Mag Layers SMB-403025 User Manual

. SCOPE
(1) SHAPES AND DIMENSIONS
(2) ELECTRICAL SPECIFICATIONS
(3) CHARACTERISTICS
This specification applies to the Pb Free Ferrite Chip Beads for SMB-403025
PRODUCT INDENTIFICATION SMB - 403025
A: 4.00±0.20 mm B: 3.10±0.15 mm
SEE TABLE 1
TEST INSTRUMENTS Z : HP 4291B IMPEDANCE ANALYER (or equivalent) RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
(3)-1 Temperature rise ................... 40 Max.
(3)-2 Ambient temperature ……......... 60 Max.
C: 2.54±0.15 mm D: 1.50±0.50 mm E: 1.25 Typ. mm
(3)-3 Operate temperature range ...... 40℃~+105
(Including self temp. rise)
(3)-4 Storage temperature range ...... 40℃~+105
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TABLE 1
MAGLAYERS PT/NO.
IMPEDANCE (Ω)
At 25MHz/0.5V
At 100MHz/0.5V
DCR(mΩ)
Max.
SMB-403025
30±25% 47±25%
0.6
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(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEM SPECIFICATION TEST DETAILS Solder The product shall be connected to the test Apply cream solder to the printed circuit board . ability circuit board by the fillet (the height Refer to clause 8 for Reflow profile.
is 0.2mm). Resistance toThere shall be no damage or problems. Temperature profile of reflow soldering Soldering heat (reflow soldering)
The specimen shall be passed through the reflow oven with the condition shown in the above pro­file for 1 time. The specimen shall be stored at standard atmosph­eric conditions for 1 hour, after which the measu-
rement shall be made. Terminal The terminal electrode and the ferrite must Solder a chip to test substrate , and then strength not damaged. laterally apply a load 9.8N in the arrow direction.
Strength on The terminal electrode and the ferrite must Solder a chip to test substrate and then apply a load. PC board not damaged. bending
High temperature resistance
Impedance:Within±20% of the initial value. After the samples shall be soldered onto the test Insulation resistance and DC resistance on circuit board,the test shall be done. the specification(refer to clause 2-1) Measurement : After placing for 24 hours min. shall be met.
not damaged. Applied current : Rated current
Temperature : +85±2
Testing time : 500±12 hours
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MECHANICAL
TEST ITEM TEST DETAILS Humidity Impedance:Within±20% of the initial value. After the samples shall be soldered onto the test resistance Insulation resistance and DC resistance on circuit board,the test shall be done.
the specification(refer to clause 2-1) Measurement : After placing for 24 hours min. shall be met. The terminal electrode and the ferrite must Applied voltage : Rated voltage not damaged. Applied current : Rated current
Thermal Impedance:Within±20% of the initial value. shock Insulation resistance and DC resistance on
the specification(refer to clause 2-1) shall be met. The terminal electrode and the ferrite must not damaged.
Low temperature storage
Impedance:Within±20% of the initial value. After the samples shall be soldered onto the test Insulation resistance and DC resistance on circuit board,the test shall be done. the specification(refer to clause 2-1) Measurement : After placing for 24 hours min. shall be met. The terminal electrode and the ferrite must Testing time : 500±12 hours not damaged.
SPECIFICATION
Temperature : +60±2 , Humidity : 90 to 95 %RH
Testing time : 500±12 hours
Temperature : -40±2
Vibration Impedance:Within±20% of the initial value. After the samples shall be soldered onto the test
Insulation resistance and DC resistance on circuit board,the test shall be done. the specification(refer to clause 2-1) Frequency : 10 to 55 Hz shall be met. Amplitude : 1.52 mm The terminal electrode and the ferrite must Dimension and times : X ,Y and Z directions not damaged. for 2 hours each.
Solderability
New solder More than 75% Flux (rosin, isopropyl alcohol{JIS-K-1522})
shall be coated over the whole of the sample before hard, the sample shall then be preheated for about 2 minutes in a temperature of 130150 and after it has been immersed to a depth 0.5mm below for 3±0.2 seconds fully in molten solder M705 with a temperature of 245±2.
shall be couered with new solder smoothly when the sample is taken out of the solder bath.
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(5) LAND DIMENSION (Ref.)
PCB: GLASS EPOXY t1.6mm
(5)-1 LAND PATTERN DIMENSIONS
(STANDARD PATTERN)
unitmm
(5)-2 FLOW SOLDERING
Temperature()
300 260
200 150 100
50
Preheating
Solding
260
Natural Cooling
Time
10 sec1 to 4 min. more than 2 min.
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(6) PACKAGING
(6)-1 CARRIER TAPE DIMENSIONS (mm)
(6)-2 TAPING DIMENSIONS (mm)
(6)-3 REEL DIMENSIONS (mm)
(6)-3 QUANTITY
500pcs/Reel
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TYPICAL ELECTRICAT CHARACTERISTICS
IMPEDANCE(Ω)
70
60
50
40
30
20
10
0
1 10 100 1000
FREQUENCY(MHz)
MAG.LAYERS
SMB-403025
ATTACHMENT-1
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