For more information, visit our website at: www.marvell.com
Disclaimer
No part of this document may be repr od uced or transmitted in any form or by any means, electronic or m ech ani ca l, in cl ud in g p hotocopying and recording, for any purpose,
without the express written permission of Marvell. Marvell retains the right to m ake cha ng es to th is document at any time, without notice. Marvell makes no warranty of any
kind, expressed or implied, with r egard to any info rmation conta ined in this do cument, in cluding, but no t limited to, the implie d warra nties of merchant abil ity or fi tness for a ny
particular purpose. Further, Marvell does not warrant the accuracy or completeness of the information, text, graphics, or other items contained within this document.
Marvell products are not designed for use in life-support equipment or applications that would cause a life-threatening situation if any such products failed. Do not use
Marvell products in these types of equipment or applications.
With respect to the products described herein, the user or recipient, in the absence of appropriate U.S. government authorization, agrees:
1) Not to re-export or release any such information consisting of technology, software or source code controlled for national security reasons by the U.S. Export Control
Regulations ("EAR"), to a national of EAR Count ry Gr oups D:1 or E:2;
2) Not to export the direct product of such technology or such software, to EAR Country Groups D:1 or E:2, if such technology or software and direct products thereof are
controlled for national security reasons by the EAR; and,
3) In the case of technology controlled for national security reasons under the EAR where the direct product of the technology is a complete plant or component of a plant,
not to export to EAR Country Groups D:1 or E:2 the direct product of the plant or major component thereof, if such direct product is controlled for national security reasons
by the EAR, or is subject to controls under the U.S. Munitions List ("USML").
At all times hereunder , the recipi ent o f any such info rmati on agre es t hat the y shal l be deem ed to h ave manu all y sign ed this d ocument in conne ction with their re ceipt of any
such information.
The Marvell® 88F6281 is a high-performance, highly integrated controller. The 88F6281 is based on the Marvell
proprietary, ARMv5TE-compliant, high-speed Sheeva
™
CPU core. The CPU core integrates a 256 KB L2 cache.
About this Document.......................................................................................................................................15
Related Documentation...................................................................................................................................15
1.3Internal Pull-up and Pull-down Pins................................................................................................................48
6.6Serial ROM Initialization..................................................................................................................................70
8.1Absolute Maximum Ratings ............................................................................................................................75
8.3Thermal Power Dissipation .............................................................................................................................79
Figure 5:SDRAM DDR2 Interface Test Circuit................................................................................................91
Figure 6:SDRAM DDR2 Interface Write AC Timing Diagram .........................................................................91
Figure 7:SDRAM DDR2 Interface Address and Control AC Timing Diagram.................................................92
Figure 8:SDRAM DDR2 Interface Read AC Timing Diagram.........................................................................92
Figure 9:RGMII Test Circuit ................. ... ... .....................................................................................................94
Figure 10:RGMII AC Timing Diagram...............................................................................................................94
Figure 11: GMII Test Circuit...............................................................................................................................95
Figure 12: GMII Output AC Timing Diagram............................................. ... ......................................................96
Figure 13: GMII Input AC Timing Diagram.........................................................................................................96
Figure 14: MII/MMII MAC Mode Test Circuit......................................................................................................97
Figure 15: MII/MMII MAC Mode Output Delay AC Timing Diagram...................................................................97
Figure 16: MII/MMII MAC Mode Input AC Timing Diagram................................................................................98
Figure 17: MDIO Master Mode Test Circuit.......................................................................................................99
Figure 18: MDC Master Mode Test Circuit ......................................................................................................100
Figure 19: SMI Master Mode Output AC Timing Diagram...............................................................................100
Figure 20: SMI Master Mode Input AC Timing Diagram..................................................................................100
Figure 21: JTAG Interface Test Circuit ............................................................................................................101
Figure 22: JTAG Interface Output Delay AC Timing Diagram .........................................................................102
Figure 23: JTAG Interface Input AC Timing Diagram ......................................................................................102
Figure 24: TWSI Test Circuit............................................................................................................................104
Figure 25: TWSI Output Delay AC Timing Diagram.........................................................................................104
Figure 26: TWSI Input AC Timing Diagram .....................................................................................................104
Figure 27: S/PDIF Test Circuit............................................................. ... .. ................................ .......................106
This datasheet provides the hardware specifications for the 88F6281 integrated controller. The
hardware specifications include detailed pin information, configuration settings, electrical
characteristics and physical specifications.
This datasheet is intended to be the basic source of information for designers of new systems.
In this document, the “88F6281” is often referred to as the “device”.
Related Documentation
The following documents contain additional information related to the 88 F6281:
88F6180, 88F6190, 88F6192, and 88F62 81 Functional Specifications,
Doc No. MV-S104860-U0
Sheeva
Doc No. MV-S104950-U0
Unified Layer 2 (L2) Cache for Sheeva
88F6180, 88F6190, 88F6192, and 88F6281 Functional Errata, Interface Guidelines, and
Restrictions, Doc No. MV-S501157-U0
88F6180, 88F6190, 88F6192, and 88F6281 Design Guide, Doc No. MV-S301398-00
AN-63: Thermal Management for Marvell Technology Products Doc No. MV-S300281-00
AN-179: TWSI Software Guidelines for Discovery™, Horizon™, and Feroceon
Doc No. MV-S300754-00
AN-183: 88F5181 and 88F5281 Big Endian and Little Endian Support,
Doc No. MV-S300767-00
AN-249: Configuring the Marvell
Doc No. MV-S301342-00
AN-260 System Power-Saving Methods for 88F6180, 88F6190, 88F6192, and 88F6281,
Doc No. MV-S301454-00
TB-227: Differences Between the 88F6190, 88F6192, and 88F6281 Stepping Z0 and A0,
Doc No. MV-S105223-00
White Paper, ThetaJC, ThetaJA, and Temperature Calculations, Doc No. MV-S700019-00
ARM Architecture Reference Manual, Second Edition
PCI Express Base Specification, Revision 1.1
Universal Serial Bus Specification, Revision 2.0, April 2000, Compaq, Hewlett-Packard, Intel,
Lucent, Microsoft, NEC, Philips
Enhanced Host Controller Interface Specification for Universal Serial Bus, Revision 0.95,
November 2000, Intel Corporation
ARC USB-HS OTG High-Speed Controller Core reference V 4.0.1
Federal Information Processing Standards (FIPS) 46-2 (Data Encryption Standard)
FIPS 81 (DES Modes of Operation)
FIPS 180-1 (Secure Hash Standard)
FIPS draft - Advanced Encryption Standard (Rijndeal)
1. This document is a Marvell proprietary, confidential document, requiring an NDA and can be downloaded from the
™
88SV131 ARM v5TE Processor Core with MMU and L1/L2 Cache Datasheet,
RFC 1321 (The MD5 Message-Digest Algorithm)
RFC 1851 – The ESP Triple DES Transform
RFC 2104 (HMAC: Keyed-Hashing for Message Authentication).
RFC 2405 – The ESP DES-CBC Cipher Algorithm With Explicit IV
IEEE standard, 802.3-2000 Clause 14
ANSI standard X3.263-1995
See the Marvell Extranet website for the latest product documentation.
Document Conventions
The following conventions are used in this document:
Signal RangeA signal name followed by a range enclosed i n bracket s represent s a range of l ogical ly relat ed
signals. The first number in the range indicates the most significant bit (MSb) and the last
number indicates the least significant bit (LSb).
Example: DB_Addr[12:0]
Active Low Signals #An n letter at the end of a signal name indicates that the signal’s active state occurs when
voltage is low.
Example: INTn
State NamesState names are indicated in italic font.
Example: linkfail
Register Naming
Conventions
Reset ValuesReset values have the following meanings:
AbbreviationsKb: kil obit
Numbering ConventionsUnless otherwise indicated, all numbers in this document are decimal (base 10).
Register field names are indicated by angle brackets.
Example: <RegInit>
Register field bits are enclosed in brackets.
Example: Field [1:0]
Register addresses are represented in hexadecimal format.
Example: 0x0
Reserved: The contents of the register are reserved for interna l use only or for future use.
A lowercase <n> in angle brackets in a register indicates that there are multiple registers with
this name.
Example: Multicast Configuration Register< n>
This section details all the pins for the different interfaces providing a functional description of each
pin and pin attributes.
Table 1<Default ¬¹ Font> defines the abbreviations and acronyms used in the pin description tables.
Table 1:Pin Functions and Assignments Table Key
TermDefinition
[n]n - Represents the SERDES pair number
<n>Represents port number when there are more than one ports
AnalogAnalog Driver/Receiver or Power Supply
CalibCalibration pad type
CMLCommon Mode Logic
CMOSComplementary Metal-Oxide-Semiconductor
DDRDouble Data Rate
GNDGround Supply
HCSLHigh-speed Current Steering Logic
IInput
I/OInput/Output
OOutput
o/dOpen Drain pin
The pin allows multiple drivers simultaneously (wire-OR conn ection).
A pull-up is required to sustain the inactive value.
PowerVDD Power Supply
SSTLStub Series Terminated Logic for 1.8V
t/sTri-State pin
XXXnn - Suffix represents an Active Low Signal
Table 3 provides the voltage levels for the various interface pins. These do not include the analog
power supplies for the PLLs or PHYs which are explicitly mentioned in the other pin description
tables.
Table 3:Power Pin Assignments
Pin and Signal Descriptions
Pin Descriptions
Pin NameI/OPin
Description
Type
VDDIPower1.0V Digital core voltage
VDD_CPUIPower1.1V Digital CPU voltage
VDDOIPower3.3V I/O power for MPP[49:36],MPP[19:0] and JTAG pins
VDD_GE_AIPower1.8V or 3.3V I/O supply voltage for RGMII and SMI interfaces
3.3V I/O supply voltage for GMII, MII/MMII, and SMI interfaces
VDD_GE_BIPowerI/O power for MPP[35:20]
1.8V or 3.3V I/O supply voltage for RGMII interfaces
3.3V I/O supply voltage for GMII and MII/MMII interfaces
VDD_M IPower1.8V I/O supply voltage for the DDR2 SDRAM interface
VSSIGNDVSS
CPU_PLL_AVDDIPower1.8V analog quiet power to CPU PLL
NOTE: See the 88F6180, 88F6190, 88F6192, and 88F6281 Design
Guide
for power supply filtering recommendations.
CPU_PLL_AVSSIGNDCPU PLL ground
CORE_PLL_AVDDIPower1.8V analog quiet power to Core PLL
NOTE: See the 88F6180, 88F6190, 88F6192, and 88F6281 Design
Guide for power supply filtering recommendations.
CORE_PLL_AVSSIGNDCore PLL ground
SSCG_AVDDIPower1.8V quiet power supply to the internal Spread Spectrum Clock
Generator
SSCG_AVSSIGNDGround for the internal Spread Spectrum Clock Generator
XTAL_ AVDDIPower1.8V analog quiet power to on-chip clock inverter for supporting external
crystal, and on-chip current reference for SATA and USB PHYs
NOTE: See the 88F6180, 88F6190, 88F6192, and 88F6281 Design
Guide for power supply filtering recommendations.
XTAL_ A VSSIGNDGround for supporting external crystal, and on-chip current reference for
SATA and USB PHYs
VHVIPowerI/O supply voltage for eFuse:
This pin is multiplexed on the MPP pins (see Section 4, Pin
Multiplexing, on page 51).
TPOAnalogAnalog Test Point for SATA, USB, and PCI Express
interfaces
For internal use. Leave this pin unconnected.
ISETIAnalogCurrent reference for both the USB and SATA PHYs.
Terminate this pin with a 6.04 k
Ω resistor, pulled down.
MRnICMOSVDD_GE_AActive-Low, Manual Reset Input
SYSRST_OUTn is asserted low as long as the MRn input
signal is asserted low, and for additional 20 ms after MRn
(manual reset) de-assertion
This pin is internally pulled up.
88F6281 indication of starting a burst read transaction.
Asserted with the first M_CASn cycle of SDRAM access.
NOTE: Must be routed on board to the SDRAM, and back to
the 88F6281 as M_STARTBURST_IN. For the
recommended length calculation for this routing and
termination requirements, see the 8 8F6180, 88F619 0, 88F6192, and 88F6281 Design Guide.
M_START
ISSTLVDD_MStart Burst Input
BURST_IN
M_PCALICalibSDRAM interface P channel output driver calibration. Connect
to VSS through a resistor. The resistor value can vary
between 30–70 ohm.
NOTE: See the 88F6180, 88F6190, 88F6192, and 88F6281
Design Guide for the recommended values of the
calibration resistors.
M_NCALICalibSDRAM interface N channel output driver calibration. Connect
to M_VDD through a resistor. The resistor value can vary
between 30–70 ohm.
NOTE: See the 88F6180, 88F6190, 88F6192, and 88F6281
100 MHz, differential
This clock can be configured as input or output according to the
reset strap (see Table 32, Reset Configuration, on page 67).NOTE: For Output mode, 50-ohm, pull-down resistors are
required.
PEX_TX_P/NOCMLPEX_AVDDTransmit Lane
Differential pair of PCI Express transmit data
PEX_RX_P/NICMLPEX_AVDDReceive Lane
Differential pair of PCI Express receive data
PEX_ISETIAnalogCurrent reference. Pull down to VSS through a 5 k
See the 88F6180, 88F6190, 88F6192, and 88F6281 Design Guide for the recommended resistor value.
RGMII transmit reference output clock for GE_TXD[3:0] and
GE_TXCTL.
Provides 125 MHz, 25 MHz or 2.5 MHz clock.
Not used in MII/MMII mode.
IMII/MMII Transmit Clock
MII/MMII transmit reference clock fro m PHY.
Provides the timing reference for the transmission of the MII
transmit clock, transmit enable, and GE_TXD[3:0] signals. This
clock operates at 2.5 MHz or 25 MHz.
t/s
O
GMII Transmit Clock
Provides the timing reference for the transfer of the transmit
enable, transmit error and transmit data signals. This clock
operates at 125 MHz.
GE_TXD[3:0]t/s OCMOSVDD_GE_ARGMII Transmit Data
Contains the transmit data nibble outp ut s that run at doubl e dat a
rate with bits [3:0] driven on the rising edge of GE_TXCLKOUT
and bits [7:4] driven on the falling edge.
MII/MMII Transmit Data
Contains the transmit data nibble outputs that are synchronous
to the transmit clock input.
GMII Transmit Data
Contains the transmit data nibble outputs.
GE_TXCTL t/s OCMOSVDD_GE_ARGMII Transmit Control
Transmit control synchronous to the GE_TXCLKOUT output
rising/falling edge.
GE_TXEN is driven on the rising edge of GE_TXCLKOUT.
A logical derivative of transmit enable and transmit error is driven
on the falling edge of GE_TXCLKOUT.
MII/MMII Transmit Enable
Indicates that the packet is being transmitted to the PH Y. It Is
synchronous to transmit clock.
GMII Transmit Enable
Indicates that the packet is being transmitted to the PH Y.
It Is synchronous to GE_TXCLKOUT.
Contains the receive data nibble inputs that are synchronous to
GE_RXCLK input rising/falling edge.
MII/MMII Receive Data
Contains the receive data nibble inputs that are synchronous to
GE_RXCLK input.
GMII Receive Data
Contains the receive data nibble inputs.
GE_RXCTLICMOSVDD_GE_ARGMII Receive Control
GE_RXCTL is presented on the rising edge of GE_RXCLK.
A logical derivative of receive data vali d and receive d ata error is
presented on the falling edge of RXCLK.
MII/MMII Receive Data Valid
GMII Receive Data Valid.
GE_RXCLKICMOSVDD_GE_ARGMII Receive Clock
The receive clock provides a 125 MHz, 25 MHz, or 2.5 MHz
reference clock derived from the received data stream.
MII/MMII Receive Clock
Provides the timing reference for the reception of the receive
data valid, receive error, and GE_RXD[3:0] signals. This clock
operates at 2.5 MHz or 25 MHz.
GMII Receive Clock
Provides the timing reference for the reception of the GE_RXDV,
receive error and receive data signals. This clock operates at
125 MHz
Port1—Multiplexed GbE Pins
MPP[23:20]/
GE1[3:0]
t/s OCMOSVDD_GE_BRGMII Transmit Data
Contains the transmit data nibble outp ut s that run at doubl e dat a
rate with bits [3:0] presented on the rising edge of
GE_TXCLKOUT and bits [7:4] presented on the falling edge.
MII/MMII Transmit Data
Contains the transmit data nibble outputs that are synchronous
to the transmit clock input.
GMII Transmit Data
Contains the transmit data nibble outputs.
MII/MMII transmit reference clock fro m PHY.
Provides the timing reference for the transmission of the MII
transmit clock, transmit enable, and GE_TXD[3:0] signals. This
clock operates at 2.5 MHz or 25 MHz.
t/s
O
GMII Transmit Clock
Provides the timing reference for the transfer of the transmit
enable, transmit error and transmit data signals. This clock
operates at 125 MHz.
MPP[30]/GE1[10]ICMOSVDD_GE_BRGMII Receive Control
GE_RXCTL is presented on the rising edge of GE_RXCLK.
A logical derivative of receive data vali d and receive d ata error is
presented on the falling edge of RXCLK.
MII/MMII Receive Data Valid
GMII Receive Error
MPP[31]/GE1[11]ICMOSVDD_GE_BRGMII Receive Clock
The receive clock provides a 125 MHz, 25 MHz, or 2.5 MHz
reference clock derived from the received data stream.
MII/MMII Receive Clock
Provides the timing reference for the reception of the receive
data valid, receive error, and GE_RXD[3:0] signals. This clock
operates at 2.5 MHz or 25 MHz.