■
A
P
P
L
I
C
A
T
I
O
N
■
A
P
P
L
I
C
A
■
A
P
P
L
PDA, notebook, desktop, and server applications
Low profile, high current power supplies
Battery powered devices
DC/DC converters in distributed power systems
T
I
C
A
T
I
O
N
I
O
N
DC/DC converters for field programmable gate array
■
F
E
A
T
U
R
E
S
■
F
E
A
T
U
■
F
E
A
RoHS Compliant.
Super low resistance, ultra high current rating
High performance (I sat) realized by metal dust core
■
P
R
■
■
O
P
R
O
P
R
MMD - 06AB - R68 M - S1
① Product Code
② Dimensions : 7.2 x 6.7 x 1.2 mm
R
T
U
R
D
U
C
D
U
O
C
D
U
C
① ② ③ ④ ⑤
E
E
T
T
T
S
S
I
D
E
N
T
I
F
I
C
A
T
I
O
N
I
D
E
N
T
I
F
I
C
A
I
D
E
N
T
I
F
T
I
C
A
T
I
O
N
I
O
N
③ Inductance : R68 = 0.68μH
④ Tolerance : M = ±20%
⑤ Series Type : S1 Type
NOTE:Please refer to the “Product Dimension” for detail dimensions.
■
P
R
O
D
U
C
T
D
I
M
E
N
S
I
O
N
■
■
P
R
O
D
U
C
T
D
I
M
E
N
P
R
O
D
U
C
T
D
I
M
E
N
S
S
I
O
N
I
O
N
MAG.LAYERS
MMD-06AB-SERIES-S1
NOTE
:Dimensions in mm
PRODUCT NO. A B C D E
MMD-06AB-SERIES-S1
E
L
E
C
T
R
I
C
A
E
L
E
C
T
■ E
L
E
PART NUMBER
MMD-06AB-R47M-S1 0.47 15 17 8 11
MMD-06AB-R68M-S1 0.68 17 19 7 8
MMD-06AB-1R0M-S1 1.0 26 28 6 7
MMD-06AB-1R5M-S1 1.5 35.5 40.8 4 6
MMD-06AB-2R2M-S1 2.2 75 82.5 3.5 4.4
MMD-06AB-3R3M-S1 3.3 90 103 3 3.6
C
T
R
R
L
I
C
A
L
I
C
A
6.86 ± 0.38 6.47 ± 0.25
R
E
Q
U
I
R
E
L
R
E
Q
R
E
Q
INDUCTANCE
Lo(μH)±20%
U
U
@0A
M
I
R
E
M
I
R
E
M
E
N
T
E
S
N
T
E
S
N
T
S
(mΩ)
Typ. Max
R
1.2Max 3.0 ± 0.3 1.3 ± 0.3
dc
HEAT RATING
CURRENT(Idc)
DC AMPS
1
SATURATION
CURRENT(Isat)
DC AMPS2
MMD-06AB-4R7M-S1 4.7 155 170 2.4 2.8
MMD-06AB-6R8M-S1 6.8 189 217 2.1 2.4
MMD-06AB-100M-S1 10 250 290 1.8 2.2
TEST FREQUENCY:100KHz,0.25V
TESTING INSTRUMENT L :Agilent4284A,WK4235,CH3302/G LCR METER
CH1320,CH1320S BIAS CURRENT SOURCE
R
NOTES:
1.DC current (Idc) that will cause an approximate △T of 40℃
2.DC current (I
3.All test data is referenced to 25℃ ambient
4.Operating Temperature Range -55℃ to +125℃
5.The part temperature (ambient + temp rise) should not exceed 125℃under worst case
operating conditions. Circuit design, component placement, PWB trace size and
thickness, airflow and other cooling provisions all affect the part temperature. Part
sat
) that will cause Lo to drop approximately 30%
:CH11025,GOM802 MICRO OHMMETER
dc
temperature should be verified in the end application.
MAG.LAYERS
MMD-06AB-SERIES-S1