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A
P
P
L
I
C
A
T
I
O
N
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A
P
P
L
I
C
A
■
A
P
P
L
PDA, notebook, desktop, and server applications
Low profile, high current power supplies
Battery powered devices
DC/DC converters in distributed power systems
T
I
C
A
T
I
O
N
I
O
N
DC/DC converters for field programmable gate array
■
F
E
A
T
U
R
E
S
■
F
E
A
T
U
■
F
E
A
RoHS compliant
Super low resistance, ultra high current rating
High performance (I sat) realized by metal dust core
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P
R
■
■
O
P
R
O
P
R
MMD - 04BZ - 1R0 M - X2
① Product Code
② Dimensions : 4.7 x 4.3 x 2.0 mm
R
T
U
R
D
U
C
D
U
O
C
D
U
C
① ② ③ ④ ⑤
E
E
T
T
T
S
S
I
D
E
N
T
I
F
I
C
A
T
I
O
N
I
D
E
N
T
I
F
I
C
A
I
D
E
N
T
I
F
T
I
C
A
T
I
O
N
I
O
N
③ Inductance : 1R0 = 1.0μH
④ Tolerance : M = ±20%
⑤ Series Type: X2 Type
NOTE:Please refer to the “Product Dimension” for detail dimensions.
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R
O
D
U
C
T
D
I
M
E
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■
P
R
O
D
U
C
T
P
R
O
D
U
B
C
T
D
D
I
I
M
M
E
E
D
C
N
N
N
S
S
S
I
O
N
I
O
N
I
O
N
MAG.LAYERS
MMD-04BZ-SERIES-X2
NOTE
:Dimensions in mm
PRODUCT NO. A B C D E
MMD-04BZ-SERIES-X2
E
L
E
C
T
R
I
C
E
L
E
C
■ E
L
PART NUMBER
MMD-04BZ-R10M-X2
MMD-04BZ-R22M-X2
MMD-04BZ-R47M-X2
MMD-04BZ-1R0M-X2
MMD-04BZ-1R5M-X2
MMD-04BZ-2R2M-X2
MMD-04BZ-3R3M-X2
TEST FREQUENCY: 100 KHz, 0.25V
E
C
T
T
R
R
A
I
C
A
I
C
A
4.45 ± 0.25 4.06 ± 0.25
L
R
E
Q
U
I
L
R
E
L
R
E
INDUCTANCE
Lo(µH)±20%
R
Q
U
I
R
Q
U
I
R
@0A
0.10 3.5 4.0 12 22
0.22 6.0 6.6 9.0 12.5
0.47 12.5 14 7.0 9.5
1.0 24 27 4.5 7.0
1.5 38 46 4.0 6.0
2.2 52 58 3.0 5.0
3.3 74 87 2.5 4.0
2.0 Max 2.0 ± 0.3 0.76 ± 0.3
E
M
E
N
T
E
M
E
E
M
S
N
T
E
S
N
T
S
R
dc
(mΩ)
Typ. Max
HEAT RATING
CURRENT(Idc)
DC AMPS
1
SATURATION
CURRENT(Isat)
DC AMPS2
TESTING INSTRUMENT L: HP4284A, CH3302G, CH1320, CH1320S LCR METER
Rdc: CH502A MICRO OHMMETER
NOTES:
1. DC current (Idc) that will cause an approximate △T of 40℃
2. DC current (I
3. All test data is referenced to 25℃ ambient
4. Operating Temperature Range -55℃ to +125℃
5. The part temperature (ambient + temp rise) should not exceed 125℃
under the worst operating conditions. Circuit design, component placement,
PWB trace size and thickness, airflow and other cooling provisions all affect
the part temperature. Part temperature should be verified in the end application.
sat
) that will cause Lo to drop approximately 30%
MAG.LAYERS
MMD-04BZ-SERIES-X2