Test Frequency : 100KHz/0.1V
※ IDC1: Based on inductance change (△L/Lo:drop 20% Typ.) @ ambient temp. 25℃
IDC2:Based on inductance change (△L/Lo: drop 20% Typ.) @ ambient temp. 25℃
IDC3: Based on temperature rise (△T: 40℃ TYP.)
0.24±20%
100±20%
0.252±8%205533R24
RDC TEST POINT
SCHEMATIC
MAG.LAYERS
MSI-101004PF-SERIES-□
Page 2/8
(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEMSPECIFICATIONTEST DETAILS
Substrate bending
△L/Lo≦±5%
There shall bedirection is made approximately 3mm.(keep time 30 seconds)
no mechanicalPCB dimension shall the page 7/9
damage or elec- F(Pressurization)
trical damege.
The sample shall be soldered onto the printed circuit board
in figure 1 and a load applied unitil the figure in the arrow
PRESSURE ROD
figure-1
Vibration
Solderability
△L/Lo≦±5%
There shall beand a frequency of from 10 to 55Hz/1 minute repeated should
no mechanicalbe applied to the 3 directions (X,Y,Z) for 2 hours each.
damage.(A total of 6 hours)
New solderFlux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated
More than 90%over the whole of the sample before hard, the sample shall
The sample shall be soldered onto the printed circuit board
and when a vibration having an amplitude of 1.52mm
then be preheated for about 2 minutes in a temperature of
130~150℃ and after it has been immersed to a depth 0.5mm
below for 3±0.2 seconds fully in molten solder M705 with
a temperature of 245±5℃.
More than 90% of the electrode sections shall be couered
with new solder smoothly when the sample is taken out of
the solder bath.
MAG.LAYERS
MSI-101004PF-SERIES-□
Page 3/8
MECHANICAL
(230
℃)
TEST ITEMSPECIFICATION
Resistance toThere shall beTemperature profile of reflow soldering
Soldering heatno damage or
(reflow soldering)problems.
300
250
soldering
(Peak temperature 260±3℃ 10 sec
200
150
100
Sodering temperature (℃)
50
Pre-heating
150 ~ 180℃
2 min
30 sec Min
+0
10
sec.
Slow cooling
(Stored at room
temperature)
2 min. or more
The specimen shall be passed through the reflow oven with the
condition shown in the above profile for 1 time.
The specimen shall be stored at standard atmospheric conditions
for 1 hour, after which the measurement shall be made.
ELECTRICAL
TEST ITEMSPECIFICATIONTEST DETAILS
Temperature△L/L20℃≦±10%The test shall be performed after the sample has stabilized in
characteristics0~2000 ppm/℃an ambient temperature of -20 to +85℃,and the value
calculated based on the value applicable in a normal
temperature and narmal humidity shall be △L/L20℃≦±10%.
MAG.LAYERS
MSI-101004PF-SERIES-□
Page 4/8
ENVIROMENT CHARACTERISTICS
TEST ITEMSPECIFICATION
High temperature
storage
△L/Lo≦±5%
There shall beUpon completion of the measurement shall be made after the
no mechanicalsample has been left in a normal temperature and normal
damage.humidity for 1 hour.
The sample shall be left for 96±4 hours in an atmospere with
a temperature of 125℃ and a normal humidity.
Low temperature
storage
Change of
temperaturein the table 2 below and then it shall be subjected to standard
△L/Lo≦±5%
There shall beUpon completion of the test, the measurement shall be made
no mechanicalafter the sample has been left in a normal temperature and
damage.normal humidity for 1 hour.
△L/Lo≦±5%
There shall beatmospheric conditions for 1 hour, after which measurement
no other dama-shall be made.
ge of problems
The sample shall be left for 96±4 hours in an atmosphere with
a temperature of -25±3℃.
The sample shall be subject to 5 continuos cycles, such as shown
table 2
TemperatureDuration
1
(Themostat No.1)
2
atmospheric
3
(Themostat No.2)
4
atmospheric
-25±3℃
Standard
85±2℃
Standard
30 min.
No.1→No.2
30 min.
No.2→No.1
Moisture storage
Test conditions:
The sample shall be reflow soldered onto the printed circuit board in every test.
△L/Lo≦±5%
There shall beUpon completion of the test, the measurement shall be made
no mechanicalafter the sample has been left in a normal temperature and
damage.normal humidity more than 1 hour.
MAG.LAYERS
The sample shall be left for 96±4 hours in a temperature of
40±2℃ and a humidity(RH) of 90~95%.
MSI-101004PF-SERIES-□
Page 5/8
(5) LAND DIMENSION (Ref.)
PCB: GLASS EPOXY t=1.6mm
(5)-1 LAND PATTERN DIMENSIONS(mm)
(STANDARD PATTERN)Unit:mm
(5)-2 SUBSTRATE BENDING TEST BENDING TEST BOARD
MAG.LAYERS
Page-7/9Page 6/8
MSI-101004PF-SERIES-□
(6) PACKAGING
(6)-1 CARRIER TAPE DIMENSIONS (mm)
(6)-2 TAPING DIMENSIONS (mm)
Unreeling
Direction
MAG.LAYERS
MSI-101004PF-SERIES-□
Page 7/8
(6)-3 REEL DIMENSIONS (mm)
(6)-4 QUANTITY
900 pcs/Reel
The products are packaged so that no damage will be sustained.
Page-9/9
MAG.LAYERS
MSI-101004PF-SERIES-□
Page 9/8
TYPICAL ELECTRICAL CHARACTERISTICS
Temperature Rise vs. DC Current
【
L1 , L2
】
INDUCTANCE vs. DC CURRENT@100kHz/1.0V 【2LK】
Ambient Temperature : 25℃
MSI-101004PF-SERIES-□
0.14
0.12
0.10
0.08
0.06
Inductance(uH)
0.04
0.02
0.00
01020304050607080
DC Current(A)
MSI-101004PF-SERIES-□
60
50
)
40
℃
30
20
Temperature(
10
0
010203040
DC Current(A)
MAG.LAYERS
MSI-101004PF-SERIES-□
ATTACHMENT-1
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