MAXIM DS1859 User Manual

DS1859
Dual, Temperature-Controlled Resistors with
Internally Calibrated Monitors
______________________________________________ Maxim Integrated Products 1
For pricing delivery, and ordering information please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
General Description
Applications
Optical Transceivers
Optical Transponders
Instrumentation and Industrial Controls
RF Power Amps
Diagnostic Monitoring
Features
SFF-8472 CompatibleFive Monitored Channels (Temperature, VCC,
MON1, MON2, MON3)
Three External Analog Inputs (MON1, MON2, MON3)
That Support Internal and External Calibration
Scalable Dynamic Range for External Analog InputsInternal Direct-to-Digital Temperature SensorAlarm and Warning Flags for All Monitored
Channels
Two 50kΩ or Two 20k, Linear, 256-Position,
Nonvolatile Temperature-Controlled Variable Resistors
Resistor Settings Changeable Every 2°CAccess to Monitoring and ID Information
Configurable with Separate Device Addresses
2-Wire Serial InterfaceTwo Buffers with TTL/CMOS-Compatible Inputs and
Open-Drain Outputs
Operates from a 3.3V or 5V SupplyOperating Temperature Range of -40°C to +95°C
Ordering Information
Rev 4; 2/06
EVALUATION KIT
AVAILABLE
PART
RESISTANCE
PIN-PACKAGE
DS1859B-020 20k 16 CSBGA DS1859B-020+ 20k 16 CSBGA DS1859B-050 50k 16 CSBGA DS1859B-050+ 50k 16 CSBGA
A
TOP VIEW
B
C
D
1
CSBGA (4mm x 4mm)
1.0mm PITCH
TSSOP
324
MON3
OUT1IN2
MON1
L0GND
WPEN
L1
H0SDA
OUT2
H1
V
CC
SCLIN1
MON2
DS1859
SDA
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
SCL
OUT1
IN1
OUT2
IN2
WPEN
GND
V
CC
H1
L1
H0
L0
MON3
MON2
MON1
Pin Configurations
DS1859
SDA
1
2
3
4
5
6
7
8
16
0.1µF
15
14
13 12
11
10
9
SCL
OUT1
IN1
OUT2
IN2
WPEN
GND
V
CC
H1
L1
H0 L0
MON3
MON2
MON1
GROUND TO
DISABLE WRITE
PROTECT
Rx POWER*
DIAGNOSTIC INPUTS
TO LASER MODULATION CONTROL
TO LASER BIAS CONTROL
DECOUPLING CAP
Tx POWER*
Tx BIAS*
*SATISFIES SFF-8472 COMPATIBILITY
V
CC
VCC = 3.3V
4.7k4.7k
Tx-FAULT
LOS
2-WIRE
INTERFACE
Typical Operating Circuit
+Denotes lead-free package.
Ordering Information continued at end of data sheet.
DS1859
Dual, Temperature-Controlled Resistors with Internally Calibrated Monitors
2 _____________________________________________________________________
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage V
CC
(Note 1)
5.5 V
V
IH
(Note 2)
V
V
IL
(Note 2)
V
Resistor Inputs (L0, L1, H0, H1)
V
Resistor Current I
RES
-3 +3 mA
High-Z Resistor Current I
ROFF
0.1 µA
Input logic 1
Input Logic Levels (IN1, IN2)
Input logic 0 0.9
V
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Voltage Range on VCCRelative to Ground ...........-0.5V to +6.0V
Voltage Range on Inputs Relative
to Ground* ................................................-0.5V to V
CC
+ 0.5V
Voltage Range on Resistor Inputs Relative
to Ground* ................................................-0.5V to V
CC
+ 0.5V
Current into Resistors............................................................5mA
Operating Temperature Range ...........................-40°C to +95°C
Programming Temperature Range .........................0°C to +70°C
Storage Temperature Range .............................-55°C to +125°C
Soldering Temperature .......................................See IPC/JEDEC
J-STD-020A
RECOMMENDED DC OPERATING CONDITIONS
(TA= -40°C to +95°C, unless otherwise noted.)
PARAMETER
CONDITIONS
UNITS
Supply Current I
CC
(Note 3) 1 2 mA
Input Leakage I
IL
nA
V
OL1
3mA sink current 0 0.4
Low-Level Output Voltage (SDA, OUT1, OUT2)
V
OL2
6mA sink current 0 0.6
V
Full-Scale Input (MON1, MON2, MON3)
At factory setting (Note 4)
2.5
V
Full-Scale VCC Monitor
At factory setting (Note 5)
V
I/O Capacitance C
I/O
10 pF
WPEN Pullup R
WPEN
40 65 100 k
Digital Power-On Reset POD
2.2 V
Analog Power-On Reset POA
2.6 V
DC ELECTRICAL CHARACTERISTICS
(VCC= 2.85V to 5.5V, TA= -40°C to +95°C, unless otherwise noted.)
*Not to exceed 6.0V.
Input Logic 1 (SDA, SCL, WPEN)
Input Logic 0 (SDA, SCL, WPEN)
2.85
0.7 x Vcc VCC + 0.3
-0.3 +0.3 x V
-0.3 VCC + 0.3
0.001
1.5
CC
SYMBOL
MIN TYP MAX
-200 +200
2.4875
6.5208 6.5536 6.5864
1.0
2.0
2.5125
DS1859
Dual, Temperature-Controlled Resistors with
Internally Calibrated Monitors
_____________________________________________________________________ 3
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Thermometer Error T
ERR
-40°C to +95°C
°C
DIGITAL THERMOMETER
(VCC= 2.85V to 5.5V, TA= -40°C to +95°C, unless otherwise noted.)
PARAMETER
CONDITIONS
UNITS
EEPROM Writes +70°C
NONVOLATILE MEMORY CHARACTERISTICS
(VCC= 2.85V to 5.5V)
PARAMETER
CONDITIONS
Input Resolution
µV
Supply Resolution ∆V
CC
1.6 mV
Input/Supply Accuracy (MON1, MON2, MON3, V
CC
)
A
CC
At factory setting
% FS
Update Rate for MON1, MON2, MON3, Temp, or V
CC
t
frame
30 45 ms
Input/Supply Offset (MON1, MON2, MON3, V
CC
)
V
OS
(Note 14) 0 5 LSB
ANALOG VOLTAGE MONITORING
(VCC= 2.85V to 5.5V, TA= -40°C to +95°C, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Position 00h Resistance (50k)T
A
= +25°C
1.0
k
Position FFh Resistance (50k)T
A
= +25°C 40 50 60 k
Position 00h Resistance (20k)T
A
= +25°C
k
Position FFh Resistance (20k)T
A
= +25°C 16 20 24 k
Absolute Linearity (Note 6) -2 +2 LSB
Relative Linearity (Note 7) -1 +1 LSB
Temperature Coefficient (Note 8) 50
ANALOG RESISTOR CHARACTERISTICS
(VCC= 2.85V to 5.5V, TA= -40°C to +95°C, unless otherwise noted.)
SYMBOL
VMON 610
0.65
0.20 0.40 0.55
MIN TYP MAX UNITS
0.25 0.5
1.35
ppm/°C
(full scale)
SYMBOL
MIN TYP MAX
50,000
±3.0
DS1859
Dual, Temperature-Controlled Resistors with Internally Calibrated Monitors
4 _____________________________________________________________________
PARAMETER
CONDITIONS
UNITS
Fast mode (Note 9) 0 400
SCL Clock Frequency f
SCL
Standard mode (Note 9) 0 100
kHz
Fast mode (Note 9) 1.3
Bus Free Time Between STOP and START Condition
t
BUF
Standard mode (Note 9) 4.7
µs
Fast mode (Notes 9, 10) 0.6
Hold Time (Repeated) START Condition
Standard mode (Notes 9, 10) 4.0
µs
Fast mode (Note 9) 1.3
LOW Period of SCL Clock t
LOW
Standard mode (Note 9) 4.7
µs
Fast mode (Note 9) 0.6
HIGH Period of SCL Clock t
HIGH
Standard mode (Note 9) 4.0
µs
Fast mode (Notes 9, 11, 12) 0 0.9
Data Hold Time
Standard mode (Notes 9, 11, 12) 0
µs
Fast mode (Note 9)
Data Setup Time
Standard mode (Note 9)
ns
Fast mode (Note 9) 0.6
START Setup Time
Standard mode (Note 9) 4.7
µs
Fast mode (Note 13)
300
Rise Time of Both SDA and SCL Signals
t
R
Standard mode (Note 13)
ns
Fast mode (Note 13)
300
Fall Time of Both SDA and SCL Signals
t
F
Standard mode (Note 13)
300
ns
Fast mode 0.6
Setup Time for STOP Condition
Standard mode 4.0
µs
Capacitive Load for Each Bus Line
C
B
(Note 13) 400 pF
EEPROM Write Time t
W
(Note 14) 10 20 ms
AC ELECTRICAL CHARACTERISTICS
(VCC= 2.85V to 5.5V, TA= -40°C to +95°C, unless otherwise noted. See Figure 6.)
Note 1: All voltages are referenced to ground. Note 2: I/O pins of fast-mode devices must not obstruct the SDA and SCL lines if V
CC
is switched off.
Note 3: SDA and SCL are connected to V
CC
and all other input signals are connected to well-defined logic levels.
Note 4: Full Scale is user programmable. The maximum voltage that the MON inputs read is approximately Full Scale, even if the volt-
age on the inputs is greater than Full Scale.
Note 5: This voltage defines the maximum range of the analog-to-digital converter voltage, not the maximum V
CC
voltage.
Note 6: Absolute linearity is the difference of measured value from expected value at DAC position. The expected value is a
straight line from measured minimum position to measured maximum position.
Note 7: Relative linearity is the deviation of an LSB DAC setting change vs. the expected LSB change. The expected LSB change
is the slope of the straight line from measured minimum position to measured maximum position.
Note 8: See the Typical Operating Characteristics. Note 9: A fast-mode device can be used in a standard-mode system, but the requirement t
SU:DAT
> 250ns must then be met. This is automatically the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line t
RMAX
+ t
SU:DAT
= 1000ns + 250ns = 1250ns
before the SCL line is released.
SYMBOL
MIN TYP MAX
t
HD:STA
t
HD:DAT
t
SU:DAT
t
SU:STA
t
SU:STO
100
250
20 + 0.1C
20 + 0.1C
20 + 0.1C
20 + 0.1C
B
B
B
B
1000
DS1859
Dual, Temperature-Controlled Resistors with
Internally Calibrated Monitors
_____________________________________________________________________ 5
Note 10: After this period, the first clock pulse is generated. Note 11: The maximum t
HD:DAT
only has to be met if the device does not stretch the LOW period (t
LOW
) of the SCL signal.
Note 12: A device must internally provide a hold time of at least 300ns for the SDA signal (see the V
IH MIN
of the SCL signal) to
bridge the undefined region of the falling edge of SCL.
Note 13: C
B
—total capacitance of one bus line, timing referenced to 0.9 x VCCand 0.1 x VCC.
Note 14: Guaranteed by design.
Typical Operating Characteristics
(VCC= 5.0V, TA= +25°C, for both 50kΩ and 20kΩ versions, unless otherwise noted.)
TEMPERATURE (°C)
40 60 80200-20
560
600
640
680
720
520
-40 100
SUPPLY CURRENT vs. TEMPERATURE
DS1859 toc01
SUPPLY CURRENT (µA)
SDA = SCL = V
CC
SUPPLY CURRENT vs. VOLTAGE
DS1859 toc02
VOLTAGE (V)
SUPPLY CURRENT (µA)
5.04.54.03.5
450
500
550
600
650
700
400
3.0 5.5
SDA = SCL = V
CC
RESISTANCE vs. SETTING
DS1859 toc03
SETTING (DEC)
RESISTANCE (k)
20015010050
10
20
30
40
50
60
0
0 250
50k VERSION
RESISTANCE vs. SETTING
DS1859 toc04
SETTING (DEC)
RESISTANCE (k)
20015010050
5
10
15
20
0
0 250
20k VERSION
ACTIVE SUPPLY CURRENT
vs. SCL FREQUENCY
DS1859 toc05
SCL FREQUENCY (kHz)
ACTIVE SUPPLY CURRENT (µA)
300200100
600
640
680
720
760
560
0 400
SDA = V
CC
RESISTOR 0 INL (LSB)
DS1859 toc06
SETTING (DEC)
RESISTOR 0 INL (LSB)
225200150 17550 75 100 12525
-0.8
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
0.8
1.0
-1.0 0 250
DS1859
Dual, Temperature-Controlled Resistors with Internally Calibrated Monitors
6 _____________________________________________________________________
Typical Operating Characteristics (continued)
(VCC= 5.0V, TA= +25°C, for both 50kΩ and 20kΩ versions, unless otherwise noted.)
RESISTOR 0 DNL (LSB)
DS1859 toc07
SETTING (DEC)
RESISTOR 0 DNL (LSB)
225200150 17550 75 100 12525
-0.8
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
0.8
1.0
-1.0 0 250
RESISTOR 1 INL (LSB)
DS1859 toc08
SETTING (DEC)
RESISTOR 1 INL (LSB)
225200150 17550 75 100 12525
-0.8
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
0.8
1.0
-1.0 0 250
RESISTOR 1 DNL (LSB)
DS1859 toc09
SETTING (DEC)
RESISTOR 1 DNL (LSB)
225200150 17550 75 100 12525
-0.8
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
0.8
1.0
-1.0 0 250
POSITION 00h RESISTANCE
vs. TEMPERATURE
DS1859 toc12
TEMPERATURE (°C)
RESISTANCE (k)
20 35 50 65 805-10-25
0.96
0.97
0.98
0.99
1.00
0.95
-40 95
50k VERSION
RESISTANCE
vs. POWER-UP VOLTAGE
DS1859 toc11
POWER-UP VOLTAGE (V)
RESISTANCE (k)
2341
30 20
40
50
60
70
80
90
100
110
120
0
10
05
PROGRAMMED RESISTANCE (80h)
>1M 20k VERSION
RESISTANCE
vs. POWER-UP VOLTAGE
DS1859 toc10
POWER-UP VOLTAGE (V)
RESISTANCE (k)
2341
30 20
40
50
60
70
80
90
100
110
120
0
10
05
PROGRAMMED RESISTANCE (80h)
>1M 50k VERSION
DS1859
Dual, Temperature-Controlled Resistors with
Internally Calibrated Monitors
_______________________________________________________________________________________ 7
Typical Operating Characteristics (continued)
(VCC= 5.0V, TA= +25°C, for both 50kΩ and 20kΩ versions, unless otherwise noted.)
POSITION FFh RESISTANCE
vs. TEMPERATURE
DS1859 toc14
TEMPERATURE (°C)
RESISTANCE (k)
80655035205-10-25
51.20
51.40
51.60
51.80
52.00
51.00
-40 95
50k VERSION
POSITION FFh RESISTANCE
vs. TEMPERATURE
DS1859 toc15
TEMPERATURE (°C)
RESISTANCE (k)
80655035205-10-25
19.20
19.40
19.50
19.80
20.00
19.00
-40 95
20k VERSION
TEMPERATURE COEFFICIENT vs. SETTING
DS1859 toc16
SETTING (DEC)
TEMPERATURE COEFFICIENT (ppm/°C)
20015010050
100
50
0
-50
150
200
250
300
350
400
-100 0 250
50k VERSION
+25°C TO +95°C +25°C TO -40°C
TEMPERATURE COEFFICIENT vs. SETTING
DS1859 toc17
SETTING (DEC)
TEMPERATURE COEFFICIENT (ppm/°C)
20015010050
100
0
200
300
400
500
600
700
800
-100 0 250
+25°C TO +95°C +25°C TO -40°C
20k VERSION
LSB ERROR vs. FULL-SCALE INPUT
DS1859 toc18
NORMALIZED FULL SCALE (%)
LSB ERROR
755025
-7
-6
-5
-4
-3
-2
-1
0
1
2
3
4
5
6
-8 0 100
+3 SIGMA
-3 SIGMA
MEAN
LSB ERROR vs. FULL-SCALE INPUT
DS1859 toc19
NORMALIZED FULL SCALE (%)
LSB ERROR
9.3756.2503.125
-3
-2
-1
0
1
2
3
-4 0 12.500
+3 SIGMA
-3 SIGMA
MEAN
POSITION 00h RESISTANCE
vs. TEMPERATURE
DS1859 toc13
TEMPERATURE (°C)
RESISTANCE (k)
80655035205-10-25
0.34
0.35
0.36
0.37
0.38
0.33
-40 95
20k VERSION
DS1859
Dual, Temperature-Controlled Resistors with Internally Calibrated Monitors
8 _____________________________________________________________________
Detailed Description
The user can read the registers that monitor the VCC, MON1, MON2, MON3, and temperature analog signals. After each signal conversion, a corresponding bit is set that can be monitored to verify that a conversion has occurred. The signals also have alarm and warning flags that notify the user when the signals go above or below the user-defined value. Interrupts can also be set for each signal.
The position values of each resistor can be indepen­dently programmed. The user can assign a unique value to each resistor for every 2°C increment over the
-40°C to +102°C range.
Two buffers are provided to convert logic-level inputs into open-drain outputs. Typically, these buffers are used to implement transmit (Tx) fault and loss-of-signal (LOS) functionality. Additionally, OUT1 can be asserted in the event that one or more of the monitored values go beyond user-defined limits.
PIN
FUNCTION
1B2
2-Wire Serial Data I/O Pin. Transfers serial data to and from the device.
2A2SCL 2-Wire Serial Clock Input. Clocks data into and out of the device.
3C3
Open-Drain Buffer Output
4A1IN1 TTL/CMOS-Compatible Input to Buffer
5B1
Open-Drain Buffer Output
6C2IN2 TTL/CMOS-Compatible Input to Buffer
7C1
Write Protect Enable. The device is not write protected if WPEN is connected to ground. This pin has an internal pullup (R
WPEN
). See Table 6.
8D1
Ground
9D3
External Analog Input
10 D4
External Analog Input
11 C4
External Analog Input
12 D2 L0
Low-End Resistor 0 Terminal. It is not required that the low-end terminals be connected to a potential less than the high-end terminals of the corresponding resistor. Voltage applied to any of the resistor terminals cannot exceed the power-supply voltage, V
CC
, or go below ground.
13 B3 H0
High-End Resistor 0 Terminal. It is not required that the high-end terminals be connected to a potential greater than the low-end terminals of the corresponding resistor. Voltage applied to any of the resistor terminals cannot exceed the power-supply voltage, V
CC
, or go below ground.
14 B4 L1 Low-End Resistor 1 Terminal
15 A4 H1 High-End Resistor 1 Terminal
16 A3 V
CC
Supply Voltage
Pin Description
BALL NAME
SDA
OUT1
OUT2
WPEN
GND
MON1
MON2
MON3
DS1859
Dual, Temperature-Controlled Resistors with
Internally Calibrated Monitors
_____________________________________________________________________ 9
DEVICE
ADDRESS
AD (AUXILIARY DEVICE ENABLE A0h)
MD (MAIN DEVICE ENABLE)
DEVICE ADDRESS
ADDRESS
ADDRESS
ADDRESS
R/W
R/W
TxF
DATA BUS
R/W
TxF
RxL
LOS
ADEN ADFIX
SDA
SCL
IN1
OUT1
2-WIRE
INTERFACE
MINT
INV1
Tx FAULT
IN2
MON2
MON1
MON3
V
CC
GND
WPEN
OUT2
INV2
EEPROM
128 x 8 BIT
00h-7Fh
STANDARDS
PROT
AUX
AD
ADDRESS
TABLE
SELECT
R/W
EEPROM
72 x 8 BIT
80h-C7h
TABLE 02
RESISTOR 0
LOOK-UP
TABLE
PROT MAIN
MD
EEPROM
96 x 8 BIT
00h-5Fh
LIMITS
SRAM
32 x 8 BIT
60h-7Fh
NOT PROTECTED
PROT MAIN
MD
TEMP INDEX
ALARM FLAGS
WARNING FLAGS
MUX CTRL
MEASUREMENT
ADDRESS
TABLE
SELECT
R/W
EEPROM
72 x 8 BIT
80h-C7h
TABLE 03
RESISTOR 1
LOOK-UP
TABLE
PROT MAIN
MD
TEMP INDEX
R
WPEN
MONITORS LIMIT
HIGH
MONITORS LIMIT
LOW
TABLE SELECT
TEMP INDEX
MINT (BIT)
INTERNAL
TEMP
V
CC
MUX
ADC
12-BIT
INTERNAL
CALIBRATION
A/D
CTRL
V
CC
V
CC
PROT AUX
PROT MAIN
MPEN
APEN
COMPARATOR
MEASUREMENT
ALARM FLAGS
WARNING FLAGS
MONITORS LIMIT LOW
MONITORS LIMIT HIGH
COMP CTRL
INTERRUPT
MINT
TABLE 01
EEPROM
16 x 8 BIT
80h-8Fh
VENDOR
PROT MAIN
MD R/W
DEVICE ADDRESS
ADDRESS
TABLE SELECT
MASKING (TMP, V
CC
, MON1, MON2, MON3)
ADFIX (BIT)
ADEN (BIT)
MPEN (BIT)
APEN (BIT)
INV2 (BIT)
INV1 (BIT)
RESISTOR 0 50k OR 20kFULL SCALE 256 POSITIONS
L0
H0
REGISTERREGISTER
RESISTOR 1 50k OR 20kFULL SCALE 256 POSITIONS
L1
H1
RIGHT
SHIFTING
DS1859
Figure 1. Block Diagram
DS1859
Dual, Temperature-Controlled Resistors with Internally Calibrated Monitors
10 ____________________________________________________________________
Monitored Signals
Each signal (VCC, MON1, MON2, MON3, and tempera­ture) is available as a 16-bit value with 12-bit accuracy (left-justified) over the serial bus. See Table 1 for signal scales and Table 2 for signal format. The four LSBs should be masked when calculating the value.
For the 20kversion, the 3 LSBs are internally masked with 0s.
The signals are updated every frame rate (t
frame
) in a
round-robin fashion.
The comparison of all five signals with the high and low user-defined values are done automatically. The corre­sponding flags are set to 1 within a specified time of the occurrence of an out-of-limit condition.
Calculating Signal Values
The LSB = 100µV for VCC, and the LSB = 38.147µV for the MON signals when using factory default settings.
To calculate VCC, convert the unsigned 16-bit value to decimal and multiply by 100µV.
To calculate MON1, MON2, or MON3, convert the unsigned 16-bit value to decimal and multiply by
38.147µV.
To calculate the temperature, treat the two’s comple­ment value binary number as an unsigned binary num­ber, then convert to decimal and divide by 256. If the result is greater than or equal to 128, subtract 256 from the result.
Temperature: high byte: -128°C to +127°C signed; low byte: 1/256°C.
SIGNAL
+FS
+FS
-FS
-FS
(hex)
Temperature
-128°C 8000
V
CC
0V 0000
MON1
0V 0000
MON2
0V 0000
MON3
0V 0000
Table 1. Scales for Monitor Channels at Factory Setting
SIGNAL FORMAT
V
CC
Unsigned
MON1 Unsigned
MON2 Unsigned
MON3 Unsigned
Temperature Two’s complement
Table 2. Signal Comparison
TEMPERATURE
(°C)
CORRESPONDING LOOK-UP
TABLE ADDRESS
<-40 80h
-40 80h
-38 81h
-36 82h
-34 83h
——
+98 C5h
+100 C6h
+102 C7h
>+102 C7h
Table 3. Look-up Table Address for Corresponding Temperature Values
2
8
2
0
Monitor/VCCBit Weights
Temperature Bit Weights
Monitor Conversion Example
VCCConversion Examples
Temperature Conversion Examples
SIGNAL
127.984°C 7FFC
6.5528V FFF8
2.4997V FFF8
2.4997V FFF8
2.4997V FFF8
(hex)
SIGNAL
MSB (BIN) LSB (BIN) VOLTAGE (V)
11000000 00000000 1.875
10000000 10000000 1.255
S262
-1
2
-2
2
5
4
2
-3
2
-4
2
3
2
-5
2
2
2
-6
2
1
2
-7
2
0
2
-8
2
MSB 2
LSB 2
15214213212211210
7
MSB (BIN) LSB (BIN) VOLTAGE (V)
10000000 10000000 3.29
11000000 11111000 4.94
6
2
5
2
9
2
4
3
2
2
2
2
1
2
MSB (BIN) LSB (BIN) TEMPERATURE (°C)
01000000 00000000 64
01000000 00001111 64.059
01011111 00000000 95
11110110 00000000 -10
11011000 00000000 -40
DS1859
Dual, Temperature-Controlled Resistors with
Internally Calibrated Monitors
____________________________________________________________________ 11
Variable Resistors
The value of each variable resistor is determined by a temperature-addressed look-up table, which can assign a unique value (00h to FFh) to each resistor for every 2°C increment over the -40°C to +102°C range (see Table 3). See the Temperature Conversion section for more information.
The variable resistors can also be used in manual mode. If the TEN bit equals 0, the resistors are in manu­al mode and the temperature indexing is disabled. The user sets the resistors in manual mode by writing to addresses 82h and 83h in Table 01 to control resistors 0 and 1, respectively.
Memory Description
Main and auxiliary memories can be accessed by two separate device addresses. The Main Device address is A2h (or value in Table 01 byte 8Ch, when ADFIX = 1) and the Auxiliary Device address is A0h. A user option is provided to respond to one or two device addresses. This feature can be used to save component count in SFF applications (Main Device address can be used) or other applications where both GBIC (Auxiliary Device address can be used) and monitoring functions are implemented and two device addresses are need­ed. The memory blocks are enabled with the corre­sponding device address. Memory space from 80h and
ADEN
(ADDRESS
ENABLE)
NO. OF SEPARATE
DEVICE
ADDRESSES
ADDITIONAL
INFORMATION
02See Figure 2
1
See Figure 3
Table 4. ADEN Address Configuration
ADEN ADFIX
AUXILIARY
MAIN ADDRESS
00A0h A2h
01A0h
EEPROM
(Table 01, 8Ch)
10N/A A2h
11N/A
EEPROM
(Table 01, 8Ch)
Table 5. ADEN and ADFIX Bits
MAIN
DEVICE
MON LOOK-UP
TABLE CONTROL
R0 LOOK-UP
TABLE
AUXILIARY
DEVICE
0
DEC
0
95 96
127 128
143
199
MEMORY PARTITION WITH ADEN BIT = 0
EN
EN
EN
5Fh
60h
EN
SEL
EN
SEL
7Fh 7Fh
80h
80h
C7h
F0h
FFh
RESERVED
8Fh
TABLE SELECT
MAIN DEVICE ENABLE
AUXILIARY DEVICE ENABLE
DECODER
0
F0h
FFh
RESERVED
R1 LOOK-UP
TABLE
EN
SEL
80h
C7h
TABLE 03TABLE 02TABLE 01
Figure 2. Memory Organization, ADEN = 0
1 (Main Device only)
ADDRESS
DS1859
Dual, Temperature-Controlled Resistors with Internally Calibrated Monitors
12 ____________________________________________________________________
above is accessible only through the Main Device address. This memory is organized as three tables. The desired table can be selected by the contents of mem­ory location 7Fh, Main Device. The Auxiliary Device address has no access to the tables, but the Auxiliary Device address can be mapped into the Main Device’s memory space as a fourth table. Device addresses are programmable with two control bits in EEPROM.
ADEN configures memory access to respond to differ­ent device addresses (see Tables 4 and 5).
The default device address for EEPROM-generated addresses is A2h.
If the ADEN bit is 1, additional 128 bytes of EEPROM are accessible through the Main Device, selected as Table 00 (see Figure 3). In this configuration, the Auxiliary Device is not accessible. APEN controls the protection of Table 00 regardless of ADEN’s setting.
ADFIX (address fixed) determines whether the Main Device address is determined by an EEPROM byte (Table 01, byte 8Ch, when ADFIX = 1). There can be up to 128 devices sharing a common 2-wire bus, with each device having its own unique device address.
WPEN
MPEN PROTECT MAIN
0X No
X0 No
11 Yes
Table 6. Main Device
APEN
WPEN PROTECT AUXILIARY
0
XNo
1
X Yes
Table 7. Auxiliary Device
MAIN
DEVICE
MON LOOK-UP
TABLE CONTROL
R0 LOOK-UP
TABLE
AUXILIARY
DEVICE
80h
DEC
0
95 96
127 128
143
199
255
EN
EN
EN
5Fh
60h
EN
SEL
EN
SEL
FFh
7Fh
80h
80h
C7h
F0h
FFh
RESERVED
8Fh
TABLE SELECT
TABLE 00
MAIN DEVICE ENABLE
DECODER
0
F0h
FFh
RESERVED
R1 LOOK-UP
TABLE
EN
SEL
80h
C7h
TABLE 03TABLE 02TABLE 01
MEMORY PARTITION WITH ADEN BIT = 1
Figure 3. Memory Organization, ADEN = 1
DS1859
Dual, Temperature-Controlled Resistors with
Internally Calibrated Monitors
____________________________________________________________________ 13
MEMORY LOCATION
(hex)
EEPROM/SRAM
R/W
DEFAULT SETTING
(hex)
NAME OF LOCATION FUNCTION
00 to 7F EEPROM
00 Standards Data
Auxiliary Device
MEMORY
LOCATION
(hex)
EEPROM/
SRAM
DEFAULT
(hex)
FUNCTION
00 to 01 EEPROM
00
Contains upper limit settings for temperature. If the limit is violated, an alarm flag in Main Device byte 70h is set.
02 to 03 EEPROM
00
Contains lower limit settings for temperature. If the limit is violated, an alarm flag in Main Device byte 70h is set.
04 to 05 EEPROM
00
Contains upper limit settings for temperature. If the limit is violated, a warning flag in Main Device byte 74h is set.
06 to 07 EEPROM
00
Contains lower limit settings for temperature. If the limit is violated, a warning flag in Main Device byte 74h is set.
08 to 09 EEPROM
00
Contains upper limit settings for VCC. If the limit is violated, an alarm flag in Main Device byte 70h is set.
0A to 0B EEPROM
00
Contains lower limit settings for VCC. If the limit is violated, an alarm flag in Main Device byte 70h is set.
0C to 0D EEPROM
00
Contains upper limit settings for VCC. If the limit is violated, a warning flag in Main Device byte 74h is set.
0E to 0F EEPROM
00
Contains lower limit settings for VCC. If the limit is violated, a warning flag in Main Device byte 74h is set.
10 to 11 EEPROM
00
Contains upper limit settings for MON1. If the limit is violated, an alarm flag in Main Device byte 70h is set.
Main Device
Note: SRAM defaults are power-on defaults. EEPROM defaults are factory defaults.
Register Map
A description of the registers is below. The registers are read only (R) or read/write (R/W). The R/W registers are writable only if write protect has not been asserted (see the Memory Description section).
Bytes designated as "Reserved" have been set aside for added functionality in future revisions of this device.
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
SETTING
NAME OF LOCATION
TMPlimhi (MSB to LSB)
TMPlimlo (MSB to LSB)
TMPwrnhi (MSB to LSB)
TMPwrnlo (MSB to LSB)
VCClimhi (MSB to LSB)
VCClimlo (MSB to LSB)
VCCwrnhi (MSB to LSB)
VCCwrnlo (MSB to LSB)
MON1limhi (MSB to LSB)
DS1859
Dual, Temperature-Controlled Resistors with Internally Calibrated Monitors
14 ____________________________________________________________________
MEMORY
LOCATION
(hex)
EEPROM/
SRAM
R/W
DEFAULT
(hex)
NAME OF LOCATION
FUNCTION
12 to 13 EEPROM
00
Contains lower limit settings for MON1. If the limit is violated, an alarm flag in Main Device byte 70h is set.
14 to 15 EEPROM
00
MON1wrnhi
(MSB to LSB)
Contains upper limit settings for MON1. If the limit is violated, a warning flag in Main Device byte 74h is set.
16 to 17 EEPROM
00
MON1wrnlo
(MSB to LSB)
Contains lower limit settings for MON1. If the limit is violated, a warning flag in Main Device byte 74h is set.
18 to 19 EEPROM
00
Contains upper limit settings for MON2. If the limit is violated, an alarm flag in Main Device byte 70h is set.
1A to 1B EEPROM
00
Contains lower limit settings for MON2. If the limit is violated, an alarm flag in Main Device byte 70h is set.
1C to 1D EEPROM
00
MON2wrnhi
(MSB to LSB)
Contains upper limit settings for MON2. If the limit is violated, a warning flag in Main Device byte 74h is set.
1E to 1F EEPROM
00
MON2wrnlo
(MSB to LSB)
Contains lower limit settings for MON2. If the limit is violated, a warning flag in Main Device byte 74h is set.
20 to 21 EEPROM
00
Contains upper limit settings for MON3. If the limit is violated, an alarm flag in Main Device byte 71h is set.
22 to 23 EEPROM
00
Contains lower limit settings for MON3. If the limit is violated, an alarm flag in Main Device byte 71h is set.
24 to 25 EEPROM
00
MON3wrnhi
(MSB to LSB)
Contains upper limit settings for MON3. If the limit is violated, a warning flag in Main Device byte 75h is set.
26 to 27 EEPROM
00
MON3wrnlo
(MSB to LSB)
Contains lower limit settings for MON3. If the limit is violated, a warning flag in Main Device byte 75h is set.
28 to 37 EEPROM Reserved
38 to 5F EEPROM
Memory
60 to 61 SRAM R
Measured TMP
(MSB to LSB)
Digitized measured value for temperature. See Table 1.
62 to 63 SRAM R
Measured V
CC
(MSB to LSB)
Digitized measured value for V
CC
.
See Table 1.
64 to 65 SRAM R
Measured MON1
(MSB to LSB)
Digitized measured value for MON1. See Table 1.
66 to 67 SRAM R
Measured MON2
(MSB to LSB)
Digitized measured value for MON2. See Table 1.
Main Device (continued)
SETTING
R/W
MON1limlo (MSB to LSB)
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
MON2limhi (MSB to LSB)
MON2limlo (MSB to LSB)
MON3limhi (MSB to LSB)
MON3limlo (MSB to LSB)
DS1859
Dual, Temperature-Controlled Resistors with
Internally Calibrated Monitors
____________________________________________________________________ 15
MEMORY
LOCATION
(hex)
EEPROM/
SRAM
DEFAULT
(hex)
FUNCTION
68 to 69 SRAM R
Measured MON3
(MSB to LSB)
Digitized measured value for MON3. See Table 1.
6A to 6D SRAM Reserved
6E SRAM Logic states
Bit 7 R X HIZSTA
Resistor status bit. A high indicates that both resistors are in high-impedance mode. A low indicates that both resistors are operating normally.
6—
0 HIZCO
Resistor control bit. Setting this bit high causes both resistors to go into a high­impedance state.
5—X X
4—X X
3—X X
2—RX TXF
This status bit is high when OUT1 is high, assuming there is an external pullup resistor on OUT1.
1—RX RXL
This status bit is high when OUT2 is high, assuming there is an external pullup resistor on OUT2.
0—RX RDYB
This status bit goes high when V
CC
has fallen
below the POA level.
6F SRAM Conversion updates
Bit 7
0 TAU
This bit goes high after a temperature and address update has occurred for the corresponding measurement in bytes 60h to 61h. This bit can be written to a 0 by the user and monitored to verify that a conversion has occurred.
6—
0V
CC
U
This bit goes high after a V
CC
update has occurred for the corresponding measurement in bytes 62h to 63h. This bit can be written to a 0 by the user and monitored to verify that a conversion has occurred.
5—
0 MON1U
This bit goes high after a MON1 update has occurred for the corresponding measurement in bytes 64h to 65h. This bit can be written to a 0 by the user and monitored to verify that a conversion has occurred.
Main Device (continued)
R/W
R/W
R/W
SETTING
NAME OF LOCATION
R/W
R/W
DS1859
Dual, Temperature-Controlled Resistors with Internally Calibrated Monitors
16 ____________________________________________________________________
MEMORY
LOCATION
(hex)
EEPROM/
SRAM
R/W
DEFAULT
(hex)
NAME OF LOCATION
FUNCTION
4—
0 MON2U
This bit goes high after a MON2 update has occurred for the corresponding measurement in bytes 66h to 67h. This bit can be written to a 0 by the user and monitored to verify that a conversion has occurred.
3——0 MON3U
This bit goes high after a MON3 update has occurred for the corresponding measurement in bytes 68h to 69h. This bit can be written to a 0 by the user and monitored to verify that a conversion has occurred.
2—0
1—0
0—0
70 SRAM R Alarm flags
Bit 7 TMPhi
This alarm flag goes high when the upper limit of the temperature setting is violated.
6——— TMPlo
This alarm flag goes high when the lower limit of the temperature setting is violated.
5—— V
CC
hi
This alarm flag goes high when the upper limit of the V
CC
setting is violated.
4—— V
CC
lo
This alarm flag goes high when the lower limit of the V
CC
setting is violated.
3——— MON1hi
This alarm flag goes high when the upper limit of the MON1 setting is violated.
2——— MON1lo
This alarm flag goes high when the lower limit of the MON1 setting is violated.
1——— MON2hi
This alarm flag goes high when the upper limit of the MON2 setting is violated.
0——— MON2lo
This alarm flag goes high when the lower limit of the MON2 setting is violated.
71 SRAM R Alarm flags
Bit 7 MON3hi
This alarm flag goes high when the upper limit of the MON3 setting is violated.
6——— MON3lo
This alarm flag goes high when the lower limit of the MON3 setting is violated.
5— X
4— X
Main Device (continued)
SETTING
R/W
DS1859
Dual, Temperature-Controlled Resistors with
Internally Calibrated Monitors
____________________________________________________________________ 17
MEMORY
LOCATION
(hex)
EEPROM/
SRAM
R/W
DEFAULT
(hex)
NAME OF LOCATION
FUNCTION
3— X
2— X
1— X
0——— MINT
A mask of all flags located in Table 01 byte 88h determines the value of MINT. MINT is maskable to 0 if no interrupt is desired by setting Table 01 byte 88h to 0.
72 to 73 SRAM Reserved
74 SRAM R Warning flags
Bit 7 TMPhi
This warning flag goes high when the upper limit of the temperature setting is violated.
6——— TMPlo
This warning flag goes high when the lower limit of the temperature setting is violated.
5—— V
CC
hi
This warning flag goes high when the upper limit of the V
CC
setting is violated.
4—— V
CC
lo
This warning flag goes high when the lower limit of the V
CC
setting is violated.
3——— MON1hi
This warning flag goes high when the upper limit of the MON1 setting is violated.
2——— MON1lo
This warning flag goes high when the lower limit of the MON1 setting is violated.
1——— MON2hi
This warning flag goes high when the upper limit of the MON2 setting is violated.
0——— MON2lo
This warning flag goes high when the lower limit of the MON2 setting is violated.
Main Device (continued)
SETTING
DS1859
Dual, Temperature-Controlled Resistors with Internally Calibrated Monitors
18 ____________________________________________________________________
MEMORY
LOCATION
(hex)
EEPROM/
SRAM
R/W
DEFAULT
(hex)
NAME OF LOCATION
FUNCTION
75 SRAM R Warning Flags
Bit 7 0 MON3hi
This warning flag goes high when the upper limit of the MON3 setting is violated.
6——0 MON3lo
This warning flag goes high when the lower limit of the MON3 setting is violated.
5—0 X
4—0 X
3—0 X
2—0 X
1—0 X
76 to 7E SRAM Reserved
7F SRAM
Table select
Bit 7 0 X
6—0 X
5—0 X
4—0 X
3—0 X
2—0 X
1—0
0—0
Table select bits
Set bits = 00 to select Table 00, set bits = 01 to select Table 01, set bits = 10 to select Table 02, set bits = 11 to select Table 03.
Main Device (continued)
SETTING
R/W
DS1859
Dual, Temperature-Controlled Resistors with
Internally Calibrated Monitors
____________________________________________________________________ 19
MEMORY
LOCATION
(hex)
EEPROM/
SRAM
R/W
DEFAULT
SETTING
(hex)
NAME OF
LOCATION
FUNCTION
80 SRAM R/W Mode
Bit 7 0 X
6——0 X
5——0 X
4——0 X
3——0 X
2——0 X
1——1 TEN
If TEN = 0, the resistors can be controlled manually. The user sets the resistor in manual mode by writing to addresses 82h and 83h in Table 01 to control resistors 0 and 1, respectively.
0——1 AEN
AEN = 0 is a test mode setting and provides manual
control of the temperature index (Table 01, address 81h).
81 SRAM R
Temperature
index
This byte is the temperature-calculated index used to select the address of resistor settings in the look-up tables (Tables 02 and 03, addresses 80h through C7h).
82 SRAM R/W FF Resistor 0 Resistor 0 position values from 00h to FFh.
83 SRAM R/W FF Resistor 1 Resistor 1 position values from 00h to FFh.
84 to 87 SRAM Reserved
88
R/W
This byte configures a maskable interrupt, determining which event asserts a buffer 1 output (MINT set to 1, see register 89h in Table 01). If any combination of temperature, V
CC
, MON1, MON2, or MON3 is desired to generate an interrupt, the corresponding bits are set to 1. If interrupt generation is not desired, set all bits to 0.
Bit 7 1 TMP
6——1 V
CC
5——1 MON1
4——1 MON2
3——1 MON3
2——0 X
1——0 X
0——0 X
89
R/W Configuration
Bit 7 0 X
6——0 X
Table 01h
EEPROM
EEPROM
Interrupt enable
DS1859
Dual, Temperature-Controlled Resistors with Internally Calibrated Monitors
20 ____________________________________________________________________
MEMORY
LOCATION
(hex)
EEPROM/
SRAM
R/W
DEFAULT
SETTING
(hex)
NAME OF
LOCATION
FUNCTION
5——0 ADEN
Controls if the device responds to one or two device addresses (see the Memory Description section and Table 5).
4——0 ADFIX
Controls the means by which Main and Auxiliary Device addresses are set (see the Memory Description section and Table 5).
3——0 APEN
Controls auxiliary write protect. See the Memory Description section.
2——0 MPEN
Controls main write protect. See the Memory Description section.
1——0 INV1
Configures buffer 1 with OUT1 = MINT + (INV1 [XOR] IN1).
0——0 INV2 Configures buffer 2 with OUT2 = INV2 [XOR] IN2.
8A to 8B
—— Reserved
8C
R/W A2
Contains Main Device address if the bit ADFIX = 1. If ADFIX = 0, then address A2h is used.
8D
—— Reserved
8E
R/W
Contains bits used to perform right shift operations on the A/D output converter. See the Right Shift A/D Conversion Result section.
7——0
6——0 MON1
2
Right Shift Control MSB
5——0 MON1
1
4——0 MON1
0
Right Shift Control LSB
3——0
2——0 MON2
2
Right Shift Control MSB
1——0 MON2
1
0——0 MON2
0
Right Shift Control LSB
8F
R/W
Contains bits used to perform right shift operations on the A/D output converter. See the Right Shift A/D Conversion Result section.
7——0
6——0 MON3
2
Right Shift Control MSB
5——0 MON3
1
4——0 MON3
0
Right Shift Control LSB
3——0
2——0
1——0
0——0
Table 01h (continued)
EEPROM
EEPROM
EEPROM
EEPROM
EEPROM
Device address
DS1859
Dual, Temperature-Controlled Resistors with
Internally Calibrated Monitors
____________________________________________________________________ 21
MEMORY
LOCATION
(hex)
EEPROM/
SRAM
R/W
DEFAULT SETTING
(hex)
NAME OF
LOCATION
FUNCTION
90 to 91
—0 Reserved
92 to 93
R/W Gain Cal V
CC
Gain registers for internal calibration. See the Internal Calibration section.
94 to 95
R/W
96 to 97
R/W
98 to 99
R/W
9A to 9F
Reserved
A0 to A1
Reserved
A2 to A3
R/W
Offset registers for internal calibration. See the Internal Calibration section.
A4 to A5
R/W
A6 to A7
R/W
A8 to A9
R/W
AA to AD
Reserved
AE to AF
R/W
Factory
Offset calibration for temperature calibrated at factory.
Table 01h (continued)
MEMORY
LOCATION
(hex)
EEPROM/
SRAM
R/W
DEFAULT
SETTING
(hex)
NAME OF LOCATION FUNCTION
80 to C7
R/W FF Resistor 0 Temp LUT Look-up table for Resistor 0.
F0 to F7
—— Reserved
F8 to FF
R
Factory
Resistor 0 Cal Constants
Calibration constants for Resistor 0. (See Table 8)
Table 02h
MEMORY
LOCATION
(hex)
EEPROM/
SRAM
R/W
DEFAULT
SETTING
(hex)
NAME OF LOCATION FUNCTION
80 to C7
R/W FF Resistor 1 Temp LUT Look-up table for Resistor 1.
F0 to F7
—— Reserved
F8 to FF
R
Factory
Resistor 1 Cal Constants
Calibration constants for Resistor 1. (See Table 8)
Table 03h
EEPROM
EEPROM
EEPROM
EEPROM
EEPROM
EEPROM
EEPROM
EEPROM
EEPROM
EEPROM
EEPROM
EEPROM
EEPROM
EEPROM
EEPROM
Programmed
Gain Cal Mon1
Gain Cal Mon2
Gain Cal Mon3
Offset Cal V
Offset Cal Mon1
Offset Cal Mon2
Offset Cal Mon3
Offset Cal Tmp
CC
EEPROM
EEPROM
EEPROM
EEPROM
Programmed
Programmed
DS1859
Dual, Temperature-Controlled Resistors with Internally Calibrated Monitors
22 ____________________________________________________________________
Programming the Look-up Table (LUT)
The following equation can be used to determine which resistor position setting, 00h to FFh, should be written in the LUT to achieve a given resistance at a specific tem­perature.
α = 3.852357 for the 20kresistor α = 4.5680475 for the 50kresistor
R = the resistance desired at the output terminal C = temperature in degrees Celsius u, v, w, x
1
, x0, y, and z are calculated values found in the corresponding look-up tables. The variable x from the equation above is separated into x1(the MSB of x) and x
0
(the LSB of x). Their addresses and LSB values are given below. Resistor 0 variables are found in Table 1, and Resistor 1 variables are found in Table 2.
When shipped from the factory, all other memory loca­tions in the LUTs are programmed to FFh.
Table 8. Calibration Constants
Internal Calibration
The DS1859 has two methods for scaling an analog input to a digital result. The two methods are gain and offset. Each of the inputs (V
CC
, MON1, MON2, and MON3) has a unique register for the gain and the offset found in Table 01h, 92h to 99h, and A2h to A9h.
To scale the gain and offset of the converter for a spe­cific input, you must first know the relationship between the analog input and the expected digital result. The input that would produce a digital result of all zeros is the null value (normally this input is GND). The input that would produce a digital result of all ones is the full­scale (FS) value. The FS value is also found by multiply­ing an all-ones digital answer by the weighted LSB (e.g., since the digital reading is a 16-bit register, let us
assume that the LSB of the lowest weighted bit is 50µV, then the FS value is 65,535 x 50µV = 3.27675V).
A binary search is used to scale the gain of the con­verter. This requires forcing two known voltages to the input pin. It is preferred that one of the forced voltages is the null input and the other is 90% of FS. Since the LSB of the least significant bit in the digital reading reg­ister is known, the expected digital results are also known for both inputs (null/LSB = CNT1 and 90%FS/ LSB = CNT2).
The user might not directly force a voltage on the input. Instead they have a circuit that transforms light, fre­quency, power, or current to a voltage that is the input to the DS1859. In this situation, the user does not need to know the relationship of voltage to expected digital result but instead knows the relationship of light, fre­quency, power, or current to the expected digital result.
pos R C
Ru v C w C
xyC zC
α, α,
••
••
()
=
−+ −
()
+−
()
 
 
()
+−
()
+−
()
 
 
125 25
125 25
2
2
M6
M5
M4
M3
M2
M1
246810 12
TEMPERATURE (°C)
MEMORY LOCATION
INCREASING
TEMPERATURE
DECREASING
TEMPERATURE
Figure 4. Look-Up Table Hysteresis
ADDRESS (Hex)
VARIABLE LSB
F8 u 2
0
F9 v 20E-6
FA w 100E-9
FB x
1
2
1
FC x
0
2
-7
FD y 2E-6 (signed)
FE z 10E-9
FF Reserved
DS1859
Dual, Temperature-Controlled Resistors with
Internally Calibrated Monitors
____________________________________________________________________ 23
An explanation of the binary search used to scale the gain is best served with the following example pseudo­code:
/* Assume that the Null input is 0.5V. */
/* In addition, the requirement for LSB is 50µV. */
FS = 65535 x 50E-6; /* 3.27675 */
CNT1 = 0.5 / 50E-6; /* 10000 */
CNT2 = 0.90 x FS / 50E-6; /* 58981.5 */
/* Thus the null input 0.5V and the 90% of FS input is
2.949075V. */
Set the trim-offset-register to zero;
Set Right-Shift register to zero (typically zero.
See Right-Shifting section);
gain_result = 0h;
Clamp = FFF8h/2^(Right_Shift_Register);
For n = 15 down to 0
begin
gain_result = gain_result + 2^n;
Force the 90% FS input (2.949075V);
Meas2 = read the digital result from the part;
If Meas2 >= Clamp then
gain_result = gain_result – 2^n;
Else
Force the null input (0.5V);
Meas1 = read the digital result from the part;
if (Meas2 – Meas1) > (CNT2 – CNT1) then
gain_result = gain_result – 2^n;
end;
Set the gain register to gain_result;
The gain register is now set and the resolution of the conversion will best match the expected LSB. The next step is to calibrate the offset of the DS1859. With the correct gain value written to the gain register, again force the null input to the pin. Read the digital result from the part (Meas1). The offset value is equal to the negative value of Meas1.
The calculated offset is now written to the DS1859 and the gain and offset scaling is now complete.
Right-Shifting A/D Conversion Result
(Scalable Dynamic Ranging)
The right-shifting method is used to regain some of the lost ADC range of a calibrated system. If a system is calibrated such that the maximum expected input results in a digital output value of less than 7FFFh (1/2 FS), then it is a candidate for using the right-shifting method.
If the maximum desired digital output is less than 7FFFh, then the calibrated system is using less than 1/2 of the ADC’s range. Similarly, if the maximum desired digital output is less than 1FFFh, then the calibrated system is only using 1/8 of the ADC’s range. For example, if using a zero for the right-shift during internal calibration and the maximum expected input results in a maximum digi­tal output less than 1FFCh, only 1/8 of the ADC’s range is used. If left like this, the three MS bits of the ADC will never be used. In this example, a value of 3 for the right­shifting will maximize the ADC range. No resolution is lost since this is a 12-bit converter that is left justified. The value can be right-shifted four times without losing resolution. Table 9 shows when the right-shifting method can be used.
Memory Protection
Memory access from either device address can be either read/write or read only. Write protection is accomplished by a combination of control bits in EEPROM (APEN and MPEN in configuration register 89h) and a write-protect enable (WPEN) pin. Since the WPEN pin is often not accessible from outside the mod­ule, this scheme effectively allows the module to be locked by the manufacturer to prevent accidental writes by the end user.
Separate write protection is provided for the Auxiliary and Main Device address through distinct bits APEN and MPEN. APEN and MPEN are bits from configura­tion register 89h, Table 01. Due to the location, the APEN and MPEN bits can only be written through the
Offset gister h
Meas
XOR h_Re =−
 
 
[]
4000
1
2
4000
OUTPUT RANGE USED
WITH ZERO RIGHT-SHIFTS
NUMBER OF
RIGHT-SHIFTS NEEDED
0h .. FFFFh 0
0h .. 7FFFh 1
0h .. 3FFFh 2
0h .. 1FFFh 3
0h .. 0FFFh 4
Table 9. Right Shifting
DS1859
Dual, Temperature-Controlled Resistors with Internally Calibrated Monitors
24 ____________________________________________________________________
Main Device address. The control of write privileges through the Auxiliary Device address depends on the value of APEN. Care should be taken with the setting of MPEN, once set to a 1, assuming WPEN is high. Access through the Main Device is thereafter denied unless WPEN is taken to a low level. By this means, inadvertent end-user write access can be denied.
Main Device address space 60h to 7Fh is SRAM and is not write protected by APEN, MPEN, or WPEN. For example, the user may reset flags set by the device. Note that in single device mode (ADEN bit = 1), APEN determines the protection level of Table 00, indepen­dent of WPEN.
The write-protect operation, for both Main and Auxiliary Devices, is summarized in Tables 6 and 7.
Temperature Conversion
The direct-to-digital temperature sensor measures tem­perature through the use of an on-chip temperature measurement technique with an operating range from
-40°C to +102°C. Temperature conversions are initiated upon power-up, and the most recent conversion is stored in memory locations 60h and 61h of the Main Device, which are updated every t
frame
. Temperature conversions do not occur during an active read or write to memory.
The value of each resistor is determined by the tempera­ture-addressed look-up table. The look-up table assigns a unique value to each resistor for every 2°C increment with a 1°C hysteresis at a temperature transition over the operating temperature range (see Figure 4).
Power-Up and Low-Voltage Operation
During power-up, the device is inactive until V
CC
exceeds the digital power-on-reset voltage (POD). At this voltage, the digital circuitry, which includes the 2-wire interface, becomes functional. However, EEPROM­backed registers/settings cannot be internally read (recalled into shadow SRAM) until VCCexceeds the ana­log power-on-reset voltage (POA), at which time the remainder of the device becomes fully functional. Once VCCexceeds POA, the RDYB bit in byte 6Eh of the Main Device memory is timed to go from a 1 to a 0 and indi­cates when analog-to-digital conversions begin. If V
CC
ever dips below POA, the RDYB bit reads as a 1 again. Once a device exceeds POA and the EEPROM is recalled, the values remain active (recalled) until VCCfalls below POD.
For 2-wire device addresses sourced from EEPROM (ADFIX = 1), the device address defaults to A2h until V
CC
exceeds POA and the EEPROM values are recalled. The Auxiliary Device (A0h) is always available within this volt-
age window (between POD and the EEPROM recall) regardless of the programmed state of ADEN.
Furthermore, as the device powers up, the V
CC
lo alarm flag (bit 4 of 70h in Main Device) defaults to a 1 until the first VCCanalog-to-digital conversion occurs and sets or clears the flag accordingly.
2-Wire Operation
Clock and Data Transitions: The SDA pin is normally pulled high with an external resistor or device. Data on the SDA pin may only change during SCL-low time periods. Data changes during SCL-high periods will indicate a START or STOP condition depending on the conditions discussed below. See the timing diagrams in Figures 5 and 6 for further details.
START Condition: A high-to-low transition of SDA with SCL high is a START condition that must precede any other command. See the timing diagrams in Figures 5 and 6 for further details.
STOP Condition: A low-to-high transition of SDA with SCL high is a STOP condition. After a read or write sequence, the stop command places the DS1859 into a low-power mode. See the timing diagrams in Figures 5 and 6 for further details.
Acknowledge: All address and data bytes are trans­mitted through a serial protocol. The DS1859 pulls the SDA line low during the ninth clock pulse to acknowl­edge that it has received each word.
Standby Mode: The DS1859 features a low-power mode that is automatically enabled after power-on, after a STOP command, and after the completion of all internal operations.
Device Addressing: The DS1859 must receive an 8-bit device address following a START condition to enable a specific device for a read or write operation. The address is clocked into this part MSB to LSB. The address byte consists of either A2h or the value in Table 01 8Ch for the Main Device or A0h for the Auxiliary Device, then the R/W bit. This byte must
match the address programmed into Table 01 8Ch or A0h (for the Auxiliary Device). If a device address match occurs, this part will output a zero for one clock cycle as an acknowledge and the corresponding block of memory is enabled (see the Memory Organization section). If the R/W bit is high, a read operation is initi­ated. If the R/W is low, a write operation is initiated (see the Memory Organization section). If the address does not match, this part returns to a low-power mode.
DS1859
Dual, Temperature-Controlled Resistors with
Internally Calibrated Monitors
____________________________________________________________________ 25
Write Operations
After receiving a matching address byte with the R/W bit set low, if there is no write protect, the device goes into the write mode of operation (see the Memory Organization section). The master must transmit an 8­bit EEPROM memory address to the device to define the address where the data is to be written. After the byte has been received, the DS1859 transmits a zero for one clock cycle to acknowledge the address has been received. The master must then transmit an 8-bit data word to be written into this address. The DS1859 again transmits a zero for one clock cycle to acknowl­edge the receipt of the data. At this point, the master must terminate the write operation with a STOP condi­tion. The DS1859 then enters an internally timed write process twto the EEPROM memory. All inputs are dis­abled during this byte write cycle.
Page Write
The DS1859 is capable of an 8-byte page write. A page is any 8-byte block of memory starting with an address evenly divisible by eight and ending with the starting address plus seven. For example, addresses 00h through 07h constitute one page. Other pages would be addresses 08h through 0Fh, 10h through 17h, 18h through 1Fh, etc.
A page write is initiated the same way as a byte write, but the master does not send a STOP condition after the first byte. Instead, after the slave acknowledges the data byte has been received, the master can send up to seven more bytes using the same nine-clock
sequence. The master must terminate the write cycle with a STOP condition or the data clocked into the DS1859 will not be latched into permanent memory.
The address counter rolls on a page during a write. The counter does not count through the entire address space as during a read. For example, if the starting address is 06h and 4 bytes are written, the first byte goes into address 06h. The second goes into address 07h. The third goes into address 00h (not 08h). The fourth goes into address 01h. If more than 9 bytes or more are written before a STOP condition is sent, the first bytes sent are overwritten. Only the last 8 bytes of data are written to the page.
Acknowledge Polling: Once the internally timed write has started and the DS1859 inputs are disabled, acknowledge polling can be initiated. The process involves transmitting a START condition followed by the device address. The R/W bit signifies the type of opera­tion that is desired. The read or write sequence will only be allowed to proceed if the internal write cycle has completed and the DS1859 responds with a zero.
Read Operations
After receiving a matching address byte with the R/W bit set high, the device goes into the read mode of opera­tion. There are three read operations: current address read, random read, and sequential address read.
Current Address Read
The DS1859 has an internal address register that main­tains the address used during the last read or write
STOP
CONDITION
OR REPEATED
START
CONDITION
REPEATED IF MORE BYTES
ARE TRANSFERRED
ACK
START
CONDITION
ACK
ACKNOWLEDGEMENT
SIGNAL FROM RECEIVER
ACKNOWLEDGEMENT
SIGNAL FROM RECEIVER
SLAVE ADDRESS
MSB
SCL
SDA
R/W
DIRECTION
BIT
12 678 9 12 893–7
Figure 5. 2-Wire Data Transfer Protocol
DS1859
Dual, Temperature-Controlled Resistors with Internally Calibrated Monitors
26 ____________________________________________________________________
operation, incremented by one. This data is maintained as long as VCCis valid. If the most recent address was the last byte in memory, then the register resets to the first address.
Once the device address is clocked in and acknowl­edged by the DS1859 with the R/W bit set to high, the current address data word is clocked out. The master does not respond with a zero, but does generate a STOP condition afterwards.
Single Read
A random read requires a dummy byte write sequence to load in the data byte address. Once the device and data address bytes are clocked in by the master and acknowl­edged by the DS1859, the master must generate another START condition. The master now initiates a current address read by sending the device address with the R/W bit set high. The DS1859 acknowledges the device address and serially clocks out the data byte.
Sequential Address Read
Sequential reads are initiated by either a current address read or a random address read. After the mas­ter receives the first data byte, the master responds with an acknowledge. As long as the DS1859 receives this acknowledge after a byte is read, the master can clock out additional data words from the DS1859. After reaching address FFh, it resets to address 00h.
The sequential read operation is terminated when the master initiates a STOP condition. The master does not respond with a zero.
The following section provides a detailed description of the 2-wire theory of operation.
2-Wire Serial-Port Operation
The 2-wire serial-port interface supports a bidirectional data transmission protocol with device addressing. A device that sends data on the bus is defined as a trans­mitter, and a device that receives data as a receiver. The device that controls the message is called a mas­ter. The devices that are controlled by the master are slaves. The bus must be controlled by a master device that generates the serial clock (SCL), controls the bus access, and generates the START and STOP condi­tions. The DS1859 operates as a slave on the 2-wire bus. Connections to the bus are made through the open-drain I/O lines SDA and SCL. The following I/O terminals control the 2-wire serial port: SDA, SCL. Timing diagrams for the 2-wire serial port can be found in Figures 5 and 6. Timing information for the 2-wire serial port is provided in the AC Electrical Characteristics table for 2-wire serial communications.
The following bus protocol has been defined:
Data transfer may be initiated only when the bus is not busy.
During data transfer, the data line must remain stable whenever the clock line is high. Changes in
SDA
SCL
t
HD:STA
t
LOW
t
HIGH
t
R
t
F
t
BUF
t
HD:DAT
t
SU:DAT
REPEATED
START
t
SU:STA
t
HD:STA
t
SU:STO
t
SP
STOP START
Figure 6. 2-Wire AC Characteristics
DS1859
Dual, Temperature-Controlled Resistors with
Internally Calibrated Monitors
____________________________________________________________________ 27
the data line while the clock line is high will be interpreted as control signals.
Accordingly, the following bus conditions have been defined:
Bus not busy: Both data and clock lines remain high.
Start data transfer: A change in the state of the data
line from high to low while the clock is high defines a START condition.
Stop data transfer: A change in the state of the data line from low to high while the clock line is high defines the STOP condition.
Data valid: The state of the data line represents valid data when, after a START condition, the data line is sta­ble for the duration of the high period of the clock signal. The data on the line can be changed during the low peri­od of the clock signal. There is one clock pulse per bit of data. Figures 5 and 6 detail how data transfer is accom­plished on the 2-wire bus. Depending on the state of the R/W bit, two types of data transfer are possible.
Each data transfer is initiated with a START condition and terminated with a STOP condition. The number of data bytes transferred between START and STOP con­ditions is not limited and is determined by the master device. The information is transferred byte-wise and each receiver acknowledges with a ninth bit.
Within the bus specifications, a standard mode (100kHz clock rate) and a fast mode (400kHz clock rate) are defined. The DS1859 works in both modes.
Acknowledge: Each receiving device, when addressed, is obliged to generate an acknowledge after the byte has been received. The master device must generate an extra clock pulse, which is associated with this acknowl­edge bit.
A device that acknowledges must pull down the SDA line during the acknowledge clock pulse in such a way that the SDA line is a stable low during the high period of the acknowledge-related clock pulse. Setup and hold times must be taken into account. A master must signal an end of data to the slave by not generating an acknowledge bit on the last byte that has been clocked out of the slave. In this case, the slave must leave the data line high to enable the master to generate the STOP condition.
1) Data transfer from a master transmitter to a slave receiver. The first byte transmitted by the master is the command/control byte. Next follows a number of data bytes. The slave returns an acknowledge bit after each received byte.
2) Data transfer from a slave transmitter to a mas- ter receiver. The master transmits the first byte
(the command/control byte) to the slave. The slave then returns an acknowledge bit. Next fol­lows a number of data bytes transmitted by the slave to the master. The master returns an acknowledge bit after all received bytes other than the last byte. At the end of the last received byte, a not acknowledge can be returned.
The master device generates all serial clock pulses and the START and STOP conditions. A transfer is ended with a STOP condition or with a repeated START condition. Since a repeated START condition is also the beginning of the next serial transfer, the bus is not released.
The DS1859 can operate in the following three modes:
1) Slave Receiver Mode: Serial data and clock are received through SDA and SCL, respectively. After each byte is received, an acknowledge bit is trans­mitted. START and STOP conditions are recog­nized as the beginning and end of a serial transfer. Address recognition is performed by hardware after the slave (device) address and direction bit have been received.
2) Slave Transmitter Mode: The first byte is received and handled as in the slave receiver mode. However, in this mode the direction bit indicates that the transfer direction is reversed. Serial data is transmitted on SDA by the DS1859, while the serial clock is input on SCL. START and STOP conditions are recognized as the beginning and end of a serial transfer.
3) Slave Address: Command/control byte is the first byte received following the START condition from the master device. The command/control byte consists of 4-bit control code. They are used by the master device to select which of eight possi­ble devices on the bus is to be accessed. When reading or writing to the DS1859, the device­select bits must match one of two valid device addresses, 00h or the address registered in Table 01 location 8Ch. The last bit of the command/con­trol byte (R/W) defines the operation to be per­formed. When set to a ‘1’ a read operation is selected, and when set to a ‘0’ a write operation is selected. The slave address can be set by the EEPROM. Following the START condition, the DS1859 monitors the SDA bus checking the device type identifier being transmitted. Upon receiving the 1010 control code, the appropriate device address bits, and the read/write bit, the slave device outputs an acknowledge signal on the SDA line.
DS1859
Dual, Temperature-Controlled Resistors with Internally Calibrated Monitors
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
28 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2006 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc.
is a registered trademark of Dallas Semiconductor Corporation.
Chip Information
TRANSISTOR COUNT: 47,191
SUBSTRATE CONNECTED TO GROUND
Package Information
For the latest package outline information, go to
www.maxim-ic.com/DallasPackInfo
.
Ordering Information (continued)
PART
RESISTANCE
PIN-PACKAGE
50k 16 CSBGA DS1859B-050/T&R 50k 16 CSBGA DS1859E-020 20k 16 TSSOP DS1859E-020+ 20k 16 TSSOP DS1859E-020/T&R 20k 16 TSSOP
20k 16 TSSOP DS1859E-050 50k 16 TSSOP DS1859E-050+ 50k 16 TSSOP
50k 16 TSSOP DS1859E-050/T&R 50k 16 TSSOP
+Denotes lead-free package.
T&R denotes tape-and-reel package.
DS1859B-050+T&R
DS1859E-020+T&R
DS1859E-050+T&R
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