Marvel Group 88F6281 User Manual

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88F6281
Hardware Specifications
Doc. No. MV-S104859-U0, Rev. E December 2, 2008, Preliminary
Document Classification: Proprietary Information
88F6281 Hardware Specifications
Document Conventions
Note: Provides related information or information of special importance.
Caution: Indicates potential damage to hardware or software, or loss of data.
Warning: Indicates a risk of personal injury.
Document Status
Doc Status: Preliminary Technical Publication: 0.xx
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Doc. No. MV-S104859-U0 Rev. E Copyright © 2008 Marvell Page 2 Document Classification: Proprietary Information December 2, 2008, Preliminary
Sheeva™ CPU Core
16 KB-I, 16 KB-D
Up to 1.5 GHz
AES/DES/
3DES
SHA-1/MD5
Processor
Memory
Security Engin e
L2
Cache
256 KB
DDR
SDRAM
Controller
JTAG Interface
PCI Express
SATA
USB 2.0
High Speed I/0
PCI Express x1
Dual SATA ports
USB 2.0 port
88F6281 Functional Block Diagram
External DDR
800 MHz
Misc
FXS / FXO
SPI, NAND, SDIO
Slow Bus
TDM
UART x2 GPIO, TWSI Flash, SDIO
4 XOR/DMA channels
XOR Engine
Internal Bus
Gigabit Ethernet IEEE 1588AVB support
GE
GE
MPEG2-TS
I
2
S / S/PDIF
Media Interfaces
MPEG TS
Audio

PRODUCT OVERVIEW

88F6281
Integrated Controller
Hardware Specifications
The Marvell® 88F6281 is a high-performance, highly integrated controller. The 88F6281 is based on the Marvell proprietary, ARMv5TE-compliant, high-speed Sheeva
CPU core. The CPU core integrates a 256 KB L2 cache.
Copyright © 2008 Marvell Doc. No. MV-S104859-U0 Rev. E December 2, 2008, Preliminary Document Classification: Proprietary Information Page 3

FEATURES

88F6281 Hardware Specifications
The 88F6281 includes:
High-performance CPU core, running at up to
1.5 GHz, with integrated, four-way, set-associative L1 16-KB I-cache/16-KB D-cache and unified, 256-KB, four-way, set-associative L2 cache
High-bandwidth dual-port DDR2 memory interface
(16-bit DDR2 SDRAM @ up to 800 MHz data rate)
PCI Express (x1) port with integrated PHY
Two Gigabit Ethernet (10/100/1000 Mbps) MACs
USB 2.0 port with integrated PHY
Two SATA 2.0 ports w ith inte grated 3 Gbp s SATA II
PHY
Security Cryptographic engine
S/PDIF (Sony/Philips Digital Interconnect Format) /
2
S (Integrated Interchip Sound) Audio in/out
I interface
SD/SDIO/MMC interface
TDM SLIC/SLAC Codec interface
Two XOR engines, each containing two XOR/DMA
channels (a total of four XOR/DMA channels)
MPEG Transport Stream (TS) interface
SPI port with SPI flash boot support
8-bit NAND flash interface with boot support
Two 16550 compatible UART interfaces
TWSI port
50 multi-purpose pins
Internal Real Time Clock (RTC)
Interrupt controller
Timers
128-bit eFuse (one-time programmable memory)
Sheeva
CPU core
Up to 1.5 GHz
32-bit and 16-bit RISC architecture
Compliant with v5TE architecture, as published in
the ARM Architect Reference Manual, Second Edition
Includes MMU to support virtual memory features
256-KB, four-way, set-associative L2 unified cache
16-KB, four-way, set-associative I-cache
16-KB, four-way, set-associative D-cache
64-bit internal data bus
Branch Prediction Unit
Supports JTAG/ARM ICE
Supports both Big and Little Endian modes
DDR2 SDRAM controller
16-bit interface
Up to 400 MHz clock frequency (800 MHz data
rate)
DDR SDRAM with a clock ratio of 1:N and 2:N
between the DDR SDRAM and the CPU core, respectively
SSTL 1.8V I/Os
Auto calibration of I/Os output impedance
Supports four DRAM chip selects
Supports all DDR devices densities up to 2 Gb
Supports up to 32 open pages (page per bank)
Up to 2 GB total address space
Supports on-board DDR designs (no DIMM
support)
Supports 2T mode, to enable high-frequency
operation under heavy load configuration
Supports DRAM bank interleaving
Supports up to a 128-byte burst per single memory
access
PCI Express interface (x1)
PCI Express Base 1.1 compatible
Integrated low-power SERDES PHY, based on
®
proven Marvell
SERDES technology
Serves as a Root Complex or an Endpoint port
x1 link width
2.5 Gbps data rate
Lane polarity reversal support
Maximum payload size of 128 bytes
Single Virtual Channel (VC-0)
Replay buffer support
Extended PCI Express configuration space
Advanced Error Reporting (AER) support
Power management: L0s and software L1 support
Interrupt emulation message support
Error message support
PCI Express master specific features
Single outstanding read transaction
Maximum read request of up to 128 bytes
Maximum write request of up to 128 bytes
Up to four outstanding read transactions in
Endpoint mode
PCI Express target specific features
Supports up to eight read request transactions
Maximum read request size of 4 KB
Maximum write request of 128 bytes
Supports PCI Express access to all of the
controller’s internal registers
Two Integrated GbE (10/100/1000) MAC ports
Supports 10/100/1000 Mbps
Dedicated DMA for data movement between
memory and port
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Features
Priority queuing on receive based on Destination
Address (DA), VLAN Tag, and IP TOS
Layer 2/3/4 frame encapsulation detection
TCP/IP checksum on receive and transmit
Supports proprietary 200 Mbps Marvell MII (MMII)
interface
Supports four modes:
- Port 0 RGMII, Port 1 RGMII
- Port 0 RGMII, Port 1 MII/MMII
- Port 0 MII/MMII, port 1 RGMII
- Port 0 GMII, Port 1 N/A
DA filtering
Precise Timing Protocol (PTP)
Supports precise time stamping for packets, as
defined in IEEE 1588 PTP v1 and v2 and IEEE
802.1AS draft standards
Supports Flexible Time Application interface to
distribute PTP clock and time to other devices in the system
Optionally accepts an external clock input for time
stamping
Audio Video Bridging networks
Supports IEEE 802.1Qav draft Audio Video
Bridging networks
Supports time- and priority-aware egress pacing
algorithm to prevent bunching and bursting effects—suitable for audio/video applications
Supports Egress Jitter Pacer for AVB-Class A and
AVB-Class B traffic and strict priority for legacy traffic queues
USB 2.0 port
Serves as a peripheral or host
USB 2.0 compliant
Integrated USB 2.0 PHY
Enhanced Host Controller Interface (EHCI)
compatible as a host
As a host, supports direct connection to all
peripheral types (LS, FS, HS)
As a peripheral, connects to all host types (HS, FS)
and hubs
Up to four independent endpoints, supporting
control, interrupt, bulk, and isochronous data transfers
Dedicated DMA for data movement between
memory and port
T wo Integrated Marvell 3 Gbps (Gen2i) SA T A PHYs
Compliant with SATA II Phase 1 specifications
- Supports SATA II Native Command Queuing
(NCQ), up to 128 outstanding commands per port
- Fully supports first party DMA (FPDMA)
- Backwards compatible with SATA I devices
Supports SATA II Phase 2 advanced features
- 3 Gbps (Gen2i) SATA II speed
- Port Multiplier (PM)—Performs FIS-based
switching, as defined in SAT A working group PM definition
- Port Selector (PS)—Issues the protocol-bas ed
Out-Of-Band (OOB) sequence for selecting the active host port
Supports device 48-bit addressing
Supports ATA Tag Command Queuing
SATA II Host Controller
Enhanced-DMA (EDMA) for the SATA ports
Automatic command execution, without host
intervention
Command queuing support, for up to 32
outstanding commands
Separate SATA request/response queues
64-bit addressing support for descriptors and data
buffers in system memory
Read ahead
Advanced interrupt coalescing
Target mode operation—supports attaching two
88F6281 controllers through their Serial-ATA ports, enabling data communication between the 88F6281 controllers
Advanced drive diagnostics via the ATA SMART
command
Cryptographic engine
Hardware implementation on encryption and
authentication engines, to boost packet processing speed
Dedicated DMA to feed the hardware engines with
data from the internal SRAM memory or from the DDR memory
Implements AES, DES, and 3DES encryption
algorithms
Implements SHA1 and MD5 authentication
algorithms
S/PDIF / I
Either S/PDIF or I
Both S/PDIF and I
S/PDIF-specific features
2
S Audio In/Out interface
time
simultaneously active, transferring the same PCM data
2
S inputs can be active at one
2
S outputs can be
Compliant with 60958-1, 60958-3, and IEC61937
specifications
Sample rates of 44.1/48/96 kHz
16/20/24-bit depths
Copyright © 2008 Marvell Doc. No. MV-S104859-U0 Rev. E December 2, 2008, Preliminary Document Classification: Proprietary Information Page 5
88F6281 Hardware Specifications
2
I
S-specific features
Sample rates of 44.1/48/96 kHz
2
I
S input and I2S output operate at the same
sample rate
16/24-bit depths
2
I
S in and I2S out support independent bit depths
(16 bit/24 bit)
Supports plain I
2
S, right-justified and left-justified
formats
SD/SDIO/MMC host interface
1-bit/4-bit SDmem, SDIO, and MMC cards
Up to 50 MHz
Hardware generate/check CRC, on all command
and data transactions on the card bus
TDM SLIC/SLAC Codec interface
Generic interface to standard SLIC/SLAC codec
devices
Compatible with standard PCM highway formats
TDM protocol support for two channels, up to
128 time slots
Dedicated SPI interface for codec management
Integrated DMA to transfer voice data to/from
memory buffer
Two XOR engines and DMA
Two XOR/DMA channels per XOR engine (for a
total of four XOR/DMA channels)
Chaining via linked-lists of descriptors
Moves data from source interface to destination
interface
Supports increment or hold on both Source and
Destination Addresses
Supports XOR operation, on up to eight source
blocks—useful for RAID applications
Supports iSCSI CRC-32 calculation
NAND flash controller
8-bit NAND flash interface
Glueless interface to CE Care and CE Don’t Care
NAND flash devices
Boot support
Serial Peripheral Interface (SPI) controller
Up to 50 MHz clock
Supports direct boot from external SPI serial flash
memory
MPEG Transport Stream (TS) interface
ISO/IEC 13818-1 standard compliant
Supports any one of the following modes:
- Parallel (8 bit) input
- Parallel output
- Two independent serial interfaces
Data rate up to 80 Mbps
Two UART Interfaces
16550 UART compatible
Two pins for transmit and receive operations
Two pins for mode m control functions
Two-Wire Serial Interface (TWSI)
General purpose TWSI master/slave port
Can also be used for serial ROM initialization
50 dedicated Multi-Purpose Pins (MPPs) for
peripheral functions and general purpose I/O
Each pin can be configured independently.
GPIO inputs can be used to register interrupts from
external devices, and to generate maskable interrupts.
Only two of the following multiplexed interfaces
may be configured simultaneously:
- Audio
- TS
- TDM
- GbE Port 0 in GMII mode or GbE Port 1
Interrupt Controller
Maskable interrupts to CPU core (and PCI Express for a PCI Express endpoint)
Two general purpose 32-bit timers/countersInternal architecture
Mbus-L bus for high-performance, low-latency CPU
core to DDR SDRAM connectivity
Advanced Mbus architecture
Dual port DDR SDRAM controller connectivity to
both CPU and Mbus
Bootable from
SPI flash
SATA device
NAND flash
PCI Express
UART (for debug purpose)
288-pin HSBGA package, 19 x 19 mm, 1 mm ball
pitch
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Features
x16
x8
TDM
Usage Model Example: VoIP Gateway
PCI Express
Mini Card Wi-Fi
SD Card
USB Host
SATA Port
Multiplier
HDD
Audio
A/D – D/A
GbE PHY FXS FXO
NAND Flash
SPI Flash (op.)
On Board DDR2
88F6281
Copyright © 2008 Marvell Doc. No. MV-S104859-U0 Rev. E December 2, 2008, Preliminary Document Classification: Proprietary Information Page 7
88F6281 Hardware Specifications

Table of Contents

Product Overview.......................................................................................................................................3
Features.......................................................................................................................................................4
Preface.......................................................................................................................................................15
About this Document.......................................................................................................................................15
Related Documentation...................................................................................................................................15
Document Conventions...................................................................................................................................16
1 Pin and Signal Descriptions.......................................................................................................17
1.1 Pin Logic .........................................................................................................................................................18
1.2 Pin Descriptions..............................................................................................................................................19
1.3 Internal Pull-up and Pull-down Pins................................................................................................................48
2 Unused Interface Strapping........................................................................................................49
3 88F6281 Pin Map and Pin List .......... ... ... ... .... ... ............................................. ... .... ... ... ... .............50
4 Pin Multiplexing...........................................................................................................................51
4.1 Multi-Purpose Pins Functional Summary........................................................................................................51
4.2 Gigabit Ethernet (GbE) Pins Multiplexing on MPP..........................................................................................57
4.3 TSMP (TS Multiplexing Pins) on MPP.............................................................................................................59
5 Clocking .......................................................................................................................................60
5.1 Spread Spectrum Clock Generator (SSCG)....................................................................................................62
6 System Power Up/Down and Reset Settings............................................................................63
6.1 Power-Up/Down Sequence Requirements......................................................................................................63
6.2 Hardware Reset ..............................................................................................................................................64
6.3 PCI Express Reset.......................................... ... ... ..........................................................................................66
6.4 Sheeva
6.5 Pins Sample Configuration..............................................................................................................................66
6.6 Serial ROM Initialization..................................................................................................................................70
6.7 Boot Sequence................................................................................................................................................71
CPU TAP Controller Reset..............................................................................................................66
7 JTAG Interface.............................................................................................................................73
7.1 TAP Controller.................................................................................................................................................73
7.2 Instruction Register.........................................................................................................................................73
7.3 Bypass Register..............................................................................................................................................74
7.4 JTAG Scan Chain ............... ............................................................................... .. ...........................................74
7.5 ID Register........................................ ..............................................................................................................74
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Table of Contents
8 Electrical Specifications (Preliminary) ......................................................................................75
8.1 Absolute Maximum Ratings ............................................................................................................................75
8.2 Recommended Operating Conditions.............................................................................................................77
8.3 Thermal Power Dissipation .............................................................................................................................79
8.4 Current Consumption......................................................................................................................................80
8.5 DC Electrical Specifications............................................................................................................................81
8.6 AC Electrical Specifications ............................................................................................................................86
8.7 Differential Interface Electrical Characteristics..............................................................................................118
9 Thermal Data (Preliminary).......................................................................................................129
10 Package......................................................................................................................................130
11 Part Order Numbering/Package Marking ................................................................................132
11.1 Part Order Numbering........................................ ... ... ............................................... ......................................132
11.2 Package Marking ..........................................................................................................................................133
A Revision History ........................................................................................................................134
Copyright © 2008 Marvell Doc. No. MV-S104859-U0 Rev. E December 2, 2008, Preliminary Document Classification: Proprietary Information Page 9
88F6281 Hardware Specifications

List of Tables

1 Pin and Signal Descriptions ............................................................................................................17
Table 1: Pin Functions and Assignments Table Key......................................................................................19
Table 2: Interface Pin Prefix Codes................................. ................................................ ...............................19
Table 3: Power Pin Assignments....................................................................................................................21
Table 4: Miscellaneous Pin Assignments .......................................................................................................23
Table 5: DDR SDRAM Interface Pin Assignments.........................................................................................24
Table 6: PCI Express Interface Pin Assignments...........................................................................................26
Table 7: SATA Port Interface Pin Assignment................................................................................................27
Table 8: Gigabit Ethernet Port0/1 Interface Pin Assignments .......................................................................28
Table 9: Serial Management Interface (SMI) Pin Assignments......................................................................32
Table 10: USB 2.0 Interface Pin Assignments..................................................................................................33
Table 11: JTAG Pin Assignment......................................................... ..............................................................34
Table 12: RTC Interface Pin Assignments........................................................................................................35
Table 13: NAND Flash Interface Pin Assignment.............................................................................................36
Table 14: MPP Interface Pin Assignment.........................................................................................................37
Table 15: Two-Wire Serial Interface (TWSI) Interface Pin Assignment............................................................38
Table 16: UART Port 0/1 Interface Pin Assignment .........................................................................................39
Table 17: Audio (S/PDIF / I
Table 18: Serial Peripheral Interface (SPI) Interface Signal Assignment ...................................................... ...41
Table 19: Secure Digital Input/Output (SDIO) Interface Signal Assignment.....................................................42
Table 20: Time Division Multiplexing (TDM) Interface Signal Assignment .......................................................43
Table 21: Transport Stream (TS) Interface Signal Assignment........................................................................45
Table 22: Precise Timing Protocol (PTP) Interface Signal Assignment............................................................47
Table 23: Internal Pull-up and Pull-down Pins..................................................................................................48
2
S) Interface Signal Assignment....................................... ... ... ...............................40
2 Unused Interface Strapping.............................................................................................................49
Table 24: Unused Interface Strapping ..............................................................................................................49
3 88F6281 Pin Map and Pin List ......................................... ... ... ... ............................................. ..........50
4 Pin Multiplexing ................................................................................................................................51
Table 25: MPP Functionality.............................................................................................................................52
Table 26: MPP Function Summary...................................................................................................................53
Table 27: Ethernet Ports Pins Multiplexing.......................................................................................................57
Table 28: TS Port Pin Multiplexing .................................................................................................................59
5 Clocking.............................................................................................................................................60
Table 29: 88F6281Clocks.................................................................................................................................60
Table 30: Supported Clock Combinations........................................................................................................61
6 System Power Up/Down and Reset Settings .................................................................................63
Table 31: I/O and Core Voltages......................................................................................................................63
Table 32: Reset Configuration..........................................................................................................................67
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List of Tables
7 JTAG Interface ..................................................................................................................................73
Table 33: Supported JTAG Instructions............................................................................................................73
Table 34: IDCODE Register Map .....................................................................................................................74
8 Electrical Specifications (Preliminary) ...........................................................................................75
Table 35: Absolute Maximum Ratings..............................................................................................................75
Table 36: Recommended Operating Conditions...............................................................................................77
Table 37: Thermal Power Dissipation...............................................................................................................79
Table 38: Current Consumption........................................................................................................................80
Table 39: General 3.3V Interface (CMOS) DC Electrical Specifications...........................................................81
Table 40: RGMII 1.8V Interface (CMOS) DC Electrical Specifications.............................................................82
Table 41: SDRAM DDR2 Interface DC Electrical Specifications......................................................................83
Table 42: TWSI Interface 3.3V DC Electrical Specifications.............................................................................84
Table 43: SPI Interface 3.3V DC Electrical Specifications................................................................................84
Table 44: TDM Interface 3.3V DC Electrical Specifications..............................................................................85
Table 45: Reference Clock AC Timing Specifications ......................................................................................86
Table 46: SDRAM DDR2 Interface AC Timing Table .......................................................................................88
Table 47: SDRAM DDR2 Interface Address Timing Table...............................................................................89
Table 48: SDRAM DDR2 Clock Specifications.................................................................................................90
Table 49: RGMII 10/100/1000 AC Timing Table at 1.8V ..................................................................................93
Table 50: RGMII 10/100 AC Timing Table at 3.3V...........................................................................................93
Table 51: GMII AC Timing Table......................................................................................................................95
Table 52: MII/MMII MAC Mode AC Timing Table.............................................................................................97
Table 53: SMI Master Mode AC Timing Table..................................................................................................99
Table 54: JTAG Interface AC Timing Table....................................................................................................101
Table 55: TWSI Master AC Timing Table.......................................................................................................103
Table 56: TWSI Slave AC Timing Table.........................................................................................................103
Table 57: S/PDIF AC Timing Table ................................................................................................................105
Table 58: Inter-IC Sound (I2S) AC Timing Table............................................................................................107
Table 59: TDM Interface AC Timing Table .....................................................................................................109
Table 60: SPI (Master Mode) AC Timing Table..............................................................................................111
Table 61: SDIO Host in High Speed Mode AC Timing Table .........................................................................113
Table 62: Transport Stream Output Interface AC Timing Table ....................................................................115
Table 63: Transport Stream Input Interface AC Timing Table........................................................................115
Table 64: PCI Express Interface Differential Reference Clock Characteristics ..............................................118
Table 65: PCI Express Interface Spread Spectrum Requirements.................................................................119
Table 66: PCI Express Interface Driver and Receiver Characteristics ...........................................................120
Table 67: SATA-I Interface Gen1i Mode Driver and Receiver Characteristics...............................................123
Table 68: SATA-II Interface Gen2i Mode Driver and Receive
Table 69: USB Low Speed Driver and Receiver Characteristics....................................................................125
Table 70: USB Full Speed Driver and Receiver Characteristics.....................................................................126
Table 71: USB High Speed Driver and Receiver Characteristics...................................................................127
r Ch
aracteristics..............................................124
9 Thermal Data (Preliminary)............................................................................................................129
Table 72: Thermal Data for the 88F6281 in the BGA 19 x 19 mm Package (Preliminary) .............................129
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88F6281 Hardware Specifications
10 Package ...........................................................................................................................................130
Table 73: HSBGA 288-pin Package Dimensions ...........................................................................................131
11 Part Order Numbering/Package Marking......................................................................................132
Table 74: 88F6281 Part Order Options ..........................................................................................................132
A Revision History .............................................................................................................................134
Table 75: Revision History..............................................................................................................................134
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List of Figures

List of Figures
1 Pin and Signal Descriptions ........................................................................................................... 17
Figure 1: 88F6281 Pin Logic Diagram ............................................................................................................18
2 Unused Interface Strapping............................................................................................................ 49
3 88F6281 Pin Map and Pin List ......................................... ... ... ... ............................................. ......... 50
4 Pin Multiplexing ............................................................................................................................... 51
5 Clocking............................................................................................................................................ 60
6 System Power Up/Down and Reset Settings ................................................................................ 63
Figure 2: Power-Up Sequence Example..........................................................................................................64
Figure 3: Serial ROM Data Structure ...............................................................................................................70
Figure 4: Serial ROM Read Example...............................................................................................................71
7 JTAG Interface ................................................................................................................................. 73
8 Electrical Specifications (Preliminary) .......................................................................................... 75
Figure 5: SDRAM DDR2 Interface Test Circuit................................................................................................91
Figure 6: SDRAM DDR2 Interface Write AC Timing Diagram .........................................................................91
Figure 7: SDRAM DDR2 Interface Address and Control AC Timing Diagram.................................................92
Figure 8: SDRAM DDR2 Interface Read AC Timing Diagram.........................................................................92
Figure 9: RGMII Test Circuit ................. ... ... .....................................................................................................94
Figure 10: RGMII AC Timing Diagram...............................................................................................................94
Figure 11: GMII Test Circuit...............................................................................................................................95
Figure 12: GMII Output AC Timing Diagram............................................. ... ......................................................96
Figure 13: GMII Input AC Timing Diagram.........................................................................................................96
Figure 14: MII/MMII MAC Mode Test Circuit......................................................................................................97
Figure 15: MII/MMII MAC Mode Output Delay AC Timing Diagram...................................................................97
Figure 16: MII/MMII MAC Mode Input AC Timing Diagram................................................................................98
Figure 17: MDIO Master Mode Test Circuit.......................................................................................................99
Figure 18: MDC Master Mode Test Circuit ......................................................................................................100
Figure 19: SMI Master Mode Output AC Timing Diagram...............................................................................100
Figure 20: SMI Master Mode Input AC Timing Diagram..................................................................................100
Figure 21: JTAG Interface Test Circuit ............................................................................................................101
Figure 22: JTAG Interface Output Delay AC Timing Diagram .........................................................................102
Figure 23: JTAG Interface Input AC Timing Diagram ......................................................................................102
Figure 24: TWSI Test Circuit............................................................................................................................104
Figure 25: TWSI Output Delay AC Timing Diagram.........................................................................................104
Figure 26: TWSI Input AC Timing Diagram .....................................................................................................104
Figure 27: S/PDIF Test Circuit............................................................. ... .. ................................ .......................106
Copyright © 2008 Marvell Doc. No. MV-S104859-U0 Rev. E December 2, 2008, Preliminary Document Classification: Proprietary Information Page 13
88F6281 Hardware Specifications
Figure 28: Inter-IC Sound (I2S) Test Circuit ....................................................................................................107
Figure 29: Inter-IC Sound (I2S) Output Delay AC Timing Diagram .................................................................108
Figure 30: Inter-IC Sound (I2S) Input AC Timing Diagram ..............................................................................108
Figure 31: TDM Interface Test Circuit..............................................................................................................109
Figure 32: TDM Interface Output Delay AC Timing Diagram...........................................................................110
Figure 33: TDM Interface Input Delay AC Timing Diagram..............................................................................110
Figure 34: SPI (Master Mode) Test Circuit ......................................................................................................111
Figure 35: SPI (Master Mode) Output AC Timing Diagram .............................................................................112
Figure 36: SPI (Master Mode) Input AC Timing Diagram ................................................................................112
Figure 37: Secure Digital Input/Output (SDIO) Test Circuit.............................................................................113
Figure 38: SDIO Host in High Speed Mode Output AC Timing Diagram.........................................................114
Figure 39: SDIO Host in High Speed Mode Input AC Timing Diagram............................................................114
Figure 40: Transport Stream Interface Test Circuit..........................................................................................116
Figure 41: Transport Stream Output Interface AC Timing Diagram ................................................................116
Figure 42: Transport Stream Input Interface AC Timing Diagram ...................................................................117
Figure 43: PCI Express Interface Test Circuit..................................................................................................121
Figure 44: Low/Full Speed Data Signal Rise and Fall Time ............................................................................127
Figure 45: High Speed TX Eye Diagram Pattern Template............................ ... ... ...........................................128
Figure 46: High Speed RX Eye Diagram Pattern Template.............................................................................128
9 Thermal Data (Preliminary)........................................................................................................... 129
10 Package .......................................................................................................................................... 130
Figure 47: HSBGA 288-pin Package and Dimensions ...................................................................................130
11 Part Order Numbering/Package Marking..................................................................................... 132
Figure 48: Sample Part Number......................................................................................................................132
Figure 49: Commercial Package Marking and Pin 1 Location.........................................................................133
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Preface

About this Document
This datasheet provides the hardware specifications for the 88F6281 integrated controller. The hardware specifications include detailed pin information, configuration settings, electrical characteristics and physical specifications.
This datasheet is intended to be the basic source of information for designers of new systems. In this document, the “88F6281” is often referred to as the “device”.
Related Documentation
The following documents contain additional information related to the 88 F6281:
88F6180, 88F6190, 88F6192, and 88F62 81 Functional Specifications,
Doc No. MV-S104860-U0
Sheeva
Doc No. MV-S104950-U0
Unified Layer 2 (L2) Cache for Sheeva 88F6180, 88F6190, 88F6192, and 88F6281 Functional Errata, Interface Guidelines, and
Restrictions, Doc No. MV-S501157-U0
88F6180, 88F6190, 88F6192, and 88F6281 Design Guide, Doc No. MV-S301398-00 AN-63: Thermal Management for Marvell Technology Products Doc No. MV-S300281-00 AN-179: TWSI Software Guidelines for Discovery™, Horizon™, and Feroceon
Doc No. MV-S300754-00
AN-183: 88F5181 and 88F5281 Big Endian and Little Endian Support,
Doc No. MV-S300767-00
AN-249: Configuring the Marvell
Doc No. MV-S301342-00
AN-260 System Power-Saving Methods for 88F6180, 88F6190, 88F6192, and 88F6281,
Doc No. MV-S301454-00
TB-227: Differences Between the 88F6190, 88F6192, and 88F6281 Stepping Z0 and A0,
Doc No. MV-S105223-00
White Paper, ThetaJC, ThetaJA, and Temperature Calculations, Doc No. MV-S700019-00 ARM Architecture Reference Manual, Second Edition PCI Express Base Specification, Revision 1.1 Universal Serial Bus Specification, Revision 2.0, April 2000, Compaq, Hewlett-Packard, Intel,
Lucent, Microsoft, NEC, Philips
Enhanced Host Controller Interface Specification for Universal Serial Bus, Revision 0.95,
November 2000, Intel Corporation
ARC USB-HS OTG High-Speed Controller Core reference V 4.0.1 Federal Information Processing Standards (FIPS) 46-2 (Data Encryption Standard) FIPS 81 (DES Modes of Operation) FIPS 180-1 (Secure Hash Standard) FIPS draft - Advanced Encryption Standard (Rijndeal)
1. This document is a Marvell proprietary, confidential document, requiring an NDA and can be downloaded from the
88SV131 ARM v5TE Processor Core with MMU and L1/L2 Cache Datasheet,
Marvell Extranet.
Preface
About this Document
CPU Cores Addendum, Doc No. MV-S104858-U0
1
1
®
1
1
®
1
1
1
SATA PHY to Transmit Predefined Test Patterns,
Devices,
Copyright © 2008 Marvell Doc. No. MV-S104859-U0 Rev. E December 2, 2008, Preliminary Document Classification: Proprietary Information Page 15
88F6281 Hardware Specifications
RFC 1321 (The MD5 Message-Digest Algorithm) RFC 1851 – The ESP Triple DES Transform RFC 2104 (HMAC: Keyed-Hashing for Message Authentication). RFC 2405 – The ESP DES-CBC Cipher Algorithm With Explicit IV IEEE standard, 802.3-2000 Clause 14 ANSI standard X3.263-1995
See the Marvell Extranet website for the latest product documentation.
Document Conventions
The following conventions are used in this document:
Signal Range A signal name followed by a range enclosed i n bracket s represent s a range of l ogical ly relat ed
signals. The first number in the range indicates the most significant bit (MSb) and the last number indicates the least significant bit (LSb).
Example: DB_Addr[12:0]
Active Low Signals # An n letter at the end of a signal name indicates that the signal’s active state occurs when
voltage is low. Example: INTn
State Names State names are indicated in italic font.
Example: linkfail
Register Naming Conventions
Reset Values Reset values have the following meanings:
Abbreviations Kb: kil obit
Numbering Conventions Unless otherwise indicated, all numbers in this document are decimal (base 10).
Register field names are indicated by angle brackets. Example: <RegInit>
Register field bits are enclosed in brackets. Example: Field [1:0]
Register addresses are represented in hexadecimal format. Example: 0x0
Reserved: The contents of the register are reserved for interna l use only or for future use. A lowercase <n> in angle brackets in a register indicates that there are multiple registers with
this name. Example: Multicast Configuration Register< n>
0 = Bit clear 1 = Bit set
KB: kilobyte Mb: megabit MB: megabyte Gb: gigabit GB: gigabyte
An 0x prefix indicates a hexadecimal number. An 0b prefix indicates a binary number.
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1 Pin and Signal Descriptions

This section provides the pin logic diagram for the 88F6281 device and a detailed description of the pin assignments and their functionality.
Pin and Signal Descriptions
Copyright © 2008 Marvell Doc. No. MV-S104859-U0 Rev. E December 2, 2008, Preliminary Document Classification: Proprietary Information Page 17
Misc.
REF_CLK_XIN
Power
TP
XOUT
SYSRSTn
USB
USB_DM
USB_DP
Gigabit Ethernet
GE_TXCLKOUT
GE_TXCTL
GE_TXD[3 :0 ]
GE_RXD [3:0 ] GE_RXCTL GE_RXCLK GE_MDC GE_MDIO
SDRAM
M_CLKOUT M_CLKOUTn M_CKE M_RASn M_CASn M_WEn M_A[14:0] M_BA[2:0] M_CSn[3:0] M_DQ[15:0] M_DQS[1:0] M_DQS n[1:0 ]
M_STARTBURST M_STARTBURST_IN M_PCAL M_NCAL
M_DM[1:0] M_ODT[1:0]
RTC
RTC_XIN
RTC_XOUT
SATA0/1
SATA0_T_P
SATA0_R_P SATA0_R_N
SATA0_T_N
SATA1_T_P SATA1_T_N SATA1_R_P SATA1_R_N
JTAG
JT_CLK
JT_TDI
JT_TDO
JT_TMS_CORE
JT_RSTn
JT_TMS_CPU
NAND Flash
NF_CLE NF_ALE NF_CEn NF_REn
NF_WEn
NF_IO[7:0]
MPP
MPP[49:0]
RESERVED
NC
ISET
MRn
CPU_PLL_AVDD
CORE_PLL_AVDD
XTAL_AVDD
SATA0_AVDD SATA1_AVDD
CPU_PLL_AVSS
CORE_PLL_AVSS
XTAL_AVSS
VDD_M
VSS
VDDO
VDD_CPU
VDD
VDD_GE_A
PEX_AVDD
RTC_AVDD
USB_AVDD
SSCG_AVDD
SSCG_AVSS
RTC_AVSS
VHV
PCI Express
PEX_TX_P PEX_TX_N PEX_RX_P PEX_RX_N PEX_ISET
PEX_CLK_N
PEX_CLK_P
VDD_GE_B
88F6281 Hardware Specifications

1.1 Pin Logic

Figure 1: 88F6281 Pin Logic Diagram
NOTE: The GE_TXCLKOUT pin is an input only when used as the MII/MMII Transmit Clock.
For details about MPP configuration options see Section 4.1, Multi-Purpose Pins Functional
Summary, onpage 51.
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1.2 Pin Descriptions

This section details all the pins for the different interfaces providing a functional description of each pin and pin attributes.
Table 1<Default ¬¹ Font> defines the abbreviations and acronyms used in the pin description tables.
Table 1: Pin Functions and Assignments Table Key
Term Definition
[n] n - Represents the SERDES pair number <n> Represents port number when there are more than one ports Analog Analog Driver/Receiver or Power Supply Calib Calibration pad type CML Common Mode Logic CMOS Complementary Metal-Oxide-Semiconductor DDR Double Data Rate GND Ground Supply HCSL High-speed Current Steering Logic I Input I/O Input/Output O Output o/d Open Drain pin
The pin allows multiple drivers simultaneously (wire-OR conn ection).
A pull-up is required to sustain the inactive value. Power VDD Power Supply SSTL Stub Series Terminated Logic for 1.8V t/s Tri-State pin XXXn n - Suffix represents an Active Low Signal
Pin and Signal Descriptions
Pin Descriptions
Table 2: Interface Pin Prefix Codes
Interface Prefix
Misc N/A DDR SDRAM M_ PCI Express PEX_ SATA SATA0_
SATA1_ Gigabit Ethernet GE_ USB 2.0 USB_ JTAG JT_
Copyright © 2008 Marvell Doc. No. MV-S104859-U0 Rev. E December 2, 2008, Preliminary Document Classification: Proprietary Information Page 19
88F6281 Hardware Specifications
Table 2: Interface Pin Prefix Codes (Continued)
Interface Prefix
RTC RTC_ NAND Flash NF_ MPP N/A TWSI TW_ UART UA0_
UA1_ Audio AU_ SPI SPI_ SDIO SD_ TDM TDM_ PTP PTP_
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1.2.1 Power Supply Pins

Table 3 provides the voltage levels for the various interface pins. These do not include the analog
power supplies for the PLLs or PHYs which are explicitly mentioned in the other pin description tables.
Table 3: Power Pin Assignments
Pin and Signal Descriptions
Pin Descriptions
Pin Name I/O Pin
Description
Type
VDD I Power 1.0V Digital core voltage VDD_CPU I Power 1.1V Digital CPU voltage VDDO I Power 3.3V I/O power for MPP[49:36],MPP[19:0] and JTAG pins VDD_GE_A I Power 1.8V or 3.3V I/O supply voltage for RGMII and SMI interfaces
3.3V I/O supply voltage for GMII, MII/MMII, and SMI interfaces
VDD_GE_B I Power I/O power for MPP[35:20]
1.8V or 3.3V I/O supply voltage for RGMII interfaces
3.3V I/O supply voltage for GMII and MII/MMII interfaces
VDD_M I Power 1.8V I/O supply voltage for the DDR2 SDRAM interface VSS I GND VSS CPU_PLL_AVDD I Power 1.8V analog quiet power to CPU PLL
NOTE: See the 88F6180, 88F6190, 88F6192, and 88F6281 Design
Guide
for power supply filtering recommendations.
CPU_PLL_AVSS I GND CPU PLL ground CORE_PLL_AVDD I Power 1.8V analog quiet power to Core PLL
NOTE: See the 88F6180, 88F6190, 88F6192, and 88F6281 Design
Guide for power supply filtering recommendations.
CORE_PLL_AVSS I GND Core PLL ground SSCG_AVDD I Power 1.8V quiet power supply to the internal Spread Spectrum Clock
Generator SSCG_AVSS I GND Ground for the internal Spread Spectrum Clock Generator XTAL_ AVDD I Power 1.8V analog quiet power to on-chip clock inverter for supporting external
crystal, and on-chip current reference for SATA and USB PHYs
NOTE: See the 88F6180, 88F6190, 88F6192, and 88F6281 Design
Guide for power supply filtering recommendations.
XTAL_ A VSS I GND Ground for supporting external crystal, and on-chip current reference for
SATA and USB PHYs VHV I Power I/O supply voltage for eFuse:
• 2.5V for eFuse burning only
• 1.0V for eFuse reading only
Copyright © 2008 Marvell Doc. No. MV-S104859-U0 Rev. E December 2, 2008, Preliminary Document Classification: Proprietary Information Page 21
88F6281 Hardware Specifications
Table 3: Power Pin Assignments (Continued)
Pin Name I/O Pin
Description
Type
PEX_AVDD I Power PCI Express PHY quiet power supply 1.8V
NOTE: See the 88F6180, 88F6190, 88F6192, and 88F6281 Design
Guide for power supply filtering recommendations.
SATA0_AVDD SATA1_AVDD
I Power SATA II port0/1 quiet 3.3V power supply
NOTE: See 88F6180, 88F6190, 88F6192, and 88F6281 Design Guide
for power supply filtering recommendation.
USB_AVDD I Power USB 2.0 PHY quiet 3.3V power supply
NOTE: See the 88F6180, 88F6190, 88F6192, and 88F6281 Design
Guide for power supply filtering recommendation.
RTC_AVDD I Power 1.5V (via battery) or 1.8V (via the board) RTC interface voltage RTC_AVSS I GND RTC ground
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1.2.2 Miscellaneous Pin Assignment

The Miscellaneous signal list contains clock and reset, test, and related signals.
Table 4: Miscellaneous Pin Assignments
Pin and Signal Descriptions
Pin Descriptions
Pin Name I/O Pin
Type
Power Rail
Description
REF_CLK_XIN I Analog XTAL_AVDD Reference clock input from external oscillator or input from
external crystal. Used as input to core , CPU, SATA, and USB PLLs.
XOUT O Analog XTAL_AVDD XTAL_OUT
Feedback signal to external crystal. When not used, leave this pin floating.
SYSRSTn I CMOS VDDO System reset
Main reset signal of the device clock. Used to reset all units to their initial state. When in the reset state, most output pins are in Tri-State.
SYSRST_OUTn O CMOS VDDO Reset request from the device to the board reset logic.
This pin is multiplexed on the MPP pins (see Section 4, Pin
Multiplexing, on page 51).
PEX_RST_OUTn O CMOS VDDO Optional PCI Express Endpoint card reset output
This pin is multiplexed on the MPP pins (see Section 4, Pin
Multiplexing, on page 51).
TP O Analog Analog Test Point for SATA, USB, and PCI Express
interfaces For internal use. Leave this pin unconnected.
ISET I Analog Current reference for both the USB and SATA PHYs.
Terminate this pin with a 6.04 k
Ω resistor, pulled down.
MRn I CMOS VDD_GE_A Active-Low, Manual Reset Input
SYSRST_OUTn is asserted low as long as the MRn input signal is asserted low, and for additional 20 ms after MRn (manual reset) de-assertion This pin is internally pulled up.
RESERVED Reserved for Marvell
®
future usage.
Leave unconnected externally.
NC Reserved for Marvell
®
future usage.
Leave unconnected externally.
Copyright © 2008 Marvell Doc. No. MV-S104859-U0 Rev. E December 2, 2008, Preliminary Document Classification: Proprietary Information Page 23
88F6281 Hardware Specifications

1.2.3 DDR SDRAM Interface Pin Assignments

Table 5: DDR SDRAM Interface Pin Assignments
Pin Name I/O Pin
Type
M_CLKOUT
O SSTL VDD_M SDRAM Differential Clock Pair
Power Rail
Description
M_CLKOUTn M_CKE O SSTL VDD_M Driven high to enable SDRAM clock.
Driven low when setting the SDRAM to Self-refresh mode.
M_RASn O SSTL VDD_M SDRAM Row Address Select
Asserted to indicate an active ROW address driven on the SDRAM address lines.
M_CASn O SSTL VDD_M SDRAM Column Address Select
Asserted to indicate an active column address driven on the SDRAM address lines.
M_WEn O SSTL VDD_M SDRAM Write Enable
Asserted to indicate a write command to the SDRAM.
M_A[14:0] O SSTL VDD_M SDRAM Address
Driven with M_BA[2:0] during RASn and CASn cycles to generate the SDRAM address.
M_BA[2:0] O SSTL VDD_M Driven during M_RASn and M_CASn cycles to select one of
the eight SDRAM virtual banks. NOTE: If an SDRAM device does not support the BA[2] pin,
leave the M_BA[2] unconnected.
M_CSn[3:0] O SSTL VDD_M SDRAM Chip Selects
Asserted to select a specific SDRAM Physical bank.
M_DQ[15:0] t/s
SSTL VDD_M SDRAM Data Bus
I/O
Driven during write. Driven by SDRAM during reads.
M_DQS[1:0], M_DQSn[1:0]
t/s
SSTL VDD_M SDRAM Data Strobe
I/O
Driven by the 88F6281 during write. Driven by SDRAM during reads.
M_DM[1:0] O SSTL VDD_M SDRAM Data Mask
Asserted by the 88F6281 to select the specific byte out of the 16-bit data to be written to the SDRAM.
M_ODT[1:0] O SSTL VDD_M SDRAM On Die Termination control
Driven high to connect the SDRAM on die termination. Driven low to disconnect the SDRAM’s termination.
NOTE: For the recommended setting, refer to the 88F6180,
88F6190, 88F6192, and 88F6281 Design Guide.
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Table 5: DDR SDRAM Interface Pin Assignments (Continued)
Pin and Signal Descriptions
Pin Descriptions
Pin Name I/O Pin
Type
Power Rail
Description
M_STARTBURST O SSTL VDD_M Start Burst
88F6281 indication of starting a burst read transaction. Asserted with the first M_CASn cycle of SDRAM access. NOTE: Must be routed on board to the SDRAM, and back to
the 88F6281 as M_STARTBURST_IN. For the recommended length calculation for this routing and termination requirements, see the 8 8F6180, 88F619 0, 88F6192, and 88F6281 Design Guide.
M_START
I SSTL VDD_M Start Burst Input
BURST_IN M_PCAL I Calib SDRAM interface P channel output driver calibration. Connect
to VSS through a resistor. The resistor value can vary between 30–70 ohm.
NOTE: See the 88F6180, 88F6190, 88F6192, and 88F6281
Design Guide for the recommended values of the
calibration resistors.
M_NCAL I Calib SDRAM interface N channel output driver calibration. Connect
to M_VDD through a resistor. The resistor value can vary between 30–70 ohm.
NOTE: See the 88F6180, 88F6190, 88F6192, and 88F6281
Design Guide for the recommended values of the
calibration resistors.
Copyright © 2008 Marvell Doc. No. MV-S104859-U0 Rev. E December 2, 2008, Preliminary Document Classification: Proprietary Information Page 25
88F6281 Hardware Specifications

1.2.4 PCI Express Interface Pin Assignments

Table 6: PCI Express Interface Pin Assignments
Pin Name I/O Pin
Type
Power Rail
Description
PEX_CLK_P/N I/O HCSL PEX_AVDD PCI Express Reference Clock
100 MHz, differential This clock can be configured as input or output according to the reset strap (see Table 32, Reset Configuration, on page 67). NOTE: For Output mode, 50-ohm, pull-down resistors are
required.
PEX_TX_P/N O CML PEX_AVDD Transmit Lane
Differential pair of PCI Express transmit data
PEX_RX_P/N I CML PEX_AVDD Receive Lane
Differential pair of PCI Express receive data
PEX_ISET I Analog Current reference. Pull down to VSS through a 5 k
See the 88F6180, 88F6190, 88F6192, and 88F6281 Design Guide for the recommended resistor value.
Ω resistor .
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1.2.5 SATA Interface Pin Assignments

Table 7: SATA Port Interface Pin Assignment
Pin and Signal Descriptions
Pin Descriptions
Pin Name I/O Pin
Type
SATA0_T_P/N
O CML SATA0/1_AVDD Transmit Data: Differential analog output of SATA II
SATA1_T_P/N SATA0_R_P/N
I CML SATA0/1_AVDD Receive Data: Differential analog input of SATA II port0/1
SATA1_R_P/N SATA0_PRESENTn
O CMOS VDDO/
SATA1_PRESENTn
SATA0_ACTn
O CMOS VDDO/
SATA1_ACTn
Power Rail Description
port0/1
When this signal is asserted there is an active link
VDD_GE_B
between the SATA II port and the external device (disk). NOTE: These signals are multiplexed on the MPP pins
(see Section 4, Pin Multiplexing, on page 51).
When this signal is asserted, there is an active and used
VDD_GE_B
link between the SATA II port and the external device (disk). NOTE: These signals are multiplexed on the MPP pins
(see Section 4, Pin Multiplexing, on page 51).
Copyright © 2008 Marvell Doc. No. MV-S104859-U0 Rev. E December 2, 2008, Preliminary Document Classification: Proprietary Information Page 27
88F6281 Hardware Specifications

1.2.6 Gigabit Ethernet Port Interface Pin Assignments

For additional information about the Gigabit Ethernet port pin functions refer to Section 4.2, Gigabit
Ethernet (GbE) Pins Multiplexing on MPP, on page 57.
Table 8: Gigabit Ethernet Port0/1 Interface Pin Assignments
Pin Name I/O Pin
Type
Power Rail
Description
Port0—Dedicated GbE Pins
GE_TXCLKOUT t/s OCMOS VDD_GE_A RGMII Transmit Clock
RGMII transmit reference output clock for GE_TXD[3:0] and GE_TXCTL. Provides 125 MHz, 25 MHz or 2.5 MHz clock. Not used in MII/MMII mode.
I MII/MMII Transmit Clock
MII/MMII transmit reference clock fro m PHY. Provides the timing reference for the transmission of the MII transmit clock, transmit enable, and GE_TXD[3:0] signals. This clock operates at 2.5 MHz or 25 MHz.
t/s O
GMII Transmit Clock Provides the timing reference for the transfer of the transmit enable, transmit error and transmit data signals. This clock operates at 125 MHz.
GE_TXD[3:0] t/s OCMOS VDD_GE_A RGMII Transmit Data
Contains the transmit data nibble outp ut s that run at doubl e dat a rate with bits [3:0] driven on the rising edge of GE_TXCLKOUT and bits [7:4] driven on the falling edge.
MII/MMII Transmit Data Contains the transmit data nibble outputs that are synchronous to the transmit clock input.
GMII Transmit Data Contains the transmit data nibble outputs.
GE_TXCTL t/s OCMOS VDD_GE_A RGMII Transmit Control
Transmit control synchronous to the GE_TXCLKOUT output rising/falling edge. GE_TXEN is driven on the rising edge of GE_TXCLKOUT. A logical derivative of transmit enable and transmit error is driven on the falling edge of GE_TXCLKOUT.
MII/MMII Transmit Enable Indicates that the packet is being transmitted to the PH Y. It Is synchronous to transmit clock.
GMII Transmit Enable Indicates that the packet is being transmitted to the PH Y. It Is synchronous to GE_TXCLKOUT.
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Pin and Signal Descriptions
Table 8: Gigabit Ethernet Port0/1 Interface Pin Assignments (Continued)
Pin Descriptions
Pin Name I/O Pin
Type
Power Rail
Description
GE_RXD[3:0] I CMOS VDD_GE_A RGMII Receive Data
Contains the receive data nibble inputs that are synchronous to GE_RXCLK input rising/falling edge.
MII/MMII Receive Data Contains the receive data nibble inputs that are synchronous to GE_RXCLK input.
GMII Receive Data Contains the receive data nibble inputs.
GE_RXCTL I CMOS VDD_GE_A RGMII Receive Control
GE_RXCTL is presented on the rising edge of GE_RXCLK. A logical derivative of receive data vali d and receive d ata error is presented on the falling edge of RXCLK.
MII/MMII Receive Data Valid GMII Receive Data Valid.
GE_RXCLK I CMOS VDD_GE_A RGMII Receive Clock
The receive clock provides a 125 MHz, 25 MHz, or 2.5 MHz reference clock derived from the received data stream.
MII/MMII Receive Clock Provides the timing reference for the reception of the receive data valid, receive error, and GE_RXD[3:0] signals. This clock operates at 2.5 MHz or 25 MHz.
GMII Receive Clock Provides the timing reference for the reception of the GE_RXDV, receive error and receive data signals. This clock operates at 125 MHz
Port1—Multiplexed GbE Pins
MPP[23:20]/ GE1[3:0]
t/s OCMOS VDD_GE_B RGMII Transmit Data
Contains the transmit data nibble outp ut s that run at doubl e dat a rate with bits [3:0] presented on the rising edge of GE_TXCLKOUT and bits [7:4] presented on the falling edge.
MII/MMII Transmit Data Contains the transmit data nibble outputs that are synchronous to the transmit clock input.
GMII Transmit Data Contains the transmit data nibble outputs.
Copyright © 2008 Marvell Doc. No. MV-S104859-U0 Rev. E December 2, 2008, Preliminary Document Classification: Proprietary Information Page 29
88F6281 Hardware Specifications
Table 8: Gigabit Ethernet Port0/1 Interface Pin Assignments (Continued)
Pin Name I/O Pin
Type
MPP[27:24]/
I CMOS VDD_GE_B RGMII Receive Data
GE1[7:4]
Power Rail
Description
Contains the receive data nibble inputs that are synchronous to GE_RXCLK input rising/falling edge.
MII/MMII Receive Data Contains the receive data nibble inputs that are synchronous to GE_RXCLK input.
GMII Receive Data Contains the receive data nibble inputs.
MPP[28]/GE1[8] I CMOS VDD_GE _ B MII/MMII Coll ision Det e ct
Indicates a collision has been detected on the wire. This input is ignored in full-duplex mode. Collision detect is not synchronous to any clock.
GMII Collision Detect
MPP[29]/GE1[9] I CMOS VDD_GE _B MII/MMII Transmit Clock
MII/MMII transmit reference clock fro m PHY. Provides the timing reference for the transmission of the MII transmit clock, transmit enable, and GE_TXD[3:0] signals. This clock operates at 2.5 MHz or 25 MHz.
t/s O
GMII Transmit Clock Provides the timing reference for the transfer of the transmit enable, transmit error and transmit data signals. This clock operates at 125 MHz.
MPP[30]/GE1[10] I CMOS VDD_GE_B RGMII Receive Control
GE_RXCTL is presented on the rising edge of GE_RXCLK. A logical derivative of receive data vali d and receive d ata error is presented on the falling edge of RXCLK.
MII/MMII Receive Data Valid GMII Receive Error
MPP[31]/GE1[11] I CMOS VDD_GE_B RGMII Receive Clock
The receive clock provides a 125 MHz, 25 MHz, or 2.5 MHz reference clock derived from the received data stream.
MII/MMII Receive Clock Provides the timing reference for the reception of the receive data valid, receive error, and GE_RXD[3:0] signals. This clock operates at 2.5 MHz or 25 MHz.
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