This specification applies to the Pb Free high current type SMD inductors for
(1) SHAPES AND DIMENSIONS
(2) ELECTRICAL SPECIFICATIONS
MSCH-2015C-SERIES
PRODUCT INDENTIFICATION
MSCH - 2015C - 100 K
① ② ③ ④
① Product Code
② Dimensions Code
③ Inductance Code
④ Tolerance Code
A: 2.0±0.3 mm
B: 1.5±0.2 mm
C: 1.7±0.3 mm
D: 0.6Typ. mm
E: 0.8Typ. mm
SEE TABLE 1
TEST INSTRUMENTS
L : HP 4285A PRECISION LCR METER (or equivalent)
RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
(3)-1 Ambient temperature ……......... +60℃ Max.
(3)-2 Operate temperature range ...... -40℃~+125℃
(Including self temp. rise)
(3)-3 Storage temperature range ...... -40℃~+125℃
MAG.LAYERS
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MAGLAYERS
PT/NO.
MSCH-2015C-1R0□
MSCH-2015C-1R5□
MSCH-2015C-2R2□
MSCH-2015C-3R3□
MSCH-2015C-4R7□
MSCH-2015C-5R6□
MSCH-2015C-6R8□
MSCH-2015C-8R6□
MSCH-2015C-100□
MSCH-2015C-150□
MSCH-2015C-220□
※ □ specify the inductance tolerance,K(±10%),M(±20%)
※ IDC: Based on inductance change (△L/Lo: ≦ drop 10%) @ ambient temp. 25℃
Inductance Percent L Test Resistance IDC
L(μH) Tolerance Frequency RDC(Ω)Max. (mA) Max.
1.0 M 1MHz/0.25V 0.26 650
1.5 M 1MHz/0.25V 0.35 600
2.2 M 1MHz/0.25V 0.52 500
3.3 M 1MHz/0.25V 0.65 480
4.7 M 1MHz/0.25V 0.78 300
5.6 M 1MHz/0.25V 0.84 280
6.8 M 1MHz/0.25V 1.30 250
8.6 M 1MHz/0.25V 1.52 230
10 K,M 1MHz/0.25V 1.62 200
15 K,M 1MHz/0.25V 2.01 150
22 K,M 1MHz/0.25V 3.77 100
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(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEM SPECIFICATION TEST DETAILS
Substrate bending
△L/Lo≦±5%
There shall be direction is made approximately 3mm.(keep time 30 seconds)
no mechanical PCB dimension shall the page 7/9
damage or elec- F(Pressurization)
trical damege.
The sample shall be soldered onto the printed circuit board
in figure 1 and a load applied unitil the figure in the arrow
PRESSURE ROD
figure-1
Vibration
Solderability
△L/Lo≦±5%
There shall be and a frequency of from 10 to 55Hz/1 minute repeated should
no mechanical be applied to the 3 directions (X,Y,Z) for 2 hours each.
damage. (A total of 6 hours)
New solder Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated
More than 90% over the whole of the sample before hard, the sample shall
The sample shall be soldered onto the printed circuit board
and when a vibration having an amplitude of 1.52mm
then be preheated for about 2 minutes in a temperature of
130~150℃ and after it has been immersed to a depth 0.5mm
below for 3±0.2 seconds fully in molten solder M705 with
a temperature of 245±5℃.
More than 90% of the electrode sections shall be couered
with new solder smoothly when the sample is taken out of
the solder bath.
MAG.LAYERS
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