode system, but the requirement t

Note 10: C Note 11: The parameter t

Note 12: This delay applies only if the oscillator is enabled and running. If the EOSC bit is a 1, the startup time of the oscillator is

—SCL clocking at max frequency = 400kHz.

CCA

to bridge the undefined region of the falling edge of SCL.

is automatically the case if the device does not stretch the low period of the SCL signal. If such a device does stretch the low period of the SCL signal, it must output the next data bit to the SDA line t before the SCL line is released.

—total capacitance of one bus line in pF.

B

0.0V ≤ V

added to this delay.

CC

≤ V

needs only to be met if the device does not stretch the low period (t

HD:DAT

is the period of time the oscillator must be stopped for the OSF flag to be set over the voltage range of

OSF

CC(MAX)

and 2.3V ≤ V

t

R

t

HD:DAT

BAT

t

F

t

HIGH

≤ 3.4V.

t

SU:DAT

REPEATED

.

CC

START

t

SU:STA

t

HD:STA

R(MAX)

SU:DAT

串行总线上的数据传输

t

SP

of the SCL signal)

IH(MIN)

) of the SCL signal.

LOW

≥ 250ns must then be met. This

t

+

= 1000 + 250 = 1250ns

SU:DAT

t

SU:STO

6 _____________________________________________________________________

MAXIM DS3231 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual