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A
P
P
L
I
C
A
T
I
O
N
■
A
P
P
L
I
C
A
■
A
P
P
L
PDA, notebook, desktop, and server applications
Low profile, high current power supplies
Battery powered devices
DC/DC converters in distributed power systems
DC/DC converters for field programmable gate array
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F
E
A
■
■
■
■
■
F
P
P
T
E
A
F
P
T
E
A
T
RoHS Compliant.
Super low resistance, ultra high current rating
High performance (I sat) realized by metal dust core
R
O
D
R
O
D
R
O
D
① ② ③ ④ ⑤
I
U
U
U
C
U
U
U
R
R
R
A
C
C
C
E
E
E
T
T
T
T
T
S
S
S
I
O
N
I
O
N
I
D
E
N
T
I
F
I
C
A
T
I
O
N
I
D
E
N
T
I
F
I
C
A
I
D
E
N
T
I
F
T
I
C
A
T
I
O
N
I
O
N
MMD - 12CE - R68 M - V1
① Product Code
② Dimensions : 13.7
③ Inductance : R68 = 0.68μH
④ Tolerance : M = ±20%
⑤ Series Type : V1 Type
NOTE:Please refer to the “Product Dimension” for detail dimensions.
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P
R
O
D
U
C
T
D
I
M
■
■
B
P
R
O
D
U
C
T
A
C
T
P
R
O
D
U
D
D
I
I
M
M
E
E
E
D
N
N
N
S
S
S
XXXX
I
12.9
O
N
I
O
N
I
O
N
E
XXXX
3.5 mm
C
MAG.LAYERS
MMD-12CE-SERIES-V1
NOTE
PRODUCT NO. A B C D E
:Dimensions in mm
MMD-12CE-SERIES-V1
E
L
E
C
T
R
I
C
E
L
E
C
■ E
MMD-12CE-R15M-V1
MMD-12CE-R22M-V1
MMD-12CE-R33M-V1
MMD-12CE-R47M-V1
MMD-12CE-R60M-V1
MMD-12CE-R68M-V1
MMD-12CE-R82M-V1
MMD-12CE-1R0M-V1
MMD-12CE-1R5M-V1
L
PART NUMBER
E
C
T
T
R
R
A
I
C
A
I
C
A
13.2 ± 0.5 12.9 Max 3.5 Max 3.3 ± 0.5 2.2 ± 0.3
L
R
E
L
L
Q
R
E
Q
R
E
Q
INDUCTANCE
Lo(μH)±20%
U
I
R
E
M
E
N
T
U
I
R
E
M
U
I
R
@0A
0.15 1.0 1.2 41 75
0.22 1.1 1.3 38.5 65
0.33 1.3 1.5 36.5 62
0.47 1.6 2.0 32 55
0.6 1.8 2.2 29 51
0.68 2.3 2.5 28 49
0.82 2.6 3.0 25 44
1.0 3.3 3.5 24 40
1.5 5.1 5.5 19 35
E
E
M
S
N
T
E
S
N
T
S
R
dc
(mΩ)
Typ Max
HEAT RATING
CURRENT(Idc)
DC AMPS
1
SATURATION
CURRENT(Isat)
DC AMPS2
MMD-12CE-1R8M-V1
MMD-12CE-2R2M-V1
MMD-12CE-3R3M-V1
MMD-12CE-4R7M-V1
TEST FREQUENCY:100KHz,0.25V
TESTING INSTRUMENT L :Agilent4284A,WK4235,CH3302/G LCR METER
CH1320,CH1320S BIAS CURRENT SOURCE
R
NOTES:
1. DC current (Idc) that will cause an approximate △T of 40℃
2. DC current (I
3. All test data is referenced to 25℃ ambient
4. Operating Temperature Range -55℃ to +125℃
5. The part temperature (ambient + temp rise) should not exceed 125℃
under the worst operating conditions. Circuit design, component placement,
sat
) that will cause Lo to drop approximately 20%
1.8 6.5 7.0 16.5 30
2.2 7.2 8.0 16 29
3.3 11 12 12 27
4.7 14.3 15 10 24
:CH11025,GOM802 MICRO OHMMETER
dc
PWB trace size and thickness, airflow and other cooling provisions all affect
the part temperature. Part temperature should be verified in the end application.
MAG.LAYERS
MMD-12CE-SERIES-V1