Mag Layers MSI-100705 User Manual

. SCOPE
This specification applies to the Pb Free high current type SMD inductors for
(1) SHAPES AND DIMENSIONS
(2) ELECTRICAL SPECIFICATIONS
(3) CHARACTERISTICS
MSI-100705-SERIES
PRODUCT INDENTIFICATION MSI-100705-R12 M
A: 10.2 Max. mm B: 7.0 Max. mm C: 4.96 Max. mm D: 1.52 Typ. mm E: 2.49 Typ. mm
SEE TABLE 1
TEST INSTRUMENTS L : HP 4284A PRECISION LCR METER (or equivalent) RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
IDC1 : CH3302/G LCR METER CH1320,CH1320S BIAS CURRENT SOURCE(or equivalent)
(3)-1 Ambient temperature ……......... 60 Max.
(3)-2 Operate temperature range ...... 40℃~+125
(Including self temp. rise)
(3)-3 Storage temperature range ...... 40℃~+125
MAG.LAYERS
MSI-100705-SERIES Page 1/8
TABLE
MAGLAYERS
PT/NO. MSI-100705-85N MSI-100705-R10 MSI-100705-R12
MSI-100705-R155
MSI-100705-R22
※ □ specify the inductance tolerance,M(±20%),N(±30%) IDC1 Based on inductance change (L/Lo drop 20% Typ.)@ ambient temp. 25
IDC2 Based on temperature rise (T 40 TYP.) Rated DC Current The less value which is IDC1 or IDC2 .
Inductance Percent Test Resistance Rated DC Current
L(μH) Tolerance Frequency RDC(mΩ) IDC1(A) IDC2(A)
0.085 M,N 100kHz/0.1V
0.100 M 100kHz/0.1V
0.120 M 100kHz/0.1V
0.155 M 100kHz/0.1V
0.220 M 100kHz/0.1V 0.39±7.7% 33 25 R22
0.39±7.7% 70
0.39±7.7%
0.39±7.7%
0.39±7.7%
70 31 R10 52 31 R12 40 31 R155
RDC TEST POINT
The nominal DCR is measured from point ato pointb.
Marking
31 85N
a
b
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MSI-100705-SERIES
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(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEM SPECIFICATION TEST DETAILS
Substrate bending
L/Lo±5%
There shall be direction is made approximately 3mm.(keep time 30 seconds) no mechanical PCB dimension shall the page 7/9 damage or elec- F(Pressurization) trical damege.
The sample shall be soldered onto the printed circuit board in figure 1 and a load applied unitil the figure in the arrow
PRESSURE ROD
figure-1
Vibration
Solderability
L/Lo±5%
There shall be and a frequency of from 10 to 55Hz/1 minute repeated should no mechanical be applied to the 3 directions (X,Y,Z) for 2 hours each. damage. (A total of 6 hours)
New solder Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated More than 90% over the whole of the sample before hard, the sample shall
The sample shall be soldered onto the printed circuit board and when a vibration having an amplitude of 1.52mm
then be preheated for about 2 minutes in a temperature of 130150 and after it has been immersed to a depth 0.5mm below for 3±0.2 seconds fully in molten solder M705 with a temperature of 245±5. More than 90% of the electrode sections shall be couered with new solder smoothly when the sample is taken out of the solder bath.
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MECHANICAL
Sodering temperature ()
(230
)
TEST ITEM SPECIFICATION Resistance to There shall be Temperature profile of reflow soldering Soldering heat no damage or (reflow soldering) problems.
300 250
soldering (Peak temperature 260±3 10 sec
200
150
100
50
Pre-heating
150 ~ 180
2 min
The specimen shall be passed through the reflow oven with the condition shown in the above profile for 1 time. The specimen shall be stored at standard atmospheric conditions for 1 hour, after which the measurement shall be made.
ELECTRICAL
TEST ITEM SPECIFICATION TEST DETAILS Temperature characteristics
L/L20℃≦±10% 02000 ppm/ an ambient temperature of -20 to +85,and the value
The test shall be performed after the sample has stabilized in
calculated based on the value applicable in a normal
30 sec Min
+0
10 sec.
Slow cooling (Stored at room temperature)
2 min. or more
MAG.LAYERS
temperature and narmal humidity shall be L/L20℃≦±10%.
MSI-100705-SERIES
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ENVIROMENT CHARACTERISTICS
TEST ITEM SPECIFICATION High temperature storage
L/Lo±5%
There shall be Upon completion of the measurement shall be made after the no mechanical sample has been left in a normal temperature and normal damage. humidity for 1 hour.
The sample shall be left for 96±4 hours in an atmospere with a temperature of 85±2 and a normal humidity.
Low temperature storage
Change of temperature in the table 2 below and then it shall be subjected to standard
L/Lo±5%
There shall be Upon completion of the test, the measurement shall be made no mechanical after the sample has been left in a normal temperature and damage. normal humidity for 1 hour. L/Lo±5%
There shall be stmospheric conditions for 1 hour, after which measurement no other dama- shall be made. ge of problems
The sample shall be left for 96±4 hours in an atmosphere with a temperature of -25±3.
The sample shall be subject to 5 continuos cycles, such as shown
table 2
Temperature Duration
1
2
3
4
25±3
(Themostat No.1)
Standard
atmospheric
85±2
(Themostat No.2)
Standard
atmospheric
30 min.
No.1No.2
30 min.
No.2No.1
Moisture storage
Test conditions
The sample shall be reflow soldered onto the printed circuit board in every test.
MAG.LAYERS
L/Lo±5%
There shall be Upon completion of the test, the measurement shall be made no mechanical after the sample has been left in a normal temperature and damage. normal humidity more than 1 hour.
The sample shall be left for 96±4 hours in a temperature of 40±2 and a humidity(RH) of 9095%.
MSI-100705-SERIES
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(5) LAND DIMENSION (Ref.)
PCB: GLASS EPOXY t1.6mm
(5)-1 LAND PATTERN DIMENSIONS(mm)
(STANDARD PATTERN)
(5)-2 SUBSTRATE BENDING TEST BENDING TEST BOARD
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(6) PACKAGING
(6)-1 CARRIER TAPE DIMENSIONS (mm)
(6)-2 TAPING DIMENSIONS (mm)
Unreeling Direction
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(6)-3 REEL DIMENSIONS (mm)
(6)-4 QUANTITY
800pcs/Reel The products are packaged so that no damage will be sustained.
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TYPICAL ELECTRICAL CHARACTERISTICS
INDUCTANCE vs. DC CURRENT@100kHz/0.1V Ambient Temperature : 25
R10 R12 R155 R22
0.30
0.27
0.24
0.21
0.18
0.15
0.12
0.09
Inductance(uH)
0.06
0.03
0.00
MSI-100705-Series
0 10 20 30 40 50 60 70
DC Current(A)
Temperature Rise vs. DC Current
MSI-100705-Series
60
50
)
40
30
20
Temperature(
10
0
0 10 20 30 40 50
DC Current(A)
MAG.LAYERS
MSI-100705-SERIES
ATTACHMENT-1
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