Mag Layers MMD-04BZ-SERIES User Manual

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PPLLIICCAATTIIOON

APP

AP LICATION

P

PDA, notebook, desktop, and server applications

Low profile, high current power supplies
Battery powered devices
DC/DC converters in distributed power systems
DC/DC converters for field programmable gate array

F

FEEAATTUURREESS

FEATURES

RoHS compliant

Super low resistance, ultra high current rating
High performance (I sat) realized by metal dust core
Frequency Range: up to 1MHz

P

PRROODDUUCC

PRODUCT

① ② ③ ④ ⑤

T I

T IDDEENNTTIIFFIICCAATTIIOONN

N

IDENTIFICATION

MMD

① Product Code
② Dimensions : 4.7 x 4.3 x 2.0 mm
③ Inductance : 100 = 10μH
④ Tolerance : M =
⑤ Series Type : S1 Type

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PRROODDUUCC

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PRODUCT

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NOTE：Dimensions in mm

- 04BZ - 100 M - S1

±20%

T D

T DIIMMEENNSSIIOONN

DIMENSION

A

D

C

E

PRODUCT NO. A B C D E

MMD-04BZ

MAG.LAYERS

MMD-04BZ-SERIES-S1

4.45 ± 0.25 4.06 ± 0.25 2.0 Max 2.0 ± 0.3 0.76 ± 0.3

EELLEECCTTRRIICCAALLRREEQQUUIIRREEMMEENNTTS

■ ELECTRICAL

REQUIREMENTS

S

PART NUMBER

MMD-04BZ-R10M-X2
MMD-04BZ-R22M-X2
MMD-04BZ-R47M-X2
MMD-04BZ-1R0M-X2
MMD-04BZ-1R2M-X2
MMD-04BZ-1R5M-X2
MMD-04BZ-2R2M-X2
MMD-04BZ-3R3M-X2
MMD-04BZ-4R7M-S1

INDUCTANCE

Lo(μH)±20%

@0A

R

dc

(mΩ)

Typ. Max

HEAT RATING
CURRENT(Idc)

DC AMPS

1

SATURATION

CURRENT(Isat)

DC AMPS2

0.10 3.5 4.0 12 22

0.22 6.0 6.6 9.0 12.5

0.47 12.5 14 7.0 9.5

1.0 24 27 4.5 7.0

1.2 24 27 4.5 7.0

1.5 38 46 4.0 6.0

2.2 52 58 3.0 5.0

3.3 74 87 2.5 4.0

4.7 118 132 2.4 2.8

MMD-04BZ-6R8M-S1
MMD-04BZ-8R2M-S1

MMD-04BZ-100M-S1
MMD-04BZ-220M-S1

6.8 162 178 2 2.1

8.2 188 207 1.8 2.0
10 256 282 1.6 1.8
22 460 550 0.8 1.0

TEST FREQUENCY: 100 KHz, 0.25V

TESTING INSTRUMENT L :Agilent4284A,WK4235,CH3302/G LCR METER
CH1320,CH1320S BIAS CURRENT SOURCE

R

:CH11025,GOM802 MICRO OHMMETER

dc

NOTES:

1. DC current (Idc) that will cause an approximate △T of 40℃

2. DC current (I

sat) that will cause Lo to drop approximately 20%

3. All test data is referenced to 25℃ ambient

4. Operating Temperature Range -55℃ to +125℃

5. The part temperature (ambient + temp rise) should not exceed 125℃

under the worst operating conditions. Circuit design, component placement,
PWB trace size and thickness, airflow and other cooling provisions all affect

the part temperature. Part temperature should be verified in the end application.

MAG.LAYERS

MMD-04BZ-SERIES-S1