Mag Layers MSI-200904CP User Manual

. SCOPE
This specification applies to the Pb Free high current type SMD Coupled inductors for MSI-200904CP-SERIES--□□
Warn : It is here not to use synchronous rectification curcuit
PRODUCT INDENTIFICATION MSI - 200904CP - R050 M - E - □□
Product Code Dimensions Code Inductance Code Tolerance Code Inner Control Code
(1) SHAPES AND DIMENSIONS
Pin 1)
A: 20.0±0.5 mm B: 9.0±0.5 mm
C: 4.0 Max. mm C1: 4.2 Max. mm
D: 2.5±0.15 mm E: 7.3±0.25 mm F: 3.3±0.15 mm
(2) ELECTRICAL SPECIFICATIONS
SEE TABLE 1
TEST INSTRUMENTS L : HP 4285A PRECISION LCR METER (or equivalent) RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
IDC1 : CH3302/G LCR METER CH1320,CH1320S BIAS CURRENT SOURCE(or equivalent)
(3) CHARACTERISTICS
(3)-1 Ambient temperature ……......... 60 Max.
(3)-2 Operate temperature range ...... 40℃~+125
(Including self temp. rise)
(3)-3 Storage temperature range ...... 40℃~+125
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TABLE
Leakage
MAGLAYERS
MSI-200904CP-R050M-E-□□
*Inductance Test Frequency : 1MHz/1V *L BIAS Test Frequency:100kHz/1V Isat/Phase Based on inductance change (L/Lo drop 20% Max.) @ ambient temp. 25 IrmsBased on temperature rise (T 40 TYP.)
Inductance(nH)
Pin(2-3)@(1-4
short)/Phase
50±20%
Inductance(μH)
Pin(1-2) Pin(3-4)
0.3±30%
RDC(mΩ)
Pin(1-2) Pin(3-4)
0.285±10% 80 50
Rated DC Current (Max.)
Isat/Phase(A)
Pin(2-3
@1-4
short)
Irms/Phase(A)
Pin(1-2) Pin(3-4)
RDC TEST POINT
SCHEMATIC
DCR
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(4) RELIABILITY TEST METHOD
P.2/9 Product picture & dimensions is added
MECHANICAL
SPECIFICATION TEST DETAILS
L/Lo±5%
no mechanical PCB dimension shall the page 7/9 damage or elec- F(Pressurization) trical damege.
The sample shall be soldered onto the printed circuit board in figure 1 and a load applied unitil the figure in the arrow direction is made approximately 3mm.(keep time 30 seconds)
PRESSURE ROD
figure-1
Vibration
Solderability
L/Lo±5%
There shall be and a frequency of from 10 to 55Hz/1 minute repeated should no mechanical be applied to the 3 directions (X,Y,Z) for 2 hours each. damage. (A total of 6 hours)
New solder Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated More than 90% over the whole of the sample before hard, the sample shall
The sample shall be soldered onto the printed circuit board and when a vibration having an amplitude of 1.52mm
then be preheated for about 2 minutes in a temperature of 130150 and after it has been immersed to a depth 0.5mm below for 3±0.2 seconds fully in molten solder M705 with a temperature of 245±5. More than 90% of the electrode sections shall be couered with new solder smoothly when the sample is taken out of the solder bath.
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