Ⅰ
. SCOPE
(1) SHAPES AND DIMENSIONS
(2) ELECTRICAL SPECIFICATIONS
(3) CHARACTERISTICS
：
This specification applies to the Pb Free Ferrite Chip Beads for
SMB-403025
PRODUCT INDENTIFICATION
SMB - 403025
① ②
① Product Code
② Dimensions Code
A: 4.00±0.20 mm
B: 3.10±0.15 mm
SEE TABLE 1
TEST INSTRUMENTS
Z : HP 4291B IMPEDANCE ANALYER (or equivalent)
RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
(3)-1 Temperature rise …................... ＋40℃ Max.
(3)-2 Ambient temperature ……......... ＋60℃ Max.
C: 2.54±0.15 mm
D: 1.50±0.50 mm
E: 1.25 Typ. mm
(3)-3 Operate temperature range ...... －40℃～＋105℃
(Including self temp. rise)
(3)-4 Storage temperature range ...... －40℃～＋105℃
MAG.LAYERS
SMB-403025 Page 1/6
TABLE 1
MAGLAYERS PT/NO.
IMPEDANCE (Ω)
At 25MHz/0.5V
At 100MHz/0.5V
DCR(mΩ)
Max.
SMB-403025
30±25% 47±25%
0.6
MAG.LAYERS
SMB-403025
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(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEM SPECIFICATION TEST DETAILS
Solder The product shall be connected to the test Apply cream solder to the printed circuit board .
ability circuit board by the fillet (the height Refer to clause 8 for Reflow profile.
is 0.2mm).
Resistance toThere shall be no damage or problems. Temperature profile of reflow soldering
Soldering
heat (reflow
soldering)
The specimen shall be passed through the reflow
oven with the condition shown in the above profile for 1 time.
The specimen shall be stored at standard atmospheric conditions for 1 hour, after which the measu-
rement shall be made.
Terminal The terminal electrode and the ferrite must Solder a chip to test substrate , and then
strength not damaged. laterally apply a load 9.8N in the arrow direction.
Strength on The terminal electrode and the ferrite must Solder a chip to test substrate and then apply a load.
PC board not damaged.
bending
High
temperature
resistance
Impedance:Within±20% of the initial value. After the samples shall be soldered onto the test
Insulation resistance and DC resistance on circuit board,the test shall be done.
the specification(refer to clause 2-1) Measurement : After placing for 24 hours min.
shall be met.
not damaged. Applied current : Rated current
Temperature : +85±2℃
Testing time : 500±12 hours
MAG.LAYERS
SMB-403025
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MECHANICAL
TEST ITEM TEST DETAILS
Humidity Impedance:Within±20% of the initial value. After the samples shall be soldered onto the test
resistance Insulation resistance and DC resistance on circuit board,the test shall be done.
the specification(refer to clause 2-1) Measurement : After placing for 24 hours min.
shall be met.
The terminal electrode and the ferrite must Applied voltage : Rated voltage
not damaged. Applied current : Rated current
Thermal Impedance:Within±20% of the initial value.
shock Insulation resistance and DC resistance on
the specification(refer to clause 2-1)
shall be met.
The terminal electrode and the ferrite must
not damaged.
Low
temperature
storage
Impedance:Within±20% of the initial value. After the samples shall be soldered onto the test
Insulation resistance and DC resistance on circuit board,the test shall be done.
the specification(refer to clause 2-1) Measurement : After placing for 24 hours min.
shall be met.
The terminal electrode and the ferrite must Testing time : 500±12 hours
not damaged.
SPECIFICATION
Temperature : +60±2℃ , Humidity : 90 to 95 %RH
Testing time : 500±12 hours
Temperature : -40±2℃
Vibration Impedance:Within±20% of the initial value. After the samples shall be soldered onto the test
Insulation resistance and DC resistance on circuit board,the test shall be done.
the specification(refer to clause 2-1) Frequency : 10 to 55 Hz
shall be met. Amplitude : 1.52 mm
The terminal electrode and the ferrite must Dimension and times : X ,Y and Z directions
not damaged. for 2 hours each.
Solderability
New solder More than 75% Flux (rosin, isopropyl alcohol{JIS-K-1522})
shall be coated over the whole of the sample
before hard, the sample shall then be preheated
for about 2 minutes in a temperature of
130～150℃ and after it has been immersed to a
depth 0.5mm below for 3±0.2 seconds fully in
molten solder M705 with a temperature of 245±2℃.
shall be couered with new solder smoothly when
the sample is taken out of the solder bath.
MAG.LAYERS
SMB-403025
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(5) LAND DIMENSION (Ref.)
PCB: GLASS EPOXY t＝1.6mm
(5)-1 LAND PATTERN DIMENSIONS
(STANDARD PATTERN)
unit：mm
(5)-2 FLOW SOLDERING
Temperature(℃ )
300
260
200
150
100
50
Preheating
Solding
260℃
Natural Cooling
Time
10 sec1 to 4 min. more than 2 min.
MAG.LAYERS
SMB-403025
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(6) PACKAGING
(6)-1 CARRIER TAPE DIMENSIONS (mm)
(6)-2 TAPING DIMENSIONS (mm)
(6)-3 REEL DIMENSIONS (mm)
(6)-3 QUANTITY
500pcs/Reel
MAG.LAYERS
SMB-403025
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TYPICAL ELECTRICAT CHARACTERISTICS
IMPEDANCE(Ω)
70
60
50
40
30
20
10
0
1 10 100 1000
FREQUENCY(MHz)
MAG.LAYERS
SMB-403025
ATTACHMENT-1
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