DynaWave
OEM Contactless NFC Module
Installation and Operation Manual
September 2018
Document Number:
D998200265-10
REGISTERED TO ISO 9001:2015
MagTek I 1710 Apollo Court I Seal Beach, CA 90740 I Phone: (562) 546-6400 I Technical Support: (888) 624-8350
www.magtek.com
Copyright © 2006 - 2018 MagTek, Inc.
Printed in the United States of America
INFORMATION IN THIS PUBLICATION IS SUBJECT TO CHANGE WITHOUT NOTICE AND
MAY CONTAIN TECHNICAL INACCURACIES OR GRAPHICAL DISCREPANCIES. CHANGES
OR IMPROVEMENTS MADE TO THIS PRODUCT WILL BE UPDATED IN THE NEXT
PUBLICATION RELEASE. NO PART OF THIS DOCUMENT MAY BE REPRODUCED OR
TRANSMITTED IN ANY FORM OR BY ANY MEANS, ELECTRONIC OR MECHANICAL, FOR
ANY PURPOSE, WITHOUT THE EXPRESS WRITTEN PERMISSION OF MAGTEK, INC.
MagTek® is a registered trademark of MagTek, Inc.
MagnePrint® is a registered trademark of MagTek, Inc.
Magensa™ is a trademark of MagTek, Inc.
MagneSafe™ is a trademark of MagTek, Inc.
AAMVA™ is a trademark of AAMVA.
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D-PAYMENT APPLICATION SPECIFICATION® is a registered trademark to Discover Financial
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Visa® and Visa payWave® are registered trademarks of Visa International Service Association.
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Table 0-1 - Revisions
Rev Number
Date
Notes
10
Sep 26, 2018
Initial release
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LIMITED WARRANTY
MagTek warrants that the products sold pursuant to this Agreement will perform in accordance with
MagTek’s published specifications. This warranty shall be provided only for a period of one year from
the date of the shipment of the product from MagTek (the “Warranty Period”). This warranty shall apply
only to the “Buyer” (the original purchaser, unless that entity resells the product as authorized by
MagTek, in which event this warranty shall apply only to the first repurchaser).
During the Warranty Period, should this product fail to conform to MagTek’s specifications, MagTek
will, at its option, repair or replace this product at no additional charge except as set forth below. Repair
parts and replacement products will be furnished on an exchange basis and will be either reconditioned or
new. All replaced parts and products become the property of MagTek. This limited warranty does not
include service to repair damage to the product resulting from accident, disaster, unreasonable use,
misuse, abuse, negligence, or modification of the product not authorized by MagTek. MagTek reserves
the right to examine the alleged defective goods to determine whether the warranty is applicable.
Without limiting the generality of the foregoing, MagTek specifically disclaims any liability or warranty
for goods resold in other than MagTek’s original packages, and for goods modified, altered, or treated
without authorization by MagTek.
Service may be obtained by delivering the product during the warranty period to MagTek (1710 Apollo
Court, Seal Beach, CA 90740). If this product is delivered by mail or by an equivalent shipping carrier,
the customer agrees to insure the product or assume the risk of loss or damage in transit, to prepay
shipping charges to the warranty service location, and to use the original shipping container or equivalent.
MagTek will return the product, prepaid, via a three (3) day shipping service. A Return Material
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contacting MagTek Support Services at (888) 624-8350.
EACH BUYER UNDERSTANDS THAT THIS MAGTEK PRODUCT IS
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SHALL IN NO EVENT EXCEED THE TOTAL AMOUNT PAID TO MAGTEK
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EVEN IF MAGTEK HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH
DAMAGES, OR FOR ANY CLAIM BY ANY OTHER PARTY.
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LIMITATION ON LIABILITY
EXCEPT AS PROVIDED IN THE SECTIONS RELATING TO MAGTEK’S LIMITED WARRANTY,
MAGTEK’S LIABILITY UNDER THIS AGREEMENT IS LIMITED TO THE CONTRACT PRICE OF
THIS PRODUCT.
MAGTEK MAKES NO OTHER WARRANTIES WITH RESPECT TO THE PRODUCT, EXPRESSED
OR IMPLIED, EXCEPT AS MAY BE STATED IN THIS AGREEMENT, AND MAGTEK
DISCLAIMS ANY IMPLIED WARRANTY, INCLUDING WITHOUT LIMITATION ANY IMPLIED
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MAGTEK SHALL NOT BE LIABLE FOR CONTINGENT, INCIDENTAL, OR CONSEQUENTIAL
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MAGTEK’S SOLE LIABILITY AND BUYER’S EXCLUSIVE REMEDIES ARE STATED IN THIS
SECTION AND IN THE SECTION RELATING TO MAGTEK’S LIMITED WARRANTY.
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FCC INFORMATION
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) This device must accept any
interference received, including interference that may cause undesired operation.
Note: This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference in a residential installation. This equipment generates, uses and can radiate radio
frequency energy and, if not installed and used in accordance with the instructions, may cause harmful
interference to radio communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or television reception,
which can be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
Consult the dealer or an experienced radio/TV technician for help.
Caution: Changes or modifications not expressly approved by MagTek could void the
user’s authority to operate this equipment.
CUR/UR
This product is recognized per Underwriter Laboratories and Canadian Underwriter Laboratories per UL
60950 1, 2nd Edition.
CE STANDARDS
Testing for compliance with CE requirements was performed by an independent laboratory. The unit
under test was found compliant with standards established for Class B devices.
ROHS STATEMENT
When ordered as RoHS compliant, this product meets the Electrical and Electronic Equipment (EEE)
Reduction of Hazardous Substances (RoHS) European Directive 2002/95/EC. The marking is clearly
recognizable, either as written words like “Pb-free,” “lead-free,” or as another clear symbol ( ).
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SOFTWARE LICENSE AGREEMENT
IMPORTANT: YOU SHOULD CAREFULLY READ ALL THE TERMS, CONDITIONS AND
RESTRICTIONS OF THIS LICENSE AGREEMENT BEFORE INSTALLING THE SOFTWARE
PACKAGE. YOUR INSTALLATION OF THE SOFTWARE PACKAGE PRESUMES YOUR
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RESTRICTIONS, PROMPTLY RETURN THE SOFTWARE PACKAGE AND ASSOCIATED
DOCUMENTATION TO THE ADDRESS ON THE FRONT PAGE OF THIS DOCUMENT,
ATTENTION: CUSTOMER SUPPORT.
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GOVERNING LAW: If any provision of this Agreement is found to be unlawful, void, or
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laws of the State of California and shall inure to the benefit of MagTek, Incorporated, its successors or
assigns.
ACKNOWLEDGMENT: LICENSEE ACKNOWLEDGES THAT HE HAS READ THIS
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MAGTEK, INCORPORATED, ATTENTION: CUSTOMER SUPPORT, AT THE ADDRESS LISTED
IN THIS DOCUMENT, OR E-MAILED TO SUPPORT@MAGTEK.COM.
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0 - Table of Contents
Table of Contents
Table of Contents .............................................................................................................................................. 9
1 Introduction ............................................................................................................................................. 10
1.1 About DynaWave ............................................................................................................................ 10
1.2 Applications ..................................................................................................................................... 10
1.3 Security ............................................................................................................................................ 10
1.4 Integration ....................................................................................................................................... 10
1.5 About DynaWave Components .................................................................................................... 11
1.6 About Terminology ......................................................................................................................... 12
1.7 About Solution Planning................................................................................................................ 13
1.8 Handling ........................................................................................................................................... 14
2 Electrical Integration .............................................................................................................................. 15
2.1 Overview........................................................................................................................................... 15
2.2 About the Connectors .................................................................................................................... 15
2.3 Grounding / ESD Protection ......................................................................................................... 16
2.4 Shielding and Conditioning ........................................................................................................... 17
2.5 USB Device Port [J3] ...................................................................................................................... 18
2.6 UART Port [J6] ................................................................................................................................. 19
3 Mechanical Integration .......................................................................................................................... 22
3.1 About Mechanical Integration ...................................................................................................... 22
3.2 Dimensions ..................................................................................................................................... 23
3.3 Orientation ....................................................................................................................................... 24
3.4 Enclosure Design ............................................................................................................................ 25
3.5 Mounting .......................................................................................................................................... 27
3.6 Cabling ............................................................................................................................................. 30
3.7 Miscellaneous Considerations...................................................................................................... 30
4 Installation ............................................................................................................................................... 31
5 Operation ................................................................................................................................................. 32
5.1 Card and Contactless Device Reading / Transactions ............................................................. 32
5.2 About the LEDs ............................................................................................................................... 33
5.3 About Sounds .................................................................................................................................. 34
6 Maintenance ............................................................................................................................................ 35
6.1 Mechanical Maintenance .............................................................................................................. 35
6.2 Updates to Firmware, Documentation, Security Guidance...................................................... 35
6.3 Removal from Service ................................................................................................................... 36
7 Developing Host Software ..................................................................................................................... 37
Appendix A Technical Specifications ....................................................................................................... 38
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1 - Introduction
1 Introduction
This document provides guidelines and technical information for designing solutions that integrate
DynaWave, MagTek’s contactless NFC module for OEM solutions.
1.1 About DynaWave
DynaWave, MagTek’s contactless NFC module, allows you to add NFC (near-field communication)
contactless transactions to your payment solution. NFC allows for faster payments with a quick tap for
transaction processing. Whether you need to accept D-PAS®, PayPass™, payWave®, ExpressPay®,
Apple Pay®, Android Pay® or any other mobile wallet that supports contactless, DynaWave is ready.
1.2 Applications
Accept contactless payments in almost any environment. DynaWave is a perfect fit for contactless
payment environments including mobile point of sale applications, point of transaction kiosks, and
unattended payment terminals. DynaWave also works great in other NFC contactless environments,
including electronic identity locations, and key cards / fobs.
1.3 Security
DynaWave uses 3DES encryption coupled with DUKPT (Derived Unique Key Per Transaction) key
management to secure your transaction data.
1.4 Integration
Designed for easier development, DynaWave is available with USB and UART connections so
developers can choose the connection that works best for the solution. Contact a representative to find the
best fit for your application and to request the software developer kits (SDKs) and documentation.
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1 - Introduction
1.5 About DynaWave Components
Figure 1-1 - DynaWave Major Components
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1 - Introduction
1.6 About Terminology
In this document, DynaWave is referred to as the device. It is designed to be connected to a host, which
is a piece of general-purpose electronic equipment which can send commands and data to, and receive
data from, the device. Host types include PC computers/laptops, tablets, smartphones, and custom
boards. Generally, the host must have software installed that communicates with the device and is
capable of processing transactions. The combination of device(s), host(s), software, firmware,
configuration settings, physical mounting and environment, user experience, and documentation is
referred to as the solution. During a transaction, the host and its software interact with the operator,
such as a cashier or bank teller, while the device interacts with the cardholder.
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1 - Introduction
Part Number
Description
Related Sections
21079812
MDYNAMO
UART Port [J6]
1000003798
CABLE, UART, DYNAWAVE
UART Port [J6]
1000004824
ESD HARNESS CABLE, DYNAWAVE
Grounding / ESD Protection
UART Port [J6]
1000002547
CABLE, USB A PLUG TO RIGHT ANGLE
MICRO USB B PLUG
USB Device Port [J3]
1.7 About Solution Planning
A smooth deployment of a solution that integrates DynaWave requires some up-front planning and
decision-making:
Determine the overall functional requirements and desired user experience of the solution
DynaWave will be integrated into.
Determine what documentation and training will be required from solution design through testing
and field deployment.
Determine what type of host DynaWave will connect to, and what connection type it will use. The
host can be a computer or specialty board with a USB port or UART port (for example, MagTek’s
mDynamo EMV Contact Reader / Transaction Hub Module). When planning, include any additional
support or devices required by the host and its connection, such as physical locations, mounting, and
power connections. Table 1-1 provides a list of available compatible devices and accessories.
Determine what software will be installed on the host and how it will be configured. Software can
include operating system, transaction processing software, security software, board firmware, and so
on. Include any additional support required by the software, such as network connections.
Determine how DynaWave should be configured, and specify that when you order devices. MagTek
or your reseller can advise. For deep detail about configuration options and how they affect device
behavior, see D998200215 DYNAWAVE PROGRAMMER'S MANUAL (COMMANDS).
Determine how the solution design will integrate DynaWave electrically (see section 2 Electrical
Integration for details).
Determine how the solution design will integrate DynaWave mechanically (see section 3 Mechanical
Integration for details).
Develop an installation procedure. Basic device installation steps are provided in section 4
Installation, but installing technicians will need solution-specific materials. If DynaWave will be
incorporated into a solution before shipping, the installation procedure would be an assembly drawing
or assembly and test work instructions.
Determine how the solution will be tested and, if appropriate, how it will be certified.
Determine how the solution will be maintained. See section 6 Maintenance for guidance on
maintaining the DynaWave portion of the solution.
Determine how the solution will be regularly inspected. Proper inspection requires additional
solution-specific training, instructions, and visual references for inspecting the entire solution for
tampering, unauthorized added components such as eavesdropping or skimming devices, and so on.
Table 1-1 - Available Accessories
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1 - Introduction
Proper handling of the device throughout delivery, assembly, shipping, installation, usage,
and maintenance is very important. Not following the guidelines in this document could
damage the device, render it inoperable, and/or violate the conditions of the warranty.
1.8 Handling
From device delivery through assembly, shipping, installation, usage, and maintenance, the device must
not be exposed to conditions outside the ratings in Appendix A Technical Specifications.
If the device is exposed to cold temperatures, adjust it to warmer temperatures gradually to avoid
condensation, which can interfere with the operation of the device or cause permanent damage.
Upon receiving the device, inspect it to make sure it originated from an authentic source and has not been
tampered with.
Do not drop or shake the device.
The device should be transported/stored inside an anti-static bag at all times.
Before removing the device from the package, remove any static charge from your body by touching an
earth-grounded metal surface.
Avoid touching the exposed pins on the connectors when handling the device.
For information about ongoing maintenance of the device, such as cleaning, see section 6 Maintenance.
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2 - Electrical Integration
This document describes how to use DynaWave safely and securely. Not following the
guidelines in this section could damage the device, render it inoperable, and/or violate the
conditions of the warranty.
2 Electrical Integration
2.1 Overview
This section provides information and guidelines for designing the electrical aspects of a solution that
incorporates DynaWave. MagTek strongly recommends vetting and testing solution designs before
finalizing and deploying them, to make sure the design meets all requirements (e.g., functional, legal,
security, certification, safety, and so on).
When designing the electrical portions of a solution that incorporates DynaWave, consider the following:
Review section 1.5 About DynaWave Components for an overall introduction to the device’s
physical features and what they are called.
Review Appendix A Technical Specifications.
See all the subsections below for options and constraints involving cable design, signals, power, and
other aspects of electrical integration. To coordinate with the solution’s mechanical design team
about cables, see section 3.6 Cabling.
Consider additional factors that may affect the electrical aspects of the solution design. See section
3.7 Miscellaneous Considerations.
Review safe handling practices in section 1.8 Handling to make sure the logistical aspects of the
solution design meet the device’s handling requirements.
Review recommended installation practices in section 4 Installation. The steps provided in that
section depend on the solution design team to customize the steps or fill in solution-specific details
before distribution to installation technicians.
Review section 6 Maintenance. Depending on the solution design, the maintenance procedures may
require modifications, or the solution may require additional maintenance not covered in the general
guidelines provided here.
Review any additional requirements from other agencies, such as PCI certification requirements,
building codes, and so on, which may introduce additional constraints to the solution design.
2.2 About the Connectors
DynaWave provides the following connections (see section 1.5 About DynaWave Components):
A USB Device port, which can be connected to a USB-capable host for power and full-speed
bidirectional communication. For details, see section 2.5 USB Device Port [J3].
A UART port, which can be connected to a UART-capable host (usually a custom board) for
bidirectional TTL-level serial communication. It can also be used in solutions that need a separate
connection for attaching external earth ground. For details, see section 2.3 Grounding / ESD
Protection and section 2.5 USB Device Port [J3].
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2 - Electrical Integration
2.3 Grounding / ESD Protection
To guard against ground loops and to protect the device against electrostatic discharge (ESD), it is
important for the solution design to ground the device correctly by connecting it to the lowest impedance
return path available. MagTek strongly recommends checking whether the host’s communication ports
provide earth ground, and whether the cable carries that ground all the way to the port on the device. This
will help make an informed decision about proper grounding.
MagTek strongly recommends solution designs bring in earth ground to the device using
ONE AND ONLY ONE of the possible paths:
Bring in earth ground through the USB cable’s metal connector shell to the USB Device Port [J3].
In this case, it is very important to make sure the host and cable carry earth ground all the way to the
device. If they do not, use a single-wire cable and ground the UART Port [J6] as described below.
Bring in earth ground through pin 10 of the UART Port [J6]. This can be done using an O-ring
connector at the other end of the cable, to be mounted to the nearest available earth ground, such as an
earth grounded enclosure (see Figure 2-1). If there is no enclosure, or if the enclosure does not
provide earth ground, use a custom harness to bring in earth ground from another source.
If it is not practical to connect earth ground using only one of the available paths (for example, if the
solution uses multiple shielded cables that provide earth ground from the host), the solution design must
ensure that every source of external earth ground is at the same electrical potential, to prevent damaging
ground loop currents from occurring.
Figure 2-1 - Cable Configurations for Earth Ground
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2 - Electrical Integration
2.4 Shielding and Conditioning
MagTek recommends using shielded cables to provide noise immunity and to prevent radiated emissions.
The device itself has been tested by an FCC lab for Class B radiated emissions and susceptibility, and has
no special shielding requirements. For details, see the FCC information provided at the beginning of this
document.
MagTek also recommends that all communication cabling should be draped together where possible, and
isolated from the earth grounding cable to DynaWave and any other unrelated wiring at the installation
site that could potentially couple noise into the device.
The device has no special requirements for power conditioning or signal conditioning.
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2 - Electrical Integration
Do not provide power to DynaWave through both the USB Device Port and UART Port at
the same time. Doing so could present a safety hazard and / or permanently damage the
device and connected equipment. Solution designs should include safeguards against
accidental double connections throughout the device’s lifecycle.
2.5 USB Device Port [J3]
The USB Device port J3 can be used to provide power and full-speed bidirectional communication with
a USB-capable host. It is a Micro-USB B receptacle designed to mate with a standard connector found on
commercially available Micro-USB B cables. See Table 1-1 on page 13 for a list of available cables and
accessories MagTek has tested with the device. See section 3.6 for further information about cabling.
When powered through the USB port, the device draws a maximum of 350mA in steady state. Solutions
should build in a safety margin that anticipates potential peaks up to 500mA.
Programmers should see section 7 Developing Host Software for cross-references to programming tools
and documentation for communicating via this port.
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2 - Electrical Integration
Do not provide power to DynaWave through both the USB Device Port and UART Port at
the same time. Doing so could present a safety hazard and / or permanently damage the
device and connected equipment. Solution designs should include safeguards against
accidental double connections throughout the product’s lifecycle.
UART Signal
Connector Pin
GND
1
5V
2
5V
3
Device_RX_Data
4
5V 5 Device_TX_Data
6
Not connected
7 (no pin present)
Not connected
8 (no pin present)
GND
9
EARTH GND
10
2.6 UART Port [J6]
The UART port J6 can be used to provide power and bidirectional TTL-level serial communication with
a UART-capable host, which is generally a custom board designed specifically for the solution. The
UART port can also be used to provide earth ground in cases where earth ground is not available to the
USB Device Port [J3] (see section 2.3 Grounding / ESD Protection). The port connector is a JST
B10B-ZR-SM4-TF header designed to mate with a JST ZHR-10 connector or equivalent. Table 2-1
provides the port’s pinout definitions, and Figure 2-2 shows the physical location of pin 1.
Table 2-1 - Pinout Specification for UART Port [J6]
Figure 2-2 - DynaWave J6 Pin 1 Location
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2 - Electrical Integration
Parameter
Value / Default
Signal Voltage
3.3V (TTL)
Transmission Protocol
Asynchronous
Duplex
Full
Data Length
8 bits (Bit 7: MSB, Bit 0: LSB)
Parity
None
Start bits
1 bit
Stop bits
1 bit
Flow Control
None
Transmission Speed (baud rate)
115200 baud
The 5V pins and GND (digital ground) pins must be connected across the terminals of a power supply.
For optimal performance, use a 5VDC ±5% power supply with a current capacity of 500mA or greater.
The worst-case ripple voltage at the power supply’s 5VDC output must not exceed 100mV RMS.
When powered through the UART port, the device draws a maximum of 350mA in steady state.
Solutions should build in a safety margin that anticipates potential peaks up to 500mA.
MagTek recommends 22AWG wires for all signal and power lines. The connector contacts must have a
minimum of 15µ" of selective gold plating over nickel.
MagTek recommends enclosing all wires in a shielded earth-grounded jacket, and a maximum length for
the combination UART/power cable of 32 feet (10 meters). Actual cable length may vary based on cable
material and environmental factors. See Figure 2-3 for an example cable design. See Table 1-1 on page
13 for a list of available cables and accessories MagTek has tested with the device. See section 3.6 for
further information about cabling.
The communication settings for the UART port are shown in Table 2-2. The host must begin
communication using existing device settings, then can use that connection (or the USB Device Port
[J3]) to reconfigure the port settings. Programmers should see section 7 Developing Host Software for
cross-references to programming tools and documentation for communicating through this port and
configuring the device.
Table 2-2 - UART Communication Settings
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Figure 2-3 - Example UART / Power Cable
Figure 2-4 - Example Ground Cable
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3 - Mechanical Integration
This document describes how to use DynaWave effectively, safely, and securely. Not
following the guidelines in this section could damage the device, render it inoperable,
and/or violate the conditions of the warranty.
3 Mechanical Integration
3.1 About Mechanical Integration
This section provides information and guidelines for designing the mechanical aspects of a solution that
incorporates DynaWave. MagTek strongly recommends vetting and testing solution designs before
finalizing and deploying them, to make sure the design meets all requirements (e.g., functional, legal,
security, certification, safety, and so on).
When designing the mechanical portions of a solution that incorporates DynaWave, consider the
following:
Review section 1.5 About DynaWave Components for an overall introduction to the device’s
physical features and what they are called.
Review Appendix A Technical Specifications.
See section 3.2 Dimensions and section 3.3 Orientation for overall device dimensions and
requirements on mounted orientation.
If the solution includes an enclosure, design the enclosure front panel. Information about fitting the
device into a panel cutout are in section 3.4 Enclosure Design.
Determine how the device will be mounted. See section 3.5 Mounting for details. Coordinate with
the electrical design team to make sure the enclosure design, mounting hardware, and solutionspecific installation instructions meet electrical requirements.
Coordinate with the electrical design team to plan cable routing and fastening. See section 3.6
Cabling for details.
Consider additional factors that do not fit these categories. See section 3.7 Miscellaneous
Considerations.
Review safe handling practices in section 1.8 Handling to make sure the logistical aspects of the
solution design meet the device’s handling requirements.
Review recommended installation practices in section 4 Installation. The steps provided in that
section depend on the solution design team to customize the steps or fill in solution-specific details
before distribution to installation technicians or production line personnel.
Review section 6 Maintenance. When installed in the solution-specific enclosure, the maintenance
procedures may require modifications, or the solution may require additional maintenance not
covered in the general guidelines provided here.
Review any additional requirements from other agencies, such as PCI certification requirements,
building codes, and so on, which may introduce additional constraints to the design.
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3.2 Dimensions
Overall dimensions of the device are shown in Figure 3-1. For solutions that include an enclosure, the
dimensions of the enclosure panel cutout required to accommodate DynaWave are specified in section 3.4
Enclosure Design.
On request, MagTek can provide a 3D model of the device’s envelope to assist with the mechanical
portion of solution design. MagTek strongly recommends building and testing prototypes with actual
devices before finalizing the solution design.
Figure 3-1 - DynaWave Mechanical Dimensions in mm [inches]
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3 - Mechanical Integration
3.3 Orientation
The device is designed only to be oriented with the LEDs on top and facing the cardholder, as shown in
Figure 3-2. The Contactless Indicator mark on the face of the device is a trademark of EMVCo, LLC,
and may convey additional requirements to the solution design. See EMVCo usage guidelines.
Figure 3-2 - DynaWave Mounting Orientations
The device must be installed such that cardholders have an unobstructed path to tap cards or contactless
devices (such as smartphones).
The device does not incorporate drain holes, so there are no additional requirements for installation pitch
angle to facilitate drainage.
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3.4 Enclosure Design
Some solution designs may include an enclosure for security, protection from environmental factors, or
even to add trade dress. This section supports those solutions by providing important enclosure design
considerations.
The solution enclosure must include a cutout sized to expose the device’s main body. Reference
dimensions for the enclosure cutout, including the location of either screw holes or threaded studs, are
shown in Figure 3-3. The cutout dimensions should account for thermal expansion and contraction of the
enclosure, deformation due to mechanical stresses on the enclosure, and so on. Poorly toleranced cutouts
may result in being unable to install the device in the enclosure or uninstall the device from the enclosure
for maintenance or replacement, or may leave too much gap between the enclosure and the device.
Section 3.2 Dimensions provides detailed dimensions of the device’s installation face.
Figure 3-3 - DynaWave Panel Cutout Dimensions in Inches [mm]
If the solution will be exposed to the elements, the enclosure must protect the device. The device includes
a removable gasket which can be used on its installation face to create a seal with the enclosure. The
device is designed for ingress protection from the gasket forward, but the rear of the device behind the
gasket must be protected. In solutions that require a seal, the enclosure cutout must fully engage the
gasket, which generally means the areas where the gasket contacts the enclosure must be flat and rigid,
and the mounting hardware and torque specifications must be selected carefully to create a solid seal (see
section 3.5 Mounting for details).
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3 - Mechanical Integration
In addition, if the enclosure contains ferromagnetic material such as steel, the solution design team must
carefully consider the enclosure’s radio frequency (RF) absorbing effects on NFC contactless
performance. The device must protrude from such a mounting panel as much as possible (see Figure 3-4)
to avoid adverse effects on NFC communication range. For example, assuming a flat sheet steel panel,
the panel thickness should not exceed 0.25 in. (6.5mm). Designers may also wish to consider hybrid
designs that use a larger cutout and a “surround” of non-ferromagnetic material such as plastic, which
further decouples the device from RF absorbing effects of the mounting panel.
Figure 3-4 - DynaWave Protrusion from Panel
Further, if the area around the device includes any protrusions beyond the plane of the mounting panel
that contain ferromagnetic material (such as privacy shields or weather shields, or a recessed sheet metal
panel design like Figure 3-5), those protrusions may also affect NFC performance, and the solution
design should include adequate clearance distances between those features and the device.
Figure 3-5 - DynaWave Protrusion Clearance Example
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3.5 Mounting
The device is designed to be mounted into an enclosure using threaded studs, nuts, and washers (see
Figure 3-6). It can also be mounted using screws, nuts, and washers, and some solutions may not include
an enclosure. Studs or screws should be size #4 or M3. The washers help spread the load more evenly,
and can either be 4 ea. round washers, 2 ea. long flat washers, or one fixing plate. MagTek recommends
2 ea. long washers. See Figure 3-7 for recommended washer / fixing plate dimensions.
If the solution will be exposed to the elements, it must include an enclosure, and the mounting hardware
and torque specifications must apply adequate force to create a water-tight seal between the enclosure and
the gasket. For example, for M3 threaded rods and nuts, the torque may be in the range of 5 to 6 in-lbs.
(0.5 to 0.7 N-m).
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Figure 3-6 - DynaWave Threaded Stud / Nut Mounting
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Figure 3-7 - Example Mounting Washer Designs
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3 - Mechanical Integration
3.6 Cabling
This section provides information about mechanical integration of cables into a solution design. For
details about electrical aspects of integrating the device, see section 2 Electrical Integration.
MagTek recommends incorporating cable ties (not included) in the solution design to make sure the
cables stay connected during use, and provide strain relief for the device’s connectors.
If the solution design includes an enclosure, the enclosure should include adequate clearance for
installation and maintenance personnel to connect and disconnect all mechanical hardware and cables. If
the solution uses cable ties for strain relief, it should provide additional clearance to cut and re-tie them.
It should also provide support for the device when cables are being connected and disconnected.
Installation technicians will need to be provided detailed instructions for installing the cabling. For some
basic guidelines, see section 4 Installation.
3.7 Miscellaneous Considerations
The device operates on low power, so no special cooling should be necessary. However, if the solution
design includes an enclosure, there must be adequate clearance around device for heat to escape, and the
enclosure must not be an isolated thermal system that traps indefinite amounts of heat.
The device incorporates a beeper for auditory feedback to cardholders and operators (see section 1.5
About DynaWave Components, section 5.3 About Sounds). The solution design should take this into
account to avoid accidentally making the beeper inaudible.
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4 - Installation
FIRE RISK: If the device is being installed in a location near combustible materials, it is
critical to power down the whole system where it is being installed before installation to
avoid risk of fire or explosion. In these cases, follow the installation site’s standard LockOut/Tag-Out procedures to prevent accidental power-on before installation is complete.
IF YOU CAN NOT GUARANTEE POWER WILL REMAIN OFF DURING
INSTALLATION, DO NOT PROCEED.
4 Installation
This section provides an example of possible instructions to install DynaWave in a specific solution.
They are not designed to be distributed as-is to installing technicians. The solution design team must
develop solution-specific installation instructions, and may use these steps as a starting point.
1) See section 1.8 Handling for important information about handling the device before installation.
2) Make sure the power supply to the whole system is turned off and locked off.
3) Route all cables, then connect the ground cable first, then connect all other cables.
4) Tie cables down as specified by the solution design.
5) Line up the four holes on the mounting face of the device with the mounting hardware (usually studs
or screws) on the enclosure’s mounting panel. If the solution design includes an enclosure, make sure
the gasket is installed, then insert the device into the mounting hole cutout.
6) Inspect the device and enclosure from the front to make sure the device is pushed all the way into the
cutout. The device should be square, even, and flush with all four sides of the cutout. Some
enclosures with tighter tolerances may require additional force to push the device into place.
7) Tighten the mounting hardware to half of the final torque using a diagonal pattern (e.g., upper right,
lower left, upper left, lower right). This is important to create even pressure around the whole gasket.
8) Re-inspect to make sure the device is still positioned properly in the cutout.
9) Tighten the mounting hardware, again in a diagonal pattern, to the full torque.
10) Finish up any additional installation steps specified by the solution design, such as re-securing the
enclosure, cleaning the device, and installing any trade dress.
11) Restore power to the system.
12) Test the connection between the host and the device.
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5 - Operation
5 Operation
5.1 Card and Contactless Device Reading / Transactions
Transactions begin when the host software initiates them. Cardholders should tap cards or contactless
devices in the contactless landing zone on DynaWave’s front face (see section 1.5 About DynaWave
Components).
The host software may choose to use the notifications from the device as events to trigger additional
guidance (such as audible, visual, or tactile feedback) to the cardholder or operator.
Before and during transactions, an operator may control or monitor the device using the host software,
LEDs, and/or beeper (see section 5.2 About the LEDs, section 5.3 About Sounds).
Programmers of host software should see section 7 Developing Host Software for cross-references to
programming tools and documentation for communicating with the device.
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5 - Operation
Color
Flashing Pattern
Meaning
Off
Off
The device is not receiving power or is in a mode
where the host is updating firmware.
Blue
Flashing Periodically
The device flashes LED4 every 5 seconds when it
is connected and powered, ready for the host to
send it a command.
Blue
Solid On
LED 4 is lit blue when the host has initiated an
EMV transaction that allows the cardholder to
present a contactless card or contactless device.
Blue
LEDs 4, 3, 2, 1 Light
In Sequence
LEDs 4, 3, 2, and 1 light in sequence when
contactless communication is in process. After all
4 LEDs are lit, the cardholder can safely remove
the card or contactless device from the contactless
landing zone.
Blue
LEDs 4, 3, 2, 1 Light
Simultaneously
The device has just been powered on and is
performing a self-test.
5.2 About the LEDs
DynaWave provides four LEDs (see Figure 1-1) that provide feedback to operators and cardholders about
transaction progress and the internal state of the device. Table 5-1 shows how to interpret the LED
patterns.
Table 5-1 – General Status LED Meaning
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5.3 About Sounds
DynaWave’s beeper provides feedback to operators and cardholders about the internal state of the device:
The device sounds one short beep on startup to test the beeper and indicate the device is powered on.
The device sounds one short beep after it has successfully read a contactless tap, and the cardholder
can safely remove the card or contactless device from the contactless landing zone.
The device sounds two beeps when an operator cancels a pending EMV transaction.
The device sounds two short beeps when it fails to read a nearby contactless card or contactless
device.
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6 - Maintenance
The device does not contain any user-serviceable parts. Do not open the enclosure.
6 Maintenance
6.1 Mechanical Maintenance
Periodic cleaning of DynaWave’s exterior may be required. To clean the outside of the device, wipe
down the unit with a soft, damp cloth and then wipe with a dry cloth.
Solution training should direct assemblers, operators, and maintenance personnel to use a clean, dry cloth
to clean the device. Do not use chemicals or solvents.
6.2 Updates to Firmware, Documentation, Security Guidance
In addition to the security guidance in the product manuals, MagTek may provide updates to this
document, as well as supplemental security guidance or notices regarding vulnerabilities, at
www.magtek.com. MagTek advises checking the product’s home page periodically for the most up-to-
date information.
MagTek may also contact customers when it is necessary to update firmware to address critical product
bugs or security vulnerabilities. For details about obtaining and updating the device’s firmware, contact
MagTek Support Services or your reseller. The general firmware update process is as follows:
1) Obtain the firmware image to install (usually a .bin file or a .hex file) and make it available on the
filesystem of a Windows-based update workstation, which may simply be the solution’s primary host.
2) Make sure the device is connected to the update workstation via USB.
3) In a web browser on the update workstation, navigate to https://rs.magensa.net/rs2/app/publish.htm to
download the MagTek Reader Configuration Program.
4) Install any necessary prerequisites.
5) Run the application. If Windows presents security prompts, make sure the security information is
legitimate, then select the options to proceed.
6) When prompted to log in, press the Use Public Account button.
7) In the Device List, select the device you wish to update.
8) Make sure the application shows device information, including its Firmware part number and
revision number. This indicates the application has successfully connected to the device.
9) Make sure the Firmware part number for the device matches the filename you have received (for
example, if the application reports the device has firmware 1000001234A00 installed, the filename
should contain 1000001234). If it does not, contact MagTek Support Services for assistance.
10) In the Key list, select MAGENSA PROD UIK 9014500.
11) Press the Download Firmware button.
12) When prompted whether you are using DynaWave, press the Yes button to launch the Open
window for file browsing.
13) Browse to the new firmware image file on the update workstation’s filesystem and press the Open
button. The application shows ongoing status reports.
14) Wait until the application reports Firmware loaded successfully, the device automatically resets,
and the application reconnects and reports refreshed device information.
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6 - Maintenance
15) Confirm the reported Firmware part number and revision now match the firmware you installed.
16) Close the MagTek Reader Configuration Program window.
6.3 Removal from Service
DynaWave does not retain any sensitive data when it is not powered. To remove from service, simply
dispose of the device according to standard electronic waste disposal practices in your region.
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7 - Developing Host Software
7 Developing Host Software
MagTek produces software development kits (SDKs) with documentation and libraries that wrap higherlevel functions around the device’s various available communication protocols. These libraries simplify
the development of host software for solutions that use DynaWave, and include:
99510132 SOFTWARE, SDK, DYNAMAG / DYNAMAX / EDYNAMO / UDYNAMO /
ADYNAMO / MDYNAMO / TDYNAMO / DYNAWAVE (WINDOWS .NET)
99510133 DYNAMAG, DYNAMAX, EDYNAMO, MDYNAMO, TDYNAMO, DYNAWAVE
SDK FOR WINDOWS
99510109 DYNAMAG, DYNAMAX, EDYNAMO, UDYNAMO, ADYNAMO, BULLET,
MDYNAMO, TDYNAMO, DYNAWAVE SDK FOR ANDROID
In addition to the SDK libraries, custom software on any operating system can communicate directly with
the device using native libraries and protocols. For details, see D998200215 DYNAWAVE
PROGRAMMER'S MANUAL (COMMANDS).
For more information about developing custom applications that integrate with DynaWave, see the
MagTek web site or contact your reseller or MagTek Support Services.
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Appendix A - Technical Specifications
DynaWave Technical Specifications
Reference Standards and Certifications
ISO/IEC 14443 (Type A, Type B)
EN55024-2010 Information Technology Equipment - Immunity Characteristics
TDEA (3DES)-CBC using DUKPT
FCC Title 47 Part 15 Class B
EMVCo Type Approval – ESD Terminal Evaluation – Test Cases
IEC 61000-4.2 Edition 2.0 Electromagnetic Compatibility (EMC)
CE Class B EMC, CE Safety
UR/CUR UL Recognized, UL 94V-0 Safety of Flammability of Plastic Materials
MasterCard TQM
ANSI/IEC 60529-2004 Degrees of Protection Provided by Enclosures
IPC-A-610-2010 Acceptability of Electronic Assemblies, Class II Assembly
EU Directive Waste Electrical and Electronic Equipment (WEEE)
EU Directive Restriction of Hazardous Substances (RoHS)
California Proposition 65 (California)
Universal Serial Bus Specification 2.0
Physical Characteristics
Dimensions (L x W x H):
3.60 in. W x 2.95 in. H x 1.20 in. D (91.3 mm x 74.9mm x 30.6mm)
Weight
2.3 oz. (64g)
Supported Mounting Options:
Solution-specific enclosure using nuts on threaded studs/screws
Card Read Characteristics
Magnetic Stripe Reader:
Not Applicable
Magnetic Stripe Decoding:
Not Applicable
Magnetic Swipe Speeds:
Not Applicable
Contact Chip Card Reader:
Not Applicable
Contactless Reader
EMV Contactless, D-PAS®, PayPass™, payWave®, ExpressPay®,
Apple Pay®, Google Pay, Samsung Pay®
User Interface Characteristics
Status Indicators:
Four Blue LEDs
Keypad:
Not Applicable
Security Characteristics
Certifications:
Not Applicable
Electrical Characteristics
Power Inputs:
Micro USB-B
Appendix A Technical Specifications
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Appendix A - Technical Specifications
DynaWave Technical Specifications
Voltage Requirements:
5 VDC
Current Draw:
Idle: 70mA
Active: Up to 350mA
Power Outputs:
None
Data Storage:
Non-volatile memory for storage of configuration parameters
Communication Characteristics
Wired Connection Types:
Micro-USB B, compatible with USB 2.0 and higher
UART
Software Characteristics
Tested Operating System(s):
Windows 7, Windows 8.1, Windows 10, Android 4.4.2 and above on
devices with USB On-The-Go (OTG) support
Environmental Resistance
Ingress Protection:
IP65 Compliant
Operating Temperature:
-22°F to +158°F (-30°C to +70°C)
Operating Relative Humidity:
10% to 90% non-condensing
Storage Temperature:
-22°F to +158°F (-30°C to +70°C)
Storage Relative Humidity:
10% to 90% non-condensing
Vibration Resistance:
Not Applicable
Shock Resistance:
Not Applicable
ESD Tolerance (EMVCo):
Not Applicable
ESD Tolerance (FCC/CE):
±4kV contact discharge / ±8kV air discharge when properly grounded
Vapor Resistance:
Not Applicable
Reliability
Shelf Life:
5 years minimum
Magnetic Read Head Life:
Not Applicable
ICC Read Head Life:
Not Applicable
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