Page 1
SCOPE
：
This specification applies to the Pb Free high current type SMD inductors for
(1) SHAPES AND DIMENSIONS
(2) ELECTRICAL SPECIFICATIONS
(3) CHARACTERISTICS
MSI-700705-SERIES
PRODUCT INDENTIFICATION
MSI- 700705- R15 M
① ② ③ ④
① Product Code
② Dimensions Code
③ Inductance Code
④ Tolerance Code
A: 7.0 Max. mm
B: 7.0 Max. mm
C: 4.96 Max. mm
D: 1.52 Typ. mm
E: 2.49 Typ. mm
SEE TABLE 1
TEST INSTRUMENTS
L : HP 4284A PRECISION LCR METER (or equivalent)
RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
IDC1 : CH3302/G LCR METER
CH1320,CH1320S BIAS CURRENT SOURCE(or equivalent)
(3)-1 Ambient temperature ……......... ＋60℃ Max.
(3)-2 Operate temperature range ...... －40℃～＋125℃
(Including self temp. rise)
(3)-3 Storage temperature range ...... －40℃～＋125℃
MAG.LAYERS
MSI-700705-SERIES
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Page 2
TABLE 1
MAGLAYERS
PT/NO.
MSI-700705-72N□
MSI-700705-R10□
MSI-700705-R15□
※ □ specify the inductance tolerance,M(±20%),N(±30%)
※ IDC1： Based on inductance change (△L/Lo： drop 20% TYP.)@ ambient temp. 25℃
IDC2： Based on temperature rise (△T： 40℃ TYP.)
Rated DC Current： The less value which is IDC1 or IDC2 .
Inductance Percent Test Resistance Rated DC Current
L(μH) Tolerance Frequency RDC(mΩ) IDC1(A) IDC2(A)
0.072 M,N 100kHz/0.1V 0.32 ±9.4% 58 31 72N
0.10 M,N 100kHz/0.1V 0.32 ±9.4% 46 31 R10
0.15 M,N 100kHz/0.1V 0.32 ±9.4% 30 31 R15
RDC TEST POINT
The nominal DCR is measured from point 〝a〞to point〝b〞.
Marking
a
b
MAG.LAYERS
MSI-700705-SERIES
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Page 3
(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEM SPECIFICATION TEST DETAILS
Substrate bending
△L/Lo≦±5%
There shall be direction is made approximately 3mm.(keep time 30 seconds)
no mechanical PCB dimension shall the page 7/9
damage or elec- F(Pressurization)
trical damege.
The sample shall be soldered onto the printed circuit board
in figure 1 and a load applied unitil the figure in the arrow
PRESSURE ROD
figure-1
Vibration
Solderability
△L/Lo≦±5%
There shall be and a frequency of from 10 to 55Hz/1 minute repeated should
no mechanical be applied to the 3 directions (X,Y,Z) for 2 hours each.
damage. (A total of 6 hours)
New solder Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated
More than 90% over the whole of the sample before hard, the sample shall
The sample shall be soldered onto the printed circuit board
and when a vibration having an amplitude of 1.52mm
then be preheated for about 2 minutes in a temperature of
130～150℃ and after it has been immersed to a depth 0.5mm
below for 3±0.2 seconds fully in molten solder M705 with
a temperature of 245±5℃.
More than 90% of the electrode sections shall be couered
with new solder smoothly when the sample is taken out of
the solder bath.
MAG.LAYERS
Page 3/8MSI-700705-SERIES
Page 4
MECHANICAL
(230
℃)
TEST ITEM SPECIFICATION
Resistance to There shall be Temperature profile of reflow soldering
Soldering heat no damage or
(reflow soldering) problems.
300
250
soldering
(Peak temperature 260±3℃ 10 sec
200
150
100
Sodering temperature (℃)
50
Pre-heating
150 ~ 180℃
2 min
The specimen shall be passed through the reflow oven with the
condition shown in the above profile for 1 time.
The specimen shall be stored at standard atmospheric conditions
for 1 hour, after which the measurement shall be made.
ELECTRICAL
TEST ITEM SPECIFICATION TEST DETAILS
Temperature
characteristics
△L/L20℃≦±10%
0～2000 ppm/℃ an ambient temperature of -20 to +85℃,and the value
The test shall be performed after the sample has stabilized in
calculated based on the value applicable in a normal
30 sec Min
+0
10
sec.
Slow cooling
(Stored at room
temperature)
2 min. or more
MAG.LAYERS
temperature and narmal humidity shall be △L/L20℃≦±10%.
MSI-700705-SERIES
Page4/8
Page 5
ENVIROMENT CHARACTERISTICS
TEST ITEM SPECIFICATION
High temperature
storage
△L/Lo≦±5%
There shall be Upon completion of the measurement shall be made after the
no mechanical sample has been left in a normal temperature and normal
damage. humidity for 1 hour.
The sample shall be left for 96±4 hours in an atmospere with
a temperature of 85±2℃ and a normal humidity.
Low temperature
storage
Change of
temperature in the table 2 below and then it shall be subjected to standard
△L/Lo≦±5%
There shall be Upon completion of the test, the measurement shall be made
no mechanical after the sample has been left in a normal temperature and
damage. normal humidity for 1 hour.
△L/Lo≦±5%
There shall be atmospheric conditions for 1 hour, after which measurement
no other dama- shall be made.
ge of problems
The sample shall be left for 96±4 hours in an atmosphere with
a temperature of -25±3℃.
The sample shall be subject to 5 continuos cycles, such as shown
table 2
Temperature Duration
1
1
2
2
3
3
4
4
－25±3℃
(Themostat No.1)
Standard
atmospheric
85±2℃
(Themostat No.2)
Standard
atmospheric
30 min.
30 min.
No.1→No.2
30 min.
30 min.
No.2→No.1
Moisture storage
Test conditions：
The sample shall be reflow soldered onto the printed circuit board in every test.
△L/Lo≦±5%
There shall be Upon completion of the test, the measurement shall be made
no mechanical after the sample has been left in a normal temperature and
damage. normal humidity more than 1 hour.
MAG.LAYERS
The sample shall be left for 96±4 hours in a temperature of
40±2℃ and a humidity(RH) of 90～95%.
Page 5/8MSI-700705-SERIES
Page 6
(5) LAND DIMENSION (Ref.)
PCB: GLASS EPOXY t＝1.6mm
(5)-1 LAND PATTERN DIMENSIONS(mm)
(STANDARD PATTERN) Unit:mm
(5)-2 SUBSTRATE BENDING TEST BENDING TEST BOARD
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Page 7
(6) PACKAGING
(6)-1 CARRIER TAPE DIMENSIONS (mm)
(6)-2 TAPING DIMENSIONS (mm)
Unreeling
Direction
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Page 8
(6)-3 REEL DIMENSIONS (mm)
(6)-4 QUANTITY
1000pcs/Reel
The products are packaged so that no damage will be sustained.
MAG.LAYERS
MSI-700705-SERIES
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Page 9
TYPICAL ELECTRICAL CHARACTERISTICS
Temperature Rise vs. DC Current
INDUCTANCE vs. DC CURRENT@100kHz/0.1V
Ambient Temperature : 25℃
MSI-700705-SERIES
0.20
72N
R15
0.16
0.12
0.08
Inductance(uH)
0.04
0.00
0 10 20 30 40 50 60 70 80
DC Current(A)
R10
MSI-700705-SERIES
70
60
)
50
℃
40
30
20
Temperature(
10
0
0 10 20 30 40 50 60
DC Current(A)
MAG.LAYERS
MSI-700705-SERIES
ATTACHMENT-1
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