This specification applies to the Pb Free high current type SMD inductors for
MSI-100808-SERIES
PRODUCT INDENTIFICATION
(1) SHAPES AND DIMENSIONS
A: 10.31+0.1 /-0.3 mm
B: 7.65±0.25 mm
C: 7.4+0.1 /-0.4 mm
D: 2.54 Typ. mm
E: 2.21 Typ. mm
(2) ELECTRICAL SPECIFICATIONS
SEE TABLE 1
TEST INSTRUMENTS
L : HP 4284A PRECISION LCR METER (or equivalent)
RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
(3)-1 Operate temperature range ...... -40℃~+125℃
(Including self temp. rise)
(3)-2 Storage temperature range ...... -40℃~+125℃
MSI-100808-SERIES Page 1/8
IDC1 :WK3255B+3265B (or equivalent)
Inductance Percent Test Resistance Rated DC Current
L(μH) Tolerance Frequency RDC(mΩ) IDC1(A) IDC2(A)
0.115 L,M 100kHz/0.1V 0.29±10%
0.150 L,M 100kHz/0.1V 0.29±10% 72 41 R15
0.175 L,M 100kHz/0.1V 0.29±10% 62 41 R175
0.215 L,M 100kHz/0.1V 0.29±10% 48 41 R215
0.230 L,M 100kHz/0.1V 0.29±10% 43 41 R23
0.270 L,M 100kHz/0.1V 0.29±10% 37 41 R27
0.300 L,M 100kHz/0.1V 0.29±10% 32 41 R30
※ □ specify the inductance tolerance,L(±15%),M(±20%)
※ IDC1: Based on inductance change (△L/Lo:drop 20% Typ.)@ ambient temp. 25℃
IDC2: Based on temperature rise (△T: 40℃ TYP.)
Rated DC Current: The less value which is IDC1 or IDC2 .
The nominal DCR is measured from point 〝a〞to point〝b〞.
(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEM SPECIFICATION TEST DETAILS
Substrate bending
△L/Lo≦±5%
The sample shall be soldered onto the printed circuit board
in figure 1 and a load applied unitil the figure in the arrow
There shall be direction is made approximately 3mm.(keep time 30 seconds)
no mechanical PCB dimension shall the page 7/9
damage or elec- F(Pressurization)
trical damege.
Vibration
△L/Lo≦±5%
The sample shall be soldered onto the printed circuit board
and when a vibration having an amplitude of 1.52mm
There shall be and a frequency of from 10 to 55Hz/1 minute repeated should
no mechanical be applied to the 3 directions (X,Y,Z) for 2 hours each.
damage. (A total of 6 hours)
Solderability
New solder Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated
More than 90% over the whole of the sample before hard, the sample shall
then be preheated for about 2 minutes in a temperature of
130~150℃ and after it has been immersed to a depth 0.5mm
below for 3±0.2 seconds fully in molten solder M705 with
More than 90% of the electrode sections shall be couered
with new solder smoothly when the sample is taken out of
the solder bath.
Page-3/8