Mag Layers MMD-05BZ-SERIES-M2 User Manual

A
E
A
P
P
L
I
C
A
T
I
N
A
P
P
L
I
C
A
A
P
P
L
PDA, notebook, desktop, and server applications Low profile, high current power supplies
Battery powered devices DC/DC converters in distributed power systems
T
I
C
A
T
I
N
I
N
DC/DC converters for field programmable gate array
F
E
A
T
U
R
E
S
F
E
A
T
U
F
E
A
RoHS compliant Super low resistance, ultra high current rating High performance (I sat) realized by metal dust core
P
R
P
R
P
R
MMD - 05BZ - R10 M - M2
Product Code Dimensions : 5.7 x 5.4 x 2.0 mm Inductance : R10 = 0.10μH
R
T
U
R
D
U
C
D
U
C
D
U
C
① ② ③ ④ ⑤
E
E
T
T
T
S
S
I
D
E
N
T
I
F
I
C
A
T
I
N
I
D
E
N
T
I
F
I
C
A
I
D
E
N
T
I
F
T
I
C
A
T
I
N
I
N
Tolerance : M = ±20% ⑤ Series Type : M2 Type
NOTEPlease refer to the “Product Dimension” for detail dimensions.
P
R
D
U
C
T
D
I
M
E
N
S
I
N
P
R
D
U
C
T
D
I
M
E
N
P
R
D
U
C
T
D
I
M
B
E
N
S
S
D
C
I
N
I
N
MAG.LAYERS
MMD-05BZ-SERIES-M2
NOTEDimensions in mm
PRODUCT NO. A B C D E
MMD-05BZ-SERIES-M2
E
L
E
C
T
R
I
C
E
L
E
C
E
L
PART NUMBER
MMD-05BZ-R10M-M2 MMD-05BZ-R22M-M2 MMD-05BZ-R33M-M2 MMD-05BZ-R47M-M2 MMD-05BZ-R68M-M2 MMD-05BZ-1R0M-M2 MMD-05BZ-2R2M-M2 MMD-05BZ-3R3M-M2
E
C
T
T
R
R
A
I
C
A
I
C
A
L
L
L
5.49 ± 0.25 5.18 ± 0.25
R
E
U
I
R
E
R
E
R
E
INDUCTANCE
Lo(μH)±20%
U
U
M
I
R
E
M
I
R
E
M
@0A
0.10 3.6 3.9 17 38.3
0.22 4.9 5.2 15 18.7
0.33 7.6 8.2 12 21.3
0.47 8.1 8.8 11.5 17.9
0.68 11.2 12.4 10 12.8
1.0 18.9 20 7.0 13.7
2.2 45.6 50.1 4.2 10.7
3.3 79.2 85.5 3.3 7.3
E
N
T
E
S
N
T
E
S
N
T
S
Typ. Max
R
dc
(mΩ)
2.0 Max 2.0 ± 0.3 1.02 ± 0.3
HEAT RATING
CURRENT(Idc)
DC AMPS
1
SATURATION
CURRENT(Isat)
DC AMPS2
MMD-05BZ-4R7M-M2 MMD-05BZ-5R6M-M2 MMD-05BZ-6R8M-M2
MMD-05BZ-100M-M2
TEST FREQUENCY: 100 KHz, 0.25V TESTING INSTRUMENT L :Agilent4284A,WK4235,CH3302/G LCR METER
CH1320,CH1320S BIAS CURRENT SOURCE
R
NOTES:
1. DC current (Idc) that will cause an approximate T of 40
2. DC current (I
3. All test data is referenced to 25 ambient
4. Operating Temperature Range -55 to +125
5. The part temperature (ambient + temp rise) should not exceed 125
under the worst operating conditions. Circuit design, component placement,
sat
) that will cause Lo to drop approximately 30%
4.7 108 116.6
5.6 113 122 2.5 3.9
6.8 139 150 2.4 3.7 10 184 199 2.3 3.4
:CH11025,GOM802 MICRO OHMMETER
dc
2.8 4.3
PWB trace size and thickness, airflow and other cooling provisions all affect
the part temperature. Part temperature should be verified in the end application.
MAG.LAYERS
MMD-05BZ-SERIES-M2
Loading...
+ 4 hidden pages