Ⅰ
. SCOPE
MSI-280904CP-SERIES-
This specification applies to the Pb Free high current type SMD Coupled inductors for
MSI-280904CP-SERIES-□-□□
Warn : It is here not to use synchronous rectification curcuit！
：
PRODUCT INDENTIFICATION
MSI - 280904CP - R30 N - E - □□
① ② ③ ④ ⑤
① Product Code
② Dimensions Code
③ Inductance Code
④ Tolerance Code
⑤ Inner Control Code
(1) SHAPES AND DIMENSIONS
Pin 1)
A: 27.3±0.5 mm
B: 9.0±0.5 mm
C: 4.0 Max. mm
C1: 4.2 Max. mm
D: 2.5±0.15 mm
E: 7.3±0.25 mm
F: 3.3±0.15 mm
(2) ELECTRICAL SPECIFICATIONS
SEE TABLE 1
TEST INSTRUMENTS
L : HP 4285A PRECISION LCR METER (or equivalent)
RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
IDC1 : CH3302/G LCR METER
CH1320,CH1320S BIAS CURRENT SOURCE(or equivalent)
(3) CHARACTERISTICS
(3)-1 Ambient temperature ……......... ＋60℃ Max.
(3)-2 Operate temperature range ...... －40℃～＋125℃
(Including self temp. rise)
(3)-3 Storage temperature range ...... －40℃～＋125℃
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TABLE
Leakage
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MSI-280904CP-R30N-E-□□
*Inductance Test Frequency : 1MHz/1V
*L BIAS Test Frequency:100kHz/1V
※ Isat/Phase： Based on inductance change (△L/Lo： drop 20% Max.) @ ambient temp. 25℃
Irms：Based on temperature rise (△T： 40℃ TYP.)
Inductance(nH)
Pin(2-5)@(1-4,3-
6 short)/Phase
50±20%
Inductance(μH)
Pin(1-2)
Pin(3-4)
Pin(5-6)
0.3±30%
RDC(mΩ)
Pin(1-2)
Pin(3-4)
Pin(5-6)
0.285±10% 55 50
Rated DC Current (Max.)
Isat/Phase(A)
Pin(2-5
@1-4, 3-6
short)
Irms/Phase(A)
Pin(1-2)
Pin(3-4)
Pin(5-6)
RDC TEST POINT
SCHEMATIC
DCR
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MSI-280904CP-SERIES-□-□□
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(4) RELIABILITY TEST METHOD
MECHANICAL
SPECIFICATION TEST DETAILS
Substrate bending
△L/Lo≦±5%
no mechanical PCB dimension shall the page 7/9
damage or elec- F(Pressurization)
trical damege.
The sample shall be soldered onto the printed circuit board
in figure 1 and a load applied unitil the figure in the arrow
direction is made approximately 3mm.(keep time 30 seconds)
PRESSURE ROD
figure-1
Vibration
Solderability
△L/Lo≦±5%
There shall be and a frequency of from 10 to 55Hz/1 minute repeated should
no mechanical be applied to the 3 directions (X,Y,Z) for 2 hours each.
damage. (A total of 6 hours)
New solder Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated
More than 90% over the whole of the sample before hard, the sample shall
The sample shall be soldered onto the printed circuit board
and when a vibration having an amplitude of 1.52mm
then be preheated for about 2 minutes in a temperature of
130～150℃ and after it has been immersed to a depth 0.5mm
below for 3±0.2 seconds fully in molten solder M705 with
a temperature of 245±5℃.
More than 90% of the electrode sections shall be couered
with new solder smoothly when the sample is taken out of
the solder bath.
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MSI-280904CP-SERIES-□-□□
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MECHANICAL
(230
℃)
2 min
TEST ITEM SPECIFICATION
There shall be Temperature profile of reflow soldering
Soldering heat no damage or
(reflow soldering) problems.
300
250
soldering
(Peak temperature 260±3℃ 10 sec
200
150
100
Sodering temperature (℃)
50
Pre-heating
150 ~ 180℃
The specimen shall be passed through the reflow oven with the
condition shown in the above profile for 1 time.
The specimen shall be stored at standard atmospheric conditions
for 1 hour, after which the measurement shall be made.
ELECTRICAL
TEST ITEM SPECIFICATION TEST DETAILS
Temperature
characteristics
△L/L20℃≦±10%
0～2000 ppm/℃
The test shall be performed after the sample has stabilized in
calculated based on the value applicable in a normal
temperature and narmal humidity shall be △L/L20℃≦±10%.
30 sec Min
+0
10
sec.
Slow cooling
(Stored at room
temperature)
2 min. or more
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ENVIROMENT CHARACTERISTICS
TEST ITEM SPECIFICATION
△L/Lo≦±5%
storage
There shall be Upon completion of the measurement shall be made after the
damage. humidity for 1 hour.
The sample shall be left for 96±4 hours in an atmospere with
a temperature of 125℃ and a normal humidity.
sample has been left in a normal temperature and normal
Low temperature
storage
Change of
temperature in the table 2 below and then it shall be subjected to standard
△L/Lo≦±5%
There shall be Upon completion of the test, the measurement shall be made
no mechanical after the sample has been left in a normal temperature and
damage. normal humidity for 1 hour.
△L/Lo≦±5%
There shall be atmospheric conditions for 1 hour, after which measurement
no other dama- shall be made.
ge of problems
The sample shall be left for 96±4 hours in an atmosphere with
a temperature of -25±3℃.
The sample shall be subject to 5 continuos cycles, such as shown
table 2
Temperature Duration
1
2
3
4
－25±3℃
(Themostat No.1)
Standard
atmospheric
(Themostat No.2)
Standard
atmospheric
30 min.
No.1→No.2
30 min.
No.2→No.1
Moisture storage
Test conditions：
The sample shall be reflow soldered onto the printed circuit board in every test.
△L/Lo≦±5%
There shall be Upon completion of the test, the measurement shall be made
no mechanical after the sample has been left in a normal temperature and
damage. normal humidity more than 1 hour.
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The sample shall be left for 96±4 hours in a temperature of
40±2℃ and a humidity(RH) of 90～95%.
MSI-280904CP-SERIES-□-□□
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(5) LAND DIMENSION (Ref.)
(5)-1 LAND PATTERN DIMENSIONS(mm)
Unit : mm
7.3
3.3
6.0
3.2
2.7
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(6) PACKAGING
(6)-1 CARRIER TAPE DIMENSIONS (mm)
(6)-2 TAPING DIMENSIONS (mm)
R
R
R
R
R
R
Unreeling
Direction
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(6)-3 REEL DIMENSIONS (mm)
Tape width
(6)-4 QUANTITY
800 pcs/Reel
The products are packaged so that no damage will be sustained.
:44
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TYPICAL ELECTRICAL CHARACTERISTICS
INDUCTANCE vs. DC CURRENT
L(1-6)@(2-3, 4-5 Short) 100kHz/1V,Ambient Temperature : 25℃/100℃/125℃
MSI-280904CP-R30N-E-□□
0.20
0.15
0.10
Ls(uH)
0.05
0.00
0 10 20 30 40 50 60 70 80
DC Current(A)
Temperature Rise vs. DC Current 【Pin (1-2)】
MSI-280904CP-R30N-E-□□
50
25℃
100℃
125℃
)
℃
Temperature Rise(
40
30
20
10
0
0 10 20 30 40 50 60
DC Current (A)
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MSI-280904CP-SERIES-□-□□
ATTACHMENT-1
TYPICAL ELECTRICAL CHARACTERISTICS
L(1-6)@(2-3, 4-5 Short) @Ambient Temperature : 25
Inductance vs Frequency
MSI-280904CP-R30N-E-□□
0.20
0.15
0.10
Inductance(uH)
0.05
0.00
100 1000 10000
Frequency(kHz)
℃
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MSI-280904CP-SERIES-□-□□
ATTACHMENT-2
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