Mag Layers MSI-200904CP User Manual

. SCOPE
This specification applies to the Pb Free high current type SMD Coupled inductors for MSI-200904CP-SERIES--□□
Warn : It is here not to use synchronous rectification curcuit
PRODUCT INDENTIFICATION MSI - 200904CP - R050 M - E - □□
Product Code Dimensions Code Inductance Code Tolerance Code Inner Control Code
(1) SHAPES AND DIMENSIONS
Pin 1)
A: 20.0±0.5 mm B: 9.0±0.5 mm
C: 4.0 Max. mm C1: 4.2 Max. mm
D: 2.5±0.15 mm E: 7.3±0.25 mm F: 3.3±0.15 mm
(2) ELECTRICAL SPECIFICATIONS
SEE TABLE 1
TEST INSTRUMENTS L : HP 4285A PRECISION LCR METER (or equivalent) RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
IDC1 : CH3302/G LCR METER CH1320,CH1320S BIAS CURRENT SOURCE(or equivalent)
(3) CHARACTERISTICS
(3)-1 Ambient temperature ……......... 60 Max.
(3)-2 Operate temperature range ...... 40℃~+125
(Including self temp. rise)
(3)-3 Storage temperature range ...... 40℃~+125
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TABLE
Leakage
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*Inductance Test Frequency : 1MHz/1V *L BIAS Test Frequency:100kHz/1V Isat/Phase Based on inductance change (L/Lo drop 20% Max.) @ ambient temp. 25 IrmsBased on temperature rise (T 40 TYP.)
Inductance(nH)
Pin(2-3)@(1-4
short)/Phase
50±20%
Inductance(μH)
Pin(1-2) Pin(3-4)
0.3±30%
RDC(mΩ)
Pin(1-2) Pin(3-4)
0.285±10% 80 50
Rated DC Current (Max.)
Isat/Phase(A)
Pin(2-3
@1-4
short)
Irms/Phase(A)
Pin(1-2) Pin(3-4)
RDC TEST POINT
SCHEMATIC
DCR
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(4) RELIABILITY TEST METHOD
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MECHANICAL
SPECIFICATION TEST DETAILS
L/Lo±5%
no mechanical PCB dimension shall the page 7/9 damage or elec- F(Pressurization) trical damege.
The sample shall be soldered onto the printed circuit board in figure 1 and a load applied unitil the figure in the arrow direction is made approximately 3mm.(keep time 30 seconds)
PRESSURE ROD
figure-1
Vibration
Solderability
L/Lo±5%
There shall be and a frequency of from 10 to 55Hz/1 minute repeated should no mechanical be applied to the 3 directions (X,Y,Z) for 2 hours each. damage. (A total of 6 hours)
New solder Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated More than 90% over the whole of the sample before hard, the sample shall
The sample shall be soldered onto the printed circuit board and when a vibration having an amplitude of 1.52mm
then be preheated for about 2 minutes in a temperature of 130150 and after it has been immersed to a depth 0.5mm below for 3±0.2 seconds fully in molten solder M705 with a temperature of 245±5. More than 90% of the electrode sections shall be couered with new solder smoothly when the sample is taken out of the solder bath.
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MECHANICAL
P.2/9 Product picture & dimensions is added
(230
)
2 min
TEST ITEM SPECIFICATION
There shall be Temperature profile of reflow soldering no damage or
(reflow soldering) problems.
300 250
soldering (Peak temperature 260±3 10 sec
200
150
100
Sodering temperature ()
50
Pre-heating
150 ~ 180
The specimen shall be passed through the reflow oven with the condition shown in the above profile for 1 time. The specimen shall be stored at standard atmospheric conditions for 1 hour, after which the measurement shall be made.
ELECTRICAL
TEST ITEM SPECIFICATION TEST DETAILS Temperature characteristics
L/L20℃≦±10% 02000 ppm/
The test shall be performed after the sample has stabilized in
calculated based on the value applicable in a normal temperature and narmal humidity shall be L/L20℃≦±10%.
30 sec Min
+0
10 sec.
Slow cooling (Stored at room temperature)
2 min. or more
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ENVIROMENT CHARACTERISTICS
TEST ITEM SPECIFICATION
P.2/9 Product picture & dimensions is added
L/Lo±5%
There shall be Upon completion of the measurement shall be made after the
damage. humidity for 1 hour.
The sample shall be left for 96±4 hours in an atmospere with a temperature of 125 and a normal humidity.
sample has been left in a normal temperature and normal
Low temperature storage
Change of temperature in the table 2 below and then it shall be subjected to standard
L/Lo±5%
There shall be Upon completion of the test, the measurement shall be made no mechanical after the sample has been left in a normal temperature and damage. normal humidity for 1 hour. L/Lo±5%
There shall be atmospheric conditions for 1 hour, after which measurement no other dama- shall be made. ge of problems
The sample shall be left for 96±4 hours in an atmosphere with a temperature of -25±3.
The sample shall be subject to 5 continuos cycles, such as shown
table 2
Temperature Duration
1
(Themostat No.1)
2
atmospheric
3
(Themostat No.2)
4
atmospheric
25±3
Standard
Standard
30 min.
No.1No.2
30 min.
No.2No.1
Moisture storage
Test conditions
The sample shall be reflow soldered onto the printed circuit board in every test.
L/Lo±5%
There shall be Upon completion of the test, the measurement shall be made no mechanical after the sample has been left in a normal temperature and damage. normal humidity more than 1 hour.
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The sample shall be left for 96±4 hours in a temperature of 40±2 and a humidity(RH) of 9095%.
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(5) LAND DIMENSION (Ref.)
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(5)-1 LAND PATTERN DIMENSIONS(mm)
Unit : mm
7.3
3.3
6.0
3.2
2.7
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(6) PACKAGING
(6)-1 CARRIER TAPE DIMENSIONS (mm)
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(6)-2 TAPING DIMENSIONS (mm)
R
R
R
R
R
R
Unreeling Direction
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(6)-3 REEL DIMENSIONS (mm)
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Tape width
(6)-4 QUANTITY
800 pcs/Reel The products are packaged so that no damage will be sustained.
:32
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TYPICAL ELECTRICAL CHARACTERISTICS
L(2-3)@(1-4 Short) 100kHz/1V,Ambient Temperature : 25
INDUCTANCE vs. DC CURRENT
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MSI-200904CP-R050M-E-□□
0.18
0.15
0.12
0.09
Ls(uH)
0.06
0.03
0.00 0 10 20 30 40 50 60 70 80
DC Current(A)
Temperature Rise vs. DC Current Pin (1-2)
MSI-200904CP-R050M-E-□□
50
25 40 125
40
)
30
20
Temperature Rise(
10
0
0 10 20 30 40 50 60
DC Current (A)
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#REF!
ATTACHMENT-1
TYPICAL ELECTRICAL CHARACTERISTICS
L(1-4)@(2-3 Short) @Ambient Temperature : 25
Inductance vs Frequency
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0.20
0.15
0.10
Inductance(uH)
0.05
0.00 100 1000 10000
MSI-200904CP-R050M-E-□□
Frequency(kHz)
MAG.LAYERS
#REF!
ATTACHMENT-2
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