MAXIM 78M6612 User Manual

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78M6612

Power and Energy Measurement IC

19-5348; Rev 2; 1/12

MPU

RTC

TIMERS

XIN

XOUT

VREF

TX0

RX0

COM0..3

V3.3A

V3.3 SYS

VBAT

V2.5

VBIAS

SEG0..18

GNDA GNDD

SEG 24..31/

DIO 4..11

SEG 34..37/

DIO 14..17

ICE

I2C or µWire

EEPROM

POWER

FAULT

COMPARATOR

SERIAL PORTS

OSC/PLL

CONVERTER

DIO, PULSE

COMPUTE

ENGINE

FLASH

RAM

VOLTAGE REF

REGULATOR

POWER SUPPLY

TERIDIAN

78M6612

TEMP

SENSOR

32 kHz

LIVE

NEUT

PWR MODE

CONTROL

WAKE-UP

BATTERY

ICE_E

GNDD

V3P3D

SEG 32,33,

38/ICE

TX1

RX1

OPTIONAL

OUTLET

OPTIONAL

Teridian is a trademark and Single Converter Technology is a registered

Single-Phase, Dual-Outlet

DATA SHEET

DS_6612_001

DESCRIPTION

The Teridian™ 78M6612 is a highly integrated, single-phase, power and energy measurement and monitoring system-onchip (SoC) that includes a 32-bit compute engine (CE), an MPU core, RTC, and flash. Our Single Converter Technology® with a 22-bit delta-sigma ADC, four analog inputs, digital temperature compensation, and precision voltage reference supports a wide range of single-phase, dual-outlet power measurement applications with very few external components.

With measurement technology leveraged from Maxim’s flagship utility metering ICs, the device offers features including 32 KB of flash program memory, 2 KB shared RAM, three low-power modes with internal timer or external event wake-up, two UARTs, I2C/MICROWIRE® EEPROM I/F, and an in-system programmable flash. Complete outlet measurement unit (OMU) and AC power monitor (AC-PMON) firmware is available or can be preloaded into the IC.

A complete array of ICE and development tools, programming libraries and reference designs enable rapid development and certification of power and energy measurement solutions that meet the most demanding worldwide electricity metering standards.

trademark of Maxim Integrated Products, Inc. MICROW IRE is a registered trademark of National Semiconductor Corp.

Rev 2 1

FE ATURES

• Measures Each Outlet of a Duplex Receptacle with

a Single IC

• Provides Complete Energy Measurement and

Communication Protocol Capability in a Single IC

• Intelligent Switch Control Capability

• < 0.5% Wh Accuracy Over 2000:1 Current Range

and Over Temperature

• Exceeds IEC 62053/ANSIC12.20 Standards

• Voltage Referenc e < 40 ppm/°C

• Four Sensor Inputs – VDD Referenced

• Low Jitter Wh and VARh Pulse Test Outputs

(10 kHz max)

• Pulse Count for Pulse Outputs

• Line Frequency Count for RTC

• Digital Temperature Compensation

• Sag Detection for Phase A and B

• Independent 32-Bit Compute Engine

• 46-64 Hz Line Frequency Range with Same Calibration

• Phase Compensation (±7°)

• Battery Backup for RTC and Battery Monitor

• Three Battery Modes with Wake-Up Timer:

Brownout Mode (48 µA) LCD Mode (5.7 µA) Sleep Mode (2.9 µA)

• Energy Display on Main Power Failure

• Wake-Up Timer

• 22-Bit Delta-Sigma ADC

• 8-Bit MPU (80515), 1 Clock Cycle per Instruction

with Integrated ICE for MPU Debug

• RTC with Temperature Com pensation

• Auto-Calibration

• Hardware watchdog Timer, Power-Fail Monitor

• LCD Driver (Up to 152 Pixels)

• Up to 18 General-Purpose I/O Pins

• 32 kHz Time Base

• 32 KB Flash with Security

• 2 KB MPU XRAM

• Two UARTs

• Digital I/O Pins Compatible with 5 V Inputs

• 64-Pin LQFP or 68-Pin QFN Package

• RoHS-Compliant (6/6) Lead(Pb)-Free Packages

• Complete Application Firmware Available

78M6612 Data Sheet DS_6612_001

Table of Contents

Hardware Description .................................................................................................................... 7

1.1 Hardware Overview................................................................................................................. 7

1.2 Analog Front End (AFE) .......................................................................................................... 8

1.2.1 Input Multiplexer .......................................................................................................... 8

1.2.2 A/D Converter (ADC) ................................................................................................... 9

1.2.3 FIR Filter ..................................................................................................................... 9

1.2.4 Voltage References ..................................................................................................... 9

1.2.5 Temperature Sensor.................................................................................................... 9

1.2.6 Battery Monitor ............................................................................................................ 9

1.3 Digital Computation Engine (CE) ........................................................................................... 10

1.3.1 Real-Time Monitor ..................................................................................................... 10

1.3.2 Pulse Generator ........................................................................................................ 10

1.3.3 Data RAM (XRAM) .................................................................................................... 10

1.4 80515 MPU Core .................................................................................................................. 11

1.4.1 UARTs ...................................................................................................................... 11

1.5 On-Chip Resources............................................................................................................... 11

1.5.1 Oscillator ................................................................................................................... 11

1.5.2 PLL and Internal Clocks............................................................................................. 11

1.5.3 Real-Time Clock (RTC) ............................................................................................. 12

1.5.4 Temperature Sensor.................................................................................................. 12

1.5.5 Flash Memory ........................................................................................................... 12

1.5.6 Optical Interface ........................................................................................................ 13

1.5.7 Digital I/O .................................................................................................................. 13

1.5.8 LCD Drivers .............................................................................................................. 16

1.5.9 EEPROM Interface .................................................................................................... 16

1.5.10 Hardware Watchdog Timer ........................................................................................ 17

1.5.11 Test Ports (TXUXOUT pin) ........................................................................................ 17

2 Functional Description ................................................................................................................ 18

2.1 Theory of Operation .............................................................................................................. 18

2.2 Fault and Reset Behavior ...................................................................................................... 19

2.2.1 Reset Mode ............................................................................................................... 19

2.2.2 Power Fault Circuit .................................................................................................... 19

2.3 Data Flow ............................................................................................................................. 19

2.4 CE/MPU Communication ...................................................................................................... 20

3 Application Information ............................................................................................................... 21

3.1 Connection of Sensors (CT, Resistive Shunt) ........................................................................ 21

3.2 Connecting 5 V Devices ........................................................................................................ 22

3.3 Temperature Measurement ................................................................................................... 22

3.4 Temperature Compensation .................................................................................................. 22

3.5 Connecting LCDs .................................................................................................................. 23

3.6 Connecting I2C EEPROMs .................................................................................................... 23

3.7 Connecting Three-Wire EEPROMs ....................................................................................... 24

3.8 UART0 (TX0/RX0) ................................................................................................................ 24

3.9 UART1 (TX1/RX1) ................................................................................................................ 25

3.10 Connecting V1 and Reset Pins .............................................................................................. 25

3.11 Connecting the Emulator Port Pins ........................................................................................ 26

3.12 Flash Programming ............................................................................................................... 26

3.13 MPU Firmware Library .......................................................................................................... 26

3.14 Crystal Oscillator ................................................................................................................... 26

3.15 Measurement Calibration ...................................................................................................... 27

4 Electrical Specifications .............................................................................................................. 28

4.1 Absolute Maximum Ratings ................................................................................................... 28

4.2 Recommended External Components ................................................................................... 29

2 Rev 2

DS_6612_001 78M6612 Data Sheet

4.3 Recommended Operating Conditions .................................................................................... 29

4.4 Performance Specifications ................................................................................................... 30

4.4.1 Input Logic Levels ..................................................................................................... 30

4.4.2 Output Logic Levels ................................................................................................... 30

4.4.3 Power-Fault Comparator ........................................................................................... 30

4.4.4 Battery Monitor .......................................................................................................... 31

4.4.5 Supply Current .......................................................................................................... 31

4.4.6 V3P3D Switch ........................................................................................................... 31

4.4.7 2.5V Voltage Regulator ............................................................................................. 32

4.4.8 Low Power Voltage Regulator ................................................................................... 32

4.4.9 Crystal Oscillator ....................................................................................................... 32

4.4.10 VREF, VBIAS ............................................................................................................ 33

4.4.11 LCD Drivers .............................................................................................................. 33

4.4.12 ADC Converter, V3P3A Referenced .......................................................................... 34

4.4.13 UART1 Interface........................................................................................................ 34

4.4.14 Temperature Sensor.................................................................................................. 34

4.5 Timing Specifications ............................................................................................................ 35

4.5.1 RAM and Flash Memory ............................................................................................ 35

4.5.2 Flash Memory Timing ................................................................................................ 35

4.5.3 EEPROM Interface .................................................................................................... 35

4.5.4 RESET and V1 .......................................................................................................... 35

4.5.5 RTC .......................................................................................................................... 35

5 Packaging .................................................................................................................................... 36

5.1 64-Pin LQFP Package .......................................................................................................... 36

5.1.1 Pinout........................................................................................................................ 36

5.1.2 Package Outline (LQFP 64) ....................................................................................... 37

5.1.3 Recommended PCB Land Pattern for the LQFP-64 Package..................................... 38

5.2 68-Pin QFN Package ............................................................................................................ 39

5.2.1 Pinout........................................................................................................................ 39

5.2.2 Package Outline ........................................................................................................ 40

5.2.3 Recommended PCB Land Pattern for the QFN-68 Package ...................................... 41

6 Pin Descriptions .......................................................................................................................... 42

6.1 Power/Ground Pins ............................................................................................................... 42

6.2 Analog Pins........................................................................................................................... 42

6.3 Digital Pins ............................................................................................................................ 43

7 I/O Equivalent Circuits ................................................................................................................. 44

8 Ordering Information ................................................................................................................... 45

9 Contact Information ..................................................................................................................... 45

Revision History .................................................................................................................................. 46

Rev 2 3

78M6612 Data Sheet DS_6612_001

Figures

Figure 1: IC Functional Block Diagram ..................................................................................................... 6

Figure 2: AFE Block Diagram ................................................................................................................... 8

Figure 3: Connecting an External Load to DIO Pins ............................................................................... 15

Figure 4: Functions Defined by V1 ......................................................................................................... 17

Figure 5: Voltage, Current, Momentary and Accumulated Energy ........................................................... 18

Figure 6: MPU/CE Data Flow ................................................................................................................. 19

Figure 7: MPU/CE Communication ........................................................................................................ 20

Figure 8: Resistive Voltage Divider ........................................................................................................ 21

Figure 9: Resistive Current Shunt .......................................................................................................... 21

Figure 10: Current Transformer .............................................................................................................. 21

Figure 11: Connecting LCDs .................................................................................................................. 23

Figure 12: I

Figure 13: Three-Wire EEPROM Connection ......................................................................................... 24

Figure 14: Connections for the RX0 Pin ................................................................................................. 24

Figure 15: Voltage Divider for V1 ........................................................................................................... 25

Figure 16: External Components for RESET: Development Circuit (Left), Production Circuit (Right) ....... 25

Figure 17: External Components for the Emulator Interface.................................................................... 26

Figure 18: 64-Pin LQFP Pinout .............................................................................................................. 36

Figure 19: 68-Pin QFN Pinout ................................................................................................................ 39

C EEPROM Connection ...................................................................................................... 23

4 Rev 2

DS_6612_001 78M6612 Data Sheet

Tables

Table 1: Inputs Selected in Regular and Alternate Multiplexer Cycles ....................................................... 8

Table 2: Data/Direction Registers and Internal Resources for DIO Pin Groups ....................................... 14

Table 3: DIO_DIR Control Bit ................................................................................................................. 15

Table 4: Selectable Controls using the DIO_DIR Bits ............................................................................. 16

Table 5: Absolute Maximum Ratings ...................................................................................................... 28

Table 6: Recommended External Components ...................................................................................... 29

Table 7: Recommended Operation Conditions ....................................................................................... 29

Table 8: Input Logic Levels .................................................................................................................... 30

Table 9: Output Logic Levels ................................................................................................................. 30

Table 10: Power-Fault Comparator Performance Specifications ............................................................. 30

Table 11: Power-Fault Comparator Performance Specifications (BME=1) .............................................. 31

Table 12: Supply Current Performance Specifications ............................................................................ 31

Table 13: V3P3D Switch Performance Specifications ............................................................................. 31

Table 14: 2.5 V Voltage Regulator Performance Specifications .............................................................. 32

Table 15: Low-Power Voltage Regulator Performance Specifications ..................................................... 32

Table 16: Crystal Oscillator Performance Specifications ......................................................................... 32

Table 17: VREF, VBIAS Performance Specifications.............................................................................. 33

Table 18: LCD Drivers Performance Specifications ................................................................................ 33

Table 19: ADC Converter Performance Specifications ........................................................................... 34

Table 20: UART1 Interface Performance Specifications ......................................................................... 34

Table 21: Temperature Sensor Performance Specifications ................................................................... 34

Table 22: RAM and Flash Memory Specifications .................................................................................. 35

Table 23: Flash Memory Timing Specifications ...................................................................................... 35

Table 24: EEPROM Interface Timing ..................................................................................................... 35

Table 25: RESET and V1 Timing ........................................................................................................... 35

Table 26: RTC Range ............................................................................................................................ 35

Table 27: Power/Ground Pins ................................................................................................................ 42

Table 28: Analog Pins ............................................................................................................................ 42

Rev 2 5

78M6612 Data Sheet DS_6612_001

MUX

XIN

XOUT

VREF

CKADC

CKTEST/

SEG19

32 bit Compute

Engine

MPU

(80515)

CONTROL

RX1 /

DIO1

TX1 /

DIO2 /

WPULSE /

VARPULSE

RESET

EMULATOR

PORT

CE_BUSY

UART

XFER BUSY

COM0..3

VLC2

LCD DISPLAY

DRIVER

DATA 00-7F

PROG

000-7FF

DATA

0000-FFFF

PROG

0000-7FFF

00007FFF

MPU XRAM

(2KB)

0000-07FF

DIGITAL I/O

CONFIG

2000-20FF

I/O RAM

CE RAM

(0.5KB)

MEMORY SHARE

1000-11FF

RTCLK

RTCLK (32KHz)

MUX_SYNC

CKCE

CKMPU

CK32

CE_E

RTM_E

LCD_E

LCD_CLK

LCD_MODE

DIO

4.9MHz

GNDD

V3P3A

V3P3D

VBAT

VOLT

REG

2.5V to logic

V2P5

MPU_DIV

SUM_CYCLES

PRE_SAMPS

EQU

CKOUT_E

32KHz

TMUXOUT

MPU_RSTZ

FAULTZ

WAKE

TMUX[4:0]

CONFIGURATION

PARAMETERS

GNDA

VBIAS

CROSS

CK_GEN

OSC

(32KHz)

CK32

CKOUT_E

MCK

PLL

VREF

VREF_DIS

DIV

ADC

MUX

CTRL

MUX_DIV

CHOP_E

EQU

STRT

MUX

CKFIR

4.9MHz

RTM

SEG34 / DIO14 .. SEG37 / DIO17, SEG39 / DIO19, SEG40 / DIO20

WPULSE

VARPULSE

WPULSE

VARPULSE

TEST

TEST MODE

LCD_MODE

VLC1

VLC0

LCD_E

4.9MHz

LCD_NUM

DIO_R

DIO_DIR

LCD_NUM

DIO_PV/PW

MUX_ALT

SEG24 / DIO4 .. SEG31 / DIO11

SDCK

SDOUT

SDIN

E_RXTX/SEG38

E_TCLK/SEG33

E_RST/SEG32

FLASH (32KB)

FLSH66ZT

V3P3A

FIR_LEN

FIR

SEG0..18

EEPROM

INTERFACE

DIO_EEX

CK_2X

ECK_DIS

V3P3D

LCD_GEN

RTC

RTC_INC_SEC

RTC_DEC_SEC

VBIAS

MEMORY

SEG32,33 SEG19,38

E_RXTX E_TCLK E_RST (Open Drain)

ICE_E

DIO1,2

VREF_CAL

∆Σ ADC

CONVERTER

VREF

ADC_E

RTM_0..3

CE_LCTN

PLS_MAXWIDTH

PLS_INTERVAL

PLS_INV

LCD_BLKMAP LCD_SEG LCD_Y

SLEEP

LCD_ONLY

V3P3SYS

TEST

MUX

DIO3, DIO21 / SEG41

(68 Pin Package Only)

V3P3D

TEMP

VBAT

VBIAS

OPTICAL

COMP_STAT

POWER FAULT

OPT_TXE OPT_TXINV

OPT_RXINV

OPT_RXDIS

MOD

OPT_TXMOD OPT_FDC

CE_LCTN

(SEG13 and SEG 14

on 68 Pin Package

Only)

Figure 1: IC Functional Block Diagram

6 Rev 2

DS_6612_001 78M6612 Data Sheet

1 Hardware Description

1.1 Hardware Overview

The Teridian 78M6612 single-chip measurement and monitoring IC integrates all the primary AC measurement and control blocks required to implement a solid-state electricity Power and Energy Measurement function. The 78M6618 includes:

• A four-input analog front end (AFE)

• An independent digital computation engine (CE)

• An 8051-compatible microprocessor (MPU) which executes one instruction per clock cycle (80515)

• A precision voltage reference

• A temperature sensor

• LCD drivers

• RAM and Flash memory

• A real time clock (RTC)

• A variety of I/O pins

Various current sensor technologies are supported including Current Transformers (CT), and Resistive Shunts.

In a typical application, the 32-bit compute engine (CE) of the 78M6612 sequentially processes the samples from the analog inputs on pins IA, VA, IB, VB and performs calculations to measure active energy (Wh), reactive energy (VARh), A measurements are then accessed by the MPU, processed further, and output using the peripheral devices available to the MPU.

In addition to advanced measurement functions, the real time clock function allows the 78M6612 to record time of use (TOU) measurement information for multi-rate applications and to time-stamp events. Measurements can be displayed on 3.3 V LCDs if desired. Flexible mapping of LCD display segments will facilitate utilization of existing custom LCDs. Design trade-off between number of LCD segments vs. DIO pins can be implemented in software to accommodate various requirements.

In addition to the temperature-trimmed ultra-precision voltage reference, the on-chip digital temperature compensation mechanism includes a temperature sensor and associated controls for correction of unwanted temperature effects on measurement and RTC accuracy, e.g. to meet the requirements of ANSI and IEC standards. Temperature-dependent external components such as crystal oscillator, current transformers (CTs), and their corresponding signal conditioning circuits can be characterized and their correction factors can be programmed to produce measurements with exceptional accuracy over the industrial temperature range.

A block diagram of the IC is shown in Figure 1. A detailed description of various functional blocks follows.

h, and V2h for four-quadrant measurement. These

Rev 2 7

78M6612 Data Sheet DS_6612_001

Mux State

EQU 0 1 2 3 0 1 2 3

MUX

VREF

4.9MHz

VBIAS

CROSS

CK32

VREF

VREF_DIS

MUX

CTRL

MUX_DIV

CHOP_E

EQU

MUX

MUX_ALT

V3P3A

FIR_LEN

FIR

VBIAS

VREF_CAL

∆Σ ADC

CONVERTER

VREF

ADC_E

TEMP

VBAT

FIR_DONE

FIR_START

1.2 Analog Front End (AFE)

The AFE functions as a data acquisition system, controlled by the MPU. It consists of an input multiplexer, a delta-sigma A/D converter, and a voltage reference. The main signals (IA, VA, IB, VB) are sampled and the ADC counts obtained are stored in CE DRAM where they can be accessed by the CE and, if necessary, by the MPU.

Figure 2: AFE Block Diagram

1.2.1 Input Multiplexer

The input multiplexer supports up to four input signals that are applied to pins IA, VA, IB, and VB of the device. Additionally, using the alternate multiplexer selection, it has the ability to select temperature and the battery voltage. The multiplexer can be operated in two modes:

• During a normal multiplexer cycle, the signals from the IA, IB, VA, and VB pins are selected.

• During the alternate multiplexer cycle, the temperature signal (TEMP) and the battery monitor are

selected, along with the signal sources shown in Table 1. To prevent unnecessary drainage on the battery, the battery monitor is enabled only with the BME bit (0x2020[6]) in the I/O RAM.

The alternate multiplexer cycles are usually performed infrequently (e.g. every second or so) by the MPU. In order to prevent disruption of the voltage tracking PLL and voltage allpass networks, VA is not replaced in the ALT mux selections. Table 1 details the regular and alternative multiplexer sequences. Missing samples due to an ALT multiplexer sequence are filled in by the CE.

Table 1: Inputs Selected in Regular and Alternate Multiplexer Cycles

Regular MUX Sequence ALT MUX Sequence

2 IA VA IB VB TEMP VA VBAT VB

In a typical application, IA and IB are connected to current sensors that sense the current on each branch of the line voltage. VA and VB are typically connected to voltage sensors through resistor dividers. The multiplexer control circuit is clocked by CK32, the 32.768 kHz clock from the PLL block, and launches with each new pass of the CE program. The duration of each multiplexer state depends on the number of ADC samples processed by the FIR.

8 Rev 2

DS_6612_001 78M6612 Data Sheet

1.2.2 A/D Converter (ADC)

A single delta-sigma A/D converter digitizes the voltage and current inputs to the 78M6612. The resolution of the ADC is configurable to either 21 or 22 bit. At the end of each ADC conversion, the FIR filter output data is stored into the CE RAM location.

1.2.3 FIR Filter

The finite impulse response filter is an integral part of the ADC and it is optimized for use with the multiplexer. The purpose of the FIR filter is to decimate the ADC output to the desired resolution. At the end of each ADC conversion, the output data is stored into the CE RAM location determined by the multiplexer selection. FIR data is stored LSB justified, but shifted left by nine bits.

1.2.4 Voltage References

The device includes an on-chip precision bandgap voltage reference that incorporates auto-zero techniques. The reference is trimmed to minimize errors caused by component mismatch and drift. The result is a voltage output with a predictable temperature coefficient.

1.2.5 Temperature Sensor

The 78M6612 includes an on-chip temperature sensor implemented as a bandgap reference. It is used to determine the die temperature The MPU reads the temperature sensor output during alternate multiplexer cycles. The primary use of the temperature data is to determine the magnitude of compensation required to offset the thermal drift in the system (see Section 3.4 Temperature

Compensation).

1.2.6 Battery Monitor

The 78M6618 also has the ability to measure battery voltage by the ADC during alternative multiplexer frames. When set, an on-chip 45 kΩ load resistor is applied to the battery and a scaled fraction of the

battery voltage is applied to the ADC input. Battery operating modes are not supported in all firmware libraries. Contact Maxim support for more information.

Rev 2 9

78M6612 Data Sheet DS_6612_001

1.3 Digital Computation Engine (CE)

The CE, a dedicated 32-bit signal processor, performs the precision computations necessary to accurately measure energy. The CE calculations and processes include:

• Multiplication of each current sample with its associated voltage sample to obtain the energy per

sample (when multiplied with the constant sample time).

• Frequency-insensitive delay cancellation on all four channels (to compensate for the delay between

samples caused by the multiplexing scheme).

• 90° phase shifter (for narrowband VAR calculations).

• Pulse generation.

• Monitoring of the input signal frequency (for frequency and phase information).

• Monitoring of the input signal amplitude (for sag detection).

• Scaling of the processed samples based on calibration coefficients.

CE code is provided by Maxim as a part of the application firmware available. The CE is not programmable by the user. Measurement algorithms in the CE code can be customized by Maxim upon request.

The CE program resides in Flash memory. Allocated Flash space for the CE program cannot exceed 1024 words (2 KB). The CE can access up to 2 KB of data RAM (XRAM), or 512 32-bit data words. The CE is also aided by support hardware to facilitate implementation of equations, pulse counters and accumulators. Usage of this hardware is firmware specific.

1.3.1 Real-Time Monitor

The CE contains a Real-Time Monitor (RTM), which can be programmed to monitor four selectable CE DRAM locations at full sample rate

for system debug purposes. The four monitored locations can be serially

output to the TMUXOUT pin via the digital output multiplexer at the beginning of each CE code pass. The RTM output is clocked by CKTEST.

1.3.2 Pulse Generator

The CE provides four pulse generators used to output CE status indicators (e.g. SAG) directly to designated DIO pins.

1.3.3 Data RAM (XRAM)

The CE and MPU use a single general-purpose Data RAM (also referred to as XRAM). When the MPU and CE are clocking at maximum frequency (10 MHz), the RAM may be accessed up to four times during each 100 ns interval. These consist of two MPU accesses, one CE access and one SPI access.

10 Rev 2

DS_6612_001 78M6612 Data Sheet

1.4 80515 MPU Core

The 78M6612 includes an 80515 MPU (8-bit, 8051-compatible) that processes most instructions in one clock cycle. Using a 5 MHz (4.9152 MHz) clock results in a processing throughput of 5 MIPS. The 80515 architecture eliminates redundant bus states and implements parallel execution of fetch and execution phases. Normally a machine cycle is aligned with a memory fetch, therefore, most of the 1-byte instructions are performed in a single machine cycle (MPU clock cycle). This leads to an 8x average performance improvement (in terms of MIPS) over the Intel



8051 device running at the same clock frequency. Actual processor clocking speed can be adjusted to the total processing demand of the application (measurement calculations, memory management and I/O management).

Typical power and energy measurement functions based on the results provided by the internal 32-bit compute engine (CE) are available for the MPU as part of Maxim’s standard library. A standard ANSI “C” 80515 application program library is available to help reduce design cycle.

1.4.1 UARTs

The 78M6612 includes two UARTs (UART0 and UART1) that can be programmed to communicate with a variety of external devices. The UARTs are dedicated 2-wire serial interfaces, which can communicate at rates up to 38,400 bits/s. All UART transfers are programmable for parity enable, parity, 2 stop bits/1 stop bit and XON/XOFF option for variable communication baud rates from 300 to 38,400 bps.

1.5 On-Chip Resources

1.5.1 Oscillator

The 78M6612 oscillator drives a standard 32.768 kHz watch crystal. These crystals are accurate and do not require a high-current oscillator circuit. The 78M6612 oscillator has been designed specifically to handle these crystals and is compatible with their high impedance and limited power handling capability.

1.5.2 PLL and Internal Clocks

Timing for the device is derived from the 32.768 kHz oscillator output. On-chip timing functions include:

• The MPU master clock

• A real time clock (RTC)

• The delta-sigma sample clock.

The two general-purpose counter/timers are contained in the MPU.

The ADC master clock, CKADC, is generated by an on-chip PLL. It multiplies the oscillator output frequency (CK32) by 150.

The CE clock frequency is always CK32 * 150, or 4.9152 MHz, where CK32 is the 32 kHz clock. The MPU clock frequency is determined by MPU_DIV and can be 4.9152 MHz *2 varies from 0 to 7 (MPU_DIV is 0 on power-up). This makes the MPU clock scalable from 4.9152 MHz down to 38.4 kHz. The circuit also generates a 2x MPU clock for use by the emulator. This 2x MPU clock is not generated when ECK_DIS is asserted by the MPU.

The setting of MPU_DIV is maintained when the device transitions to BROWNOUT mode, but the time base in BROWNOUT mode is 28,672 Hz.

MPU_DIV

Hz where MPU_DIV

Rev 2 11

78M6612 Data Sheet DS_6612_001

1.5.3 Real-Time Clock (RTC)

The RTC is driven directly by the crystal oscillator. The RTC consists of a counter chain and output registers. The counter chain consists of seconds, minutes, hours, day of week, day of month, month, and year. The RTC is not supported in all firmware libraries. Contact Maxim support for more information.

1.5.4 Temperature Sensor

The device includes an on-chip temperature sensor for determining the temperature of the bandgap reference. The MPU may request an alternate multiplexer frame containing the temperature sensor output by asserting MUX_ALT. The primary use of the temperature data is to determine the magnitude of compensation required to offset the thermal drift in the system (see Section 3.4 Temperature

Compensation).

1.5.5 Flash Memory

The 78M6612 includes 32 KB of on-chip Flash memory. The Flash memory primarily contains MPU and CE program code. It also contains images of the CE DRAM, MPU RAM, and I/O RAM. On power-up, before enabling the CE, the MPU copies these images to their respective locations.

The Flash memory is segmented into individually erasable 1024-byte pages. Flash space allocated for the CE program is limited to 1024 words (2 KB). The CE program must begin on a 1-KB boundary of the Flash address space.

Flash Write Procedures

The MPU has the ability to write to the Flash memory when the CE is disabled. As an alternative to using Flash, a small EEPROM can store data without compromises. EEPROM interfaces are included in the device.

Updating Individual Bytes in Flash Memory

The original state of a Flash byte is 0xFF (all ones). Once a value other than 0xFF is written to a Flash memory cell, overwriting with a different value usually requires that the cell be erased first. Since cells cannot be erased individually, the page has to be copied to RAM, followed by a page erase. After this, the page can be updated in RAM and then written back to the Flash memory.

Flash Erase Procedures

Flash erasure is initiated by writing a specific data pattern to specific SFR registers in the proper sequence. These special pattern/sequence requirements prevent inadvertent erasure of the Flash memory.

The mass erase sequence is:

1. Write 1 to the FLSH_MEEN bit (SFR address 0xB2[1].

2. Write pattern 0xAA to FLSH_ERASE (SFR address 0x94).

The mass erase cycle can only be initiated when the ICE port is enabled.

The page erase sequence is:

1. Write the page address to FLSH_PGADR (SFR address 0xB7[7:1].

2. Write pattern 0x55 to FLSH_ERASE (SFR address 0x94).

12 Rev 2

DS_6612_001 78M6612 Data Sheet

1.5.6 Optical Interface

The device includes an interface to implement an IR/optical port on UART1. The pin TX1 is designed to directly drive an external LED for transmitting data on an optical link. The pin RX1 is designed to sense the input from an external photo detector used as the receiver for the optical link. The IR/optical interface is not supported in all firmware libraries. Contact Maxim support for more information.

1.5.7 Digital I/O

The device includes up to 18 pins (QFN 68 package) or 16 pins (LQFP 64 package) of general purpose digital I/O. These pins are compatible with 5V inputs (no current-limiting resistors are needed). Some of them are dedicated DIO (DIO3), some are dual-function that can alternatively be used as LCD drivers (DIO4-11, 14-17, 19-21) and some share functions with the optical port (DIO1, DIO2). On reset or power-up, all DIO pins are inputs until they are configured for the desired direction under MPU control. The pins are configured by the DIO registers and by the five bits of the LCD_NUM register (located in I/O RAM). Once declared as DIO, each pin can be configured independently as an input or output with the DIO_DIRn bits. A 3-bit configuration word, DIO_Rx, can be used for certain pins, when configured as DIO, to individually assign an internal resource such as an interrupt or a timer control. Table 2 lists the direction registers and configurability associated with each group of DIO pins. Table 3 shows the configuration for a DIO pin through its associated bit in its DIO_DIR register.

Tables showing the relationship between LCD_NUM and the available segment/DIO pins can be found in

Section 3.5 Connecting LCDs and in Section 4.3 I/O Description under LCD_NUM[4:0].

Rev 2 13

78M6612 Data Sheet DS_6612_001

Configurable

DIO_DIR2 (SFR 0xA1)

Configurable

Table 2: Data/Direction Registers and Internal Resources for DIO Pin Groups

DIO x 1 2 3 4 5 6 7 8 9

Pin no. (64 LQFP)

Pin no. (68 QFN)

Data Register

Direction Register

– 5

– 6

3 –

3 5

– 1 2 3 4 5 6 7 0 1 2 3 – – 6 7

36 37 38 39 40 41 42 4

39 40 41 42 43 44 45 4

–

Internal Resources

–

Y Y Y Y Y Y Y Y Y Y Y – – – –

DIO 16

Pin no. (64 LQFP) 22

Pin no. (68 QFN) 23

1 7

1 3

1 8

–

19 20 2

23 4

24 47 6

22 2

– – –

0 1 – 3 4 5 – –

Data Register

Direction Register

Internal Resources

0 1 – 3 4 5 – –

N N – N N N – –

DIO2=P2 (SFR 0xA0)

10 11 12 13 14 1

– –

DIO1=P1 (SFR 0x90)

DIO_DIR1 (SFR 0x91)

20 2

21 2

14 Rev 2

DS_6612_001 78M6612 Data Sheet

DIO Pin n Function

Not recommended

78M6612

DIO

V3P3

V3P3SYS

3.3V

DGN

VBA

DIO1

V3P3D

LED

V3P3SYS

3.3V

DGND

VBAT

Recommended

DIO

V3P3

V3P3SYS

DGN

VBA

3.3V

Recommended

LED

DIO1

V3P3D

78M6612

V3P3SYS

DGND

VBA

3.3V

Table 3: DIO_DIR Control Bit

DIO_DIR [n]

0 1

Input Output

Additionally, if DIO6 and DIO7 are declared outputs, they can be configured as dedicated pulse outputs (WPULSE = DIO6, VARPULSE = DIO7) using DIO_PW and DIO_PV registers. In this case, DIO6 and DIO7 are under CE control. DIO4 and DIO5 can be configured to implement the EEPROM Interface.

If the optical UART is not used, TX1 and RX1 can be configured as dedicated DIO pins (DIO1, DIO2, see

Section 1.5.6 Optical Interface).

A 3-bit configuration word, I/O RAM register, DIO_Rx (0x2009[2:0] through 0x200E[6:4]) can be used for certain pins, when configured as DIO, to individually assign an internal resource such as an interrupt or a timer control (see Table 2 for DIO pins available for this option). This way, DIO pins can be tracked even if they are configured as outputs.

Tracking DIO pins configured as outputs is useful for pulse counting without external hardware.

When driving LEDs, relay coils etc., the DIO pins should sink the current into ground (as

shown in to the resistance of the internal switch that connects V3P3D to either V3P3SYS or VBAT.

When configured as inputs, the dual-function (DIO/SEG) pins should not be pulled above V3P3SYS in MISSION and above VBAT in LCD and BROWNOUT modes. Doing so will distort the LCD waveforms of the other pins. This limitation applies to any pin that can be configured as a LCD driver.

The control resources selectable for the DIO pins are listed in Table 4. If more than one input is connected to the same resource, the resources are combined using a logical OR.

Figure 3, right), not source it from V3P3D (as shown in Figure 3, left). This is due

Rev 2 15

Figure 3: Connecting an External Load to DIO Pins

78M6612 Data Sheet DS_6612_001

Value

Resource Selected for DIO Pin

NONE

T1 (counter1 clock)

High priority I/O interrupt (INT0 falling)

Table 4: Selectable Controls using the DIO_DIR Bits

DIO_R

1 Reserved

2 T0 (counter0 clock)

4 High priority I/O interrupt (INT0 rising)

5 Low priority I/O interrupt (INT1 rising)

7 Low priority I/O interrupt (INT1 falling)

1.5.8 LCD Drivers

The device in the 68-pin QFN package contains 20 dedicated LCD segment drivers in addition to the 18 multi-use pins described above. Thus, the device is capable of driving between 80 to 152 pixels of LCD display with 25% duty cycle (or 60 to 114 pixels with 33% duty cycle). At eight pixels per digit, this corresponds to 10 to 19 digits.

The device in the 64-pin LQFP package contains 18 dedicated LCD segment drivers in addition to the 17 multi-use pins described above. Thus, the device is capable of driving between 72 to 140 pixels of LCD display with 25% duty cycle (or 60 to 105 pixels with 33% duty cycle). At eight pixels per digit, this corresponds to 9 to 17 digits.

The LCD drivers are grouped into four commons and up to 38 segment drivers (68-pin package), or 4 commons and 35 segment drivers (64-pin package). The LCD interface is flexible and can drive either digit segments or enunciator symbols.

Segment drivers SEG18 and SEG19 can be configured to blink at either 0.5 Hz or 1 Hz. The blink rate is controlled by LCD_Y. There can be up to four pixels/segments connected to each of these drivers. LCD_BLKMAP18[3:0] and LCD_BLKMAP19[3:0] identify which pixels, if any, are to blink.

LCD interface memory is powered by the non-volatile supply. The bits of the LCD memory are preserved in LCD and SLEEP modes, even if their pin is not configured as SEG. In this case, they can be useful as general- purpose non-volatile storage.

1.5.9 EEPROM Interface

The 78M6612 provides hardware support for an optional two-pin or a three-wire (µ-wire) EEPROM interface.

Two-Pin EEPROM Interface

The dedicated 2-pin serial interface communicates with external EEPROM devices. The interface is multiplexed onto the DIO4 (SCK) and DIO5 (SDA) pins.

Three-Wire (µ-Wire) EEPROM Interface

A 500 kHz 3-wire interface, using SDATA, SCK, and a DIO pin for CS is also available.

16 Rev 2

DS_6612_001 78M6612 Data Sheet

V3P3

V3P3 -

400mV

V3P3 - 10mV

VBIAS

Battery modes

Normal

operation,

WDT

enabled

WDT dis-

abled

1.5.10 Hardware Watchdog Timer

In addition to the basic watchdog timer included in the 80515 MPU, an independent, robust, fixed-duration, watchdog timer (WDT) is included in the device. It uses the crystal oscillator as its time base and must be refreshed by the MPU firmware at least every 1.5 seconds. When not refreshed on time the WDT overflows, and the part is reset as if the RESET pin were pulled high, except that the I/O RAM bits will be maintained. 4096 oscillator cycles (or 125 ms) af ter the WDT overflow, the MPU will be launched from program address 0x0000. Asserting ICR_E will deactivate the WDT.

The WDT can also be disabled by tying the V1 pin to V3P3. Of course, this also deactivates V1 power fault detection. Since there is no method in firmware to disable the crystal oscillator or the WDT, it is guaranteed that whatever state the part might find itself in, upon WDT overflow, the part will be reset to a known state.

Figure 4: Functions Defined by V1

1.5.11 Test Ports (TXUXOUT pin)

One out of 16 digital or 8 analog signals can be selected to be output on the TMUXOUT pin. The function of the multiplexer is described in the applicable firmware documentation.

Rev 2 17

78M6612 Data Sheet DS_6612_001

∫

dttItVE

)()(

-500

-400

-300

-200

-100

100

200

300

400

500

0 5 10 15 20

Current [A]

Voltage [V]

Energy per Interval [W s]

Accum ulated Energy [W s]

2 Functional Description

2.1 Theory of Operation

The energy delivered by a power source into a load can be expressed as:

The following formulas apply for wide band mode (true RMS):

• P = ∑ (i(t) * v(t))

• Q = √(S

• S = V * I

• V = √∑v(t)2

• I = √∑i(t)

For actual measurement equations, refer to the applicable 78M6612 Firmware Description Document.

For some applications, not only voltage and current amplitudes, but also phase angles and harmonic content may change constantly. Thus, simple RMS measurements are inherently inaccurate. A modern solid-state electricity measurement IC such as the 78M6612 functions by emulating the integral operation above, i.e. it processes current and voltage samples through an ADC at a constant frequency. As long as the ADC resolution is high enough and the sample frequency is beyond the harmonic range of interest, the current and voltage samples, multiplied with the time period of sampling will yield an accurate quantity for the momentary energy. Summing up the momentary energy quantities over time will result in accumulated energy.

– P2)

Figure 5: Voltage, Current, Momentary and Accumulated Energy

Figure 5 shows the shapes of V(t), I(t), the momentary power and the accumulated power, resulting from

50 samples of the voltage and current signals over a period of 20 ms. The application of 240 VAC and 100 A results in an accumulation of 480 Ws (= 0.133 Wh) over the 20 ms period, as indicated by the Accumulated Power curve. The described sampling method works reliably, even in the presence of dynamic phase shift and harmonic distortion.

18 Rev 2

DS_6612_001 78M6612 Data Sheet

Processo

Pos

Processo

IRQ

Processed

Metering

Data

Pulses

I/O RAM (Configuration RAM)

Samples

Data

2.2 Fault and Reset Behavior

2.2.1 Reset Mode

When the RESET pin is pulled high, all digital activity stops. The oscillator and RTC module continue to run. Additionally, all I/O RAM bits are set to their default states. As long as V1, the input voltage at the power fault block, is greater than VBIAS, the internal 2.5 V regulator continues to provide power to the digital section.

Once initiated, the reset mode persists until the reset timer times out. This occurs in 4096 cycles of the real time clock after RESET goes low, at which time the MPU begins executing its preboot and boot sequences from address 00.

2.2.2 Power Fault Circuit

The 78M6612 includes a comparator to monitor system power fault conditions. When the output of the comparator falls (V1<VBIAS), the PLL status bits in the I/O RAM are zeroed and the IC power downs. Once system power returns, the MPU remains in reset and does not start until 2048 to 4096 CK32 clock cycles later. Program execution starts at address 0x00. MPU RAM will be re-initialized.

2.3 Data Flow

The data flow between the Compute Engine (CE) and the MPU is shown in Figure 6. In a typical application, the 32-bit CE sequentially processes the samples from the current and voltage inputs on pins IA, VA, IB, and VB, performing calculations to measure active power (Wh), reactive power (VARh), A

h for four-quadrant measurement. These measurements are then accessed by the MPU,

and V processed further and output using the peripheral devices available to the MPU.

Rev 2 19

Figure 6: MPU/CE Data Flow

78M6612 Data Sheet DS_6612_001

PULSES

INTERRUPTS

DISPLAY (Memor y

Mapped

Segments)

DIO

EEPROM

(I2C

SERIAL

(UART0/1)

SAMPLES

VAR (DIO7)

VARSU M

WS UM

EXT_PULS E

CE_BUS Y

XFER_BUSY

Mux

DATA

APULSEW

APULSE R

SAG CON TROL

I/O RAM (CONFIGURATION RAM)

2.4 CE/MPU Communication

Figure 7 shows the functional relationship between the CE and the MPU. The CE is controlled by the

MPU via shared registers in the I/O RAM and RAM. The CE outputs two interrupt signals to the MPU to indicate the CE is actively processing data and the CE is updating data to the output region of the RAM.

Figure 7: MPU/CE Communication

20 Rev 2

DS_6612_001 78M6612 Data Sheet

3 Application Information

3.1 Connection of Sensors (CT, Resistive Shunt)

Figure 8, Figure 9, and Figure 10 show how resistive voltage dividers, resistive current shunts, and

current transformers are connected to the voltage and current inputs of the 78M6612.

Figure 8: Resistive Voltage Divider

Figure 9: Resistive Current Shunt

Figure 10: Current Transformer

Rev 2 21

78M6612 Data Sheet DS_6612_001

NTN

T +

−=))((

16385_

PPMCXTEMPPPMCXTEMP

ADJGAIN

⋅

3.2 Connecting 5 V Devices

All digital input pins of the 78M6612 are compatible with external 5 V devices. I/O pins configured as inputs do not require current-limiting resistors when they are connected to external 5 V devices.

3.3 Temperature Measurement

Measurement of absolute temperature uses the on-chip temperature sensor and applying the following formula:

In the above formula, T is the temperature in °C, N(T) is the ADC count at temperature T, Nn is the ADC count at 25°C, S

is the sensitivity in LSB/°C and Tn is +25 °C.

3.4 Temperature Compensation

Temperature Coefficients: The internal voltage reference is calibrated during device manufacture.

The temperature coefficients TC1 and TC2 are given as constants that represent typical component behavior (in

µV/°C and µV/°C

Since TC1 and TC2 are given in (1.195V) has to be taken into account when transitioning to PPM/°C and PPM/°C that PPMC = 26.84*TC1/1.195, and PPMC2 = 1374*TC2/1.195).

Temperature Compensation: The CE provides the bandgap temperature to the MPU, which then may digitally compensate the power outputs for the temperature dependence of VREF.

The MPU, not the CE, is entirely in charge of providing temperature compensation. The MPU applies the following formula to determine GAIN_ADJ (address 0x12). In this formula TEMP_X is the deviation from nominal or calibration temperature expressed in multiples of 0.1°C:

, respectively).

V/°C and µV/°C2, respectively, the value of the VREF voltage

. This means

22 Rev 2

In a power and energy measurement unit, the 78M6612 is not the only component contributing to temperature dependency. A whole range of components (e.g. current transformers, resistor dividers, power sources, filter capacitors) will contribute temperature effects. Since the output of the on-chip temperature sensor is accessible to the MPU, temperature-compensation mechanisms with great flexibility are possible

local to the chip)

(e.g. system-wide temperature correction over the entire unit rather than

DS_6612_001 78M6612 Data Sheet

DIO4

DIO5

78M6612

EEPROM

SCL

SDA

V3P3D

10k Ω 10k Ω DIO4

DIO5

EEPROM

SCL

SDA

V3P3D

10k Ω 10k

segments

78M6612

LCD

commons

3.5 Connecting LCDs

The 78M6612 has an on-chip LCD controller capable of controlling static or multiplexed LCDs. Figure 11 shows the basic connection for an LCD.

Figure 11: Connecting LCDs

The LCD segment pins can be organized in the following groups:

• Seventeen pins are dedicated LCD segment pins (SEG0 to SEG13, SEG16 to SEG18).

• Four pins are dual-function pins CKTEST/SEG19, E_RXTX/SEG38, E_TCLK/SEG33, and

E_RST/SEG32.

• Fourteen pins are available as combined DIO and segment pins SEG24/DIO4 to SEG31/DIO11,

SEG34/DIO14 to SEG37/DIO17, SEG39/DIO19, and SEG40/DIO20.

• The QFN-68 package adds an additional combination pin, SEG41/DIO21. Also adds two additional

LCD segment pins, SEG13 and SEG14.

3.6 Connecting I2C EEPROMs

I2C EEPROMs or other I2C compatible devices should be connected to the DIO pins DIO4 and DIO5, as shown in Figure 12.

Pull-up resistors of roughly 10 kΩ to V3P3D should be used for both SCL and SDA signals. The DIO_EEX register in I/O RAM must be set to 01 in order to convert the DIO pins DIO4 and DIO5 to I

pins SCL and SDA.

Figure 12: I2C EEPROM Connection

Rev 2 23

78M6612 Data Sheet DS_6612_001

TX0

RX0

10k

100pF

78M6612

10k

100pF

RX0

TX0

DIO4

DIO5

EEPROM

SCLK

V3P3D

10k

DIOn

10k

DIO4

DIO5

78M6612

EEPROM

SCLK

V3P3D

10k

DIOn

10k

3.7 Connecting Three-Wire EEPROMs

µWire EEPROMs and other compatible devices should be connected to the DIO pins DIO4 and DIO5, as shown in Figure 13 and described below:

• DIO5 connects to both the DI and DO pins of the three-wire device.

• The CS pin must be connected to a vacant DIO pin of the 78M6618.

• In order to prevent bus contention, a 10 kΩ to resistor is used to separate the DI and DO signals.

• The CS and CLK pins should be pulled down with resistors to prevent operation of the three-wire

device on power-up, before the 78M6618 can establish a stable signal for CS and CLK.

• The DIO_EEX register in I/O RAM must be set to 2 (b10) in order to convert the DIO pins DIO4 and

DIO5 to µWire pins.

The µ-Wire EEPROM interface is only functional when MPU_DIV[2:0] = 000.

Figure 13: Three-Wire EEPROM Connection

3.8 UART0 (TX0/RX0)

The UART0 RX0 pin should be pulled down by a 10 kΩ resistor and additionally protected by a 100 pF ceramic capacitor, as shown in Figure 14.

Figure 14: Connections for the RX0 Pin

24 Rev 2

DS_6612_001 78M6612 Data Sheet

V3P3

5kΩ

100pF

GND

V3P3

5kΩ

100pF

GND

R 1 RESE

78M6612

DGN

V3P3D

R 2 Reset

Switc

1k Ω 1nF

10k Ω R 1 DGN

VBAT/ V3P3D

Reset

Switc

1k Ω 1nF

10k Ω R 1 100

RESET

78M6612

DGND

100

3.9 UART1 (TX1/RX1)

The TX1 and RX1 pins can be used for a regular serial interface (by connecting a RS-232 transceiver for example), or they can be used to directly operate optical components (for example, an infrared diode and phototransistor implementing a FLAG interface).

3.10 Connecting V1 and Reset Pins

A voltage divider should be used to establish that V1 is in a safe range (see Figure 15). V1 must be lower than 2.9 V in all cases in order to keep the hardware watchdog timer enabled. A series 5 kΩ

resistor (R3) and a capacitor to ground (C1) are added for enhanced EMC immunity. The parallel impedance of R1 and R2 should be approximately 8 kΩ to 10 kΩ in order to provide hysteresis for the

power fault monitor.

Figure 15: Voltage Divider for V1

Even though a functional power and measurement unit will not necessarily need a reset switch, it is useful to have a reset pushbutton switch for prototyping, as shown in Figure 16, left side. The RESET signal may be sourced from V3P3SYS, or VBAT (if a battery is present), or from a combination of these sources, depending on the application.

For production, the RESET pin should be protected by the external components shown in Figure 16, right side. R

should be in the range of 100 Ω and mounted as closely as possible to the IC. The RESET pin

can also be directly connected to ground.

Figure 16: External Components for RESET: Development Circuit (Left), Production Circuit (Right)

Rev 2 25

78M6612 Data Sheet DS_6612_001

E_RST

E_RXT

E_TCL

62 Ω 62 Ω 6

22p

LCD

(optional

ICE_E

V3P3D

E_RST

78M661

E_RXTX

E_TCLK

62 Ω 62 Ω 6

22p

LCD

(optional

ICE_E

V3P3D

3.11 Connecting the Emulator Port Pins

Even when the emulator is not used, small shunt capacitors to ground (22 pF) should be used for protection from EMI as illustrated in Figure 17. Production boards should have the ICE_E pin connected to ground.

Figure 17: External Components for the Emulator Interface

3.12 Flash Programming

Operational or test code can be programmed into the Flash memory using either an in-circuit emulator or the Flash Programmer Module (TFP2) available from Maxim. The Flash programming procedure uses the E_RST, E_RXTX, and E_TCLK pins.

3.13 MPU Firmware Library

Any applications-specific MPU functions mentioned above are available from Maxim as a standard ANSI C library and as ANSI “C” source code. Sample application code using the measurement library is preprogrammed in Evaluation Kits for the 78M6618 IC and can be pre-programmed into engineering IC samples for system evaluation. Application code allows for quick and efficient evaluation of the IC without having to write firmware or having to purchase an in-circuit emulator (ICE). A Software Licensing Agreement (SLA) can be signed to receive either the source Flash HEX file for use in a production environment or source code and SDK documentation for modification.

3.14 Crystal Oscillator

The oscillator drives a standard 32.768 kHz watch crystal. The oscillator has been designed specifically to handle these crystals and is compatible with their high impedance and limited power handling capability. Good layouts will have XIN and XOUT shielded from each other.

Since the oscillator is self-biasing, an external resistor must not be connected across the crystal.

26 Rev 2

DS_6612_001 78M6612 Data Sheet

3.15 Measurement Calibration

Once the 78M6612 energy measurement device has been installed in a measurement system, it is typically calibrated. A complete calibration includes the following:

• Calibration of the metrology section, i.e. calibration for tolerances of the current sensors, voltage

dividers and signal conditioning components as well as of the internal reference voltage (VREF).

• Establishment of the reference temperature (Section 3.3) for temperature measurement and

temperature compensation (Section 3.4).

The metrology section can be calibrated using the gain and phase adjustment factors accessible to the CE. The gain adjustment is used to compensate for tolerances of components used for signal conditioning, especially the resistive components. Phase adjustment is provided to compensate for phase shifts introduced by certain types of current sensors or by the effects of reactive power supplies.

Due to the flexibility of the MPU firmware, any calibration method, such as calibration based on energy, or current and voltage can be implemented. It is also possible to implement segment-wise calibration (depending on current range).

Rev 2 27

78M6612 Data Sheet DS_6612_001

Supplies and Ground Pins

Analog Output Pins

Temperature and ESD Stress

4 Electrical Specifications

4.1 Absolute Maximum Ratings

Table 5 shows the absolute maximum ranges for the device. Stresses beyond Absolute Maximum

Ratings may cause permanent damage to the device. These are stress ratings only and functional operation at these or any other conditions beyond those indicated under recommended operating conditions (Section 4.3) is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to GNDA.

Table 5: Absolute Maximum Ratings

V3P3SYS, V3P3A -0.5 V to 4.6 V

VBAT -0.5 V to 4.6 V

GNDD -0.5 V to +0.5 V

V3P3D

VREF

V2P5

Analog Input Pins

IA, VA, IB, VB, V1

XIN, XOUT

All Other Pins

Configured as SEG or COM drivers

Configured as Digital Inputs

Configured as Digital Outputs

All other pins -0.5 V to V3P3D+0.5 V

-10 mA to 10 mA,

-0.5 V to 4.6 V

-10 mA to +10 mA,

-0.5 V to V3P3A+0.5 V

-10 mA to +10 mA,

-0.5 V to 3.0 V

-10 mA to +10 mA

-0.5 V to V3P3A+0.5 V

-10 mA to +10 mA

-0.5 V to 3.0 V

-1 mA to +1 mA,

-0.5 to V3P3D+0.5

-10 mA to +10 mA,

-0.5 to 6 V

-15 mA to +15 mA,

-0.5 V to V3P3D+0.5 V

Operating junction temperature (peak, 100 ms) 140 °C

Operating junction temperature (continuous) 125 °C

Storage temperature -45 °C to +165 °C

Solder temperature – 10 second duration 250 °C

ESD stress on all pins 4 kV

Stresses beyond Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to GNDA.

28 Rev 2

DS_6612_001 78M6612 Data Sheet

Name

From

Function

Value

Unit

1.0±30%

4.2 Recommended External Components

Table 6: Recommended External Components

C1 V3P3A AGND

C2 V3P3D DGND

CSYS V3P3SYS DGND

C2P5 V2P5 DGND

XTAL XIN XOUT 32.768 kHz crystal – electrically similar to

Bypass capacitor for 3.3V supply.

Bypass capacitor for 3.3V output.

Bypass capacitor for V3P3SYS.

Bypass capacitor for V2P5.

≥0.1±20% µF

0.1±20% µF

≥

0.1±20% µF

32.768 kHz ECS .327-12.5-17X or Vishay XT26T, load capacitance 12.5 pF.

CXS † XIN AGND Load capacitor for crystal (exact value

CXL † XOUT AGND

†

Depending on trace capacitance, higher or lower values for CXS and CXL must be used. Capacitance

depends on crystal specifications and parasitic capacitance of board).

27±10% 27±10%

from XIN to GNDD and XOUT to GNDD (combining pin, trace and crystal capacitance) should be 35 pF to 37 pF.

4.3 Recommended Operating Conditions

Table 7: Recommended Operation Conditions

Parameter Condition Min Typ Max Unit

V3P3SYS, V3P3A: 3.3V Supply Voltage V3P3A and V3P3SYS must be at the same voltage

VBAT No Battery Externally Connect to V3P3SYS

Operating Temperature -40 +85 ºC

Normal Operation 3.0 3.3 3.6 V

Battery Backup 0 3.6 V

Battery Backup BRN and LCD modes SLEEP mode

3.0

2.0

3.8

V V

Rev 2 29

78M6612 Data Sheet DS_6612_001

Other digital inputs

-1

µA

4.4 Performance Specifications

4.4.1 Input Logic Levels

Table 8: Input Logic Levels

Parameter Condition Min T yp Max Unit

Digital high-level input voltage†, VIH 2 V

Digital low-level input voltage†, VIL 0.8 V

Input pull-up current, IIL E_RXTX, E_RST, CKTEST Other digital inputs

Input pull down current, IIH ICE_E

†

In battery powered modes, digital inputs should be below 0.3 V or above 2.5 V to minimize battery

current.

4.4.2 Output Logic Levels

VIN=0V, ICE_E=1

VIN=V3P3D

Table 9: Output Logic Levels

10 10

-1

100 100

100

µA µA µA

µA

Parameter Condition Min Typ Max Unit

= 1 mA V3P3D-0.4 V

Digital high-level output voltage VOH

Digital low-level output voltage VOL

LOAD

= 15 mA V3P3D-0.6 V

LOAD

= 1 mA 0 0.4 V

LOAD

= 15 mA 0.8 V

LOAD

TX1 VOH (V3P3D-TX1) ISOURCE=1 mA 0.4 V

TX1 VOL ISINK=20 mA 0.7 V

4.4.3 Power-Fault Comparator

Table 10: Power-Fault Comparator Performance Specifications

Parameter Condition Min T yp Max Unit

Offset Voltage: V1-VBIAS -20 +15 mV

Hysteresis Current: V1 Vin = VBIAS – 100 mV 0.8 1.2

Response Time: V1 +100 mV overdrive 2 5 10

WDT Disable Threshold (V1-V3P3A) -400 -10 mV

µA

µs

30 Rev 2

DS_6612_001 78M6612 Data Sheet

Parameter

Condition

Min

Typ

Max

Unit

-2.3

4.4.4 Battery Monitor

Table 11: Power-Fault Comparator Performance Specifications (BME=1)

Load Resistor 27 45 63 kΩ

LSB Value - does not include the 9-bit left shift at CE input.

FIR_LEN=0 FIR_LEN=1

-6.0

-2.6

-5.4

-4.9

-2.0

µV µV

Offset Error -200 -72 +100 mV

4.4.5 Supply Current

Table 12: Supply Current Performance Specifications

Parameter Condition Min T yp Max Unit

Normal Operation,

V3P3A + V3P3SYS current

V3P3A=V3P3SYS=3.3V

6.1 7.7 mA

MPU_DIV[1:0]=3 (614 kHz) CKOUT_E[1:0]=00, CE_EN=1,

VBAT current -300 +300 nA

RTM_E=0, ECK_DIS=1, ADC_E=1, ICE_E=0

V3P3A + V3P3SYS current vs. MPU clock frequency

V3P3A + V3P3SYS current, Write Flash

VBAT current †

†

Current into V3P3A and V3P3SYS pins is not zero if voltage is applied at these pins in brownout, LCD or

Same conditions as above 0.5

Normal Operation as above, except write Flash at maximum

9.1 10 mA

rate, CE_E=0, ADC_E=0

VBAT=3.6V BROWNOUT mode, <25°C BROWNOUT mode, <>5°C

LCD Mode, 25 °C LCD mode, over temperature SLEEP Mode, 25 °C Sleep mode, over temperature

48 65

5.7

2.9

120 150

8.5 15

5.0 10

mA/

MHz

µA µA

µA µA µA µ

sleep modes.

4.4.6 V3P3D Switch

Table 13: V3P3D Switch Performance Specifications

Parameter Condition Min T yp Max Unit

On resistance – V3P3SYS to V3P3D | I

On resistance – VBAT to V3P3D | I

| ≤ 1 mA

V3P3D

| ≤ 1 mA 40 Ω

V3P3D

10 Ω

Rev 2 31

78M6612 Data Sheet DS_6612_001

Parameter

Condition

Min

Typ

Max

Unit

Parameter

Condition

Min

Typ

Max

Unit

V2P5

2.0

2.5

2.7

Parameter

Condition

Min

Typ

Max

Unit

4.4.7 2.5V Voltage Regulator

Unless otherwise specified, load = 5 mA.

Table 14: 2.5 V Voltage Regulator Performance Specifications

Voltage overhead V3P3-V2P5

PSSR ∆V2P5/∆V3P3

Reduce V3P3 until V2P5 drops 200 mV

440 mV

RESET=0, iload=0 -3 +3 mV/V

4.4.8 Low Power Voltage Regulator

Unless otherwise specified, V3P3SYS=V3P3A=0.

Table 15: Low-Power Voltage Regulator Performance Specifications

LOAD

V2P5 load regulation ILOAD=0 mA to 1 mA 30 mV

LOAD=1 mA,

VBAT voltage requirement

Reduce VBAT until

3.0 V

REG_LP_OK=0

PSRR ΔV2P5/ΔVBAT ILOAD=0

-50 50 mV/V

4.4.9 Crystal Oscillator

Table 16: Crystal Oscillator Performance Specifications

Maximum Output Power to Crystal Crystal connected 1

XIN to XOUT Capacitance 3 pF

Capacitance to DGND XIN XOUT

5 5

µW

pF pF

32 Rev 2

DS_6612_001 78M6612 Data Sheet

2)22(1)22()22()(

TCTTCTVREFTVNOM −+−+=

V/°C2

)()(

VNOM

TVNOMTVREF −

Parameter

Condition

Min

Typ

Max

Unit

4.4.10 VREF, VBIAS

Unless otherwise specified, VREF_DIS=0.

Table 17: VREF, VBIAS Performance Specifications

Parameter Condition Min T yp Max Unit

VREF output voltage, VNOM(25) Ta = 22ºC 1.193 1.195 1.197 V

VREF chop step 50 mV

VREF output impedance

VREF_CAL =1, I

LOAD = 10 µA, -10 µA

2.5 kΩ

VNOM definition1

VREF temperature coefficients TC1 TC2

+7.0

-0.341

VREF aging ±25

µV/ºC

ppm/

VREF(T) deviation from VNOM(T)

VBIAS voltage

This relationship describes the nominal behavior of VREF at different temperatures.

Ta = -40ºC to +85ºC -40 +40

Ta = 25 ºC Ta = -40 ºC to 85 ºC

(-1%) (-4%)

1.6

(+1%) (+4%)

ppm/º

4.4.11 LCD Drivers

The information in Table 18 applies to all COM and SEG pins.

Table 18: LCD Drivers Performance Specifications

VLC2 Max Voltage With respect to VLCD -0.1 0+.1 V

VLC1 Voltage, ⅓ bias ½ bias

VLC0 Voltage, ⅓ bias ½ bias

With respect to 2*VLC2/3 With respect to VLC2/2

With respect to VLC2/3 With respect to VLC2/2

-4

-3

+2 +2

year

V V

% %

VLCD is V3P3SYS in MISSION mode and VBAT in BROWNOUT and LCD modes.

Rev 2 33

78M6612 Data Sheet DS_6612_001

)cos(

*10

VcrosstalkVin

Vin

Vcrosstalk

∠−∠

FIR_LEN

3.3/33100

/35710

APV

VnVNout

INPK

∆

Parameter

Condition

Min

Typ

Max

Unit

TX1 VOH (V3P3D-TX1)

=1 mA

0.4

TX1 VOL

ISINK=20 mA

0.7

Parameter

Condition

Min

Typ

Max

Unit

N(T)= Sn*(T-Tn)+Nn

Temperature Error†



 





 



−

−=

NTN

TERR

))((

4.4.12 ADC Converter, V3P3A Referenced

FIR_LEN=0, VREF_DIS=0, LSB values do not include the 9-bit left shift at CE input.

Table 19: ADC Converter Performance Specifications

Parameter Condition Min Typ Max Unit

Recommended Input Range (Vin-V3P3A)

Voltage to Current Crosstalk:

-250 250

Vin = 200 mV peak, 65 Hz, on VA

Vcrosstalk = largest

-10 10 μV/V

measurement on IA or IB

THD (First 10 harmonics) 250 mV-pk 20 mV-pk

Vin=65 Hz, 64 kpts FFT, BlackmanHarris window

-75

-90

Input Impedance Vin=65 Hz 40 90 kΩ

Temperature coefficient of Input Impedance

LSB size

Digital Full Scale

Vin=65 Hz 1.7 Ω/°C

FIR_LEN=0 FIR_LEN=1

FIR_LEN=1

357 151

+884736

±2097152

ADC Gain Error vs %Power Supply Variation

Vin=200 mV pk, 65 Hz V3P3A=3.0V, 3.6V

50 ppm/%

peak

dB dB

nV/LSB

LSB

Input Offset (Vin-V3P3A)

-10 10 mV

4.4.13 UART1 Interface

Table 20: UART1 Interface Performance Specifications

SOURCE

4.4.14 Temperature Sensor

Table 21: Temperature Sensor Performance Specifications

Nominal Sensitivity (Sn) †

Nominal (Nn)

† †

1.0

†

LSB values do not include the 9-bit left shift at CE input.

††

Nn is measured at Tn during calibration and is stored in MPU or CE for use in temperature calculations.

A=25ºC, TA=75ºC,

FIR_LEN = 1 Nominal relationship:

A = -40ºC to +85ºC

Tn = 25°C

-2180 LSB/ºC

-10 +10 ºC

LSB

34 Rev 2

DS_6612_001 78M6612 Data Sheet

CKMPU = 4.9152 MHz

Cycles

CKMPU = 1.25 MHz

Cycles

CKMPU = 614 kHz

Cycles

V3P3A=V3P3SYS=0 BROWNOUT MODE

Flash write cycles

-40 °C to +85 °C

20,000

Cycles

Flash data retention

25 °C

100

Years

Flash data retention

85 °C

Years

Flash byte writes between page or mass erase operations

4.5 Timing Specifications

4.5.1 RAM and Flash Memory

Table 22: RAM and Flash Memory Specifications

Parameter Condition Min T yp Max Unit

CE DRAM wait states

Flash Read Pulse Width

2 Cycles

100 ns

4.5.2 Flash Memory Timing

Table 23: Flash Memory Timing Specifications

Parameter Condition Min T yp Max Unit

Write Time per Byte

Page Erase (512 bytes)

Mass Erase

42 µs

20 ms

200 ms

4.5.3 EEPROM Interface

Table 24: EEPROM Interface Timing

Parameter Condition Min T yp Max Unit

CKMPU=4.9152 MHz,

Write Clock frequency (I2C)

Write Clock frequency (3-wire) CKMPU=4.9152 MHz

Using interrupts

CKMPU=4.9152 MHz, “bit-banging” DIO4/5

78 kHz

150 kHz

500 kHz

4.5.4 RESET and V1

Table 25: RESET and V1 Timing

Parameter Condition Min T yp Max Unit

Reset pulse fall time 1

Reset pulse width 5

V1 Response Time +100 mv overdrive 10 37 100

4.5.5 RTC

Parameter Condition Min T yp Max Unit

Range for date 2000 2255 year

Rev 2 35

µs µs µs

Table 26: RTC Range

78M6612 Data Sheet DS_6612_001

TERIDIAN

78M6612-IGT

2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

2627282930

171819

2021222324

646362

TMUXOUT

TX1/DIO2

TX0

SEG37/DIO17

SEG3

V3P3D

SEG19/CKTEST

SEG4 SEG5

COM1

V3P3SYS

COM3

E_RXTX/SEG38

GNDD

COM2

SEG13

SEG12

SEG7

SEG8

SEG6

SEG36/DIO16

SEG35/DIO15

SEG34/DIO14

SEG2

SEG1

SEG16

SEG0

SEG9

SEG11

SEG10

SEG27/DIO7

SEG40/DIO20

SEG26/DIO6 SEG25/DIO5

SEG29/DIO9

RX0

SEG31/DIO11

RESET V2P5 VBAT

SEG24/DIO4

SEG28/DIO8

ICE_E SEG18 SEG17

SEG30/DIO10

E_RST/SEG32

E_TCLK/SEG33VAGNDD

XOUT

TEST

XIN

VREFIAIB

V3P3A

GNDA

GNDD

RX1/DIO1

SEG39/DIO19

COM0

5 Packaging

5.1 64-Pin LQFP Package

5.1.1 Pinout

36 Rev 2

Figure 18: 64-Pin LQFP Pinout

DS_6612_001 78M6612 Data Sheet

11.7

12.3

0.60 Typ.

1.40

1.60

11.7

12.3

0.00

0.20

9.8

10.2

0.50 Typ.

0.14

0.28

PIN No. 1 Indicator

5.1.2 Package Outline (LQFP 64)

NOTE

: Controlling dimensions are in mm.

Rev 2 37

78M6612 Data Sheet DS_6612_001

5.1.3 Recommended PCB Land Pattern for the LQFP-64 Package

Recommended PCB Land Pattern Dimensions

Symbol Description

Typical

Dimension

e Lead pitch 0.5 mm

x Pad width 0.25 mm

y Pad length. See Note. 2.0 mm

A 7.75 mm

G 9.0 mm

Note: The y dimension has been elongated to allow for hand soldering and reworking. Production

assembly may allow this dimension to be reduced as long as the G dimension is maintained.

38 Rev 2

DS_6612_001 78M6612 Data Sheet

TERIDIAN

78M

6612-IM

GNDD

E_RXTX/SEG38

68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52

18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34

TX1/DIO2

TMUXOUT

DIO3

TX0

SEG3

V3P3D

CKTEST/SEG19

V3P3SYS

SEG4

SEG5

SEG37/DIO17

COM0

COM1

COM2

COM3

SEG0

SEG1

SEG2

SEG34/DIO14

SEG35/DIO15

SEG36/DIO16

SEG39/DIO19

SEG6

SEG7

SEG8

SEG9

SEG10

SEG11

SEG12

SEG13

SEG14

SEG15

SEG16

SEG17

SEG18

ICE_E

SEG24/DIO4

SEG25/DIO5

SEG26/DIO6

SEG27/DIO7

SEG28/DIO8

SEG29/DIO9

SEG30/DIO10

SEG31/DIO11

SEG40/DIO20

RX0

VBAT

V2P5

RESET

GNDA

V3P3A

VREF

RX1/DIO1

GNDD

XIN

XOUT

TEST

GNDD

E_RST/SEG32

E_TCLK/SEG33

SEG41/DIO21

5.2 68-Pin QFN Package

5.2.1 Pinout

Rev 2 39

Figure 19: 68-Pin QFN Pinout

78M6612 Data Sheet DS_6612_001

5.2.2 Package Outline

Dimensions (in mm):

*) Pin length is nominally 0.4 mm (min. 0.3 mm, max 0.4 mm). **) Exposed pad is internally connected to GNDD.

40 Rev 2

DS_6612_001 78M6612 Data Sheet

Dimension

Pad width

0.23 mm

6.63 mm

5.2.3 Recommended PCB Land Pattern for the QFN-68 Package

Recommended PCB Land Pattern Dim ensions

Symbol Description

Typical

e Lead pitch 0.4 mm

y Pad length. See Note 3. 0.8 mm

d See Note 1. 6.3 mm

G 7.2 mm

Note 1: Do not place unmasked vias in region denoted by dimension d. Note 2: Soldering of bottom internal pad is not required for proper operation. Note 3: The y dimension has been elongated to allow for hand soldering and reworking. Production

assembly may allow this dimension to be reduced as long as the G dimension is maintained.

Rev 2 41

78M6612 Data Sheet DS_6612_001

supply.

should be connected to this pin.

Unused pins must be connected to V3P3A.

6 Pin Descriptions

6.1 Power/Ground Pins

Table 27: Power/Ground Pins

Name Type Circuit Description

GNDA P – Analog ground: This pin should be connected directly to the ground

plane.

GNDD P – Digital ground: This pin should be connected directly to the ground

plane.

V3P3A P – Analog power supply: A 3.3V power supply should be connected to

this pin, must be the same voltage as V3P3SYS.

V3P3SYS P – System 3.3 V supply. This pin should be connected to a 3.3 V power

V3P3D O 13 Auxiliary voltage output of the chip, controlled by the internal 3.3 V

selection switch. In mission mode, this pin is internally connected to V3P3SYS. In BROWNOUT mode, it is internally connected to VBAT. This pin is floating in LCD and sleep mode.

VBAT P 12 Battery backup power supply. A battery or super-capacitor is to be

connected between VBAT and GNDD. If no battery is used, connect VBAT to V3P3SYS.

V2P5 O 10 Output of the internal 2.5 V regulator. A 0.1 µF capacitor to GNDA

6.2 Analog Pins

Table 28: Analog Pins

Name Type Circuit Description

IA, IB I 6 Line Current Sense Inputs: These pins are voltage inputs to the

internal A/D converter. Typically, they are connected to the outputs of current sensors.

VA, VB I 6 Line Voltage Sense Inputs: These pins are voltage inputs to the

internal A/D converter. Typically, they are connected to the outputs of resistor dividers. Unused pins must be connected to V3P3A or tied to the voltage sense input that is in use.

V1 I 7 Comparator Input: This pin is a voltage input to the internal power-fail

comparator. The input voltage is compared to the internal BIAS voltage (1.6 V). If the input voltage is above VBIAS, the comparator output will be high (1). If the comparator output is lower, a voltage fault will occur and the chip will be forced to battery mode.

VREF O 9 Voltage Reference for the ADC. This pin is normally disabled by

setting the VREF_CAL bit in the I/O RAM and can then be left

µF capacitor to GNDA should be

XIN XOUT

unconnected. If enabled, a 0.1 connected.

I 8 Crystal Inputs: A 32 kHz crystal should be connected across these

pins. Typically, a 27 pF capacitor is also connected from each pin to GNDA. It is important to minimize the capacitance between these pins. See the crystal manufacturer datasheet for details.

Pin types: P = Power, O = Output, I = Input, I/O = Input/Output The circuit number denotes the equivalent circuit, as specified in Section 7 I/O Equivalent Circuits.

42 Rev 2

DS_6612_001 78M6612 Data Sheet

Name

Type

Circuit

Description

COM3,

COM0

LCD common outputs: These f our pins provide the select signals for the

SEG0…SEG18

Dedicated LCD segment output pins. SEG 14 and SEG15 are only available on the 68-pin package.

SEG24/DIO4…

I/O

3, 4, 5

Multi-use pins, configurable as either LCD SEG driver or DIO. (DIO4 =

firmware.

SEG34/DIO14

SEG40/DIO20

I/O

3, 4, 5

Multi-use pins, configurable as either LCD SEG driver or DIO. If unused,

SEG41/DIO21

I/O

3, 4, 5

Multi-use pins, configurable as LCD driver or DIO (QFN 68 package only).

by the firmware.

E_RST/SEG32

Multi-use pins, configurable as either emulator port pins (when ICE_E

E_TCLK/SEG33

4, 5

ICE_E I 2

ICE enable. When zero, E_RST, E_TCLK, and E_RXTX become SEG32,

CKTEST/SEG19

4, 5

Multi-use pin, configurable as either Clock PLL output or LCD segment driver. Can be enabled and disabled by

TMUXOUT

Digital output test multiplexer. Controlled by TMUX[4:0].

Multi-use pin, configurable as UART1 Input or general DIO. When con-

output by the firmware.

TX1/DIO2

I/O

3, 4

Multi-use pin, configurable as a transmit output from UART1 (or optionally

open, or configured as a DIO and set to an output by the firmware.

DIO3

I/O

3, 4

DIO pin (QFN 68 package only)

RESET

This input pin resets the chip into a known state. For normal operation,

normal operation.

RX0 I 3

UART input. If unused, this pin must be terminated to V3P3D or GNDD.

TX0 O 4

UART output.

TEST I 7

Enables Production Test. Must be grounded in normal operation.

6.3 Digital Pins

COM2, COM1,

SEG31/DIO11

… SEG37/DIO17, SEG39/DIO19,

E_RXTX/SEG38

LCD display.

SCK, DIO5 = SDA when configured as EEPROM interface, WPULSE = DIO6, VARPULSE = DIO7 when configured as pulse outputs). If unused,

these pins must be configured as DIOs and set to outputs by the

these pins must be configured as DIOs and set to outputs by the firmware.

If unused, this pin must be configured as a DIO and set to an output

I/O 1, 4, 5

pulled high) or LCD SEG drivers (when ICE_E tied to GND).

SEG33, and SEG38 respectively. For production units, this pin should be pulled to GND to disable the emulator port. This pin sho uld be brought out to the programming interface in order to create a way for reprogramming parts that have the SECURE bit set.

CKOUT_E[1:0]

RX1/DIO1 I/O 3, 4, 7

figured as RX1, this pin can optionally receive a signal from an external photo-detector used in an IR serial interface. If unused, this pin must be

terminated to V3P3D or GNDD, or configured as a DIO and set to an

an Optical LED Transmit Output), WPULSE, RPULSE, or general DIO. When configured as TX1, this pin is capable of directly driving an LED for transmitting data in an IR serial interface. If unused, this pin must be left

this pin is connected to GNDD. To reset the chip, this pin should be pulled high. No external reset circuitry is necessary. Direct connect to ground in

Pin types: P = Power, O = Output, I = Input, I/O = Input/Output The circuit number denotes the equivalent circuit, as specified on the following page.

Rev 2 43

78M6612 Data Sheet DS_6612_001

Digital Input Equivalent Circuit

Type 1:

Standard Digital Input or

pin configured as DIO Input

with Internal Pull-Up

GNDD

110K

V3P3D

CMOS

Input

V3P3D

Digital

Input

CMOS

Output

GNDD

V3P3D

GNDD

V3P3D

Digital Output Equivalent Circuit

Type 4:

Standard Digital Output or

pin configured as DIO Output

Digital

Output

LCD Output Equivalent Circuit

Type 5:

LCD SEG or

pin configured as LCD SEG

LCD

Driver

GNDD

LCD SEG

Output

MUX

GNDA

V3P3A

Analog Input Equivalent Circuit

Type 6:

ADC Input

Analog

Input

Comparator Input Equivalent

Circuit Type 7:

Comparator Input

GNDA

V3P3A

Comparator

Input

VREF Equivalent Circuit

Type 9:

VREF

from

internal

reference

GNDA

V3P3A

VREF

V2P5 Equivalent Circuit

Type 10:

V2P5

from

internal

reference

GNDD

V3P3D

V2P5

VBAT Equivalent Circuit

Type 12:

VBAT Power

GNDD

Power

Down

Circuits

VBAT

V3P3D Equivalent Circuit

Type 13:

V3P3D

from

V3P3SYS

V3P3D

from

VBAT

Oscillator Equivalent Circuit

Type 8:

Oscillator I/O

Oscillator

GNDD

Oscillator

Digital Input

Type 2:

Pin configured as DIO Input

with Internal Pull-Down

GNDD

110K

GNDD

CMOS

Input

V3P3D

Digital

Input

Digital Input Type 3:

Standard Digital Input or

pin configured as DIO Input

GNDD

CMOS

Input

V3P3D

Digital

Input

7 I/O Equivalent Circuits

44 Rev 2

DS_6612_001 78M6612 Data Sheet

(Lead(Pb)-free)

8 Ordering Information

Part Description

Part

78M6612

*Contact the factory for more information on programmed part options.

(Package, accuracy)

64-pin LQFP, 0.5%

64-pin LQFP, 0.5% (Lead(Pb)-free)

64-pin LQFP, 0.5%

64-pin LQFP, 0.5% (Lead(Pb)-free)

68-pin QFN, 0.5%

68-pin QFN, 0.5% (Lead(Pb)-free)

Flash

Memory

Size

32KB Bulk 78M6612-IGT/F 78M6612-IGT

32KB Tape & Reel 78M6612-IGTR/F 78M6612-IGT

32KB

32KB Bulk 78M6612-IM/F 78M6612-IM

32KB Tape & Reel 78M6612-IMR/F 78M6612-IM

32KB

Packaging Ordering Number

*Programmed,

Bulk

*Programmed,

Tape & Reel

*Programmed,

Bulk

*Programmed,

Tape & Reel

9 Contact Information

Package

Marking

78M6612-IGT/F/P 78M6612-IGT

78M6612-IGTR/F/P 78M6612-IGT

78M6612-IM/F/P 78M6612-IM

78M6612-IMR/F/P 78M6612-IM

For more information about Maxim products or to check the availability of the 78M6613, contact technical support at

www.maxim-ic.com/support.

Rev 2 45

78M6612 Data Sheet DS_6612_001

1/12

Revision History

REVISION DATE DESCRIPTION

1.0 4/1/2009

1.3 5/7/2010

First publication.

Moved firmware specific information to respective developers manuals. Added Caution to Section 1.4.6: “Caution. If UART1 is being used for full

duplex operation, TX interrupts may be inadvertently cleared and thus a TX safety timer is recommended.”

Added Caution to Section 1.4.6 about UART0 interrupts. In Section 3.10, changed “I/O RAM register TX1DIS” to “I/O RAM register

TX1E”. In Figure 18, corrected the name of pin 45 from “RX” to “RX0”.

Added Maxim logo.

46 Rev 2

Maxim cannot assume responsibility for use of any circuitry other than c ircuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Max im reserv es the right to change the circuitry and spec ifications without notice at any time.

Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408- 737- 7600

 2012 Maxim Integrated Pr oducts Maxim is a register ed trademark of Maxim Integrated Products.

MAXIM 78M6612 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

1 Hardware Description

1.1 Hardware Overview

1.2 Analog Front End (AFE)

1.2.1 Input Multiplexer

1.2.2 A/D Converter (ADC)

1.2.3 FIR Filter

1.2.4 Voltage References

1.2.5 Temperature Sensor

1.2.6 Battery Monitor

1.3 Digital Computation Engine (CE)

1.3.1 Real-Time Monitor

1.3.2 Pulse Generator

1.3.3 Data RAM (XRAM)

1.4 80515 MPU Core

1.4.1 UARTs

1.5 On-Chip Resources

1.5.1 Oscillator

1.5.2 PLL and Internal Clocks

1.5.3 Real-Time Clock (RTC)

1.5.4 Temperature Sensor

1.5.5 Flash Memory

1.5.6 Optical Interface

1.5.7 Digital I/O

1.5.8 LCD Drivers

1.5.9 EEPROM Interface

Two-Pin EEPROM Interface

1.5.10 Hardware Watchdog Timer

1.5.11 Test Ports (TXUXOUT pin)

2 Functional Description

2.1 Theory of Operation

2.2 Fault and Reset Behavior

2.2.2 Power Fault Circuit

2.3 Data Flow

2.4 CE/MPU Communication

3 Application Information

3.1 Connection of Sensors (CT, Resistive Shunt)

3.2 Connecting 5 V Devices

3.3 Temperature Measurement

3.4 Temperature Compensation

3.5 Connecting LCDs

3.6 Connecting I2C EEPROMs

3.7 Connecting Three-Wire EEPROMs

3.8 UART0 (TX0/RX0)

3.9 UART1 (TX1/RX1)

3.10 Connecting V1 and Reset Pins

3.11 Connecting the Emulator Port Pins

3.12 Flash Programming

3.13 MPU Firmware Library

3.14 Crystal Oscillator

3.15 Measurement Calibration

4 Electrical Specifications

4.1 Absolute Maximum Ratings

4.2 Recommended External Components

4.3 Recommended Operating Conditions

4.4 Performance Specifications

4.4.5 Supply Current

4.5 Timing Specifications

5 Packaging

5.1 64-Pin LQFP Package

5.1.1 Pinout

5.1.2 Package Outline (LQFP 64)

5.1.3 Recommended PCB Land Pattern for the LQFP-64 Package

5.2 68-Pin QFN Package

5.2.1 Pinout

5.2.2 Package Outline

5.2.3 Recommended PCB Land Pattern for the QFN-68 Package

6 Pin Descriptions

6.1 Power/Ground Pins

6.2 Analog Pins

6.3 Digital Pins

7 I/O Equivalent Circuits

8 Ordering Information

9 Contact Information

Revision History