Mag Layers MSI-101004PF User Manual

. SCOPE
This specification applies to the Pb Free high current type SMD Coupled inductors for
(1) SHAPES AND DIMENSIONS
MSI-101004PF-SERIES-
Warn : It is here not to use synchronous rectification curcuit
PRODUCT INDENTIFICATION MSI - 101004PF - R20 M -E
Product Code Dimensions Code Inductance Code Tolerance Code Inner Control Code
A: 9.7±0.3 mm
R24
EPOXY
(2) ELECTRICAL SPECIFICATIONS
SEE TABLE 1
TEST INSTRUMENTS L : HP 4284A PRECISION LCR METER (or equivalent) RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
(3) CHARACTERISTICS
(3)-1 Ambient temperature ……......... 60 Max.
(3)-2 Operate temperature range ...... 40℃~+125
(Including self temp. rise)
B: 9.7±0.3 mm C: 3.7±0.3 mm D: 2.5±0.3 mm E: 1.8±0.3 mm F: 1.55±0.3 mm G: 5.3±0.3 mm
(3)-3 Storage temperature range ...... 40℃~+125
MAG.LAYERS
MSI-101004PF-SERIES-
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TABLE
MAGLAYERS
Coupling
Inductance
MSI-101004PF-R20M-E
Inductance (μH)
L(1-2),L(4-3)
0.20±20% 100±20%
2Lk (nH)
(1-4@2-3 short)
Resistance
RDC(mΩ)
(1-2,4-3)
0.252±8%
Rated DC Current (Max.)
IDC1(A ) (1-2,4-3)
20 55
IDC2(A)
(1-4)@2-3
short
IDC3(A)
(1-4)@2-3
short
33
Marking
R20
MSI-101004PF-R24M-E
Test Frequency : 100KHz/0.1V IDC1 Based on inductance change (L/Lodrop 20% Typ.) @ ambient temp. 25 IDC2Based on inductance change (L/Lo drop 20% Typ.) @ ambient temp. 25 IDC3 Based on temperature rise (T 40 TYP.)
0.24±20%
100±20%
0.252±8% 20 55 33 R24
RDC TEST POINT
SCHEMATIC
MAG.LAYERS
MSI-101004PF-SERIES-
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(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEM SPECIFICATION TEST DETAILS
Substrate bending
L/Lo±5%
There shall be direction is made approximately 3mm.(keep time 30 seconds) no mechanical PCB dimension shall the page 7/9 damage or elec- F(Pressurization) trical damege.
The sample shall be soldered onto the printed circuit board in figure 1 and a load applied unitil the figure in the arrow
PRESSURE ROD
figure-1
Vibration
Solderability
L/Lo±5%
There shall be and a frequency of from 10 to 55Hz/1 minute repeated should no mechanical be applied to the 3 directions (X,Y,Z) for 2 hours each. damage. (A total of 6 hours)
New solder Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated More than 90% over the whole of the sample before hard, the sample shall
The sample shall be soldered onto the printed circuit board and when a vibration having an amplitude of 1.52mm
then be preheated for about 2 minutes in a temperature of 130150 and after it has been immersed to a depth 0.5mm below for 3±0.2 seconds fully in molten solder M705 with a temperature of 245±5. More than 90% of the electrode sections shall be couered with new solder smoothly when the sample is taken out of the solder bath.
MAG.LAYERS
MSI-101004PF-SERIES-
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MECHANICAL
(230
)
TEST ITEM SPECIFICATION Resistance to There shall be Temperature profile of reflow soldering Soldering heat no damage or (reflow soldering) problems.
300 250
soldering (Peak temperature 260±3 10 sec
200
150
100
Sodering temperature ()
50
Pre-heating
150 ~ 180
2 min
30 sec Min
+0
10 sec.
Slow cooling (Stored at room temperature)
2 min. or more
The specimen shall be passed through the reflow oven with the condition shown in the above profile for 1 time. The specimen shall be stored at standard atmospheric conditions for 1 hour, after which the measurement shall be made.
ELECTRICAL
TEST ITEM SPECIFICATION TEST DETAILS Temperature L/L20℃≦±10% The test shall be performed after the sample has stabilized in characteristics 02000 ppm/ an ambient temperature of -20 to +85,and the value
calculated based on the value applicable in a normal temperature and narmal humidity shall be L/L20℃≦±10%.
MAG.LAYERS
MSI-101004PF-SERIES-
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ENVIROMENT CHARACTERISTICS
TEST ITEM SPECIFICATION High temperature storage
L/Lo±5%
There shall be Upon completion of the measurement shall be made after the no mechanical sample has been left in a normal temperature and normal damage. humidity for 1 hour.
The sample shall be left for 96±4 hours in an atmospere with a temperature of 125 and a normal humidity.
Low temperature storage
Change of temperature in the table 2 below and then it shall be subjected to standard
L/Lo±5%
There shall be Upon completion of the test, the measurement shall be made no mechanical after the sample has been left in a normal temperature and damage. normal humidity for 1 hour. L/Lo±5%
There shall be atmospheric conditions for 1 hour, after which measurement no other dama- shall be made. ge of problems
The sample shall be left for 96±4 hours in an atmosphere with a temperature of -25±3.
The sample shall be subject to 5 continuos cycles, such as shown
table 2
Temperature Duration
1
(Themostat No.1)
2
atmospheric
3
(Themostat No.2)
4
atmospheric
25±3
Standard
85±2
Standard
30 min.
No.1No.2
30 min.
No.2No.1
Moisture storage
Test conditions
The sample shall be reflow soldered onto the printed circuit board in every test.
L/Lo±5%
There shall be Upon completion of the test, the measurement shall be made no mechanical after the sample has been left in a normal temperature and damage. normal humidity more than 1 hour.
MAG.LAYERS
The sample shall be left for 96±4 hours in a temperature of 40±2 and a humidity(RH) of 9095%.
MSI-101004PF-SERIES-
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(5) LAND DIMENSION (Ref.)
PCB: GLASS EPOXY t1.6mm
(5)-1 LAND PATTERN DIMENSIONS(mm)
(STANDARD PATTERN) Unit:mm
(5)-2 SUBSTRATE BENDING TEST BENDING TEST BOARD
MAG.LAYERS
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MSI-101004PF-SERIES-
(6) PACKAGING
(6)-1 CARRIER TAPE DIMENSIONS (mm)
(6)-2 TAPING DIMENSIONS (mm)
Unreeling Direction
MAG.LAYERS
MSI-101004PF-SERIES-
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(6)-3 REEL DIMENSIONS (mm)
(6)-4 QUANTITY
900 pcs/Reel The products are packaged so that no damage will be sustained.
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MAG.LAYERS
MSI-101004PF-SERIES-
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TYPICAL ELECTRICAL CHARACTERISTICS
Temperature Rise vs. DC Current
L1 , L2
INDUCTANCE vs. DC CURRENT@100kHz/1.0V 2LK Ambient Temperature : 25
MSI-101004PF-SERIES-
0.14
0.12
0.10
0.08
0.06
Inductance(uH)
0.04
0.02
0.00 0 10 20 30 40 50 60 70 80
DC Current(A)
MSI-101004PF-SERIES-
60
50
)
40
30
20
Temperature(
10
0
0 10 20 30 40
DC Current(A)
MAG.LAYERS
MSI-101004PF-SERIES-
ATTACHMENT-1
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